½ÃÀ庸°í¼­
»óǰÄÚµå
1558328

SOC(½ºÇÉ ¿Â Ä«º») ½ÃÀå ¿¹Ãø(-2030³â) : Àç·á À¯Çüº°, ±â¼úº°, ¿ëµµº°, ÃÖÁ¾»ç¿ëÀÚº°, Áö¿ªº° ¼¼°è ºÐ¼®

Spin on Carbon Market Forecasts to 2030 - Global Analysis By Material Type (Hot-Temperature Spin on Carbon and Normal-Temperature Spin on Carbon), Technology (Photolithography, Deposition, Etching and Etching), Application, End User and Geography

¹ßÇàÀÏ: | ¸®¼­Ä¡»ç: Stratistics Market Research Consulting | ÆäÀÌÁö Á¤º¸: ¿µ¹® 200+ Pages | ¹è¼Û¾È³» : 2-3ÀÏ (¿µ¾÷ÀÏ ±âÁØ)

    
    
    



¡Ø º» »óǰÀº ¿µ¹® ÀÚ·á·Î Çѱ۰ú ¿µ¹® ¸ñÂ÷¿¡ ºÒÀÏÄ¡ÇÏ´Â ³»¿ëÀÌ ÀÖÀ» °æ¿ì ¿µ¹®À» ¿ì¼±ÇÕ´Ï´Ù. Á¤È®ÇÑ °ËÅ並 À§ÇØ ¿µ¹® ¸ñÂ÷¸¦ Âü°íÇØÁֽñ⠹ٶø´Ï´Ù.

Stratistics MRC¿¡ µû¸£¸é, ¼¼°è SOC(½ºÇÉ ¿Â Ä«º») ½ÃÀåÀº 2024³â 2¾ï 5,000¸¸ ´Þ·¯ ±Ô¸ð¿¡¼­ 2030³â 11¾ï 4,000¸¸ ´Þ·¯¿¡ ´ÞÇÒ °ÍÀ¸·Î ¿¹»óµÇ¸ç, ¿¹Ãø ±â°£ µ¿¾È 28.4%ÀÇ CAGRÀ» ±â·ÏÇÒ °ÍÀ¸·Î ¿¹»óµË´Ï´Ù.

SOC(Spin on Carbon)(SOC)´Â ¹ÝµµÃ¼ Á¦Á¶¿¡¼­ Æ÷Å丮¼Ò±×·¡ÇÇ ¹× ¿¡Äª °øÁ¤¿¡¼­ Èñ»ýÃþÀ¸·Î »ç¿ëµÇ´Â Ư¼ö Àç·á·Î, ¿þÀÌÆÛ¿¡ ¾×ü·Î µµÆ÷µÈ ÈÄ È¸ÀüÇÏ¿© ±ÕÀÏÇÑ Åº¼Ò ÃþÀ» Çü¼ºÇÏ¿© º¸È£ ¶Ç´Â Àý¿¬ À庮À¸·Î ÀÛ¿ëÇÑ´Ù, ¸Þ¸ð¸® ¼ÒÀÚ, ·ÎÁ÷ ¼ÒÀÚ, 3D NAND¿¡ ¹Ì¼¼ÇÑ ÆÐÅÏÀ» Çü¼ºÇÏ¿© ´õ ÀÛ°í È¿À²ÀûÀÎ ¹ÝµµÃ¼ ºÎǰÀÇ Á¤¹ÐÇÑ ¿¡Äª ¹× ÁõÂøÀ» °¡´ÉÇÏ°Ô Çϴ ÷´Ü ³ëµå¿¡ ÇʼöÀûÀÎ ¿ä¼ÒÀÔ´Ï´Ù.

¹ÝµµÃ¼»ê¾÷Çùȸ(SIA)¿¡ µû¸£¸é 2024³â 2ºÐ±â ¼¼°è ¹ÝµµÃ¼ »ê¾÷ ¸ÅÃâÀº 1,499¾ï ´Þ·¯·Î 2023³â 2ºÐ±â ´ëºñ 18.3%, 2024³â 1ºÐ±â ´ëºñ 6.5% Áõ°¡Çß½À´Ï´Ù.

¹ÝµµÃ¼ »ê¾÷ÀÇ ¼ö¿ä Áõ°¡

¹ÝµµÃ¼ »ê¾÷ÀÇ ±Þ¼ÓÇÑ ¼ºÀå°ú ²÷ÀÓ¾ø´Â ÁøÈ­´Â SOC(Spin-on-Carbon) Àç·á¿¡ ´ëÇÑ ¼ö¿ä¸¦ ÁÖµµÇϰí ÀÖ½À´Ï´Ù. ÀÌ·¯ÇÑ Àç·á´Â ƯÈ÷ Æ÷Å丮¼Ò±×·¡ÇÇ ¹× ¿¡Äª°ú °°Àº ÃÖ÷´Ü ¹ÝµµÃ¼ Á¦Á¶ °øÁ¤¿¡¼­ Áß¿äÇÑ ¿ªÇÒÀ» ´ã´çÇϰí ÀÖ½À´Ï´Ù. Ĩ Á¦Á¶¾÷üµéÀÌ ´õ ÀÛ°í È¿À²ÀûÀÎ µð¹ÙÀ̽º¸¦ ¸¸µé±â À§ÇØ ³ë·ÂÇÏ´Â °¡¿îµ¥, ÆÐÅÏ Àü»ç Á¤È®µµ¸¦ ³ôÀ̰í Àüü µð¹ÙÀ̽º ¼º´ÉÀ» Çâ»ó½ÃŰ´Â SOC(Spin-on-Carbon)ÀÇ ±â´ÉÀº Á¡Á¡ ´õ Áß¿äÇØÁö°í ÀÖ½À´Ï´Ù. ÀÌ·¯ÇÑ ¹ÝµµÃ¼ Á¦Á¶¾÷üÀÇ ¼ö¿ä Áõ°¡´Â SOC(Spin-on-Carbon) ½ÃÀåÀ» ¹ßÀü½ÃŰ´Â Áß¿äÇÑ ¿äÀÎÀÔ´Ï´Ù.

ÀÀ¿ë ÇÁ·Î±×·¥ÀÇ º¹À⼺

¹ÝµµÃ¼ Á¦Á¶¿¡ SOC(Spin-on-Carbon) Àç·á¸¦ Àû¿ëÇÏ·Á¸é Á¤¹ÐÇÑ Á¦¾î¿Í Àü¹® Áö½ÄÀÌ ÇÊ¿äÇÕ´Ï´Ù. ÀÌ °øÁ¤Àº ÄÚÆÃ, º£ÀÌÅ·, ¿¡Äª°ú °°Àº º¹ÀâÇÑ °øÁ¤À» Æ÷ÇÔÇϸç, Ư¼ö Àåºñ¿Í ¼÷·ÃµÈ ±â¼úÀÚ°¡ ÇÊ¿äÇÕ´Ï´Ù. ÄÚÆÃÀÌ À߸øµÇ¸é ÃÖÁ¾ Á¦Ç°¿¡ °áÇÔÀÌ ¹ß»ýÇÏ¿© ¼öÀ²ÀÌ ¶³¾îÁú ¼ö ÀÖ½À´Ï´Ù. ÀÌ·¯ÇÑ º¹À⼺Àº ƯÈ÷ ¼Ò±Ô¸ð Á¦Á¶¾÷ü³ª ÷´Ü °øÁ¤À¸·Î ÀüȯÇÏ·Á´Â Á¦Á¶¾÷üÀÇ Ã¤Åà À庮ÀÌ µÇ¾î ½ÃÀå ¼ºÀåÀ» ÀúÇØÇÏ´Â ¿äÀÎÀ¸·Î ÀÛ¿ëÇÒ ¼ö ÀÖ½À´Ï´Ù.

÷´Ü ¹ÝµµÃ¼ °øÁ¤ÀÇ ¿¬±¸°³¹ß

÷´Ü ¹ÝµµÃ¼ °øÁ¤ÀÇ ¿¬±¸ °³¹ßÀº SOC(Spin-on-Carbon) ½ÃÀå¿¡ Å« ±âȸ¸¦ Á¦°øÇϰí ÀÖ½À´Ï´Ù. ¾÷°è°¡ ´õ ÀÛÀº ³ëµå Å©±â¿Í ´õ º¹ÀâÇÑ 3D ¾ÆÅ°ÅØÃ³·Î À̵¿ÇÔ¿¡ µû¶ó ÀÌ·¯ÇÑ °úÁ¦¸¦ ÇØ°áÇÒ ¼ö ÀÖ´Â Çõ½ÅÀûÀÎ Àç·á¿¡ ´ëÇÑ ¿ä±¸°¡ Áõ°¡Çϰí ÀÖÀ¸¸ç, SOC(Spin-on-Carbon) Àç·á´Â ÆÐÅÏ Àü»ç, ¿¡Äª ÀúÇ× ¹× Àü¹ÝÀûÀÎ µð¹ÙÀ̽º ¼º´É °³¼±ÀÇ ÀáÀç·ÂÀ» Á¦°øÇÔÀ¸·Î½á ÀÌ·¯ÇÑ ¿ä±¸¸¦ ÃæÁ·½Ãų ¼ö ÀÖ´Â ÁÁÀº À§Ä¡¿¡ ÀÖ½À´Ï´Ù. ÀÌ·¯ÇÑ ¿ä±¸¸¦ ÃæÁ·½Ãų ¼ö ÀÖ´Â ÁÁÀº À§Ä¡¿¡ ÀÖ½À´Ï´Ù. µû¶ó¼­ ½ÃÀå Âü¿©ÀÚµéÀº »õ·Î¿î ¹èÇÕ°ú ¿ëµµ¸¦ °³¹ßÇÏ¿© Á¦Ç° Æ÷Æ®Æú¸®¿À¿Í ½ÃÀå ¹üÀ§¸¦ È®ÀåÇÒ ¼ö ÀÖ´Â ±âȸ¸¦ ¾ò°Ô µÇ¾ú½À´Ï´Ù.

ºÒ¾ÈÁ¤ÇÑ ¿øÀÚÀç °¡°Ý

½ºÇÉ ¿Â Ä«º» ½ÃÀåÀº ºÒ¾ÈÁ¤ÇÑ ¿ø·á °¡°ÝÀÇ À§Çù¿¡ Á÷¸éÇØ ÀÖ½À´Ï´Ù. ÀÌ·¯ÇÑ Àç·áÀÇ »ý»êÀº Á¾Á¾ Ư¼ö È­ÇÐ Àü±¸Ã¼¿¡ ÀÇÁ¸ÇÏ´Â °æ¿ì°¡ ¸¹À¸¸ç, °ø±Þ¸Á È¥¶õ, ÁöÁ¤ÇÐÀû »ç°Ç, »ý»ê´É·ÂÀÇ º¯È­ µî ´Ù¾çÇÑ ¿äÀÎÀ¸·Î ÀÎÇØ °¡°ÝÀÌ º¯µ¿µÉ ¼ö ÀÖ½À´Ï´Ù. ÀÌ·¯ÇÑ °¡°Ý º¯µ¿Àº Á¦Á¶¾÷üÀÇ ¼öÀÍ·ü¿¡ ¿µÇâÀ» ¹ÌÃÄ ÃÖÁ¾»ç¿ëÀÚÀÇ ºñ¿ë »ó½ÂÀ¸·Î À̾îÁú ¼ö ÀÖ½À´Ï´Ù. ÀÌ·¯ÇÑ ¿øÀÚÀç °¡°ÝÀÇ ºÒÈ®½Ç¼ºÀº ½ÃÀåÀÇ ¾ÈÁ¤¼ºÀ» À§ÇùÇϰí äÅ÷üÀ» µÐÈ­½Ãų ¼ö ÀÖ½À´Ï´Ù.

COVID-19ÀÇ ¿µÇâ:

COVID-19´Â Ãʱ⿡´Â ¹ÝµµÃ¼ °ø±Þ¸Á¿¡ È¥¶õÀ» ÀÏÀ¸ÄÑ SOC(½ºÇÉ¿ÂÄ«º») ½ÃÀå¿¡ ¿µÇâÀ» ¹ÌÃÆ½À´Ï´Ù. ±×·¯³ª ¿ø°Ý ±Ù¹«¿Í µðÁöÅÐ ÀüȯÀ¸·Î ÀÎÇÑ ÀüÀÚ±â±â ¼ö¿ä Áõ°¡·Î ¹ÝµµÃ¼ »ý»êÀÌ °¡¼ÓÈ­µÇ¸é¼­ SOC(½ºÇÉ¿ÂÄ«º») ½ÃÀåÀÌ ¼ºÀå¼¼¸¦ º¸À̰í ÀÖ½À´Ï´Ù. ¶ÇÇÑ, ÆÒµ¥¹ÍÀº ±¹³» ¹ÝµµÃ¼ »ý»ê´É·ÂÀÇ Á߿伺À» ºÎ°¢½ÃÄÑ ´Ù¾çÇÑ Áö¿ª¿¡¼­ Àå±âÀûÀÎ ¼ºÀåÀ» ÃËÁøÇÒ ¼ö ÀÖ½À´Ï´Ù.

¿¹Ãø ±â°£ µ¿¾È »ó¿Â SOC(½ºÇÉ ¿Â Ä«º») ºÎ¹®ÀÌ °¡Àå Å« ºñÁßÀ» Â÷ÁöÇÒ °ÍÀ¸·Î ¿¹»óµË´Ï´Ù.

»ó¿Â SOC(spin-on-carbon) ºÎ¹®Àº ´ÙÀç´Ù´ÉÇÏ°í ±âÁ¸ ¹ÝµµÃ¼ Á¦Á¶ °øÁ¤¿¡ ½±°Ô ÅëÇÕÇÒ ¼ö Àֱ⠶§¹®¿¡ ½ÃÀåÀ» Àå¾ÇÇÒ °¡´É¼ºÀÌ ³ô½À´Ï´Ù. ÀÌ ¼ÒÀçµéÀº ¼º´É°ú ºñ¿ë È¿À²¼ºÀÇ ±ÕÇüÀÌ Àß ÀâÇô ÀÖ¾î ¹ÝµµÃ¼ »ê¾÷ÀÇ ´Ù¾çÇÑ ÀÀ¿ë ºÐ¾ß¿¡ ÀûÇÕÇÕ´Ï´Ù. Ç¥ÁØ Ã³¸® ¿Âµµ¿¡¼­ ¿ì¼öÇÑ ¿¡Äª ÀúÇ×°ú ÆÐÅÏ Àü»ç Á¤¹Ðµµ¸¦ Á¦°øÇÒ ¼ö Àֱ⠶§¹®¿¡ ´ë·® »ý»ê¿¡ ƯÈ÷ ¸Å·ÂÀûÀÔ´Ï´Ù. ¹ÝµµÃ¼ »ê¾÷ÀÌ °è¼Ó ¹ßÀüÇÔ¿¡ µû¶ó ÀÌ·¯ÇÑ Àç·á¿¡ ´ëÇÑ ¼ö¿ä°¡ Áõ°¡ÇÏ°í ½ÃÀå Áö¹è·ÂÀ» °­È­ÇÒ °ÍÀ¸·Î ¿¹»óµË´Ï´Ù.

¿¹Ãø ±â°£ µ¿¾È °¡Àå ³ôÀº CAGRÀ» ±â·ÏÇÒ °ÍÀ¸·Î ¿¹»óµÇ´Â ºÐ¾ß´Â ÁýÀû µð¹ÙÀ̽º Á¦Á¶¾÷ü(IDM) ºÎ¹®ÀÔ´Ï´Ù.

ÁýÀû µð¹ÙÀ̽º Á¦Á¶¾÷ü(IDM) ºÎ¹®Àº ¸î °¡Áö ¿äÀÎÀ¸·Î ÀÎÇØ °¡Àå ³ôÀº ¼ºÀå·üÀ» º¸ÀÏ °ÍÀ¸·Î ¿¹»óµË´Ï´Ù. µ¶ÀÚÀûÀÎ ¹ÝµµÃ¼ ĨÀ» ¼³°è, Á¦Á¶, ÆÇ¸ÅÇÏ´Â IDMÀº °æÀï·ÂÀ» À¯ÁöÇϱâ À§ÇØ Ã·´Ü Á¦Á¶ °øÁ¤À» äÅÃÇϰí ÀÖ½À´Ï´Ù. ÀÌ¿¡ µû¶ó SOC(Spin-on-Carbon)¿Í °°Àº °í¼º´É ¼ÒÀç¿¡ ´ëÇÑ ¼ö¿ä°¡ Áõ°¡Çϰí ÀÖ½À´Ï´Ù. ¶ÇÇÑ, IDMÀº ´Ù¸¥ ºÐ¾ßº¸´Ù ½Å¼ÒÀç¿Í ½Å°øÁ¤À» ºü¸£°Ô µµÀÔÇÒ ¼ö ÀÖ´Â ÀÚ¿ø°ú Àü¹® Áö½ÄÀ» º¸À¯Çϰí ÀÖ´Â °æ¿ì°¡ ¸¹À¸¸ç, IDMÀÌ ¹ÝµµÃ¼ ±â¼úÀÇ ÇѰ踦 °è¼Ó ³ÐÇô°¡°í Àֱ⠶§¹®¿¡ SOC(½ºÇÉ¿ÂÄ«º») ¼ÒÀçÀÇ Ã¤ÅÃÀÌ °¡¼ÓÈ­µÇ¾î ½ÃÀå ¼ºÀå¿¡ Å©°Ô ±â¿©ÇÒ °ÍÀ¸·Î ¿¹»óµË´Ï´Ù.

°¡Àå Å« Á¡À¯À²À» Â÷ÁöÇÏ´Â Áö¿ª:

¾Æ½Ã¾ÆÅÂÆò¾çÀº ¹ÝµµÃ¼ Á¦Á¶¿¡¼­ °­·ÂÇÑ ÀÔÁö¸¦ °¡Áö°í Àֱ⠶§¹®¿¡ SOC(½ºÇÉ¿ÂÄ«º») ½ÃÀåÀ» ÁÖµµÇÒ °ÍÀ¸·Î ¿¹»óµË´Ï´Ù. ´ë¸¸, Çѱ¹, Áß±¹ µîÀÇ ±¹°¡´Â ÁÖ¿ä ¹ÝµµÃ¼ ÆÄ¿îµå¸® ¹× IDMÀÇ º»°ÅÁö·Î¼­ ÷´Ü ¼ÒÀç¿¡ ´ëÇÑ Å« ¼ö¿ä¸¦ ÁÖµµÇϰí ÀÖ½À´Ï´Ù. ÀÌ Áö¿ªÀÇ ¹ÝµµÃ¼ ÀÎÇÁ¶ó¿¡ ´ëÇÑ Áö¼ÓÀûÀÎ ÅõÀÚ¿Í »ý»ê´É·Â È®´ë´Â ½ÃÀå ¼ºÀåÀ» ´õ¿í ÃËÁøÇϰí ÀÖ½À´Ï´Ù. ¶ÇÇÑ, Áß±¹, Àεµ¿Í °°Àº ±¹°¡µéÀÇ ±¹³» ¹ÝµµÃ¼ »ý»ê´É·ÂÀ» °­È­Çϱâ À§ÇÑ Á¤ºÎÀÇ ³ë·ÂÀº ÀÌ Áö¿ªÀÇ ½ÃÀå Áö¹è·Â¿¡ ±â¿©ÇÒ °ÍÀ¸·Î º¸ÀÔ´Ï´Ù.

CAGRÀÌ °¡Àå ³ôÀº Áö¿ª:

¾Æ½Ã¾ÆÅÂÆò¾çÀº SOC(½ºÇÉ¿ÂÄ«º») ½ÃÀå¿¡¼­ °¡Àå ³ôÀº ¼ºÀå·üÀ» º¸ÀÏ °ÍÀ¸·Î ¿¹»óµË´Ï´Ù. ÀÌ·¯ÇÑ ºü¸¥ ¼ºÀåÀº ÀÌ Áö¿ªÀÇ ¹ÝµµÃ¼ »ê¾÷ È®´ë, ÷´Ü Á¦Á¶ °øÁ¤ÀÇ Ã¤Åà Áõ°¡, ÀüÀÚ±â±â ¼ö¿ä Áõ°¡¿¡ ÈûÀÔÀº ¹Ù Å®´Ï´Ù. ¼¼°è ¹ÝµµÃ¼ Á¦Á¶ÀÇ ¾Æ½Ã¾Æ·ÎÀÇ À̵¿Àº ÷´Ü °øÀå ¹× R&D ¼¾ÅÍ¿¡ ´ëÇÑ Áö¼ÓÀûÀÎ ÅõÀÚ¿Í ÇÔ²² ½ÃÀå È®´ë¸¦ À§ÇÑ ºñ¿ÁÇÑ Åä¾çÀ» Á¶¼ºÇϰí ÀÖ½À´Ï´Ù. ¶ÇÇÑ, 5G, AI, IoT¿Í °°Àº ½ÅÈï ±â¼ú¿¡ ´ëÇÑ °ü½ÉÀÌ ³ô¾ÆÁö¸é¼­ SOC(Spin-on-Carbon)¸¦ Æ÷ÇÔÇÑ Ã·´Ü ¹ÝµµÃ¼ ¼ÒÀç¿¡ ´ëÇÑ ¼ö¿ä°¡ ´õ¿í Áõ°¡ÇÒ °ÍÀ¸·Î ¿¹»óµË´Ï´Ù.

¹«·á Ä¿½ºÅ͸¶ÀÌ¡ ¼­ºñ½º

ÀÌ º¸°í¼­¸¦ ±¸µ¶ÇÏ´Â °í°´Àº ´ÙÀ½°ú °°Àº ¹«·á ¸ÂÃãÈ­ ¿É¼Ç Áß Çϳª¸¦ »ç¿ëÇÒ ¼ö ÀÖ½À´Ï´Ù.

  • ±â¾÷ °³¿ä
    • Ãß°¡ ½ÃÀå ±â¾÷ÀÇ Á¾ÇÕÀûÀÎ ÇÁ·ÎÆÄÀϸµ(ÃÖ´ë 3°³»ç±îÁö)
    • ÁÖ¿ä ±â¾÷ SWOT ºÐ¼®(ÃÖ´ë 3°³»ç)
  • Áö¿ª ¼¼ºÐÈ­
    • °í°´ÀÇ °ü½É¿¡ µû¸¥ ÁÖ¿ä ±¹°¡º° ½ÃÀå ÃßÁ¤Ä¡, ¿¹Ãø, CAGR(ÁÖ : Ÿ´ç¼º °ËÅä¿¡ µû¸¥)
  • °æÀï»ç º¥Ä¡¸¶Å·
    • Á¦Ç° Æ÷Æ®Æú¸®¿À, Áö¸®Àû ÀÔÁö, Àü·«Àû Á¦ÈÞ¸¦ ±â¹ÝÀ¸·Î ÇÑ ÁÖ¿ä ±â¾÷ º¥Ä¡¸¶Å·

¸ñÂ÷

Á¦1Àå ÁÖ¿ä ¿ä¾à

Á¦2Àå ¼­¹®

  • °³¿ä
  • ÀÌÇØ°ü°èÀÚ
  • Á¶»ç ¹üÀ§
  • Á¶»ç ¹æ¹ý
    • µ¥ÀÌÅÍ ¸¶ÀÌ´×
    • µ¥ÀÌÅÍ ºÐ¼®
    • µ¥ÀÌÅÍ °ËÁõ
    • Á¶»ç Á¢±Ù¹ý
  • Á¶»ç Á¤º¸ Ãâó
    • 1Â÷ Á¶»ç Á¤º¸ Ãâó
    • 2Â÷ Á¶»ç Á¤º¸ Ãâó
    • °¡Á¤

Á¦3Àå ½ÃÀå µ¿Ç⠺м®

  • ¼ºÀå ÃËÁø¿äÀÎ
  • ¼ºÀå ¾ïÁ¦¿äÀÎ
  • ±âȸ
  • À§Çù
  • ±â¼ú ºÐ¼®
  • ¿ëµµ ºÐ¼®
  • ÃÖÁ¾»ç¿ëÀÚ ºÐ¼®
  • ½ÅÈï ½ÃÀå
  • COVID-19ÀÇ ¿µÇâ

Á¦4Àå Porter's Five Forces ºÐ¼®

  • °ø±Þ ±â¾÷ÀÇ ±³¼··Â
  • ±¸¸ÅÀÚÀÇ ±³¼··Â
  • ´ëüǰÀÇ À§Çù
  • ½Å±Ô Âü¿©¾÷üÀÇ À§Çù
  • °æÀï ±â¾÷ °£ÀÇ °æÀï °ü°è

Á¦5Àå ¼¼°èÀÇ SOC(½ºÇÉ ¿Â Ä«º») ½ÃÀå : Àç·á À¯Çüº°

  • °í¿Â SOC(½ºÇÉ ¿Â Ä«º»)
  • »ó¿Â SOC(½ºÇÉ ¿Â Ä«º»)

Á¦6Àå ¼¼°èÀÇ SOC(½ºÇÉ ¿Â Ä«º») ½ÃÀå : ±â¼úº°

  • Æ÷Å丮¼Ò±×·¡ÇÇ
    • UV ¸®¼Ò±×·¡ÇÇ
    • EUV ¸®¼Ò±×·¡ÇÇ
  • Áõ¾ð·ÏÃë
    • È­ÇÐ ÁõÂø¹ý(CVD)
    • ¹°¸® ÁõÂø¹ý(PVD)
  • ¿¡Äª
    • µå¶óÀÌ ¿¡Äª
    • ¿þÆ® ¿¡Äª
  • È­ÇÐ ±â°è Æòźȭ(CMP)

Á¦7Àå ¼¼°èÀÇ SOC(½ºÇÉ ¿Â Ä«º») ½ÃÀå : ¿ëµµº°

  • ·ÎÁ÷ µð¹ÙÀ̽º
  • ¸Þ¸ð¸® µð¹ÙÀ̽º
    • 3D NAND
    • ´ÙÀ̳ª¹Í ·£´ý ¾×¼¼½º ¸Þ¸ð¸®(DRAM)
  • ÆÄ¿ö µð¹ÙÀ̽º
  • ¹Ì¼¼ÀüÀÚ±â°è ½Ã½ºÅÛ(MEMS)
  • Æ÷Åä´Ð½º
  • ÷´Ü Æ÷Àå
  • ±âŸ ¿ëµµ
    • ÇÁ¸°Æ¼µå ÀÏ·ºÆ®·Î´Ð½º
    • Ç÷º¼­ºí ÀÏ·ºÆ®·Î´Ð½º

Á¦8Àå ¼¼°èÀÇ SOC(½ºÇÉ ¿Â Ä«º») ½ÃÀå : ÃÖÁ¾»ç¿ëÀÚº°

  • ¹ÝµµÃ¼ ÆÄ¿îµå¸®
  • ÅëÇÕ µð¹ÙÀ̽º Á¦Á¶¾÷ü(IDM)
  • ¾Æ¿ô¼Ò½Ì ¹ÝµµÃ¼ Á¶¸³¡¤Å×½ºÆ®(OSAT)

Á¦9Àå ¼¼°èÀÇ SOC(½ºÇÉ ¿Â Ä«º») ½ÃÀå : Áö¿ªº°

  • ºÏ¹Ì
    • ¹Ì±¹
    • ij³ª´Ù
    • ¸ß½ÃÄÚ
  • À¯·´
    • µ¶ÀÏ
    • ¿µ±¹
    • ÀÌÅ»¸®¾Æ
    • ÇÁ¶û½º
    • ½ºÆäÀÎ
    • ±âŸ À¯·´
  • ¾Æ½Ã¾ÆÅÂÆò¾ç
    • ÀϺ»
    • Áß±¹
    • Àεµ
    • È£ÁÖ
    • ´ºÁú·£µå
    • Çѱ¹
    • ±âŸ ¾Æ½Ã¾ÆÅÂÆò¾ç
  • ³²¹Ì
    • ¾Æ¸£ÇîÆ¼³ª
    • ºê¶óÁú
    • Ä¥·¹
    • ±âŸ ³²¹Ì
  • Áßµ¿ ¹× ¾ÆÇÁ¸®Ä«
    • »ç¿ìµð¾Æ¶óºñ¾Æ
    • ¾Æ¶ø¿¡¹Ì¸®Æ®
    • īŸ¸£
    • ³²¾ÆÇÁ¸®Ä«°øÈ­±¹
    • ±âŸ Áßµ¿ ¹× ¾ÆÇÁ¸®Ä«

Á¦10Àå ÁÖ¿ä ¹ßÀü

  • °è¾à, ÆÄÆ®³Ê½Ê, Çù¾÷, ÇÕÀÛÅõÀÚ
  • Àμö¿Í ÇÕº´
  • ½ÅÁ¦Ç° ¹ß¸Å
  • »ç¾÷ È®´ë
  • ±âŸ ÁÖ¿ä Àü·«

Á¦11Àå ±â¾÷ °³¿ä

  • Shell
  • Amazon
  • Deutsche Telekom
  • Samsung
  • Google
  • South Pole Group
  • 3Degrees
  • Finite Carbon
  • EKI Energy Services Ltd
  • IETA
  • Merck KGaA
  • Shin-Etsu Chemical Co.
  • Brewer Science, Inc.
  • JSR Micro, Inc.
  • Nano-C
  • DNF Co., Ltd.
  • DGB Group
  • NativeEnergy
ksm 24.10.07

According to Stratistics MRC, the Global Spin on Carbon Market is accounted for $0.25 billion in 2024 and is expected to reach $1.14 billion by 2030, growing at a CAGR of 28.4% during the forecast period. Spin on Carbon (SOC) is a specialized material used in semiconductor manufacturing as a sacrificial layer during photolithography and etching processes. It is applied as a liquid and spun onto the wafer to form a uniform carbon layer, which acts as a protective or insulating barrier. SOC is essential in advanced nodes for creating fine patterns in memory devices, logic devices, and 3D NAND, enabling precise etching and deposition for smaller, more efficient semiconductor components.

According to the Semiconductor Industry Association (SIA), global semiconductor industry sales totaled $149.9 billion during the second quarter of 2024, an increase of 18.3% compared to the second quarter of 2023 and 6.5% more than the first quarter of 2024.

Market Dynamics:

Driver:

Increasing demand in semiconductor industry

The semiconductor industry's rapid growth and constant evolution are driving the demand for spin on carbon materials. These materials play a crucial role in advanced semiconductor manufacturing processes, particularly in photolithography and etching. As chip manufacturers strive for smaller, more efficient devices, spin on carbon's ability to enhance pattern transfer accuracy and improve overall device performance becomes increasingly valuable. This growing demand from semiconductor manufacturers is a key factor propelling the spin on carbon market forward.

Restraint:

Complexity in application

The application of spin on carbon materials in semiconductor manufacturing requires precise control and expertise. The process involves complex steps such as coating, baking, and etching, which demand specialized equipment and skilled technicians. Any errors in application can lead to defects in the final product, potentially causing yield losses. This complexity can be a barrier to adoption, especially for smaller manufacturers or those transitioning to advanced processes, thus restraining market growth.

Opportunity:

R&D in advanced semiconductor processes

Ongoing research and development in advanced semiconductor processes present significant opportunities for the spin on carbon market. As the industry moves towards smaller node sizes and more complex 3D architectures, there is a growing need for innovative materials that can meet these challenges. Spin on carbon materials are well-positioned to address these needs, offering potential improvements in pattern transfer, etch resistance, and overall device performance. This creates opportunities for market players to develop new formulations and applications, expanding their product portfolios and market reach.

Threat:

Volatile raw material prices

The spin on carbon market faces a threat from volatile raw material prices. The production of these materials often relies on specialized chemical precursors, which can be subject to price fluctuations due to various factors such as supply chain disruptions, geopolitical events, or changes in production capacities. These price volatilities can impact manufacturers' profit margins and potentially lead to increased costs for end-users. This uncertainty in raw material costs poses a threat to market stability and could potentially slow down adoption rates.

Covid-19 Impact:

The COVID-19 pandemic initially disrupted semiconductor supply chains, impacting the spin on carbon market. However, increased demand for electronic devices due to remote work and digital transformation accelerated semiconductor production, subsequently boosting the spin on carbon market. The pandemic also highlighted the importance of domestic semiconductor manufacturing capabilities, potentially driving long-term growth in various regions.

The normal-temperature spin on carbon segment is expected to be the largest during the forecast period

The normal-temperature spin on carbon segment is likely to dominate the market due to their versatility and ease of integration into existing semiconductor manufacturing processes. These materials offer a good balance of performance and cost-effectiveness, making them suitable for a wide range of applications in the semiconductor industry. Their ability to provide excellent etch resistance and pattern transfer accuracy at standard processing temperatures makes them particularly attractive for high-volume manufacturing. As the semiconductor industry continues to evolve, the demand for these materials is expected to grow, driving their market dominance.

The integrated device manufacturers (IDMs) segment is expected to have the highest CAGR during the forecast period

The integrated device manufacturers (IDMs) segment is projected to witness the highest growth rate due to several factors. IDMs, which design, manufacture, and sell their own semiconductor chips, are increasingly adopting advanced manufacturing processes to maintain competitiveness. This drives their demand for high-performance materials like spin on carbon. Additionally, IDMs often have the resources and expertise to implement new materials and processes more quickly than other segments. As IDMs continue to push the boundaries of semiconductor technology, their adoption of spin on carbon materials is expected to accelerate, contributing significantly to market growth.

Region with largest share:

Asia Pacific region is expected to dominate the spin on carbon market due to its strong presence in semiconductor manufacturing. Countries like Taiwan, South Korea, and China are home to major semiconductor foundries and IDMs, driving significant demand for advanced materials. The region's continued investment in semiconductor infrastructure and capacity expansion further supports market growth. Additionally, government initiatives to boost domestic semiconductor capabilities in countries like China and India are likely to contribute to the region's market dominance.

Region with highest CAGR:

Asia Pacific region is also anticipated to witness the highest growth rate in the spin on carbon market. This rapid growth is fueled by the region's expanding semiconductor industry, increasing adoption of advanced manufacturing processes, and rising demand for electronic devices. The shift of global semiconductor manufacturing towards Asia, coupled with ongoing investments in cutting-edge fabs and R&D centers, creates a fertile ground for market expansion. Moreover, the growing focus on emerging technologies like 5G, AI, and IoT in the region is expected to drive further demand for advanced semiconductor materials, including spin on carbon.

Key players in the market

Some of the key players in Spin on Carbon Market include Shell, Amazon, Deutsche Telekom, Samsung, Google, South Pole Group, 3Degrees, Finite Carbon, EKI Energy Services Ltd, IETA, Merck KGaA, Shin-Etsu Chemical Co., Brewer Science, Inc., JSR Micro, Inc., Nano-C, DNF Co., Ltd., DGB Group, and NativeEnergy.

Key Developments:

In February 2023, Merck expanded its presence in Kaohsiung, Taiwan, with a new production facility for its semiconductor solutions business. This expansion could potentially impact their involvement in spin-on carbon materials, which are used in semiconductor manufacturing.

Material Types Covered:

  • Hot-Temperature Spin on Carbon
  • Normal-Temperature Spin on Carbon

Technologies Covered:

  • Photolithography
  • Deposition
  • Etching
  • Chemical Mechanical Planarization (CMP)

Applications Covered:

  • Logic Devices
  • Memory Devices
  • Power Devices
  • Microelectromechanical Systems (MEMS)
  • Photonics
  • Advanced Packaging
  • Other Applications

End Users Covered:

  • Semiconductor Foundries
  • Integrated Device Manufacturers (IDMs)
  • Outsourced Semiconductor Assembly and Test (OSAT)

Regions Covered:

  • North America
    • US
    • Canada
    • Mexico
  • Europe
    • Germany
    • UK
    • Italy
    • France
    • Spain
    • Rest of Europe
  • Asia Pacific
    • Japan
    • China
    • India
    • Australia
    • New Zealand
    • South Korea
    • Rest of Asia Pacific
  • South America
    • Argentina
    • Brazil
    • Chile
    • Rest of South America
  • Middle East & Africa
    • Saudi Arabia
    • UAE
    • Qatar
    • South Africa
    • Rest of Middle East & Africa

What our report offers:

  • Market share assessments for the regional and country-level segments
  • Strategic recommendations for the new entrants
  • Covers Market data for the years 2022, 2023, 2024, 2026, and 2030
  • Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
  • Strategic recommendations in key business segments based on the market estimations
  • Competitive landscaping mapping the key common trends
  • Company profiling with detailed strategies, financials, and recent developments
  • Supply chain trends mapping the latest technological advancements

Free Customization Offerings:

All the customers of this report will be entitled to receive one of the following free customization options:

  • Company Profiling
    • Comprehensive profiling of additional market players (up to 3)
    • SWOT Analysis of key players (up to 3)
  • Regional Segmentation
    • Market estimations, Forecasts and CAGR of any prominent country as per the client's interest (Note: Depends on feasibility check)
  • Competitive Benchmarking
    • Benchmarking of key players based on product portfolio, geographical presence, and strategic alliances

Table of Contents

1 Executive Summary

2 Preface

  • 2.1 Abstract
  • 2.2 Stake Holders
  • 2.3 Research Scope
  • 2.4 Research Methodology
    • 2.4.1 Data Mining
    • 2.4.2 Data Analysis
    • 2.4.3 Data Validation
    • 2.4.4 Research Approach
  • 2.5 Research Sources
    • 2.5.1 Primary Research Sources
    • 2.5.2 Secondary Research Sources
    • 2.5.3 Assumptions

3 Market Trend Analysis

  • 3.1 Introduction
  • 3.2 Drivers
  • 3.3 Restraints
  • 3.4 Opportunities
  • 3.5 Threats
  • 3.6 Technology Analysis
  • 3.7 Application Analysis
  • 3.8 End User Analysis
  • 3.9 Emerging Markets
  • 3.10 Impact of Covid-19

4 Porters Five Force Analysis

  • 4.1 Bargaining power of suppliers
  • 4.2 Bargaining power of buyers
  • 4.3 Threat of substitutes
  • 4.4 Threat of new entrants
  • 4.5 Competitive rivalry

5 Global Spin on Carbon Market, By Material Type

  • 5.1 Introduction
  • 5.2 Hot-Temperature Spin on Carbon
  • 5.3 Normal-Temperature Spin on Carbon

6 Global Spin on Carbon Market, By Technology

  • 6.1 Introduction
  • 6.2 Photolithography
    • 6.2.1 UV Lithography
    • 6.2.2 EUV Lithography
  • 6.3 Deposition
    • 6.3.1 Chemical Vapor Deposition (CVD)
    • 6.3.2 Physical Vapor Deposition (PVD)
  • 6.4 Etching
    • 6.4.1 Dry Etching
    • 6.4.2 Wet Etching
  • 6.5 Chemical Mechanical Planarization (CMP)

7 Global Spin on Carbon Market, By Application

  • 7.1 Introduction
  • 7.2 Logic Devices
  • 7.3 Memory Devices
    • 7.3.1 3D NAND
    • 7.3.2 Dynamic Random Access Memory (DRAM)
  • 7.4 Power Devices
  • 7.5 Microelectromechanical Systems (MEMS)
  • 7.6 Photonics
  • 7.7 Advanced Packaging
  • 7.8 Other Applications
    • 7.8.1 Printed Electronics
    • 7.8.2 Flexible Electronics

8 Global Spin on Carbon Market, By End User

  • 8.1 Introduction
  • 8.2 Semiconductor Foundries
  • 8.3 Integrated Device Manufacturers (IDMs)
  • 8.4 Outsourced Semiconductor Assembly and Test (OSAT)

9 Global Spin on Carbon Market, By Geography

  • 9.1 Introduction
  • 9.2 North America
    • 9.2.1 US
    • 9.2.2 Canada
    • 9.2.3 Mexico
  • 9.3 Europe
    • 9.3.1 Germany
    • 9.3.2 UK
    • 9.3.3 Italy
    • 9.3.4 France
    • 9.3.5 Spain
    • 9.3.6 Rest of Europe
  • 9.4 Asia Pacific
    • 9.4.1 Japan
    • 9.4.2 China
    • 9.4.3 India
    • 9.4.4 Australia
    • 9.4.5 New Zealand
    • 9.4.6 South Korea
    • 9.4.7 Rest of Asia Pacific
  • 9.5 South America
    • 9.5.1 Argentina
    • 9.5.2 Brazil
    • 9.5.3 Chile
    • 9.5.4 Rest of South America
  • 9.6 Middle East & Africa
    • 9.6.1 Saudi Arabia
    • 9.6.2 UAE
    • 9.6.3 Qatar
    • 9.6.4 South Africa
    • 9.6.5 Rest of Middle East & Africa

10 Key Developments

  • 10.1 Agreements, Partnerships, Collaborations and Joint Ventures
  • 10.2 Acquisitions & Mergers
  • 10.3 New Product Launch
  • 10.4 Expansions
  • 10.5 Other Key Strategies

11 Company Profiling

  • 11.1 Shell
  • 11.2 Amazon
  • 11.3 Deutsche Telekom
  • 11.4 Samsung
  • 11.5 Google
  • 11.6 South Pole Group
  • 11.7 3Degrees
  • 11.8 Finite Carbon
  • 11.9 EKI Energy Services Ltd
  • 11.10 IETA
  • 11.11 Merck KGaA
  • 11.12 Shin-Etsu Chemical Co.
  • 11.13 Brewer Science, Inc.
  • 11.14 JSR Micro, Inc.
  • 11.15 Nano-C
  • 11.16 DNF Co., Ltd.
  • 11.17 DGB Group
  • 11.18 NativeEnergy
ºñ±³¸®½ºÆ®
0 °ÇÀÇ »óǰÀ» ¼±Åà Áß
»óǰ ºñ±³Çϱâ
Àüü»èÁ¦