3D IC 전망(2026년): SoIC의 양산 확대, STCO의 부상

In the OCP APAC Summit held in August 2026, suppliers including TSMC, ASE, and AMAT all highlighted the future trends of 3D IC. In September, during SEMICON, the 3DIC Advanced Manufacturing Alliance (3DICAMA), initiated by TSMC and ASE, further organized the 3DIC Global Summit. The event shifted its focus toward mass production readiness, system integration, and ecosystem collaboration in the AI era, reflecting that 3D IC is entering a new phase of large-scale manufacturing and system-level optimization.

This report provides an in-depth analysis of: (1) the definition and technology types of 3D IC; (2) the Hybrid Bonding process; (3) a summary of Hybrid Bonding suppliers; (4) TSMC’s SoIC capacity expansion timeline and market dynamics; and (5) the systemic technical challenges and future trends of 3D IC. The goal is to explain the technical principles of Hybrid Bonding, review the major bonder suppliers and market landscape, and outline the future development direction of 3D IC.

Key Highlights

• Recently, at the OCP APAC Summit, suppliers including TSMC, ASE, and Applied Materials (AMAT) jointly highlighted future development trends in 3D IC.
• Subsequently, during SEMICON, the 3DICAMA - initiated by TSMC and ASE - held the 3DIC Global Summit, focusing on mass-production readiness, system integration, and ecosystem collaboration in the AI era.
• This reflects that 3D IC is entering a new phase of large-scale mass production and system-level optimization.
• The report provides an in-depth analysis of 3D IC definitions and technology types, the Hybrid Bonding process, a summary of major suppliers, TSMC's SoIC capacity expansion timeline and market dynamics, and future systemic technical challenges and trends.
• The goal is to explain the technical principles of Hybrid Bonding, review the bonding equipment suppliers and market landscape, and outline the future direction of 3D IC development.

Table of Contents

1. Definition and Technology Types of 3D IC

• Figure 1: TSMC’s 3DFabric Integrated Platform
• Figure 2: Schematics of 2.5D, 3D, and 3.5D Packaging
• Table 1: 2.5D and 3D Packaging Platforms of Major Players
• Table 2: TCB vs. Hybrid Bonding
• Figure 3: Hybrid Bonding Evolution Process
• Figure 4: Roadmap to TSMC’s SoIC
• Figure 5: Architecture of 3D DRAM
• Figure 6: CPO Further Complicates Packaging
• Figure 7: ASE’s SiPh Optical Engine

2. Hybrid Bonding Process

• Figure 8: TCB, Fluxless, and Hybrid Bonding Processes
• Table 3: W2W vs. D2W
• Figure 9: Hybrid Bonding Process

3. Summary of Hybrid Bonding Suppliers

• Figure 10: Besi’s Hybrid Bonder Roadmap
• Figure 11: AMAT’s Kinex Integrated D2W Hybrid Bonding System
• Figure 12: ASMPT’s LITHOBOLT G2
• Figure 13: XBC300 Gen 2 D2W/W2W from SUSS
• Figure 14: Shibaura’s TFC-6700 and TFC-6800
• Figure 15: Operating Principle of EVG’s SmartView Technology
• Figure 16: EVG’s GEMINI FB
• Figure 17: TEL’s Synapse Si
• Table 4: Specifications and Target Applications of Major Equipment Providers’ Bonders

4. TSMC’s Capacity Expansion Schedule for SoIC and Market Dynamics

• Figure 18: Roadmap of AI Chips That Are Expected to Adopt SoIC (2026-2029)
• Figure 19: TSMC’s Capacity Expansion Roadmap for SoIC (2026-2028)
• Figure 20: TSMC’s SoIC Packaging Capacity Projection (2026-2028)
• Figure 21: Besi’s Order Intake and Revenue Trends (1Q22-2Q26)

5. Systemic Technical Challenges and Future Trends in the Development of 3D ICs

• Figure 22: TSMC’s STCO Initiative
• Figure 23: Vertical Scaling vs. Horizontal Scaling with CPO

6. TRI’s View