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¾Æ½Ã¾ÆÅÂÆò¾çÀÇ RF ÇÁ·ÐÆ®¿£µå Ĩ ½ÃÀå ¿¹Ãø : Áö¿ªº° ºÐ¼®-ÄÄÆ÷³ÍÆ®º°, ¿ëµµº°(-2030³â)Asia Pacific RF Front-End Chip Market Forecast to 2030 - Regional Analysis - by Component (Power Amplifier, Radio Frequency Filter, Low Noise Amplifier, RF Switch, and Others) and Application (Consumer Electronics, Wireless Communication, and Others) |
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Broadcom Inc, Infineon Technologies AG, Microchip Technology Inc, Murata Manufacturing Co Ltd, NXP Semiconductors NV, Qorvo Inc, Skyworks Solutions Inc, STMicroelectronics NV, TDK Corp, Texas Instruments Inc.´Â ¾Æ½Ã¾ÆÅÂÆò¾çÀÇ RF ÇÁ·ÐÆ®¿£µå Ĩ ½ÃÀå¿¡¼ »ç¾÷À» Àü°³ÇÏ´Â ÁÖ¿ä ±â¾÷ÀÔ´Ï´Ù.
The Asia Pacific RF front-end chip market was valued at US$ 7,548.09 million in 2022 and is expected to reach US$ 21,117.24 million by 2030; it is estimated to register a CAGR of 13.7% from 2022 to 2030.
Emergence of 5G Technology Boosts Asia Pacific RF Front-End Chip Market
Asia Pacific RF Front-End Chip Market Overview
Asia Pacific RF front-end chip market is segmented into Australia, India, China, Japan, South Korea, and the Rest of Asia Pacific. Asia Pacific is expected to register strong growth in the RF front-end chip market due to increased demand for high-speed data connectivity, expanding smartphone penetration, and the expansion of communication networks. The development of 5G networks primarily drives the Asia Pacific RF front-end chip market. Countries such as South Korea, China, and Japan are at the forefront of 5G adoption, increasing the demand for RF switches that can handle the complexities of high-frequency bands and advanced communication protocols. According to the Internet World Stats, in Asia Pacific, there are 2,934,186,678 Internet users and a 67.4% penetration rate as of July 2022. Also, as of November 2023, China having the world's first ultra-high-speed next-generation internet backbone. Such proliferation of high-speed internet connectivity is projected to drive the demand for RF front-end chips, as it helps to amplify, filter, and transmit the signal through the antenna. It also handles complex signals and higher frequencies associated with high-speed internet.
The adoption of smartphones in Asia Pacific is growing rapidly. For example, according to the Mobile Economy APAC 2023 Report, released in June 2023 at an event organized by the GSMA and Singtel in Singapore, Mobile subscribers will increase by 400 million between 2022 and 2030, reaching 2.11 billion. Smartphone use is expected to reach 94% by 2030, up 18% from 2022, due to lower device costs and better digital literacy. In today's mobile devices, a complex circuit is responsible for transforming information from near-zero frequency band signals that are used to transport information and data into radio signals that are received or delivered over the air. RF front-end chip plays an important role in smartphones. Thus, the growing adoption of smartphones in the region propels the RF front-end chip market.
Asia Pacific RF Front-End Chip Market Revenue and Forecast to 2030 (US$ Million)
Asia Pacific RF Front-End Chip Market Segmentation
The Asia Pacific RF front-end chip market is categorized into component, application, and country.
Based on component, the Asia Pacific RF front-end chip market is segmented into power amplifier, radio frequency filter, low noise amplifier, RF switch, and others. The power amplifier segment held the largest market share in 2022.
Based on application, the Asia Pacific RF front-end chip market is segmented into consumer electronics, wireless communication, and others. The consumer electronics segment held the largest market share in 2022.
By country, the Asia Pacific RF front-end chip market is segmented into China, Japan, India, South Korea, Australia, and the Rest of Asia Pacific. China dominated the Asia Pacific RF front-end chip market share in 2022.
Broadcom Inc, Infineon Technologies AG, Microchip Technology Inc, Murata Manufacturing Co Ltd, NXP Semiconductors NV, Qorvo Inc, Skyworks Solutions Inc, STMicroelectronics NV, TDK Corp, and Texas Instruments Inc are some of the leading companies operating in the Asia Pacific RF front-end chip market.