하이브리드 메모리 큐브(HMC) 및 고대역폭 메모리(HBM) 시장 - 용도별, 최종 용도별, 메모리 유형별, 용량별, 지역별 및 국가별 분석 : 분석 및 예측(2023-2033년)

“The Global Hybrid Memory Cube and High-Bandwidth Memory Market Expected to Reach $27,078.6 Million by 2033.”

Introduction to Hybrid Memory Cube and High-Bandwidth Memory Market

The hybrid memory cube and high-bandwidth memory market was valued at around $4,078.9 million in 2023 and is expected to reach $27,078.6 million by 2033, at a CAGR of 20.84% from 2023 to 2033. The exponential growth in data generation across various industries, driven by applications such as AI, big data analytics, and high-performance computing, is fueling the demand for high-bandwidth and high-capacity memory solutions to efficiently handle large datasets, particularly in AI accelerators and edge computing for IoT and autonomous systems, driving market growth.

Market Introduction

A hybrid memory cube serves as a high-performance interface for computer random-access memory designed for stacked dynamic random-access memory (DRAM) using through-silicon via-based (TSV) technology. It comprises a consolidated package with either four or eight DRAM dies and one logic die, all stacked together through TSV. Memory within each cube is vertically organized, combining sections of each memory die with corresponding portions of others in the stack. In contrast, high-bandwidth memory (HBM) represents an innovative form of computer memory engineered to deliver a blend of high-bandwidth and low power consumption. Primarily applied in high-performance computing applications that demand swift data speeds, HBM utilizes 3D stacking technology. This involves stacking multiple layers of chips on top of each other through vertical channels known as through-silicon vias (TSVs)

Industry Impact

Hybrid memory cube (HMC) and high-bandwidth memory (HBM) technologies have exerted a profound influence on the semiconductor and memory sectors. Their introduction has brought significant enhancements in memory performance and data bandwidth, leading to swifter and more efficient data processing across various applications. These innovations have proven particularly pivotal in underpinning the expansion of artificial intelligence (AI), high-performance computing, and graphics processing units (GPUs). HMC and HBM have effectively facilitated the execution of memory-intensive tasks, such as neural network training and inference, thereby contributing to the advancement of AI and machine learning. Furthermore, their integration into edge computing has yielded reductions in latency and improvements in real-time data processing, rendering them indispensable components in the realms of the Internet of Things (IoT) and autonomous systems. Collectively, HMC and HBM technologies have played a pivotal role in elevating memory capabilities and expediting technological advancements.

Market Segmentation:

Segmentation 1: by Application

• Graphics Processing Unit (GPU)
• Application-Specific Integrated Circuit (ASIC)
• Central Processing Unit (CPU)
• Accelerated Processing Unit (APU)
• Others

Graphics Processing Unit (GPU) to Lead the Market (by Application)

Hybrid memory cubes and high-bandwidth memory offer significant memory bandwidth improvements, particularly beneficial for GPUs in graphics rendering and parallel computing. They excel in gaming and professional graphics applications, enabling efficient handling of large textures and high-resolution graphics. The 3D stacking feature also enables compact GPU designs, ideal for space-constrained environments such as laptops and small form factor PCs.

Segmentation 2: by End Use

• High-Performance Computing
• Networking and Telecommunications
• Data Centers
• Graphics Rendering and Gaming
• Others

High-Performance Computing to Lead the Market (by End Use)

In high-performance computing (HPC) environments, GPUs are widely used for parallel processing tasks. Hybrid memory cubes and high-bandwidth memory provide substantial benefits in managing large datasets and parallel workloads, enhancing the overall performance of HPC applications, including simulations, data analytics, machine learning, and scientific research, where high-bandwidth memory plays a crucial role in efficiently processing complex and data-intensive tasks.

Segmentation 3: by Memory Type

• Hybrid Memory Cube (HMC)
• High-Bandwidth Memory (HBM)

High-Bandwidth Memory to Lead the Market (by Memory Type)

High-bandwidth memory is commonly employed in GPUs and accelerators for applications such as gaming, graphics rendering, and high-performance computing (HPC), where high memory bandwidth is crucial for optimal performance. It is particularly suitable for scenarios with limited space constraints, where a compact footprint is essential.

Segmentation 4: by Capacity

• 2GB to 8GB
• 8GB to 16GB
• Above 16GB
• 2GB to 8GB to Lead the Market (by Capacity)

High-bandwidth memory is available in various capacities, typically from 1GB to 8GB per stack, and GPUs can use multiple stacks to increase memory capacity for handling diverse computational tasks and larger datasets. Hybrid memory cubes come in capacities ranging from 2GB to 16GB per module, offering scalability to configure systems based on performance requirements. This modularity provides flexibility to adapt memory configurations for various applications and computing environments.

Segmentation 5: by Region

• North America
• Europe
• Asia-Pacific
• Rest-of-the-World

North America Region to Lead the Market (by Region)

North America, especially the U.S., is a central hub for the global semiconductor industry, hosting major players heavily involved in memory technologies. The adoption of hybrid memory cubes and high-bandwidth memory across sectors such as gaming, networking, and high-performance computing has bolstered North America's leadership. Key semiconductor manufacturers in the region, such as AMD, Micron, and NVIDIA, drive innovation and competition, firmly establishing North America as a pivotal market for these memory technologies. This dynamic landscape is marked by continuous advancements in hybrid memory cubes and high-bandwidth memory.

Recent Developments

• On May 30, 2023, SK Hynix Inc. announced that it had completed the development of the industry's most advanced 1bnm, the fifth-generation of the 10nm process technology, while the company and Intel began a joint evaluation of 1bnm and validation in the Intel Data Center Certified memory program for DDR5 products targeted at Intel Xeon Scalable platforms.

• On December 6, 2022, Samsung Electronics Co., Ltd., the world leader in advanced memory technology, and NAVER Corporation, a global internet company with cutting-edge AI technology, announced a broad partnership to develop semiconductor solutions for hyperscale artificial intelligence (AI) models.

• On March 14, 2022, Alphawave agreed to acquire OpenFive, a SiFive business unit, bringing OpenFive's high-speed connectivity system-on-chip (SoC) IP portfolio and a proven team based in India and Silicon Valley that has been delivering custom silicon solutions for over 15 years. The acquisition significantly increased Alphawave's customer base globally from 20 currently to over 75, especially in North America, and added an additional hyperscaler customer base in North America.

Demand - Drivers, Restraints, and Opportunities

Market Drivers

Hybrid memory cube (HMC) and high-bandwidth memory (HBM) offer exceptional performance but grapple with cost challenges in comparison to standard DRAM. Organizations must carefully balance their remarkable speed and efficiency with the higher costs associated with HMC and HBM, influencing their procurement decisions. In the consumer electronics sector, the preference for cost-effective alternatives intensifies competition, potentially limiting the demand for these advanced memory technologies. Manufacturers of HMC and HBM are actively pursuing innovations to reduce costs and enhance affordability despite the existing challenges. However, their technological advancements hold promise for cost reduction as production methods continue to evolve.

Moreover, the stacking of memory layers in HMC and HBM has raised concerns about thermal issues, which can adversely affect performance and reliability. These concerns may drive a shift in demand toward memory solutions that offer comparable performance with lower thermal footprints, potentially impacting adoption rates. Memory manufacturers are investing in the development of advanced thermal management solutions and innovative cooling techniques, which could influence pricing. Ongoing efforts to design memory modules with improved heat dissipation properties aim to enhance their reliability and long-term usability.

Market Restraints

Hybrid memory cube (HMC) and high-bandwidth memory (HBM) are valued for performance but face cost challenges compared to standard DRAM. Organizations weigh their speed and efficiency against costs, impacting procurement. In consumer electronics, cost-effectiveness favors alternatives, increasing competition. HMC and HBM manufacturers aim to innovate and reduce costs. Despite challenges, their technological advancements have the potential for cost reduction as production methods evolve.

Stacking memory layers in HMC and HBM can lead to thermal issues, impacting performance and reliability. Concerns about heat may shift demand toward memory solutions with lower thermal impact, potentially affecting adoption rates. Memory manufacturers focus on enhancing thermal management solutions and innovative cooling techniques, which may impact pricing. Efforts to design modules with improved heat dissipation continue, enhancing reliability.

Market Opportunities

The proliferation of edge-based technologies, driven by IoT devices and AI applications, has created a demand for high-performance memory solutions. Hybrid memory cube (HMC) and high-bandwidth memory (HBM) have emerged as crucial components in supporting these technologies by providing rapid data processing and low latency, essential for edge computing. The European Commission's support for initiatives in cloud, edge, and IoT technologies further underscores the importance of efficient memory solutions. HMC and HBM's capabilities align with the requirements of edge devices, enabling seamless execution of AI algorithms and real-time analytics.

The adoption of autonomous driving technology presents a lucrative opportunity for HMC and HBM. These memory solutions efficiently handle the vast data volumes generated by autonomous vehicles, ensuring rapid data access and minimal latency for swift decision-making. Their energy-efficient nature supports extended battery life, and their scalability accommodates evolving autonomous technologies, making them indispensable in meeting the demands of the autonomous driving industry.

Key Market Players and Competition Synopsis

The companies that are profiled in the hybrid memory cube and high-bandwidth memory market have been selected based on inputs gathered from primary experts and analyzing company coverage, product portfolio, and market penetration.

Some of the prominent names in the market are:

Key Questions Answered in this Report:

• What are the main factors driving the demand for hybrid memory cubes and high-bandwidth memory?
• What are the latest technological advancements in hybrid memory cubes and high-bandwidth memory market?
• What is the bottleneck around the adoption of hybrid memory cubes and high-bandwidth memory across different regions and countries?
• How does the supply chain function in the global hybrid memory cube and high-bandwidth memory market?
• What are the major patents filed by the companies active in the global hybrid memory cube and high-bandwidth memory market?
• What are the strategies adopted by the key companies to gain a competitive edge?
• What is the future outlook for the hybrid memory cube and high-bandwidth memory market in terms of growth potential and technological advancements?

Table of Contents

Executive Summary

Scope and Definition

1. Markets

• 1.1. Trends: Current and Future Impact Assessment
  • 1.1.1. Trend Analysis: Global Hybrid Memory Cube and High-Bandwidth Memory Market
  • 1.1.2. Advancements in Data Center Applications
  • 1.1.3. Increasing Focus on Energy-Efficient Technology Solutions in the Memory Industry
• 1.2. Supply Chain Overview
  • 1.2.1. Value Chain Analysis
  • 1.2.2. Market Map
    • 1.2.2.1. Hybrid Memory Cube and High-Bandwidth Memory Market - Product (by Memory Type)
      • 1.2.2.1.1. Hybrid Memory Cube (HMC)
      • 1.2.2.1.2. High-Bandwidth Memory (HBM)
• 1.3. Research and Development Review
  • 1.3.1. Patent Filing Trend (by Country, Company)
• 1.4. Impact Analysis for Key Global Events
• 1.5. Market Dynamics Overview
  • 1.5.1. Market Drivers
    • 1.5.1.1. Massive Growth of Artificial Intelligence (AI)
    • 1.5.1.2. Increasing Use of Augmented Reality (AR) and Virtual Reality (VR)
  • 1.5.2. Market Challenges
    • 1.5.2.1. Higher Cost than Other Standard DRAMs
    • 1.5.2.2. Heat Dissipation Problems due to Integrated 3D Architectures
  • 1.5.3. Market Opportunities
    • 1.5.3.1. Growing Applications of Edge-Based Technologies
    • 1.5.3.2. Increasing Adoption of Autonomous Driving

2. Application

• 2.1. Application Segmentation
• 2.2. Application Summary
• 2.3. Global Hybrid Memory Cube and High-Bandwidth Memory Market (by Application)
  • 2.3.1. Graphics Processing Unit (GPU)
  • 2.3.2. Application-Specific Integrated Circuit (ASIC)
  • 2.3.3. Central Processing Unit (CPU)
  • 2.3.4. Accelerated Processing Unit (APU)
  • 2.3.5. Others
• 2.4. Global Hybrid Memory Cube and High-Bandwidth Memory Market (by End-Use)
  • 2.4.1. High-Performance Computing
  • 2.4.2. Networking and Telecommunications
  • 2.4.3. Data Centers
  • 2.4.4. Graphics Rendering and Gaming
  • 2.4.5. Others

3. Products

• 3.1. Product Segmentation
• 3.2. Product Summary
• 3.3. Global Hybrid Memory Cube and High-Bandwidth Memory Market (by Memory Type)
  • 3.3.1. Hybrid Memory Cube (HMC)
  • 3.3.2. High-Bandwidth Memory (HBM)
• 3.4. Global Hybrid Memory Cube and High-Bandwidth Memory Market (by Capacity)
  • 3.4.1. 2GB to 8GB
  • 3.4.2. Above 8GB to 16GB
  • 3.4.3. Above 16GB

4. Regions

• 4.1. Regional Summary
• 4.2. North America
  • 4.2.1. Regional Overview
  • 4.2.2. Driving Factors for Market Growth
  • 4.2.3. Factors Challenging the Market
  • 4.2.4. Application
  • 4.2.5. Product
  • 4.2.6. U.S.
  • 4.2.7. Canada
  • 4.2.8. Mexico
• 4.3. Europe
  • 4.3.1. Regional Overview
  • 4.3.2. Driving Factors for Market Growth
  • 4.3.3. Factors Challenging the Market
  • 4.3.4. Application
  • 4.3.5. Product
  • 4.3.6. France
  • 4.3.7. Germany
  • 4.3.8. U.K.
  • 4.3.9. Rest-of-Europe
• 4.4. Asia-Pacific
  • 4.4.1. Regional Overview
  • 4.4.2. Driving Factors for Market Growth
  • 4.4.3. Factors Challenging the Market
  • 4.4.4. Application
  • 4.4.5. Product
  • 4.4.6. China
  • 4.4.7. India
  • 4.4.8. Japan
  • 4.4.9. South Korea
  • 4.4.10. Rest-of-Asia-Pacific
• 4.5. Rest-of-the-World
  • 4.5.1. Regional Overview
  • 4.5.2. Driving Factors for Market Growth
  • 4.5.3. Factors Challenging the Market
  • 4.5.4. Application
  • 4.5.5. Product
  • 4.5.6. Middle East and Africa
  • 4.5.7. South America

5. Markets - Competitive Benchmarking & Company Profiles

• 5.1. Competitive Landscape
  • 5.1.1. Samsung Electronics Co., Ltd.
    • 5.1.1.1. Overview
    • 5.1.1.2. Top Products/Product Portfolio
    • 5.1.1.3. Top Competitors
    • 5.1.1.4. Target Customers
    • 5.1.1.5. Key Personnel
    • 5.1.1.6. Analyst View
    • 5.1.1.7. Market Share (2022)
  • 5.1.2. ALPHAWAVE SEMI
    • 5.1.2.1. Overview
    • 5.1.2.2. Top Products/Product Portfolio
    • 5.1.2.3. Top Competitors
    • 5.1.2.4. Target Customers
    • 5.1.2.5. Key Personnel
    • 5.1.2.6. Analyst View
    • 5.1.2.7. Market Share (2022)
  • 5.1.3. Fujitsu Ltd.
    • 5.1.3.1. Overview
    • 5.1.3.2. Top Products/Product Portfolio
    • 5.1.3.3. Top Competitors
    • 5.1.3.4. Target Customers
    • 5.1.3.5. Key Personnel
    • 5.1.3.6. Analyst View
    • 5.1.3.7. Market Share (2022)
  • 5.1.4. NVIDIA Corporation
    • 5.1.4.1. Overview
    • 5.1.4.2. Top Products/Product Portfolio
    • 5.1.4.3. Top Competitors
    • 5.1.4.4. Target Customers
    • 5.1.4.5. Key Personnel
    • 5.1.4.6. Analyst View
    • 5.1.4.7. Market Share (2022)
  • 5.1.5. Advanced Micro Devices, Inc.
    • 5.1.5.1. Overview
    • 5.1.5.2. Top Products/Product Portfolio
    • 5.1.5.3. Top Competitors
    • 5.1.5.4. Target Customers
    • 5.1.5.5. Key Personnel
    • 5.1.5.6. Analyst View
    • 5.1.5.7. Market Share (2022)
  • 5.1.6. SK HYNIX INC.
    • 5.1.6.1. Overview
    • 5.1.6.2. Top Products/Product Portfolio
    • 5.1.6.3. Top Competitors
    • 5.1.6.4. Target Customers
    • 5.1.6.5. Key Personnel
    • 5.1.6.6. Analyst View
    • 5.1.6.7. Market Share (2022)
  • 5.1.7. Micron Technology, Inc.
    • 5.1.7.1. Overview
    • 5.1.7.2. Top Products/Product Portfolio
    • 5.1.7.3. Top Competitors
    • 5.1.7.4. Target Customers
    • 5.1.7.5. Key Personnel
    • 5.1.7.6. Analyst View
    • 5.1.7.7. Market Share (2022)
  • 5.1.8. Intel Corporation
    • 5.1.8.1. Overview
    • 5.1.8.2. Top Products/Product Portfolio
    • 5.1.8.3. Top Competitors
    • 5.1.8.4. Target Customers
    • 5.1.8.5. Key Personnel
    • 5.1.8.6. Analyst View
    • 5.1.8.7. Market Share (2022)
  • 5.1.9. Cadence Design Systems, Inc.
    • 5.1.9.1. Overview
    • 5.1.9.2. Top Products/Product Portfolio
    • 5.1.9.3. Top Competitors
    • 5.1.9.4. Target Customers
    • 5.1.9.5. Key Personnel
    • 5.1.9.6. Analyst View
    • 5.1.9.7. Market Share (2022)
  • 5.1.10. Rambus
    • 5.1.10.1. Overview
    • 5.1.10.2. Top Products/Product Portfolio
    • 5.1.10.3. Top Competitors
    • 5.1.10.4. Target Customers
    • 5.1.10.5. Key Personnel
    • 5.1.10.6. Analyst View
    • 5.1.10.7. Market Share (2022)
  • 5.1.11. Simms International plc
    • 5.1.11.1. Overview
    • 5.1.11.2. Top Products/Product Portfolio
    • 5.1.11.3. Top Competitors
    • 5.1.11.4. Target Customers
    • 5.1.11.5. Key Personnel
    • 5.1.11.6. Analyst View
    • 5.1.11.7. Market Share (2022)
  • 5.1.12. IBM
    • 5.1.12.1. Overview
    • 5.1.12.2. Top Products/Product Portfolio
    • 5.1.12.3. Top Competitors
    • 5.1.12.4. Target Customers
    • 5.1.12.5. Key Personnel
    • 5.1.12.6. Analyst View
    • 5.1.12.7. Market Share (2022)
  • 5.1.13. Achronix Semiconductor Corporation
    • 5.1.13.1. Overview
    • 5.1.13.2. Top Products/Product Portfolio
    • 5.1.13.3. Top Competitors
    • 5.1.13.4. Target Customers
    • 5.1.13.5. Key Personnel
    • 5.1.13.6. Analyst View
    • 5.1.13.7. Market Share (2022)
  • 5.1.14. Hewlett Packard Enterprise
    • 5.1.14.1. Overview
    • 5.1.14.2. Top Products/Product Portfolio
    • 5.1.14.3. Top Competitors
    • 5.1.14.4. Target Customers
    • 5.1.14.5. Key Personnel
    • 5.1.14.6. Analyst View
    • 5.1.14.7. Market Share (2022)
  • 5.1.15. Renesas Electronics Corporation
    • 5.1.15.1. Overview
    • 5.1.15.2. Top Products/Product Portfolio
    • 5.1.15.3. Top Competitors
    • 5.1.15.4. Target Customers
    • 5.1.15.5. Key Personnel
    • 5.1.15.6. Analyst View
    • 5.1.15.7. Market Share (2022)

6. Research Methodology

• 6.1. Data Sources
  • 6.1.1. Primary Data Sources
  • 6.1.2. Secondary Data Sources
  • 6.1.3. Data Triangulation
• 6.2. Market Estimation and Forecast