½ÃÀ庸°í¼­
»óǰÄÚµå
1597146

À¯·´ÀÇ RF ÇÁ·ÐÆ®¿£µå Ĩ ½ÃÀå ¿¹Ãø : Áö¿ªº° ºÐ¼®-ÄÄÆ÷³ÍÆ®º°, ¿ëµµº°(-2030³â)

Europe RF Front-End Chip Market Forecast to 2030 - Regional Analysis - by Component (Power Amplifier, Radio Frequency Filter, Low Noise Amplifier, RF Switch, and Others) and Application (Consumer Electronics, Wireless Communication, and Others)

¹ßÇàÀÏ: | ¸®¼­Ä¡»ç: The Insight Partners | ÆäÀÌÁö Á¤º¸: ¿µ¹® 141 Pages | ¹è¼Û¾È³» : Áï½Ã¹è¼Û

    
    
    



¡Ø º» »óǰÀº ¿µ¹® ÀÚ·á·Î Çѱ۰ú ¿µ¹® ¸ñÂ÷¿¡ ºÒÀÏÄ¡ÇÏ´Â ³»¿ëÀÌ ÀÖÀ» °æ¿ì ¿µ¹®À» ¿ì¼±ÇÕ´Ï´Ù. Á¤È®ÇÑ °ËÅ並 À§ÇØ ¿µ¹® ¸ñÂ÷¸¦ Âü°íÇØÁֽñ⠹ٶø´Ï´Ù.

À¯·´ÀÇ RF ÇÁ·ÐÆ®¿£µå Ĩ ½ÃÀåÀº 2022³â¿¡ 46¾ï 1,607¸¸ ´Þ·¯·Î Æò°¡µÇ¾ú°í, 2030³â¿¡´Â 105¾ï 7,219¸¸ ´Þ·¯¿¡ À̸¦ °ÍÀ¸·Î ¿¹ÃøµÇ¸ç, 2022³âºÎÅÍ 2030³â±îÁö CAGRÀº 10.9%·Î ÃßÁ¤µË´Ï´Ù.

½º¸¶Æ®Æù, ÅÂºí¸´ ¹× ±âŸ ¼ÒºñÀÚ¿ë ÀüÀÚ±â±âÀÇ º¸±ÞÀÌ À¯·´ÀÇ RF ÇÁ·ÐÆ®¿£µå Ĩ ½ÃÀåÀ» °ßÀÎ

GSMA°¡ ¸Å³â ¹ßÇ¥Çϰí ÀÖ´Â 'State of Mobile Internet Connectivity Report 2023(SOMIC)'¿¡ µû¸£¸é 2023³â 10¿ù¿¡´Â ¼¼°è Àα¸ÀÇ Àý¹Ý ÀÌ»ó(54%)¿¡ ÇØ´çÇÏ´Â ¾à 43¾ï¸íÀÌ ½º¸¶Æ®ÆùÀ» ¼ÒÀ¯Çϰí ÀÖ½À´Ï´Ù. ½º¸¶Æ®ÆùÀÇ ¼ö°¡ Å©°Ô Áõ°¡Çϰí ÀÖ½À´Ï´Ù. ¿¹¸¦ µé¾î Ericsson & The Radicati Group¿¡ µû¸£¸é 2020³â ½º¸¶Æ®ÆùÀÇ ¼ö´Â 57¾ï 5,000¸¸´ë, 2024³â¿¡´Â 69¾ï 3,000¸¸´ë, 2025³â ½ÃÁ¡¿¡¼­´Â 71¾ï 5,000¸¸´ë¿¡ ´ÞÇÒ °ÍÀ¸·Î ¿¹»óµË´Ï´Ù. ¶ÇÇÑ, ÅÂºí¸´ ´Ü¸»±â´Â ±âÁ¸ÀÇ ³ëÆ®ºÏ ¹× µ¥½ºÅ©Åé PC¸¦ ´É°¡ÇÏ´Â ´Ù¾çÇÑ ÀåÁ¡ÀÌ Àֱ⠶§¹®¿¡ ÃÖ±Ù ¸î ³âµ¿¾È Á¡Á¡ ÀαⰡ ³ô¾ÆÁö°í ÀÖ½À´Ï´Ù. ÅÂºí¸´, ½º¸¶Æ®Æù, ÇìµåÆù, ¿þ¾î·¯ºí µî°ú °°Àº Ä¿³ØÆ¼µå µð¹ÙÀ̽ºÀÇ ÀαⰡ ³ô¾ÆÁü¿¡ µû¶ó RF ÇÁ·ÐÆ®¿£µå Ĩ ¼ö¿ä°¡ ´õ¿í ³ô¾ÆÁö°í ÀÖ½À´Ï´Ù. ½º¸¶Æ®ÆùÀ̳ª ÅÂºí¸´ ´Ü¸»±â´Â ¸¹Àº Á֯ļö ´ë¿ª¿¡¼­ FM ¶óµð¿À³ª LTE µî ´Ù¼öÀÇ ¹«¼± ¼­ºñ½º¸¦ Áö¿øÇÏ´Â °æ¿ì°¡ ¸¹½À´Ï´Ù. µ¿½Ã¿¡ °¨µµ¸¦ ³ôÀ̰í Å©·Î½ºÅäÅ©¸¦ ÁÙÀ̱â À§ÇØ ¿©·¯ ¾ÈÅ׳ª¸¦ »ç¿ëÇÏ´Â ½º¸¶Æ®Æù ¹× ÅÂºí¸´ÀÌ ´Ã°í ÀÖ½À´Ï´Ù. ¼ÒÇü RF ¼Ö¸®µå ½ºÅ×ÀÌÆ® ½ºÀ§Ä¡´Â ½º¸¶Æ® ¸ð¹ÙÀÏ µð¹ÙÀ̽ºÀÇ RF ÇÁ·ÐÆ®¿£µå ¼³°è¿¡¼­ Áß¿äÇÑ ¿ªÇÒÀ» ÇÕ´Ï´Ù. ¼ÒºñÀÚ´Â ¿øÈ°ÇÑ ¿¬°á¼º°ú °í¼Ó µ¥ÀÌÅÍ Åë½ÅÀ» ±â´ëÇϰí ÀÖÀ¸¸ç, °¢ ¾÷ü´Â ¼±ÁøÀûÀÎ RF ±â¼úÀ» Àåºñ¿¡ žÀçÇϵµ·Ï ¿ä±¸Çϰí ÀÖ½À´Ï´Ù. ±× ¶§¹®¿¡, ´Ù¾çÇÑ ½ÃÀå ±â¾÷ÀÌ ½º¸¶Æ®Æù Àü¿ëÀÇ RF ÇÁ·ÐÆ® ¿£µå ¼Ö·ç¼ÇÀ» ¹ßÇ¥Çϰí ÀÖ½À´Ï´Ù. ¿¹¸¦ µé¾î, 2020³â 5¿ù, NXP ¼¼¹ÌÄÁ´öÅͽº NV´Â Wi-Fi 6 Ç¥ÁØÀ¸·Î ¼³°èµÈ Ãֽй«¼± Á֯ļö ÇÁ·ÐÆ®¿£µå(RFFE) ¼Ö·ç¼ÇÀÌ Xiaomi Mi 10 5G ½º¸¶Æ®Æù¿¡ ÅëÇյǾú´Ù°í ¹ßÇ¥Çß½À´Ï´Ù. ÀÌó·³ ½º¸¶Æ®Æù, ÅÂºí¸´, ±âŸ ¼ÒºñÀÚ¿ë ÀüÀÚ±â±âÀÇ º¸±ÞÀÌ RF ÇÁ·ÐÆ®¿£µå Ĩ ½ÃÀåÀ» °ßÀÎÇϰí ÀÖ½À´Ï´Ù.

À¯·´ÀÇ RF ÇÁ·ÐÆ®¿£µå Ĩ ½ÃÀå °³¿ä

À¯·´ÀÇ RF ÇÁ·ÐÆ®¿£µå Ĩ ½ÃÀåÀº µ¶ÀÏ, ÇÁ¶û½º, ÀÌÅ»¸®¾Æ, ¿µ±¹, ·¯½Ã¾Æ ¹× ±âŸ À¯·´À¸·Î ±¸ºÐµË´Ï´Ù. À¯·´ÀÇ RF ÇÁ·ÐÆ®¿£µå Ĩ ½ÃÀåÀº ±â¼ú Çõ½Å, °ß°íÇÑ »ê¾÷ ±â¹Ý, °íµµÀÇ Åë½Å ¼Ö·ç¼Ç¿¡ ´ëÇÑ ¼ö¿äÀÇ Áõ°¡¿¡ µû¶ó ±Þ¼ÓÈ÷ È®´ëµÇ°í ÀÖ½À´Ï´Ù. 5G ±â¼ú µµÀÔ, »ê¾÷ ÀÚµ¿È­ÀÇ ¹ßÀü, ¹«¼± Åë½Å ³×Æ®¿öÅ©ÀÇ È®´ë´Â À¯·´ ½ÃÀå ¿ªÇп¡ ±àÁ¤ÀûÀÎ ¿µÇâÀ» ¹ÌÄ¡°í ÀÖ½À´Ï´Ù. 5G ±â¼ú µµÀÔ Áõ°¡´Â RF ÇÁ·ÐÆ®¿£µå Ĩ ¼ö¿ä¿¡ ´ëÀÀÇϱâ À§ÇØ À¯·´ÀÇ ´Ù¾çÇÑ ±â¾÷ÀÌ M&A Ȱµ¿¿¡ ¸ôµÎÇϵµ·Ï Ã˱¸Çϰí ÀÖ½À´Ï´Ù. ¿¹¸¦ µé¾î 2020³â 10¿ù, STMicroelectronics´Â ¼¿·ê·¯ IoT ¹× 5G »ê¾÷À» À§ÇÑ ½Ç¸®ÄÜ ±â¹Ý Àü·Â ÁõÆø±â ¹× RF ÇÁ·ÐÆ®¿£µå ¸ðµâ(FEM)¿¡ ÁÖ·ÂÇÏ´Â ÇÁ¶û½ºÀÇ ÆÕ¸®½º ¹ÝµµÃ¼ ±â¾÷ÀÎ Somos Semiconductor¸¦ ÀμöÇß½À´Ï´Ù. Somos SemiconductorÀÇ Àμö´Â IoT ¹× 5G ¾÷°è¸¦ À§ÇÑ FEMIP¿Í Á¦Ç° ·Îµå¸ÊÀÇ °³¼± ¹× Àü¹® ÀηÂÀÇ °­È­¸¦ ±â´ëÇϰí ÀÖ½À´Ï´Ù. Ãʱâ Á¦Ç°ÀÎ NB-IoT/CAT-M1 ¸ðµâÀº ÇöÀç Ç¥ÁØ ÀÎÁõ °úÁ¤À» °ÅÄ¡°í ÀÖÀ¸¸ç, Ä¿³ØÆ¼ºñƼ RFFEM Á¦Ç°ÀÇ »õ·Î¿î ·Îµå¸ÊÀÇ ½ÃÀÛÀÌ µË´Ï´Ù.

À¯·´Àº ¶ÇÇÑ IoT¿Í °°Àº ¸î °¡Áö ±â¼úÀûÀ¸·Î °í±Þ ¼Ö·ç¼ÇÀÇ º»°ÅÁöÀ̸ç À¯·´ °¢±¹¿¡¼­´Â ¹ÝµµÃ¼ »ê¾÷ÀÌ È°¹ßÇÕ´Ï´Ù. Eurostat¿¡ µû¸£¸é 2021³â¿¡´Â EU ±â¾÷ÀÇ 29%°¡ IoT µð¹ÙÀ̽º¸¦ »ç¿ëÇϰí ÀÖÀ¸¸ç, ±×´ëºÎºÐÀº »ç³» ¾ÈÀüÀ» À¯ÁöÇϱâ À§Çؼ­ÀÔ´Ï´Ù. ÀÌ ¶§¹®¿¡ RF ÇÁ·ÐÆ®¿£µå Ĩ ±â¼úÀÇ Çõ½ÅÀÌ ÃËÁøµÇ¾î °í¼º´ÉÀÇ ½Å·Ú¼ºÀÌ ³ôÀº ÄÄÆ÷³ÍÆ®°¡ ¸¸µé¾îÁö°í ÀÖ½À´Ï´Ù. À¯·´ÀÇ ´Ù¾çÇÑ ±â¾÷µéÀÌ IoT ±â±â¿ë RF ÇÁ·ÐÆ®¿£µå ĨÀ» Á¦°øÇϰí ÀÖ½À´Ï´Ù. ¿¹¸¦ µé¾î Skyworks Solutions Inc.IoT RF ÇÁ·ÐÆ®¿£µå ¸ðµâ(FEM)Àº ÇϳªÀÇ RF ¸ðµâ¿¡¼­ ´Ù¼öÀÇ ¹«¼± ÇÁ·ÎÅäÄݰú SoC/RFICÀ» Áö¿øÇÕ´Ï´Ù. IoT FEMÀº Áö±×ºñ, Thread, BLUE TOOTH 5¸¦ Æ÷ÇÔÇÑ ºí·çÅõ½º ±Ô°ÝÀ» Áö¿øÇϱ⠶§¹®¿¡ ¹«¼± ¿¬°á¿¡ ÀûÇÕÇÕ´Ï´Ù. IoT FEMÀº SoC (System on Chip) Ç÷§Æû°ú ¿¬°áÇϸé È¿À²ÀûÀÎ »ç¹°ÀÎÅͳÝ(IoT) ¼Ö·ç¼ÇÀÌ µË´Ï´Ù. ÀÌó·³ »ó±â ¸ðµç ¿äÀεéÀÌ RF ÇÁ·ÐÆ®¿£µå Ĩ ½ÃÀåÀÇ ¼ºÀåÀ» ÃËÁøÇϰí ÀÖ½À´Ï´Ù.

À¯·´ÀÇ RF ÇÁ·ÐÆ®¿£µå Ĩ ½ÃÀå ¼öÀÍ ¹× ¿¹Ãø(´ÜÀ§ : 100¸¸ ´Þ·¯)(-2030³â)

À¯·´ÀÇ RF ÇÁ·ÐÆ®¿£µå Ĩ ½ÃÀå ¼¼ºÐÈ­

À¯·´ÀÇ RF ÇÁ·ÐÆ®¿£µå Ĩ ½ÃÀåÀº ÄÄÆ÷³ÍÆ®º°, ¿ëµµº°, ±¹°¡º°·Î ºÐ·ùµË´Ï´Ù.

ÄÄÆ÷³ÍÆ®º°·Î À¯·´ÀÇ RF ÇÁ·ÐÆ®¿£µå Ĩ ½ÃÀåÀº ÆÄ¿ö ¾ÚÇÁ, °íÁÖÆÄ ÇÊÅÍ, ·Î¿ì ³ëÀÌÁî ¾ÚÇÁ, RF ½ºÀ§Ä¡, ±âŸ µîÀ¸·Î ±¸ºÐµË´Ï´Ù. 2022³â ½ÃÀå Á¡À¯À²Àº ÆÄ¿ö ¾ÚÇÁ°¡ ÃÖ´ë¿´½À´Ï´Ù.

¿ëµµº°·Î À¯·´ÀÇ RF ÇÁ·ÐÆ®¿£µå Ĩ ½ÃÀåÀº ¼ÒºñÀÚ ÀüÀÚ, ¹«¼±Åë½Å, ±âŸ µîÀ¸·Î ±¸ºÐµË´Ï´Ù. ¼ÒºñÀÚ ÀüÀÚ ºÎ¹®Àº 2022³â¿¡ ÃÖ´ëÀÇ ½ÃÀå Á¡À¯À²À» Â÷ÁöÇß½À´Ï´Ù.

±¹°¡º°·Î À¯·´ÀÇ RF ÇÁ·ÐÆ®¿£µå Ĩ ½ÃÀåÀº µ¶ÀÏ, ¿µ±¹, ÇÁ¶û½º, ÀÌÅ»¸®¾Æ, ·¯½Ã¾Æ ¹× ±âŸ À¯·´À¸·Î ±¸ºÐµË´Ï´Ù. 2022³â À¯·´ÀÇ RF ÇÁ·ÐÆ®¿£µå Ĩ ½ÃÀå Á¡À¯À²Àº µ¶ÀÏÀÌ Â÷ÁöÇß½À´Ï´Ù.

Broadcom Inc, Infineon Technologies AG, Microchip Technology Inc, Murata Manufacturing Co Ltd, NXP Semiconductors NV, Qorvo Inc, Skyworks Solutions Inc, STMicroelectronics NV, TDK Corp, Texas Instruments Inc µîÀÌ À¯·´ÀÇ RF ÇÁ·ÐÆ®¿£µå Ĩ ½ÃÀå¿¡¼­ »ç¾÷À» Àü°³ ÇÏ´Â ÁÖ¿ä ±â¾÷ÀÔ´Ï´Ù.

¸ñÂ÷

Á¦1Àå ¼­·Ð

Á¦2Àå ÁÖ¿ä ¿ä¾à

Á¦3Àå ºÐ¼® ¹æ¹ý

Á¦4Àå À¯·´ÀÇ RF ÇÁ·ÐÆ®¿£µå Ĩ ½ÃÀåÀÇ »óȲ

  • »ýÅÂ°è ºÐ¼®
    • ¹ë·ùüÀÎÀÇ º¥´õ À϶÷

Á¦5Àå À¯·´ÀÇ RF ÇÁ·ÐÆ®¿£µå Ĩ ½ÃÀå : ÁÖ¿ä ½ÃÀå ¿ªÇÐ

  • ½ÃÀå ¼ºÀå ÃËÁø¿äÀÎ
    • ¹«¼± ³×Æ®¿öÅ© ÀÎÇÁ¶óÀÇ º¸±Þ È®´ë
    • ½º¸¶Æ®Æù ¹× ÅÂºí¸´ µîÀÇ ¼ÒºñÀÚ ÀüÀÚÀÇ º¸±Þ È®´ë
  • ½ÃÀå ¼ºÀå ¾ïÁ¦¿äÀÎ
    • RF ÇÁ·ÐÆ®¿£µå ĨÀÇ ³ôÀº Á¦Á¶ ºñ¿ë
    • RF ÇÁ·ÐÆ®¿£µå Ĩ ÅëÇÕÀÇ °úÁ¦
  • ½ÃÀå ±âȸ
    • IoT(»ç¹°ÀÎÅͳÝ) µð¹ÙÀ̽ºÀÇ ±ÞÁõ
    • 5G ±â¼úÀÇ µîÀå
  • ÇâÈÄÀÇ µ¿Çâ
    • RF ÇÁ·ÐÆ®¿£µå ¸ðµâÀÇ ¼ÒÇüÈ­
    • ¸ÖƼ Ĩ ÇÁ·ÐÆ® ¿£µå ¸ðµâ
  • ¼ºÀå ÃËÁø¿äÀΰú ¾ïÁ¦¿äÀÎÀÇ ¿µÇâ

Á¦6Àå À¯·´ÀÇ RF ÇÁ·ÐÆ®¿£µå Ĩ ½ÃÀå ºÐ¼®

  • À¯·´ÀÇ RF ÇÁ·ÐÆ®¿£µå Ĩ ½ÃÀåÀÇ ¼öÀÍ(2022-2030³â)
  • À¯·´ÀÇ RF ÇÁ·ÐÆ®¿£µå Ĩ ½ÃÀå ¿¹Ãø ºÐ¼®

Á¦7Àå À¯·´ÀÇ RF ÇÁ·ÐÆ®¿£µå Ĩ ½ÃÀå ºÐ¼® : ºÎǰº°

  • ÆÄ¿ö ¾ÚÇÁ
  • °íÁÖÆÄ ÇÊÅÍ
  • ÀúÀâÀ½ ÁõÆø±â
  • RF ½ºÀ§Ä¡
  • ±âŸ

Á¦8Àå À¯·´ÀÇ RF ÇÁ·ÐÆ®¿£µå Ĩ ½ÃÀå ºÐ¼® : ¿ëµµº°

  • ¼ÒºñÀÚ¿ë ÀüÀÚ
  • ¹«¼± Åë½Å
  • ±âŸ

Á¦9Àå À¯·´ÀÇ RF ÇÁ·ÐÆ®¿£µå Ĩ ½ÃÀå : ±¹°¡º° ºÐ¼®

  • µ¶ÀÏ
  • ¿µ±¹
  • ÇÁ¶û½º
  • ÀÌÅ»¸®¾Æ
  • ·¯½Ã¾Æ
  • ±âŸ À¯·´

Á¦10Àå °æÀï ±¸µµ

  • °¢»çÀÇ Æ÷Áö¼Å´× ¹× ÁýÁßµµ
  • ÁÖ¿ä ±â¾÷ÀÇ È÷Æ®¸Ê ºÐ¼®

Á¦11Àå ¾÷°è Á¤¼¼

  • ½ÃÀå ÀÌ´Ï¼ÅÆ¼ºê
  • Á¦Ç° °³¹ß
  • ±â¾÷ ÇÕº´ ¹× Àμö(M&A)

Á¦12Àå ±â¾÷ ÇÁ·ÎÆÄÀÏ

  • Infineon Technologies AG
  • TDK Corp
  • Texas Instruments Inc
  • Broadcom Inc
  • Qorvo Inc
  • Skyworks Solutions Inc
  • STMicroelectronics NV
  • Murata Manufacturing Co Ltd
  • Microchip Technology Inc
  • NXP Semiconductors NV

Á¦13Àå ºÎ·Ï

AJY 24.12.05

The Europe RF front-end chip market was valued at US$ 4,616.07 million in 2022 and is expected to reach US$ 10,572.19 million by 2030; it is estimated to register a CAGR of 10.9% from 2022 to 2030.

Rising Adoption of Smartphones, Tablets, and Other Consumer Electronics Products Drives Europe RF Front-End Chip Market

According to GSMA's annual State of Mobile Internet Connectivity Report 2023 (SOMIC), in October 2023, over half (54%) of the global population-approximately 4.3 billion people-owned a smartphone. The number of smartphones is increasing significantly. For example, according to Ericsson & The Radicati Group, in 2020, there were 5.75 billion smartphones, and in 2024, the number of smartphones grown to 6.93 billion, and as of 2025, it is expected to reach 7.15 billion. Also, tablets have become increasingly popular in recent years due to the range of benefits they offer over traditional laptops and desktop computers. The rising popularity of connected devices, such as tablets, smartphones, headphones, and wearables, further fuels the demand for RF frond-end chips. Smartphones and tablets often support numerous wireless services, including FM radio and LTE, across many frequency bands. At the same time, a growing number of smartphone and tablets use several antennas to improve sensitivity and reduce crosstalk. Miniature RF solid-state switches play a vital part in RF front-end designs for smart mobile devices. Consumers expect seamless connectivity and high data speeds, pushing manufacturers to incorporate advanced RF technologies into their devices. Hence, various market players have launched RF frond-end solutions for smartphones. For example, in May 2020, NXP Semiconductors NV announced that its most recent radio frequency front-end (RFFE) solution, designed with Wi-Fi 6 standards, was integrated into the Xiaomi Mi 10 5G smartphone. Thus, the growing adoption of smartphones, tablets, and other consumer electronics is driving the RF front-end chip market.

Europe RF Front-End Chip Market Overview

The Europe RF front-end chip market is segmented into Germany, France, Italy, the UK, Russia, and the Rest of Europe. The Europe RF front-end chip market is expanding rapidly due to technical innovation, a solid industrial base, and rising demand for advanced communication solutions. The implementation of 5G technology, developments in industrial automation, and the expansion of wireless communication networks positively impact the market dynamics in Europe. The rising deployment of 5G technology has encouraged various players across Europe to indulge in mergers and acquisitions activities to cater to the demand for RF front-end chips. For example, in October 2020, STMicroelectronics acquired Somos Semiconductor, a French fabless semiconductor firm focused on silicon-based power amplifiers and RF front-end modules (FEM) for the cellular IoT and 5G industries. The acquisition of Somos Semiconductor is projected to improve its FEM IP and product roadmap for the IoT and 5G industries, as well as reinforce its specialized staff. An initial product-an NB-IoT/CAT-M1 module-is now going through the standard qualification process and is the beginning of a new roadmap of connectivity RF FEM products.

Europe is also home to several technologically advanced solutions, such as IoT, and the countries in Europe have thriving semiconductor industries. According to Eurostat, in 2021, 29% of EU enterprises used IoT devices, mostly for keeping their premises secure. This encourages innovation in RF front-end chip technologies, resulting in the creation of high-performance and dependable components. Various players across Europe are providing RF front-end chips for IoT devices. For example, Skyworks Solutions Inc. provides Skyworks Solutions Inc. IoT RF Front-End Modules (FEM) support numerous wireless protocols and SoCs/RFICs in a single RF module. The IoT FEM is suitable for wireless connectivity, as it supports ZigBee, Thread, and Bluetooth standards, including BLUETOOTH 5. The IoT FEM is an efficient Internet of Things (IoT) solution when linked with a System on Chip (SoC) platform. Thus, all the factors mentioned above propel the growth of the RF front-end chip market.

Europe RF Front-End Chip Market Revenue and Forecast to 2030 (US$ Million)

Europe RF Front-End Chip Market Segmentation

The Europe RF front-end chip market is categorized into component, application, and country.

Based on component, the Europe RF front-end chip market is segmented into power amplifier, radio frequency filter, low noise amplifier, RF switch, and others. The power amplifier segment held the largest market share in 2022.

Based on application, the Europe RF front-end chip market is segmented into consumer electronics, wireless communication, and others. The consumer electronics segment held the largest market share in 2022.

By country, the Europe RF front-end chip market is segmented into Germany, the UK, France, Italy, Russia, and the Rest of Europe. Germany dominated the Europe RF front-end chip market share in 2022.

Broadcom Inc, Infineon Technologies AG, Microchip Technology Inc, Murata Manufacturing Co Ltd, NXP Semiconductors NV, Qorvo Inc, Skyworks Solutions Inc, STMicroelectronics NV, TDK Corp, and Texas Instruments Inc are some of the leading companies operating in the Europe RF front-end chip market.

Table Of Contents

1. Introduction

  • 1.1 The Insight Partners Research Report Guidance
  • 1.2 Market Segmentation

2. Executive Summary

  • 2.1 Key Insights
  • 2.2 Market Attractiveness

3. Research Methodology

  • 3.1 Coverage
  • 3.2 Secondary Research
  • 3.3 Primary Research

4. Europe RF Front-End Chip Market Landscape

  • 4.1 Overview
  • 4.2 Ecosystem Analysis
    • 4.2.1 List of Vendors in the Value Chain

5. Europe RF Front-End Chip Market - Key Market Dynamics

  • 5.1 Market Drivers
    • 5.1.1 Increasing Adoption of Wireless Network Infrastructure
    • 5.1.2 Rising Adoption of Smartphones, Tablets, and Other Consumer Electronics Products
  • 5.2 Market Restraints
    • 5.2.1 High Manufacturing Cost of RF Front-End Chips
    • 5.2.2 Integration Challenges of RF Front-End Chips
  • 5.3 Market Opportunities
    • 5.3.1 Proliferation of Internet of Things (IoT) Devices
    • 5.3.2 Emergence of 5G Technology
  • 5.4 Future Trends
    • 5.4.1 Miniaturization of RF Frond-End Modules
    • 5.4.2 Multi-Chip Front-End Modules
  • 5.5 Impact of Drivers and Restraints:

6. RF Front-End Chip Market - Europe Analysis

  • 6.1 Europe RF Front-End Chip Market Revenue (US$ Million), 2022-2030
  • 6.2 Europe RF Front-End Chip Market Forecast Analysis

7. Europe RF Front-End Chip Market Analysis - by Component

  • 7.1 Power Amplifier
    • 7.1.1 Overview
    • 7.1.2 Power Amplifier: Europe RF Front-End Chip Market - Revenue and Forecast to 2030 (US$ Million)
  • 7.2 Radio Frequency Filter
    • 7.2.1 Overview
    • 7.2.2 Radio Frequency Filter: Europe RF Front-End Chip Market - Revenue and Forecast to 2030 (US$ Million)
  • 7.3 Low Noise Amplifier
    • 7.3.1 Overview
    • 7.3.2 Low Noise Amplifier: Europe RF Front-End Chip Market - Revenue and Forecast to 2030 (US$ Million)
  • 7.4 RF Switch
    • 7.4.1 Overview
    • 7.4.2 RF Switch: Europe RF Front-End Chip Market - Revenue and Forecast to 2030 (US$ Million)
  • 7.5 Others
    • 7.5.1 Overview
    • 7.5.2 Others: Europe RF Front-End Chip Market - Revenue and Forecast to 2030 (US$ Million)

8. Europe RF Front-End Chip Market Analysis - by Application

  • 8.1 Consumer Electronics
    • 8.1.1 Overview
    • 8.1.2 Consumer Electronics: Europe RF Front-End Chip Market - Revenue and Forecast to 2030 (US$ Million)
  • 8.2 Wireless Communication
    • 8.2.1 Overview
    • 8.2.2 Wireless Communication: Europe RF Front-End Chip Market - Revenue and Forecast to 2030 (US$ Million)
  • 8.3 Others
    • 8.3.1 Overview
    • 8.3.2 Others: Europe RF Front-End Chip Market - Revenue and Forecast to 2030 (US$ Million)

9. Europe RF Front-End Chip Market - Country Analysis

  • 9.1 Europe RF Front-End Chip Market
    • 9.1.1 Europe RF Front-End Chip Market - Revenue and Forecast Analysis - by Country
      • 9.1.1.1 Europe RF Front-End Chip Market - Revenue and Forecast Analysis - by Country
      • 9.1.1.2 Germany: RF Front-End Chip Market - Revenue and Forecast to 2030 (US$ Million)
        • 9.1.1.2.1 Germany: RF Front-End Chip Market Breakdown, by Component
        • 9.1.1.2.2 Germany: RF Front-End Chip Market Breakdown, by Application
      • 9.1.1.3 United Kingdom: RF Front-End Chip Market - Revenue and Forecast to 2030 (US$ Million)
        • 9.1.1.3.1 United Kingdom: RF Front-End Chip Market Breakdown, by Component
        • 9.1.1.3.2 United Kingdom: RF Front-End Chip Market Breakdown, by Application
      • 9.1.1.4 France: RF Front-End Chip Market - Revenue and Forecast to 2030 (US$ Million)
        • 9.1.1.4.1 France: RF Front-End Chip Market Breakdown, by Component
        • 9.1.1.4.2 France: RF Front-End Chip Market Breakdown, by Application
      • 9.1.1.5 Italy: RF Front-End Chip Market - Revenue and Forecast to 2030 (US$ Million)
        • 9.1.1.5.1 Italy: RF Front-End Chip Market Breakdown, by Component
        • 9.1.1.5.2 Italy: RF Front-End Chip Market Breakdown, by Application
      • 9.1.1.6 Russia: RF Front-End Chip Market - Revenue and Forecast to 2030 (US$ Million)
        • 9.1.1.6.1 Russia: RF Front-End Chip Market Breakdown, by Component
        • 9.1.1.6.2 Russia: RF Front-End Chip Market Breakdown, by Application
      • 9.1.1.7 Rest of Europe: RF Front-End Chip Market - Revenue and Forecast to 2030 (US$ Million)
        • 9.1.1.7.1 Rest of Europe: RF Front-End Chip Market Breakdown, by Component
        • 9.1.1.7.2 Rest of Europe: RF Front-End Chip Market Breakdown, by Application

10. Competitive Landscape

  • 10.1 Company Positioning & Concentration
  • 10.2 Heat Map Analysis by Key Players

11. Industry Landscape

  • 11.1 Overview
  • 11.2 Market Initiative
  • 11.3 Product Development
  • 11.4 Mergers & Acquisitions

12. Company Profiles

  • 12.1 Infineon Technologies AG
    • 12.1.1 Key Facts
    • 12.1.2 Business Description
    • 12.1.3 Products and Services
    • 12.1.4 Financial Overview
    • 12.1.5 SWOT Analysis
    • 12.1.6 Key Developments
  • 12.2 TDK Corp
    • 12.2.1 Key Facts
    • 12.2.2 Business Description
    • 12.2.3 Products and Services
    • 12.2.4 Financial Overview
    • 12.2.5 SWOT Analysis
    • 12.2.6 Key Developments
  • 12.3 Texas Instruments Inc
    • 12.3.1 Key Facts
    • 12.3.2 Business Description
    • 12.3.3 Products and Services
    • 12.3.4 Financial Overview
    • 12.3.5 SWOT Analysis
    • 12.3.6 Key Developments
  • 12.4 Broadcom Inc
    • 12.4.1 Key Facts
    • 12.4.2 Business Description
    • 12.4.3 Products and Services
    • 12.4.4 Financial Overview
    • 12.4.5 SWOT Analysis
    • 12.4.6 Key Developments
  • 12.5 Qorvo Inc
    • 12.5.1 Key Facts
    • 12.5.2 Business Description
    • 12.5.3 Products and Services
    • 12.5.4 Financial Overview
    • 12.5.5 SWOT Analysis
    • 12.5.6 Key Developments
  • 12.6 Skyworks Solutions Inc
    • 12.6.1 Key Facts
    • 12.6.2 Business Description
    • 12.6.3 Products and Services
    • 12.6.4 Financial Overview
    • 12.6.5 SWOT Analysis
    • 12.6.6 Key Developments
  • 12.7 STMicroelectronics NV
    • 12.7.1 Key Facts
    • 12.7.2 Business Description
    • 12.7.3 Products and Services
    • 12.7.4 Financial Overview
    • 12.7.5 SWOT Analysis
    • 12.7.6 Key Developments
  • 12.8 Murata Manufacturing Co Ltd
    • 12.8.1 Key Facts
    • 12.8.2 Business Description
    • 12.8.3 Products and Services
    • 12.8.4 Financial Overview
    • 12.8.5 SWOT Analysis
    • 12.8.6 Key Developments
  • 12.9 Microchip Technology Inc
    • 12.9.1 Key Facts
    • 12.9.2 Business Description
    • 12.9.3 Products and Services
    • 12.9.4 Financial Overview
    • 12.9.5 SWOT Analysis
    • 12.9.6 Key Developments
  • 12.10 NXP Semiconductors NV
    • 12.10.1 Key Facts
    • 12.10.2 Business Description
    • 12.10.3 Products and Services
    • 12.10.4 Financial Overview
    • 12.10.5 SWOT Analysis
    • 12.10.6 Key Developments

13. Appendix

  • 13.1 Word Index
  • 13.2 About The Insight Partners
ºñ±³¸®½ºÆ®
0 °ÇÀÇ »óǰÀ» ¼±Åà Áß
»óǰ ºñ±³Çϱâ
Àüü»èÁ¦