인쇄회로기판(PCB) 시장 예측(-2030년) : 제품 유형별, 라미네이트 및 재료별, 제조 프로세스별, 기술별, 최종사용자별, 지역별 세계 분석

According to Stratistics MRC, the Global Printed Circuit Boards (PCBs) Market is accounted for $92.4 billion in 2024 and is expected to reach $135.6 billion by 2030, growing at a CAGR of 6.6% during the forecast period. Printed Circuit Boards (PCBs) are fundamental components in electronic devices, consisting of a non-conductive substrate with conductive pathways, pads, and other features etched or printed onto it. They serve as the foundation for connecting and supporting various electronic components. The PCB market encompasses the design, manufacturing, and distribution of these boards for diverse applications, including consumer electronics, automotive, telecommunications, and industrial sectors.

According to data from the IPC (Association Connecting Electronics Industries), China remained the largest PCB producer, accounting for 52% of global production in 2021.

Market Dynamics:

Driver:

Increasing electrification and automation of vehicles

The growing trend of vehicle electrification and automation is driving significant demand for PCBs in the automotive industry. Modern vehicles require increasingly complex electronic systems for functions like advanced driver assistance systems (ADAS), infotainment, and powertrain control. Electric and autonomous vehicles, in particular, rely heavily on sophisticated PCBs to manage their intricate electrical and computational systems. This trend is pushing automakers to incorporate more PCBs per vehicle, thereby fueling market growth.

Restraint:

Fluctuating raw material prices

The PCB industry is sensitive to fluctuations in raw material prices, particularly copper, which is a key component in PCB manufacturing. Volatile prices of copper and other materials can impact production costs and profit margins for PCB manufacturers. This instability can lead to pricing uncertainties, potentially affecting market growth. Manufacturers may need to adjust their pricing strategies or seek alternative materials, which can be challenging and time-consuming, potentially slowing down market expansion.

Opportunity:

Development of new technologies

The PCB industry is poised to benefit from emerging technologies such as 5G, Internet of Things (IoT), artificial intelligence, and advanced manufacturing techniques. These technologies are driving demand for more sophisticated and high-performance PCBs. For instance, the developments of high-density interconnect (HDI) PCBs and flexible PCBs opens up new applications in wearable devices and compact electronics. Additionally, advancements in PCB manufacturing processes, such as 3D printing, offer opportunities for more efficient and customizable production.

Threat:

Trade restrictions

Tariffs and trade disputes between major economies, particularly the US and China, can disrupt supply chains and increase costs for PCB manufacturers and their customers. These restrictions can lead to sourcing challenges, price increases, and market uncertainties. Companies may need to diversify their supply chains or relocate production facilities, which can be costly, and time-consuming, potentially impacting market growth and stability.

Covid-19 Impact:

The COVID-19 pandemic initially disrupted PCB supply chains and manufacturing operations, causing production delays and shortages. However, increased demand for electronics supporting remote work and digital services partially offset these challenges. The crisis accelerated digital transformation trends, creating long-term growth opportunities for the PCB market, particularly in sectors like healthcare and telecommunications.

The rigid PCBs segment is expected to be the largest during the forecast period

Rigid PCBs are expected to dominate the market due to their widespread use across various industries, including consumer electronics, automotive, and industrial applications. They offer superior durability, reliability, and thermal management compared to flexible PCBs. Rigid PCBs are essential in high-performance electronic devices and can accommodate complex circuitry in a compact space. Their versatility and cost-effectiveness for mass production contribute to their large market share, making them the preferred choice for many applications.

The automotive segment is expected to have the highest CAGR during the forecast period

The automotive sector is expected to register rapid growth in PCB demand due to increasing vehicle electrification and automation. Modern vehicles incorporate numerous electronic systems for functions like infotainment, ADAS, and powertrain control, all requiring sophisticated PCBs. The shift towards electric and autonomous vehicles is further accelerating this trend, as these vehicles rely heavily on complex electronic systems. This growing integration of electronics in automobiles is driving significant demand for PCBs, resulting in segment growth.

Region with largest share:

This Asia Pacific region is estimated to command the largest market share over the prediction period. Asia Pacific's dominance in the PCB market is driven by the presence of major electronics manufacturing hubs in countries like China, Taiwan, Japan, and South Korea. The region boasts a robust supply chain, a skilled workforce, and advanced manufacturing capabilities. Additionally, the high concentration of consumer electronics, automotive, and telecommunications industries in this region fuels the demand for PCBs. Government initiatives supporting electronics manufacturing further contribute to the region's market leadership.

Region with highest CAGR:

This Asia Pacific region is anticipated to witness lucrative growth during the forecast period. Asia Pacific's rapid growth in the PCB market is attributed to several factors. The region is experiencing increasing investments in emerging technologies like 5G, IoT, and AI, which drive demand for advanced PCBs. Growing domestic markets for consumer electronics and automotive products in countries like India and Southeast Asian nations are creating new opportunities. Additionally, the shift of global electronics manufacturing towards Asia and supportive government policies for the electronics industry are accelerating market growth in this region.

Key players in the market

Some of the key players in Printed Circuit Boards (PCBs) market include TTM Technologies Inc., AT&S, Unimicron Technology Corporation, Zhen Ding Tech, Compeq Manufacturing Co., Ltd., Tripod Technology Corporation, Sanmina Corporation, Jabil Inc., Wurth Elektronik Group, Becker & Muller Schaltungsdruck GmbH, RayMing Technology Co., Ltd., Plexus Corporation, Benchmark Electronics, Lenthor Engineering, Samsung Electro-Mechanics, Daeduck Electronics Co. Ltd., Nan Ya PCB Corporation, and Ibiden Co., Ltd.

Key Developments:

In May 2023, TTM Technologies, Inc., a leading global manufacturer of technology solutions including mission systems, radio frequency ("RF") components and RF microwave/microelectronic assemblies and printed circuit boards ("PCB"s) has announced the launch of its 5mm x 3.2mm X-Band 8-12 GHz 3dB hybrid coupler and 20dB directional coupler. These state-of-the-art components are designed to meet the demanding requirements of broadband use in medium power X-Band (8-12GHz) commercial-off-the-shelf (COTS) military and aerospace (Mil-Aero) applications.

In January 2024, AT&S opens its first plant in Malaysia. The Austrian company's new plant in Kulim will produce IC substrates for the next generation of microchips for high-performance computing, data centres and AI applications from manufacturers such as AMD.

In June 2023, HDI PCB maker Compeq Manufacturing is scheduled to kick off production at its new plant in Thailand in the second half of 2024, according to the Taiwan-based company.

Product Types Covered:

• Rigid PCBs
• Flexible PCBs
• Rigid-Flex PCBs
• High Density Interconnect (HDI) PCBs
• Other Product Types

Laminates and Materials Covered:

• Laminate Types
• Base Materials

Manufacturing Processes Covered:

• Fabrication Process
• Assembly Process

Technologies Covered:

• Surface Mount Technology
• 3D Printed PCB Technology
• Through-Hole Technology
• Microwave and RF Technology
• Embedded Component Technology
• Flexible and rigid-flex technology
• High-Density Interconnect (HDI) Technology
• Photochemical Machining Technology
• Laser Direct Imaging (LDI)
• Other Technologies

End Users Covered:

• Consumer Electronics
• Automotive
• Telecommunications
• Medical Devices
• Aerospace and Defense
• Industrial Electronics
• Other End Users

Regions Covered:

• North America
  • US
  • Canada
  • Mexico
• Europe
  • Germany
  • UK
  • Italy
  • France
  • Spain
  • Rest of Europe
• Asia Pacific
  • Japan
  • China
  • India
  • Australia
  • New Zealand
  • South Korea
  • Rest of Asia Pacific
• South America
  • Argentina
  • Brazil
  • Chile
  • Rest of South America
• Middle East & Africa
  • Saudi Arabia
  • UAE
  • Qatar
  • South Africa
  • Rest of Middle East & Africa

What our report offers:

• Market share assessments for the regional and country-level segments
• Strategic recommendations for the new entrants
• Covers Market data for the years 2022, 2023, 2024, 2026, and 2030
• Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
• Strategic recommendations in key business segments based on the market estimations
• Competitive landscaping mapping the key common trends
• Company profiling with detailed strategies, financials, and recent developments
• Supply chain trends mapping the latest technological advancements

Free Customization Offerings:

All the customers of this report will be entitled to receive one of the following free customization options:

• Company Profiling
  • Comprehensive profiling of additional market players (up to 3)
  • SWOT Analysis of key players (up to 3)
• Regional Segmentation
  • Market estimations, Forecasts and CAGR of any prominent country as per the client's interest (Note: Depends on feasibility check)
• Competitive Benchmarking
  • Benchmarking of key players based on product portfolio, geographical presence, and strategic alliances

Table of Contents

1 Executive Summary

2 Preface

• 2.1 Abstract
• 2.2 Stake Holders
• 2.3 Research Scope
• 2.4 Research Methodology
  • 2.4.1 Data Mining
  • 2.4.2 Data Analysis
  • 2.4.3 Data Validation
  • 2.4.4 Research Approach
• 2.5 Research Sources
  • 2.5.1 Primary Research Sources
  • 2.5.2 Secondary Research Sources
  • 2.5.3 Assumptions

3 Market Trend Analysis

• 3.1 Introduction
• 3.2 Drivers
• 3.3 Restraints
• 3.4 Opportunities
• 3.5 Threats
• 3.6 Product Analysis
• 3.7 Technology Analysis
• 3.8 End User Analysis
• 3.9 Emerging Markets
• 3.10 Impact of Covid-19

4 Porters Five Force Analysis

• 4.1 Bargaining power of suppliers
• 4.2 Bargaining power of buyers
• 4.3 Threat of substitutes
• 4.4 Threat of new entrants
• 4.5 Competitive rivalry

5 Global Printed Circuit Boards (PCBs) Market, By Product Type

• 5.1 Introduction
• 5.2 Rigid PCBs
  • 5.2.1 Single-sided
  • 5.2.2 Double-sided
  • 5.2.3 Multi-layer
• 5.3 Flexible PCBs
• 5.4 Rigid-Flex PCBs
• 5.5 High Density Interconnect (HDI) PCBs
• 5.6 Other Product Types
  • 5.6.1 Metal Core PCBs
  • 5.6.2 Aluminum PCBs

6 Global Printed Circuit Boards (PCBs) Market, By Laminates and Materials

• 6.1 Introduction
• 6.2 Laminate Types
  • 6.2.1 Rigid Laminates
  • 6.2.1 FR-4 Standard
  • 6.2.2 FR-4 High Tg
  • 6.2.3 FR-4 Halogen-Free
  • 6.2.4 Other Rigid Laminates
  • 6.2.2 Flexible Laminates
    • 6.2.2.1 Polyimide (PI)
    • 6.2.2.2 Teflon
    • 6.2.2.3 Other Flexible Laminates
  • 6.2.3 Paper-Based Laminates
  • 6.2.4 Composite Laminates
• 6.3 Base Materials
  • 6.3.1 Copper Foil
  • 6.3.2 Dielectric Materials
  • 6.3.3 Adhesive Layers

7 Global Printed Circuit Boards (PCBs) Market, By Manufacturing Processes

• 7.1 Introduction
• 7.2 Fabrication Process
  • 7.2.1 Inner Layer Production
  • 7.2.2 Lamination
  • 7.2.3 Drilling
  • 7.2.4 Metallization
  • 7.2.5 Pattern Plating
  • 7.2.6 Etching
  • 7.2.7 Solder Mask Application
  • 7.2.8 Component Placement and Soldering
  • 7.2.9 Final Testing and Inspection
• 7.3 Assembly Process
  • 7.3.1 Component Preparation
  • 7.3.2 Component Placement
  • 7.3.3 Solder Paste Application
  • 7.3.4 Reflow Soldering
  • 7.3.5 Wave Soldering
  • 7.3.6 Cleaning
  • 7.3.7 Inspection and Testing

8 Global Printed Circuit Boards (PCBs) Market, By Technology

• 8.1 Introduction
• 8.2 Surface Mount Technology
• 8.3 3D Printed PCB Technology
• 8.4 Through-Hole Technology
• 8.5 Microwave and RF Technology
• 8.6 Embedded Component Technology
• 8.7 Flexible and rigid-flex technology
• 8.8 High-Density Interconnect (HDI) Technology
• 8.9 Photochemical Machining Technology
• 8.10 Laser Direct Imaging (LDI)
• 8.11 Other Technologies

9 Global Printed Circuit Boards (PCBs) Market, By End User

• 9.1 Introduction
• 9.2 Consumer Electronics
• 9.3 Automotive
• 9.4 Telecommunications
• 9.5 Medical Devices
• 9.6 Aerospace and Defense
• 9.7 Industrial Electronics
• 9.8 Other End Users

10 Global Printed Circuit Boards (PCBs) Market, By Geography

• 10.1 Introduction
• 10.2 North America
  • 10.2.1 US
  • 10.2.2 Canada
  • 10.2.3 Mexico
• 10.3 Europe
  • 10.3.1 Germany
  • 10.3.2 UK
  • 10.3.3 Italy
  • 10.3.4 France
  • 10.3.5 Spain
  • 10.3.6 Rest of Europe
• 10.4 Asia Pacific
  • 10.4.1 Japan
  • 10.4.2 China
  • 10.4.3 India
  • 10.4.4 Australia
  • 10.4.5 New Zealand
  • 10.4.6 South Korea
  • 10.4.7 Rest of Asia Pacific
• 10.5 South America
  • 10.5.1 Argentina
  • 10.5.2 Brazil
  • 10.5.3 Chile
  • 10.5.4 Rest of South America
• 10.6 Middle East & Africa
  • 10.6.1 Saudi Arabia
  • 10.6.2 UAE
  • 10.6.3 Qatar
  • 10.6.4 South Africa
  • 10.6.5 Rest of Middle East & Africa

11 Key Developments

• 11.1 Agreements, Partnerships, Collaborations and Joint Ventures
• 11.2 Acquisitions & Mergers
• 11.3 New Product Launch
• 11.4 Expansions
• 11.5 Other Key Strategies

12 Company Profiling

• 12.1 TTM Technologies Inc.
• 12.2 AT&S
• 12.3 Unimicron Technology Corporation
• 12.4 Zhen Ding Tech
• 12.5 Compeq Manufacturing Co., Ltd.
• 12.6 Tripod Technology Corporation
• 12.7 Sanmina Corporation
• 12.8 Jabil Inc.
• 12.9 Wurth Elektronik Group
• 12.10 Becker & Muller Schaltungsdruck GmbH
• 12.11 RayMing Technology Co.Ltd
• 12.12 Plexus Corporation
• 12.13 Benchmark Electronics
• 12.14 Lenthor Engineering
• 12.15 Samsung Electro-Mechanics
• 12.16 Daeduck Electronics Co. Ltd.
• 12.17 Nan Ya PCB Corporation
• 12.18 Ibiden Co., Ltd.