북미의 3D 스태킹 시장 : 예측 - 상호접속 기술, 디바이스 유형, 최종 사용자별 지역 분석(-2031년)

The North America 3D stacking market was valued at US$ 538.48 million in 2023 and is expected to reach US$ 1,904.41 million by 2031; it is anticipated to reach a CAGR of 17.1% from 2023 to 2031.

Rising Demand for Consumer Electronics Fuels North America 3D Stacking Market

The proliferating demand for sleek, feature-rich, and power-efficient gadgets such as smartphones, tablets, smartwatches, and portable devices has led to immense pressure on manufacturers to deliver compact, high-performance solutions. For instance, according to estimates, the preliminary shipment of smartphones was 328 million units in the fourth quarter of 2023. This represents 8.6% gain over 4Q22, establishing 4Q23 as the first quarter to show major growth since 2Q21. Consumers across the globe are highly adopting smartphones for shopping, communication, entertainment, and other purposes. These devices use 3D stacked die packaging, which is revolutionizing their designs and functionality. 3D stacked die packaging is capable of significantly reducing form factors without compromising performance. By vertically stacking multiple layers of integrated circuits, this technology allows for the smooth integration of diverse components within a compact space. This consolidation not only streamlines the design and assembly processes but also enables manufacturers to create thin, more aesthetically appealing devices that align with the evolving preferences of consumers.

The enhanced performance achieved through 3D stacked die packaging plays a major role in meeting the escalating performance demands of modern consumer electronics. From advanced image processing in smartphones to real-time data analysis in smartwatches, the need for efficient and powerful semiconductor solutions is paramount. By leveraging 3D stacking technology, manufacturers can integrate memory, logic, and sensor components in a vertically interconnected manner, thereby enhancing processing capabilities while maintaining a compact form factor. Thus, the rising demand for consumer electronics that utilize 3D stacking technology is contributing to the growing North America 3D stacking market size.

North America 3D Stacking Market Overview

The rising consumer electronics industry is a significant driver for the 3D stacking market in North America. As consumers seek smaller and more portable electronic devices, the need for compact and efficient power sources, such as memories, has significantly grown. Furthermore, the proliferation of IoT and smart devices is another crucial factor propelling the 3D stacking market in North America. IoT devices, including wearables, sensors, and connected devices, rely on small and reliable power sources. Smartwatches, fitness trackers, and other wearables benefit from 3D stacking by integrating multiple functionalities in a compact form factor, including sensors, processors, and memory. The reduced power consumption from 3D stacked components extends the battery life of wearable devices.

The increasing adoption of IoT devices across various industries, such as healthcare and automotive, creates immense opportunities for 3D stacking providers. Moreover, the rise in demand for MEMS and sensors in North America has also created opportunities for market leaders engaged in the manufacturing of die, wafer, and flip-chip bonders, which boosts the requirement for 3D stacking. The rising utilization of vehicles and electronic devices fuels the demand for MEMS sensors, which is expected to fuel the 3D stacking market in North America during the forecast period.

North America 3D Stacking Market Revenue and Forecast to 2031 (US$ Million)

North America 3D Stacking Market Segmentation

The North America 3D stacking market is categorized into interconnecting technology, device type, end user, and country.

Based on interconnecting technology, the North America 3D stacking market is segmented into through-silicon via, monolithic 3D integration, and 3D hybrid bonding. The through-silicon via segment held the largest market share in 2023.

By device type, the North America 3D stacking market is segmented into memory devices, mems/sensors, LEDs, imaging & optoelectronics, and others. The memory devices segment held the largest market share in 2023.

In the terms of end user, the North America 3D stacking market is segmented into consumer electronics, telecommunication, automotive, manufacturing, healthcare, and others. The consumer electronics segment held the largest market share in 2023.

By country, the North America 3D stacking market is segmented into the US, Canada, and Mexico. The US dominated the North America 3D stacking market share in 2023.

Taiwan Semiconductor Manufacturing Co Ltd; Samsung Electronics Co Ltd; Intel Corp; MediaTek Inc.; Texas Instruments Inc; Amkor Technology Inc; ASE Technology Holding Co Ltd; Advanced Micro Devices Inc.; 3M Co.; and Globalfoundries Inc are some of the leading companies operating in the North America 3D stacking market.

Table Of Contents

1. Introduction

• 1.1 The Insight Partners Research Report Guidance
• 1.2 Market Segmentation

2. Executive Summary

• 2.1 Key Insights
• 2.2 Market Attractiveness

3. Research Methodology

• 3.1 Secondary Research
• 3.2 Primary Research
  • 3.2.1 Hypothesis formulation:
  • 3.2.2 Macro-economic factor analysis:
  • 3.2.3 Developing base number:
  • 3.2.4 Data Triangulation:
  • 3.2.5 Country level data:

4. North America 3D Stacking Market Landscape

• 4.1 Overview
• 4.2 PEST Analysis
• 4.3 Ecosystem Analysis
  • 4.3.1 List of Vendors in the Value Chain

5. North America 3D Stacking Market - Key Market Dynamics

• 5.1 3D Stacking Market - Key Market Dynamics
• 5.2 Market Drivers
  • 5.2.1 Rising Demand for Consumer Electronics
  • 5.2.2 Increasing Use of Heterogeneous Integration and Component Optimization
• 5.3 Market Restraints
  • 5.3.1 Complexity Associated with 3D Stacking Technology
• 5.4 Market Opportunities
  • 5.4.1 Surge in Demand for High-Bandwidth Memory
• 5.5 Future Trends
  • 5.5.1 Fast Processors for Gaming Purposes
• 5.6 Impact of Drivers and Restraints:

6. 3D Stacking Market -North America Market Analysis

• 6.1 North America 3D Stacking Market Overview-
• 6.2 North America 3D Stacking Market Revenue (US$ Million), 2021-2031
• 6.3 North America 3D Stacking Market Forecast Analysis

7. North America 3D Stacking Market Analysis - by Interconnecting Technology

• 7.1 Through-Silicon Via
  • 7.1.1 Overview
  • 7.1.2 Through-Silicon Via: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
• 7.2 Monolithic 3D Integration
  • 7.2.1 Overview
  • 7.2.2 Monolithic 3D Integration: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
• 7.3 3D Hybrid Bonding
  • 7.3.1 Overview
  • 7.3.2 3D Hybrid Bonding: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)

8. North America 3D Stacking Market Analysis - by Device Type

• 8.1 Memory Devices
  • 8.1.1 Overview
  • 8.1.2 Memory Devices: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
• 8.2 MEMS/Sensors
  • 8.2.1 Overview
  • 8.2.2 MEMS/Sensors: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
• 8.3 LEDs
  • 8.3.1 Overview
  • 8.3.2 LEDs: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
• 8.4 Imaging and Optoelectronics
  • 8.4.1 Overview
  • 8.4.2 Imaging and Optoelectronics: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
• 8.5 Others
  • 8.5.1 Overview
  • 8.5.2 Others: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)

9. North America 3D Stacking Market Analysis - by End User

• 9.1 Consumer Electronics
  • 9.1.1 Overview
  • 9.1.2 Consumer Electronics: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
• 9.2 Telecommunication
  • 9.2.1 Overview
  • 9.2.2 Telecommunication: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
• 9.3 Automotive
  • 9.3.1 Overview
  • 9.3.2 Automotive: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
• 9.4 Manufacturing
  • 9.4.1 Overview
  • 9.4.2 Manufacturing: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
• 9.5 Healthcare
  • 9.5.1 Overview
  • 9.5.2 Healthcare: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
• 9.6 Others
  • 9.6.1 Overview
  • 9.6.2 Others: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)

10. North America 3D Stacking Market -Country Analysis

• 10.1 North America
  • 10.1.1 North America 3D Stacking Market, by Key Country- Revenue (2023) (US$ Million)
  • 10.1.2 North America 3D Stacking Market - Revenue and Forecast Analysis - by Country
    • 10.1.2.1 North America 3D Stacking Market - Revenue and Forecast Analysis - by Country
    • 10.1.2.2 United States: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
      • 10.1.2.2.1 United States: 3D Stacking Market Breakdown, by Interconnecting Technology
      • 10.1.2.2.2 United States: 3D Stacking Market Breakdown, by Device Type
      • 10.1.2.2.3 United States: 3D Stacking Market Breakdown, by End User
    • 10.1.2.3 Canada: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
      • 10.1.2.3.1 Canada: 3D Stacking Market Breakdown, by Interconnecting Technology
      • 10.1.2.3.2 Canada: 3D Stacking Market Breakdown, by Device Type
      • 10.1.2.3.3 Canada: 3D Stacking Market Breakdown, by End User
    • 10.1.2.4 Mexico: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
      • 10.1.2.4.1 Mexico: 3D Stacking Market Breakdown, by Interconnecting Technology
      • 10.1.2.4.2 Mexico: 3D Stacking Market Breakdown, by Device Type
      • 10.1.2.4.3 Mexico: 3D Stacking Market Breakdown, by End User

11. Competitive Landscape

• 11.1 Heat Map Analysis by Key Players
• 11.2 Company Positioning & Concentration

12. Industry Landscape

• 12.1 Overview
• 12.2 Market Initiative
• 12.3 Product Development

13. Company Profiles

• 13.1 Taiwan Semiconductor Manufacturing Co Ltd
  • 13.1.1 Key Facts
  • 13.1.2 Business Description
  • 13.1.3 Products and Services
  • 13.1.4 Financial Overview
  • 13.1.5 SWOT Analysis
  • 13.1.6 Key Developments
• 13.2 Samsung Electronics Co Ltd
  • 13.2.1 Key Facts
  • 13.2.2 Business Description
  • 13.2.3 Products and Services
  • 13.2.4 Financial Overview
  • 13.2.5 SWOT Analysis
  • 13.2.6 Key Developments
• 13.3 Intel Corp
  • 13.3.1 Key Facts
  • 13.3.2 Business Description
  • 13.3.3 Products and Services
  • 13.3.4 Financial Overview
  • 13.3.5 SWOT Analysis
  • 13.3.6 Key Developments
• 13.4 MediaTek Inc
  • 13.4.1 Key Facts
  • 13.4.2 Business Description
  • 13.4.3 Products and Services
  • 13.4.4 Financial Overview
  • 13.4.5 SWOT Analysis
  • 13.4.6 Key Developments
• 13.5 Texas Instruments Inc
  • 13.5.1 Key Facts
  • 13.5.2 Business Description
  • 13.5.3 Products and Services
  • 13.5.4 Financial Overview
  • 13.5.5 SWOT Analysis
  • 13.5.6 Key Developments
• 13.6 Amkor Technology Inc
  • 13.6.1 Key Facts
  • 13.6.2 Business Description
  • 13.6.3 Products and Services
  • 13.6.4 Financial Overview
  • 13.6.5 SWOT Analysis
  • 13.6.6 Key Developments
• 13.7 ASE Technology Holding Co Ltd
  • 13.7.1 Key Facts
  • 13.7.2 Business Description
  • 13.7.3 Products and Services
  • 13.7.4 Financial Overview
  • 13.7.5 SWOT Analysis
  • 13.7.6 Key Developments
• 13.8 Advanced Micro Devices Inc
  • 13.8.1 Key Facts
  • 13.8.2 Business Description
  • 13.8.3 Products and Services
  • 13.8.4 Financial Overview
  • 13.8.5 SWOT Analysis
  • 13.8.6 Key Developments
• 13.9 3M Co
  • 13.9.1 Key Facts
  • 13.9.2 Business Description
  • 13.9.3 Products and Services
  • 13.9.4 Financial Overview
  • 13.9.5 SWOT Analysis
  • 13.9.6 Key Developments
• 13.10 Globalfoundries Inc
  • 13.10.1 Key Facts
  • 13.10.2 Business Description
  • 13.10.3 Products and Services
  • 13.10.4 Financial Overview
  • 13.10.5 SWOT Analysis
  • 13.10.6 Key Developments

14. Appendix

• 14.1 About The Insight Partners
• 14.2 Word Index