세계의 3D 낸드 플래시 메모리 시장 예측(-2030년) : 유형별, 폼 팩터별, 메모리 밀도별, 용도별, 최종 사용자별, 지역별 분석

According to Stratistics MRC, the Global 3D Nand Flash Memory Market is accounted for $22.2 billion in 2024 and is expected to reach $57.0 billion by 2030 growing at a CAGR of 17% during the forecast period. 3D NAND Flash Memory is a non-volatile storage technology that stores data in a 3D array of memory cells, resulting in higher storage density and improved performance compared to traditional 2D NAND. This technology stacks memory cells vertically in multiple layers, increasing storage capacity without requiring more surface area. It is widely used in applications like solid-state drives, memory cards, smartphones, and data centers. 3D NAND offers faster data access speeds, lower power consumption, and higher durability compared to older NAND technologies.

According to the Ericsson Mobility report, in the North American region, 5G subscriptions are expected to account for 55% of mobile subscriptions by the end of 2024.

Market Dynamics:

Driver:

Increasing demand for storage capacity

3D NAND flash memory offers a solution to the physical limitations of traditional 2D NAND technology, which has limitations due to horizontal space constraints on silicon wafers. By stacking memory cells vertically, 3D NAND increases the storage capacity of data in a given area. As demand for high-capacity devices like SSDs, smartphones, and laptops increases, 3D NAND provides a viable solution for manufacturers to produce storage solutions with higher capacities boosting the market growth.

Restraint:

Reliability and durability concerns

3D NAND flash memory has a finite lifespan, measured in Program/Erase cycles. Despite its improved endurance over 2D NAND, the cells continue to degrade over time due to increased stacking of memory cells. This reduced lifespan is a concern for applications like high-performance servers, data centers, and automotive systems, where data reliability and endurance are crucial. Moreover premature wear can lead to data corruption or loss, undermining the technology's appeal in these sectors hampers the market.

Opportunity:

Increasing shift from traditional hard disk drives (HDDs) to solid-state drives (SSDs)

SSDs offer faster read/write speeds compared to HDDs, thanks to 3D NAND technology. This technology reduces latency and stores more data in a smaller area, enhancing data transfer speeds. As applications like gaming, video production, AI, and big data analytics demand faster storage, 3D NAND is crucial for high-performance SSDs. SSDs also offer superior durability due to their lack of moving parts, making them less susceptible to physical damage. As businesses and consumers prioritize reliability, SSDs are increasingly preferred, boosting demand for 3D NAND-based storage solutions.

Threat:

Competition from alternative technologies

3D XPoint, a non-volatile memory technology developed by Intel and Micron, is a potential alternative to 3D NAND, offering higher performance, lower latency, and greater endurance. It is seen as a strong competitor to 3D NAND in high-performance storage applications. Although still in its early stages of adoption, 3D XPoint's advantages in speed and endurance make it a strong competitor in the data center and enterprise markets. If more cost-effective and widely adopted, 3D XPoint could reduce demand for 3D NAND.

Covid-19 Impact

The COVID-19 pandemic significantly impacted the 3D NAND flash memory market. Supply chain disruptions, including semiconductor shortages and factory shutdowns, led to delays in production and increased costs. However, the surge in remote work, e-commerce, and digital services drove higher demand for data storage, benefiting the market. The expansion of cloud computing, gaming, and AI applications also fueled growth in SSDs powered by 3D NAND.

The universal flash storage segment is expected to be the largest during the forecast period

The universal flash storage segment is predicted to secure the largest market share throughout the forecast period owing to demand for high-performance memory solutions. The latest versions, universal flash storage 2.1 and universal flash storage 3.1, use advanced NAND flash technology like 3D NAND for faster read and write speeds. The growing adoption of universal flash storage 3.1 in smartphones, tablets, and laptops is boosting demand for high-speed NAND memory, particularly 3D NAND, which meets universal flash storage performance standards, strengthening the 3D NAND market in consumer electronics.

The data centers & cloud services segment is expected to have the highest CAGR during the forecast period

The data centers & cloud services is expected to register lucrative growth during the estimation period due to advanced storage technologies like solid-state drives powered by 3D NAND for rapid data retrieval, real-time processing, and high-speed data transfer. 3D NAND offers faster read/write speeds, lower latency, and enhanced durability compared to traditional storage solutions like HDDs, making it ideal for cloud storage and high-performance computing applications accelerating the growth of the 3D NAND flash memory market.

Region with largest share:

During the estimation period, the North America region is expected to capture the largest market share owing to North America, particularly the US, is a hub for innovation in storage technologies, with leading semiconductor manufacturers like Intel, Micron Technology, and Western Digital leading the development of 3D NAND flash memory. This leadership in technological innovation accelerates the development and adoption of 3D NAND flash memory, driving global market growth through pioneering innovations like multi-level cell (MLC), triple-level cell (TLC), and quad-level cell (QLC) 3D NAND memory.

Region with highest CAGR:

Over the forecasted timeframe, the Asia Pacific is anticipated to exhibit the highest CAGR due to region's digital transformation is boosting the demand for robust data storage solutions, especially in cloud computing, big data analytics, and AI-based applications. High-performance storage solutions, such as 3D NAND, are well-suited for these services due to their speed, reliability, and endurance. The demand for 3D NAND is increasing due to the expansion of cloud services and data centers across APAC, fostering market growth.

Key players in the market

Some of the key players in 3D Nand Flash Memory market include Samsung Electronics Co.Ltd., Toshiba Corporation, SK Hynix Semiconductor Inc., Micron Technology Inc., Intel Corporation, Apple Inc., Lenovo Group Ltd, Advanced Micro Devices, STMicroelectronics, SanDisk Corporation, Western Digital, VIA Technologies INC, Infineon Technologies AG, Microchip Technology Inc., ON Semiconductor, Integrated Silicon Solution Inc. and Realtek Semiconductor Corp.

Key Developments:

In December 2024, Quobly Forges & STMicroelectronics announced a transformative collaboration with STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, to produce quantum processor units (QPUs) at scale.

In November 2024, Nimbus and Toshiba announced joint development of next-generation pure hydrogen fuel cell stack. Under this agreement, Nimbus will combine its patented "four-fluid stack technology" with Toshiba's long-established "fuel cell commercialization and mass production technology" to jointly develop the pure hydrogen fuel cell stack.

In November 2024, Toshiba Electronic Devices & Storage Corporation has launched TLX9152M an automotive photorelay with an output withstand voltage of 900V (min) that is highly suitable for application in high voltage automotive batteries. The new photorelay is housed in an SO16L-T package Volume shipments.

In May 2024, Bosch Ventures Amplifies Commitment to Cleantech with two Battery Recycling Investments. In an electrified world, battery recycling makes a significant contribution to conserving natural resources.

Types Covered:

• Single-Level Cell
• Multi-Level Cell
• Triple-Level Cell
• Quad-Level Cell

Form Factors Covered:

• Universal Flash Storage
• Non-Volatile Memory Express
• embedded MultiMediaCard
• Solid-State Drives
• Other Form Factors

Memory Densities Covered:

• Low-Density Memory
• High-Density Memory

Applications Covered:

• Smartphones & Wearables
• Tablets & Laptops
• Data Centers & Cloud Services
• High-Performance Computing
• Storage Arrays & Servers
• Advanced Driver-Assistance Systems
• Other Applications

End Users Covered:

• Consumer Electronics
• Automotive
• Industrial and IoT
• Enterprise Storage
• Other End User

Regions Covered:

• North America
  • US
  • Canada
  • Mexico
• Europe
  • Germany
  • UK
  • Italy
  • France
  • Spain
  • Rest of Europe
• Asia Pacific
  • Japan
  • China
  • India
  • Australia
  • New Zealand
  • South Korea
  • Rest of Asia Pacific
• South America
  • Argentina
  • Brazil
  • Chile
  • Rest of South America
• Middle East & Africa
  • Saudi Arabia
  • UAE
  • Qatar
  • South Africa
  • Rest of Middle East & Africa

What our report offers:

• Market share assessments for the regional and country-level segments
• Strategic recommendations for the new entrants
• Covers Market data for the years 2022, 2023, 2024, 2026, and 2030
• Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
• Strategic recommendations in key business segments based on the market estimations
• Competitive landscaping mapping the key common trends
• Company profiling with detailed strategies, financials, and recent developments
• Supply chain trends mapping the latest technological advancements

Free Customization Offerings:

All the customers of this report will be entitled to receive one of the following free customization options:

• Company Profiling
  • Comprehensive profiling of additional market players (up to 3)
  • SWOT Analysis of key players (up to 3)
• Regional Segmentation
  • Market estimations, Forecasts and CAGR of any prominent country as per the client's interest (Note: Depends on feasibility check)
• Competitive Benchmarking
  • Benchmarking of key players based on product portfolio, geographical presence, and strategic alliances

Table of Contents

1 Executive Summary

2 Preface

• 2.1 Abstract
• 2.2 Stake Holders
• 2.3 Research Scope
• 2.4 Research Methodology
  • 2.4.1 Data Mining
  • 2.4.2 Data Analysis
  • 2.4.3 Data Validation
  • 2.4.4 Research Approach
• 2.5 Research Sources
  • 2.5.1 Primary Research Sources
  • 2.5.2 Secondary Research Sources
  • 2.5.3 Assumptions

3 Market Trend Analysis

• 3.1 Introduction
• 3.2 Drivers
• 3.3 Restraints
• 3.4 Opportunities
• 3.5 Threats
• 3.6 Application Analysis
• 3.7 End User Analysis
• 3.8 Emerging Markets
• 3.9 Impact of Covid-19

4 Porters Five Force Analysis

• 4.1 Bargaining power of suppliers
• 4.2 Bargaining power of buyers
• 4.3 Threat of substitutes
• 4.4 Threat of new entrants
• 4.5 Competitive rivalry

5 Global 3D Nand Flash Memory Market, By Type

• 5.1 Introduction
• 5.2 Single-Level Cell
• 5.3 Multi-Level Cell
• 5.4 Triple-Level Cell
• 5.5 Quad-Level Cell

6 Global 3D Nand Flash Memory Market, By Form Factor

• 6.1 Introduction
• 6.2 Universal Flash Storage
• 6.3 Non-Volatile Memory Express
• 6.4 embedded MultiMediaCard
• 6.5 Solid-State Drives
• 6.6 Other Form Factors

7 Global 3D Nand Flash Memory Market, By Memory Density

• 7.1 Introduction
• 7.2 Low-Density Memory
• 7.3 High-Density Memory

8 Global 3D Nand Flash Memory Market, By Application

• 8.1 Introduction
• 8.2 Smartphones & Wearables
• 8.3 Tablets & Laptops
• 8.4 Data Centers & Cloud Services
• 8.5 High-Performance Computing
• 8.6 Storage Arrays & Servers
• 8.7 Advanced Driver-Assistance Systems
• 8.8 Other Applications

9 Global 3D Nand Flash Memory Market, By End User

• 9.1 Introduction
• 9.2 Consumer Electronics
• 9.3 Automotive
• 9.4 Industrial and IoT
• 9.5 Enterprise Storage
• 9.6 Other End User

10 Global 3D Nand Flash Memory Market, By Geography

• 10.1 Introduction
• 10.2 North America
  • 10.2.1 US
  • 10.2.2 Canada
  • 10.2.3 Mexico
• 10.3 Europe
  • 10.3.1 Germany
  • 10.3.2 UK
  • 10.3.3 Italy
  • 10.3.4 France
  • 10.3.5 Spain
  • 10.3.6 Rest of Europe
• 10.4 Asia Pacific
  • 10.4.1 Japan
  • 10.4.2 China
  • 10.4.3 India
  • 10.4.4 Australia
  • 10.4.5 New Zealand
  • 10.4.6 South Korea
  • 10.4.7 Rest of Asia Pacific
• 10.5 South America
  • 10.5.1 Argentina
  • 10.5.2 Brazil
  • 10.5.3 Chile
  • 10.5.4 Rest of South America
• 10.6 Middle East & Africa
  • 10.6.1 Saudi Arabia
  • 10.6.2 UAE
  • 10.6.3 Qatar
  • 10.6.4 South Africa
  • 10.6.5 Rest of Middle East & Africa

11 Key Developments

• 11.1 Agreements, Partnerships, Collaborations and Joint Ventures
• 11.2 Acquisitions & Mergers
• 11.3 New Product Launch
• 11.4 Expansions
• 11.5 Other Key Strategies

12 Company Profiling

• 12.1 Samsung Electronics Co.Ltd.
• 12.2 Toshiba Corporation
• 12.3 SK Hynix Semiconductor Inc.
• 12.4 Micron Technology Inc.
• 12.5 Intel Corporation
• 12.6 Apple Inc.
• 12.7 Lenovo Group Ltd
• 12.8 Advanced Micro Devices
• 12.9 STMicroelectronics
• 12.10 SanDisk Corporation
• 12.11 Western Digital
• 12.12 VIA Technologies INC.
• 12.13 Infineon Technologies AG
• 12.14 Microchip Technology Inc.
• 12.15 ON Semiconductor
• 12.16 Integrated Silicon Solution Inc.
• 12.17 Realtek Semiconductor Corp.