전자부품 시장 예측(-2034년) : 부품 유형, 재료/기판, 실장 기술, 용도, 최종사용자, 판매채널 및 지역별 분석

According to Stratistics MRC, the Global Electronic Components Market is accounted for $565.6 billion in 2026 and is expected to reach $1070.5 billion by 2034 growing at a CAGR of 8.3% during the forecast period. Electronic components are the fundamental building blocks of electronic circuits and systems, including active components such as semiconductors and passive components such as capacitors, resistors, and inductors. These components are manufactured using various materials and substrates including silicon, gallium arsenide, silicon carbide, gallium nitride, ceramic, polymer, copper, aluminum, and other materials, and are assembled using surface mount technology, through-hole technology, and mixed technology approaches. The market serves diverse industries including consumer electronics, automotive, telecommunications, industrial automation, healthcare, aerospace, and defense.

Market Dynamics:

Driver:

Growing demand for electronic devices across all industries

The proliferation of electronic devices and increasing semiconductor content across all industries is a primary driver for the electronic components market. Consumer electronics including smartphones, laptops, wearables, and smart home devices require extensive electronic components. Automotive electronics content continues increasing with electrification, ADAS, and infotainment systems. Industrial automation, telecommunications infrastructure, healthcare devices, and aerospace systems all require sophisticated electronic components. The expansion of IoT, AI, 5G, and autonomous technologies is dramatically increasing component demand. As electronics become ubiquitous across all sectors, component demand continues growing, supporting sustained market expansion.

Restraint:

Supply chain disruptions and component shortages

Recurring supply chain disruptions and component shortages represent a major restraint for the electronic components market. Global semiconductor shortages have affected production across multiple industries. Geopolitical tensions and trade restrictions affect component availability and pricing. Natural disasters, including earthquakes and floods in manufacturing regions, can disrupt supply. Logistics bottlenecks and container shortages affect component distribution. Manufacturers face challenges in securing consistent component supply. These supply chain vulnerabilities affect production planning and may limit market growth.

Opportunity:

Adoption of advanced materials for next-generation components

The development and adoption of advanced semiconductor materials including silicon carbide, gallium nitride, and gallium arsenide presents significant opportunities for the electronic components market. Wide-bandgap semiconductors enable higher efficiency, higher power density, and higher temperature operation compared to silicon. Gallium nitride enables smaller, faster, more efficient components. Silicon carbide is critical for electric vehicle power electronics and renewable energy systems. The shift to advanced materials for next-generation applications is creating new component categories and opportunities. As adoption accelerates, advanced material components capture growing market share.

Threat:

Intense competition and pricing pressure

Intense competition among component manufacturers and continuous pricing pressure pose significant threats to the electronic components market. Global competition from manufacturers in lower-cost regions affects pricing and margins. Commoditization of certain component categories limits differentiation. Large buyers with significant purchasing power negotiate aggressive pricing. Component manufacturers face pressure to reduce costs while maintaining quality. This competition may affect profitability and investment in innovation, particularly for smaller manufacturers.

Covid-19 Impact:

The COVID-19 pandemic had a significant impact on the electronic components market. Initial disruptions included factory shutdowns, supply chain interruptions, and reduced production. However, the pandemic accelerated digital transformation and demand for electronics across consumer, computing, and telecommunications sectors. Global semiconductor shortages emerged, affecting multiple industries. Component manufacturers increased production capacity. Post-pandemic, semiconductor demand remains strong, with continued investment in manufacturing capacity and component supply chains.

The Silicon segment is expected to be the largest during the forecast period

The Silicon segment is expected to account for the largest market share during the forecast period, driven by its dominance as the primary semiconductor material, established manufacturing infrastructure, and widespread adoption across all electronic component categories. Silicon is the foundation of the electronics industry, used for integrated circuits, microprocessors, memory chips, power devices, and discrete components. The segment benefits from extensive manufacturing capacity, continuous technology scaling, and cost-effective production. Established supply chains and economies of scale support market accessibility. With its fundamental role in electronics, silicon maintains the largest material segment share throughout the forecast period.

The Surface Mount Technology (SMT) segment is expected to have the highest CAGR during the forecast period

Over the forecast period, the Surface Mount Technology (SMT) segment is predicted to witness the highest growth rate, fueled by the advantages of miniaturization, higher component density, and automated assembly efficiency compared to through-hole technology. SMT enables smaller electronic devices with more functionality in compact form factors. The segment benefits from automation, high-speed assembly, and compatibility with modern manufacturing processes. Growing demand for smaller, lighter, and more functional electronic devices drives SMT adoption. As electronics continue miniaturizing and manufacturing automation expands, SMT delivers the fastest mounting technology segment growth.

Region with largest share:

During the forecast period, the Asia-Pacific region is expected to hold the largest market share, supported by concentrated electronics manufacturing, extensive component production, and the presence of major semiconductor and component manufacturers. China, Taiwan, South Korea, Japan, and Southeast Asian countries host the world's largest electronics manufacturing facilities and component production. The region accounts for a substantial share of global electronic component production and consumption. Government support for electronics manufacturing and semiconductor development is accelerating. With concentrated manufacturing and extensive supply chains, Asia Pacific maintains its dominant market position.

Region with highest CAGR:

Over the forecast period, the Asia-Pacific region is anticipated to exhibit the highest CAGR, driven by continued electronics manufacturing expansion, rising domestic consumption, and increasing investment in semiconductor production across countries including China, India, and Southeast Asia. The region's large and growing electronics manufacturing base creates substantial component demand. Rising middle-class populations and increasing consumer electronics consumption support market expansion. Government programs promoting domestic semiconductor and electronics manufacturing are accelerating investment. As electronics manufacturing and consumption continue growing, Asia Pacific delivers the fastest electronic components market growth globally.

Key players in the market

Some of the key players in Electronic Components Market include TDK Corporation, Murata Manufacturing Co., Ltd., TE Connectivity plc, Amphenol Corporation, Vishay Intertechnology, Inc., Yageo Corporation, Kyocera AVX Components Corporation, STMicroelectronics N.V., Texas Instruments Incorporated, Infineon Technologies AG, NXP Semiconductors N.V., Analog Devices, Inc., onsemi, Renesas Electronics Corporation, ROHM Co., Ltd., and Littelfuse, Inc.

Key Developments:

In July 2026, Infineon finalized the acquisition of ams OSRAM's non-optical analog and mixed-signal sensor portfolio for €570 million, strengthening its sensor solutions across industrial and automotive applications.

In March 2026, TDK showcased its next-generation power electronics innovations at APEC 2026, highlighting µPOL DC-DC modules, high-voltage contactors, and wireless power transfer solutions tailored for AI edge systems and electric vehicles.

In February 2026, Texas Instruments entered into a definitive agreement to acquire wireless connectivity chip designer Silicon Labs in a landmark $7.5 billion deal, expanding its microcontroller and IoT portfolio by nearly 1,200 wireless products.

In January 2026, Amphenol completed the acquisition of CommScope's Connectivity and Cable Solutions (CCS) business, integrating fiber optic interconnect and industrial cable solutions expected to generate $4.1 billion in full-year sales.

Component Types Covered:

• Active Components
• Passive Components
• Electromechanical Components
• Sensors

Materials/Substrates Covered:

• Silicon
• Gallium Arsenide (GaAs)
• Silicon Carbide (SiC)
• Gallium Nitride (GaN)
• Ceramic
• Polymer
• Copper
• Aluminum
• Other Materials/Substrates

Mounting Technologies Covered:

• Surface Mount Technology (SMT)
• Through-Hole Technology (THT)
• Mixed Technology

Applications Covered:

• Signal Processing
• Power Management
• Data Storage
• Sensing and Measurement
• Connectivity and Communication
• Display and Lighting
• Protection and Control

End Users Covered:

• Consumer Electronics
• Automotive
• Industrial
• Telecommunications
• Healthcare
• Aerospace & Defense
• Energy & Power
• IT & Data Centers
• Others

Sales Channels Covered:

• Direct Sales
• Authorized Distributors
• Independent Distributors
• Online Sales

Regions Covered:

• North America
  • United States
  • Canada
  • Mexico
• Europe
  • United Kingdom
  • Germany
  • France
  • Italy
  • Spain
  • Netherlands
  • Belgium
  • Sweden
  • Switzerland
  • Poland
  • Rest of Europe
• Asia Pacific
  • China
  • Japan
  • India
  • South Korea
  • Australia
  • Indonesia
  • Thailand
  • Malaysia
  • Singapore
  • Vietnam
  • Rest of Asia Pacific
• South America
  • Brazil
  • Argentina
  • Colombia
  • Chile
  • Peru
  • Rest of South America
• Rest of the World (RoW)
  • Middle East
• Saudi Arabia
• United Arab Emirates
• Qatar
• Israel
• Rest of Middle East
  • Africa
• South Africa
• Egypt
• Morocco
• Rest of Africa

What our report offers:

• Market share assessments for the regional and country-level segments
• Strategic recommendations for the new entrants
• Covers Market data for the years 2023, 2024, 2025, 2026, 2027, 2028, 2030, 2032 and 2034
• Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
• Strategic recommendations in key business segments based on the market estimations
• Competitive landscaping mapping the key common trends
• Company profiling with detailed strategies, financials, and recent developments
• Supply chain trends mapping the latest technological advancements

Free Customization Offerings:

All the customers of this report will be entitled to receive one of the following free customization options:

• Company Profiling
  • Comprehensive profiling of additional market players (up to 3)
  • SWOT Analysis of key players (up to 3)
• Regional Segmentation
  • Market estimations, Forecasts and CAGR of any prominent country as per the client's interest (Note: Depends on feasibility check)
• Competitive Benchmarking
  • Benchmarking of key players based on product portfolio, geographical presence, and strategic alliances

Table of Contents

1 Executive Summary

• 1.1 Market Snapshot and Key Highlights
• 1.2 Growth Drivers, Challenges, and Opportunities
• 1.3 Competitive Landscape Overview
• 1.4 Strategic Insights and Recommendations

2 Research Framework

• 2.1 Study Objectives and Scope
• 2.2 Stakeholder Analysis
• 2.3 Research Assumptions and Limitations
• 2.4 Research Methodology
  • 2.4.1 Data Collection (Primary and Secondary)
  • 2.4.2 Data Modeling and Estimation Techniques
  • 2.4.3 Data Validation and Triangulation
  • 2.4.4 Analytical and Forecasting Approach

3 Market Dynamics and Trend Analysis

• 3.1 Market Definition and Structure
• 3.2 Key Market Drivers
• 3.3 Market Restraints and Challenges
• 3.4 Growth Opportunities and Investment Hotspots
• 3.5 Industry Threats and Risk Assessment
• 3.6 Technology and Innovation Landscape
• 3.7 Emerging and High-Growth Markets
• 3.8 Regulatory and Policy Environment
• 3.9 Impact of COVID-19 and Recovery Outlook

4 Competitive and Strategic Assessment

• 4.1 Porter's Five Forces Analysis
  • 4.1.1 Supplier Bargaining Power
  • 4.1.2 Buyer Bargaining Power
  • 4.1.3 Threat of Substitutes
  • 4.1.4 Threat of New Entrants
  • 4.1.5 Competitive Rivalry
• 4.2 Market Share Analysis of Key Players
• 4.3 Product Benchmarking and Performance Comparison

5 Global Electronic Components Market, By Component Type

• 5.1 Active Components
  • 5.1.1 Integrated Circuits (ICs)
  • 5.1.2 Diodes
  • 5.1.3 Transistors
  • 5.1.4 Thyristors
  • 5.1.5 Optoelectronic Components
• 5.2 Passive Components
  • 5.2.1 Capacitors
  • 5.2.2 Resistors
  • 5.2.3 Inductors
  • 5.2.4 Transformers
  • 5.2.5 Filters
• 5.3 Electromechanical Components
  • 5.3.1 Connectors
  • 5.3.2 Switches
  • 5.3.3 Relays
  • 5.3.4 Circuit Protection Devices
• 5.4 Sensors
  • 5.4.1 Temperature Sensors
  • 5.4.2 Pressure Sensors
  • 5.4.3 Motion Sensors
  • 5.4.4 Image Sensors
  • 5.4.5 Other Sensors

6 Global Electronic Components Market, By Material/Substrate

• 6.1 Silicon
• 6.2 Gallium Arsenide (GaAs)
• 6.3 Silicon Carbide (SiC)
• 6.4 Gallium Nitride (GaN)
• 6.5 Ceramic
• 6.6 Polymer
• 6.7 Copper
• 6.8 Aluminum
• 6.9 Other Materials/Substrates

7 Global Electronic Components Market, By Mounting Technology

• 7.1 Surface Mount Technology (SMT)
• 7.2 Through-Hole Technology (THT)
• 7.3 Mixed Technology

8 Global Electronic Components Market, By Application

• 8.1 Signal Processing
• 8.2 Power Management
• 8.3 Data Storage
• 8.4 Sensing and Measurement
• 8.5 Connectivity and Communication
• 8.6 Display and Lighting
• 8.7 Protection and Control

9 Global Electronic Components Market, By End User

• 9.1 Consumer Electronics
• 9.2 Automotive
• 9.3 Industrial
• 9.4 Telecommunications
• 9.5 Healthcare
• 9.6 Aerospace & Defense
• 9.7 Energy & Power
• 9.8 IT & Data Centers
• 9.9 Others

10 Global Electronic Components Market, By Sales Channel

• 10.1 Direct Sales
• 10.2 Authorized Distributors
• 10.3 Independent Distributors
• 10.4 Online Sales

11 Global Electronic Components Market, By Geography

• 11.1 North America
  • 11.1.1 United States
  • 11.1.2 Canada
  • 11.1.3 Mexico
• 11.2 Europe
  • 11.2.1 United Kingdom
  • 11.2.2 Germany
  • 11.2.3 France
  • 11.2.4 Italy
  • 11.2.5 Spain
  • 11.2.6 Netherlands
  • 11.2.7 Belgium
  • 11.2.8 Sweden
  • 11.2.9 Switzerland
  • 11.2.10 Poland
  • 11.2.11 Rest of Europe
• 11.3 Asia Pacific
  • 11.3.1 China
  • 11.3.2 Japan
  • 11.3.3 India
  • 11.3.4 South Korea
  • 11.3.5 Australia
  • 11.3.6 Indonesia
  • 11.3.7 Thailand
  • 11.3.8 Malaysia
  • 11.3.9 Singapore
  • 11.3.10 Vietnam
  • 11.3.11 Rest of Asia Pacific
• 11.4 South America
  • 11.4.1 Brazil
  • 11.4.2 Argentina
  • 11.4.3 Colombia
  • 11.4.4 Chile
  • 11.4.5 Peru
  • 11.4.6 Rest of South America
• 11.5 Rest of the World (RoW)
  • 11.5.1 Middle East
    • 11.5.1.1 Saudi Arabia
    • 11.5.1.2 United Arab Emirates
    • 11.5.1.3 Qatar
    • 11.5.1.4 Israel
    • 11.5.1.5 Rest of Middle East
  • 11.5.2 Africa
    • 11.5.2.1 South Africa
    • 11.5.2.2 Egypt
    • 11.5.2.3 Morocco
    • 11.5.2.4 Rest of Africa

12 Strategic Market Intelligence

• 12.1 Industry Value Network and Supply Chain Assessment
• 12.2 White-Space and Opportunity Mapping
• 12.3 Product Evolution and Market Life Cycle Analysis
• 12.4 Channel, Distributor, and Go-to-Market Assessment

13 Industry Developments and Strategic Initiatives

• 13.1 Mergers and Acquisitions
• 13.2 Partnerships, Alliances, and Joint Ventures
• 13.3 New Product Launches and Certifications
• 13.4 Capacity Expansion and Investments
• 13.5 Other Strategic Initiatives

14 Company Profiles

• 14.1 TDK Corporation
• 14.2 Murata Manufacturing Co., Ltd.
• 14.3 TE Connectivity plc
• 14.4 Amphenol Corporation
• 14.5 Vishay Intertechnology, Inc.
• 14.6 Yageo Corporation
• 14.7 Kyocera AVX Components Corporation
• 14.8 STMicroelectronics N.V.
• 14.9 Texas Instruments Incorporated
• 14.10 Infineon Technologies AG
• 14.11 NXP Semiconductors N.V.
• 14.12 Analog Devices, Inc.
• 14.13 onsemi
• 14.14 Renesas Electronics Corporation
• 14.15 ROHM Co., Ltd.
• 14.16 Littelfuse, Inc.