아시아 태평양의 하이브리드 메모리 큐브(HMC) 및 고대역폭 메모리(HBM) 시장 : 용도, 최종 사용자, 메모리 유형, 용량, 국가별 분석 및 예측

Introduction to Asia-Pacific Hybrid Memory Cube and High-Bandwidth Memory Market

The Asia-Pacific memory cube and high-bandwidth memory market was valued at around $1,107.2 million in 2023 and is expected to reach $12,328.6 million by 2033, at a CAGR of 27.25% from 2023 to 2033. The rapid increase in data generation across multiple sectors, spurred by the use of AI, big data analytics, and high-performance computing, is driving the need for high-bandwidth and high-capacity memory solutions. These advanced memory solutions are essential for managing large datasets effectively, particularly in AI accelerators and edge computing applications for IoT and autonomous systems, thereby propelling market growth.

Market Introduction

The APAC Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) market is witnessing significant growth driven by increasing data-centric applications. The region's rapid adoption of AI, IoT, and high-performance computing in industries such as telecommunications, automotive, and consumer electronics fuels the demand for advanced memory solutions. HMC and HBM technologies provide superior bandwidth, efficiency, and performance, making them ideal for managing large datasets and enhancing computational capabilities. Countries like China, Japan, and South Korea are leading the market, backed by substantial investments in technology and infrastructure. According to Market Research Future, the APAC region is expected to dominate the HMC and HBM market due to these technological advancements and growing industry applications.

Market Segmentation:

Segmentation 1: by Application

• Graphics Processing Unit (GPU)
• Application-Specific Integrated Circuit (ASIC)
• Central Processing Unit (CPU)
• Accelerated Processing Unit (APU)
• Others

Segmentation 2: by End Use

• High-Performance Computing
• Networking and Telecommunications
• Data Centers
• Graphics Rendering and Gaming
• Others

Segmentation 3: by Memory Type

• Hybrid Memory Cube (HMC)
• High-Bandwidth Memory (HBM)

Segmentation 4: by Capacity

• 2GB to 8GB
• 8GB to 16GB
• Above 16GB

Segmentation 5: by Country

• China
• India
• Japan
• South Korea
• Rest-of-Asia-Pacific

Key Market Players and Competition Synopsis

The companies that are profiled in the market have been selected based on inputs gathered from primary experts and analyzing company coverage, product portfolio, and market penetration.

Some of the prominent names in the market are:

• Samsung Electronics Co., Ltd.
• Fujitsu Ltd.
• SK HYNIX INC.
• Renesas Electronics Corporation

Table of Contents

Executive Summary

Scope and Definition

1 Markets

• 1.1 Trends: Current and Future Impact Assessment
  • 1.1.1 Trend Analysis: Hybrid Memory Cube and High-Bandwidth Memory Market
  • 1.1.2 Advancements in Data Center Applications
  • 1.1.3 Increasing Focus on Energy-Efficient Technology Solutions in the Memory Industry
• 1.2 Supply Chain Overview
  • 1.2.1 Value Chain Analysis
  • 1.2.2 Market Map
    • 1.2.2.1 Hybrid Memory Cube and High-Bandwidth Memory Market - Product (by Memory Type)
      • 1.2.2.1.1 Hybrid Memory Cube (HMC)
      • 1.2.2.1.2 High-Bandwidth Memory (HBM)
• 1.3 Research and Development Review
  • 1.3.1 Patent Filing Trend (by Country, Company)
• 1.4 Impact Analysis for Key Global Events
• 1.5 Market Dynamics Overview
  • 1.5.1 Market Drivers
    • 1.5.1.1 Massive Growth of Artificial Intelligence (AI)
    • 1.5.1.2 Increasing Use of Augmented Reality (AR) and Virtual Reality (VR)
  • 1.5.2 Market Challenges
    • 1.5.2.1 Higher Cost than Other Standard DRAMs
    • 1.5.2.2 Heat Dissipation Problems due to Integrated 3D Architectures
  • 1.5.3 Market Opportunities
    • 1.5.3.1 Growing Applications of Edge-Based Technologies
    • 1.5.3.2 Increasing Adoption of Autonomous Driving

2 Regions

• 2.1 Regional Summary
• 2.2 Asia-Pacific
  • 2.2.1 Regional Overview
  • 2.2.2 Driving Factors for Market Growth
  • 2.2.3 Factors Challenging the Market
  • 2.2.4 Application
  • 2.2.5 Product
  • 2.2.6 China
  • 2.2.7 India
  • 2.2.8 Japan
  • 2.2.9 South Korea
  • 2.2.10 Rest-of-Asia-Pacific

3 Markets - Competitive Benchmarking & Company Profiles

• 3.1 Competitive Landscape
  • 3.1.1 Samsung Electronics Co., Ltd.
    • 3.1.1.1 Overview
    • 3.1.1.2 Top Products/Product Portfolio
    • 3.1.1.3 Top Competitors
    • 3.1.1.4 Target Customers
    • 3.1.1.5 Key Personnel
    • 3.1.1.6 Analyst View
    • 3.1.1.7 Market Share (2022)
  • 3.1.2 Fujitsu Ltd.
    • 3.1.2.1 Overview
    • 3.1.2.2 Top Products/Product Portfolio
    • 3.1.2.3 Top Competitors
    • 3.1.2.4 Target Customers
    • 3.1.2.5 Key Personnel
    • 3.1.2.6 Analyst View
    • 3.1.2.7 Market Share (2022)
  • 3.1.3 SK HYNIX INC.
    • 3.1.3.1 Overview
    • 3.1.3.2 Top Products/Product Portfolio
    • 3.1.3.3 Top Competitors
    • 3.1.3.4 Target Customers
    • 3.1.3.5 Key Personnel
    • 3.1.3.6 Analyst View
    • 3.1.3.7 Market Share (2022)
  • 3.1.4 Renesas Electronics Corporation
    • 3.1.4.1 Overview
    • 3.1.4.2 Top Products/Product Portfolio
    • 3.1.4.3 Top Competitors
    • 3.1.4.4 Target Customers
    • 3.1.4.5 Key Personnel
    • 3.1.4.6 Analyst View
    • 3.1.4.7 Market Share (2022)

4 Research Methodology

• 4.1 Data Sources
  • 4.1.1 Primary Data Sources
  • 4.1.2 Secondary Data Sources
  • 4.1.3 Data Triangulation
• 4.2 Market Estimation and Forecast