세계의 반도체 조립 공정 장비 시장 규모 : 패키징 기술별, 용도별, 최종 사용자별, 지역별, 범위 및 전망

Semiconductor Assembly Process Equipment Market Size And Forecast

Semiconductor Assembly Process Equipment Market size was valued at USD 3.98 Billion in 2023 and is projected to reach USD 7.28 Billion by 2030, growing at a CAGR of 9.1% during the forecast period 2024-2030. The Semiconductor Assembly Process Equipment Market encompasses the machinery, tools, and equipment utilized in the assembly and packaging stages of semiconductor manufacturing. This includes various processes such as die bonding, wire bonding, encapsulation, and testing, among others. The market covers both front-end and back-end assembly processes, catering to the diverse needs of semiconductor manufacturers worldwide.

Global Semiconductor Assembly Process Equipment Market Drivers

The market drivers for the Semiconductor Assembly Process Equipment Market can be influenced by various factors. These may include:

Technological Developments:

The need for increasingly complex assembly process equipment is driven by ongoing developments in semiconductor technology, such as the creation of smaller and more potent chips.

Growing Demand for Consumer Electronics:

In order to meet the production demands of these items, there is an increasing need for semiconductor assembly equipment due to the growing demand for smartphones, laptops, tablets, and other consumer electronics devices.

Growing Adoption of IoT and AI:

As a result of the widespread use of artificial intelligence (AI) and Internet of Things (IoT) technologies in a variety of industries, there is an increased need for semiconductors, which in turn propels the market for assembly process equipment.

Growth of the Automotive Industry:

The automotive industry's transition to advanced driver-assistance systems (ADAS), electric cars (EVs), and autonomous vehicles (AVs) necessitates a higher level of semiconductor content in vehicles, which increases demand for assembly process equipment.

5G Technology Deployment:

As 5G networks are deployed globally, the need for specialized semiconductors to be produced for telecommunications devices and infrastructure is increasing, which is driving demand for assembly process equipment.

Rapid Urbanization and Industrialization:

As a result of rising demand for electronics across a range of industries, including manufacturing, infrastructure, and healthcare, emerging nations are seeing a surge in the market for semiconductor assembly equipment.

Miniaturization Trend:

As electronic devices get smaller and more compact, there is a need for sophisticated assembly process equipment that can handle smaller components and achieve high precision and accuracy.

Government Investments and Programs:

Government investments in semiconductor fabs and infrastructure, as well as programs targeted at advancing semiconductor production and research and development (R&D) operations, all contribute to the expansion of the market.

Awareness of Supply Chain Resilience:

The COVID-19 pandemic brought attention to the significance of supply chain resilience, which incentivized semiconductor companies to make investments in modernizing assembly process equipment to augment manufacturing capacities and mitigate reliance on outside suppliers.

Environmental rules:

As environmental sustainability rules become more stringent, more energy-efficient and environmentally friendly semiconductor assembly process equipment is adopted, which in turn affects market dynamics.

Global Semiconductor Assembly Process Equipment Market Restraints

Several factors can act as restraints or challenges for the Semiconductor Assembly Process Equipment Market. These may include:

High Initial Expenditure:

Small and medium-sized semiconductor manufacturers find it difficult to enter new markets and expand due to the high initial capital expenditure needed to buy and install equipment for the semiconductor manufacturing process.

Compatibility and Integration Complexity:

It can take a lot of effort and time to integrate new assembly process equipment with the current production infrastructure. New technology adoption may be hampered by incompatibilities between several software platforms and equipment components.

The semiconductor industry is cyclical, experiencing upswings and downswings in response to spikes in demand. Market saturation, geopolitical unrest, and economic swings can all have an impact on market growth by causing demand instability for assembly process equipment.

Extensive Lead Times and Time-to-Market Pressures:

Semiconductor producers are under pressure to accelerate the release of new products and reduce the length of their product development cycles. Long lead times for purchasing and setting up assembly process equipment can affect time-to-market and manufacturing schedules, costing money and opportunities.

Global Semiconductor Shortages:

Uncertainty and bottlenecks in the market for assembly process equipment can result from disruptions in the semiconductor supply chain, such as the shortages that have occurred recently as a result of factors like increased demand, production disruptions, and geopolitical tensions.

Fast technical Obsolescence:

The semiconductor industry is known for its quick technical progress, which causes equipment and technology to become outdated very quickly. In order to maintain their competitiveness and relevance over the long run, semiconductor manufacturers need to carefully consider their investments in assembly process equipment.

Tight Competition:

There are many national and international competitors fighting for market share in the semiconductor assembly process equipment industry. Pricing pressure, dwindling profit margins, and difficulties differentiating products based on features and capabilities can all result from intense competition.

Trade laws and intellectual property protection:

Trade laws and intellectual property protection issues, such as patent disputes, can put semiconductor manufacturers in a legal bind and make it more difficult for them to develop and implement assembly line equipment on a global scale.

Complex Regulatory Compliance:

The development, production, and marketing of semiconductor assembly process equipment are made more difficult and expensive by the need to comply with a number of regulatory requirements, including safety standards, environmental laws, and export controls.

Environmental Concerns:

Because the semiconductor manufacturing process uses hazardous chemicals and produces a lot of waste, there is growing pressure to adopt cleaner, more sustainable manufacturing practices, which could result in higher costs and more work to comply with regulations.

Global Semiconductor Assembly Process Equipment Market Segmentation Analysis

The Global Semiconductor Assembly Process Equipment Market is segmented on the basis of Packaging Technology, Application, End-User, and Geography.

Semiconductor Assembly Process Equipment Market, By Packaging Technology

• Through-Hole Technology (THT)
• : Involves mounting components by inserting leads through holes in the PCB and soldering them on the opposite side.
• Surface Mount Technology (SMT)
• : Involves mounting components directly onto the surface of the PCB.
• Advanced Packaging
• : Includes various techniques such as System-in-Package (SiP), Chip-on-Board (COB), and Wafer Level Packaging (WLP).

Semiconductor Assembly Process Equipment Market, By Application

• Consumer Electronics
• : Includes applications in smartphones, tablets, laptops, and wearables.
• Automotive
• : Involves assembly process equipment used in automotive electronics, including engine control units, infotainment systems, and advanced driver-assistance systems (ADAS).
• Industrial
• : Covers equipment used in industrial automation, robotics, and control systems.
• Telecommunications
• : Encompasses equipment for telecommunications infrastructure, including base stations, routers, and switches.
• Medical
• : Involves assembly equipment used in medical devices and equipment, such as pacemakers, medical imaging devices, and monitoring systems.

Semiconductor Assembly Process Equipment Market, By End-User

• Semiconductor Manufacturers
• : Companies involved in the fabrication of semiconductor chips.
• Original Equipment Manufacturers (OEMs)
• : Companies that integrate semiconductor components into their end products, such as electronics manufacturers.
• Electronic Manufacturing Services (EMS) Providers
• : Contract manufacturers that offer assembly and manufacturing services to OEMs.

Semiconductor Assembly Process Equipment Market, By Geography

• North America:
• Market conditions and demand in the United States, Canada, and Mexico.
• Europe:
• Analysis of the Semiconductor Assembly Process Equipment Market in European countries.
• Asia-Pacific:
• Focusing on countries like China, India, Japan, South Korea, and others.
• Middle East and Africa:
• Examining market dynamics in the Middle East and African regions.
• Latin America:
• Covering market trends and developments in countries across Latin America.

Key Players

• The major players in the Semiconductor Assembly Process Equipment Market are:
• ASM Pacific Technology
• Kulicke & Soffa Industries
• Besi
• Accrutech
• Shinkawa
• Palomar Technologies
• Hesse Mechatronics
• Toray Engineering
• West Bond
• HYBOND
• DIAS Automation

TABLE OF CONTENTS

1. Introduction

• Market Definition
• Market Segmentation
• Research Methodology

2. Executive Summary

• Key Findings
• Market Overview
• Market Highlights

3. Market Overview

• Market Size and Growth Potential
• Market Trends
• Market Drivers
• Market Restraints
• Market Opportunities
• Porter's Five Forces Analysis

4. Semiconductor Assembly Process Equipment Market, By Packaging Technology

• Through-Hole Technology (THT)
• Surface Mount Technology (SMT)
• Advanced Packaging

5. Semiconductor Assembly Process Equipment Market, By Application

• Consumer Electronics
• Automotive
• Industrial
• Telecommunications
• Medical

6. Semiconductor Assembly Process Equipment Market, By End-User

• Semiconductor Manufacturers
• Original Equipment Manufacturers (OEMs)
• Electronic Manufacturing Services (EMS) Providers

7. Regional Analysis

• North America
• United States
• Canada
• Mexico
• Europe
• United Kingdom
• Germany
• France
• Italy
• Asia-Pacific
• China
• Japan
• India
• Australia
• Latin America
• Brazil
• Argentina
• Chile
• Middle East and Africa
• South Africa
• Saudi Arabia
• UAE

8. Market Dynamics

• Market Drivers
• Market Restraints
• Market Opportunities
• Impact of COVID-19 on the Market

9. Competitive Landscape

• Key Players
• Market Share Analysis

10. Company Profiles

• ASM Pacific Technology
• Kulicke & Soffa Industries
• Besi
• Accrutech
• Shinkawa
• Palomar Technologies
• Hesse Mechatronics
• Toray Engineering
• West Bond
• HYBOND
• DIAS Automation

11. Market Outlook and Opportunities

• Emerging Technologies
• Future Market Trends
• Investment Opportunities

12. Appendix

• List of Abbreviations
• Sources and References