샘플 요청 목록

 카트 문의
시장보고서
상품코드
1886042

세계의 하이브리드 메모리 큐브(HMC) 및 고대역폭 메모리(HBM) 시장

Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM)
발행일: | 리서치사: Market Glass, Inc. (Formerly Global Industry Analysts, Inc.) | 페이지 정보: 영문 385 Pages | 배송안내 : 1-2일 (영업일 기준)

    
    
    



※ 본 상품은 영문 자료로 한글과 영문 목차에 불일치하는 내용이 있을 경우 영문을 우선합니다. 정확한 검토를 위해 영문 목차를 참고해주시기 바랍니다.

세계의 하이브리드 메모리 큐브(HMC) 및 고대역폭 메모리(HBM) 시장은 2030년까지 191억 달러에 달할 전망

하이브리드 메모리 큐브(HMC) 및 고대역폭 메모리(HBM) 세계 시장은 2024년에 38억 달러로 추정되며, 2024년부터 2030년까지의 분석 기간 동안 CAGR 30.9%로 성장하여 2030년까지 191억 달러에 달할 것으로 예측됩니다. 이 보고서에서 분석 대상으로 한 부문 중 하나인 하이브리드 메모리 큐브(HMC)는 29.3%의 CAGR을 기록하며 분석 기간 종료시까지 105억 달러에 달할 것으로 예측됩니다. 고대역폭 메모리(HBM) 부문의 성장률은 분석 기간 동안 33.2%의 CAGR로 추정됩니다.

미국 시장은 14억 달러로 추정되는 한편 중국은 37.1%의 CAGR로 성장할 것으로 예측됩니다

미국의 하이브리드 메모리 큐브(HMC) 및 고대역폭 메모리(HBM) 시장은 2024년에 14억 달러 규모로 추정됩니다. 세계 2위 경제 대국인 중국은 2024년부터 2030년까지의 분석 기간 동안 37.1%의 CAGR로 증가하여 2030년까지 44억 달러의 시장 규모에 달할 것으로 예측됩니다. 기타 주목할 만한 지역별 시장 분석으로는 일본과 캐나다가 있으며, 각각 분석 기간 동안에 23.0%, 25.6%의 CAGR로 성장할 것으로 예측됩니다. 유럽에서는 독일이 약 30.7%의 CAGR로 성장할 것으로 예측됩니다.

세계의 하이브리드 메모리 큐브(HMC) 및 고대역폭 메모리(HBM) 시장 - 주요 시장 동향과 촉진요인 개요

하이브리드 메모리 큐브(HMC) 및 고대역폭 메모리(HBM)는 메모리의 전망을 어떻게 변화시키고 있을까?

하이브리드 메모리 큐브(HMC) 및 고대역폭 메모리(HBM) 기술의 등장은 더 빠르고 효율적인 데이터 전송 속도에 대한 수요 증가를 배경으로 메모리 아키텍처의 큰 도약을 의미합니다. HMC와 HBM은 구조와 성능 면에서 DDR4, DDR5 등 기존 메모리와 크게 다릅니다. HMC는 실리콘 관통전극(TSV)으로 상호연결된 3D 적층 구조를 채택하여 고속 직렬 인터페이스를 통해 통신합니다. 이 아키텍처를 통해 HMC는 낮은 지연과 높은 대역폭을 실현하고, 확장 가능하고 병렬 처리 작업을 지원합니다. 반면, HBM은 넓은 I/O를 사용하는 다른 3D 적층 방식을 채택하여 전력 효율과 높은 대역폭이 특히 중요한 사용 사례에 적합합니다. HBM은 프로세서와의 긴밀한 통합을 통해 전력 제약에 대응하면서도 고성능 컴퓨팅 환경에서 매우 중요한 대량의 데이터 처리량을 달성할 수 있습니다. 이러한 메모리 유형은 실시간 데이터 처리와 고부하 워크로드에 대한 의존도가 높아지는 전 세계의 요구에 부응하는 새로운 표준을 제시합니다.

최신 컴퓨팅 시스템이 HMC와 HBM을 채택하는 이유

고성능 컴퓨팅 애플리케이션의 확산에 따라 그래픽처리장치(GPU), 중앙처리장치(CPU), 가속처리장치(APU), 필드프로그래머블게이트어레이(FPGA), 특정 애플리케이션용 집적회로(ASIC) 등 다양한 제품 유형에서 HMC 및 HBM의 채택이 확산되고 있습니다. 병렬 처리 및 고부하 그래픽 렌더링을 위해 설계된 GPU는 HBM의 광대역 메모리 인터페이스를 통해 데이터 병목현상을 크게 완화하여 큰 이점을 누리고 있습니다. CPU의 경우, HMC 기술은 고속 데이터 전송을 통해 멀티 코어 효율을 향상시켜 데이터 분석 및 AI 모델 트레이닝과 같은 애플리케이션에 필수적인 성능을 제공합니다. CPU와 GPU 기능을 통합한 APU는 HBM을 활용하여 고부하 작업을 저전력으로 관리합니다. 높은 설정 자유도로 유명한 FPGA는 저지연 네트워크 및 고속 데이터 라우팅 애플리케이션에서 HMC의 높은 데이터 전송 속도를 활용합니다. 한편, 딥러닝 및 엣지 컴퓨팅을 위한 맞춤형 설계 시스템에 많이 사용되는 ASIC은 HBM이 제공하는 대역폭과 효율성을 통해 성능을 향상시킬 수 있습니다. 이러한 통합 사례는 다양한 컴퓨팅 시스템이 기존의 성능 한계를 극복하기 위해 첨단 메모리 기술에 대한 의존도를 높이고 있음을 보여줍니다.

HMC와 HBM 기술은 다양한 분야를 어떻게 변화시키고 있는가?

HMC와 HBM의 역량은 그래픽, 고성능 컴퓨팅(HPC), 네트워크, 데이터센터 등 다양한 애플리케이션에 혁명을 일으키고 있습니다. 그래픽 분야에서 이러한 메모리 기술은 게임과 전문적인 시각화에서 초현실적인 렌더링과 몰입감 있는 경험을 구현하는 데 필수적입니다. 이러한 분야에서는 대규모 데이터세트를 최소한의 지연으로 처리하고 표시해야 합니다. 고성능 컴퓨팅 분야에서도 변혁적인 영향을 미치고 있습니다. HBM의 속도와 효율성은 시뮬레이션 및 복잡한 계산 처리에서 빛을 발하며, 기후 모델링, 유전체 연구, 금융 시뮬레이션 등의 작업 실행 시간을 단축합니다. 네트워크 인프라 역시 5G 및 클라우드 기반 서비스 시대에 필수적인 저지연 데이터 전송과 고속 패킷 처리를 위해 이러한 메모리 기술에 대한 의존도가 높아지고 있습니다. 현대 정보 인프라의 핵심인 데이터센터는 HMC와 HBM을 활용하여 데이터 처리량과 에너지 효율을 향상시키고, 클라우드 서비스, AI, 빅데이터 분석에서 발생하는 컴퓨팅 워크로드를 원활하게 처리할 수 있도록 지원합니다. 이러한 기술은 각 분야의 방대하고 증가하는 수요를 뒷받침하고 탁월한 성능 향상을 실현하는 데 필수적입니다.

HMC 및 HBM 시장의 성장을 이끄는 요인은 무엇인가?

HMC 및 HBM 시장의 성장은 현대 기술 동향 및 애플리케이션 요구 사항과 밀접하게 연관된 여러 요인에 의해 주도되고 있습니다. 첫째, AI, 머신러닝, 실시간 분석으로 인한 데이터 생성량의 급격한 증가는 데이터센터에 더 빠르고 에너지 효율적인 메모리 솔루션의 도입을 요구하고 있습니다. 기존 메모리 시스템으로는 필요한 데이터 전송 속도와 전력 제약에 대응할 수 없기 때문에 이러한 수요가 HBM과 HMC로의 전환을 촉진하고 있습니다. 다음으로, GPU 및 FPGA와 같은 첨단 컴퓨팅 시스템의 자동차 분야(자율주행) 및 의료 분야(실시간 영상 진단)에 대한 광범위한 통합은 이러한 메모리 기술의 채택을 촉진하고 있습니다. 고해상도 그래픽과 가상현실 애플리케이션에 대한 수요도 특히 게임 및 미디어 산업에서 메모리 업그레이드에 대한 막대한 투자를 주도하고 있습니다. 또한, 5G 및 엣지 컴퓨팅 인프라로의 전환은 저지연 및 고대역폭 통신을 필요로 하며, HMC와 HBM은 이 점에서 경쟁 우위를 제공합니다. 마지막으로, 지속가능성과 에너지 효율에 대한 노력은 전력 소비를 최소화하면서 성능을 극대화하는 메모리 아키텍처의 추구를 촉진하고 있으며, 이러한 기술은 그린 컴퓨팅 개념에서 필수적인 요소로 자리 잡고 있습니다. 전반적으로, 고급 컴퓨팅 요구, 데이터 중심 성장, 지속가능성에 대한 우려가 상호 작용하여 빠르게 진화하는 시장 상황에서 HMC와 HBM의 채택을 촉진하고 있습니다.

부문:

메모리 유형(하이브리드 메모리 큐브(HMC), 고대역폭 메모리(HBM)), 제품 유형(중앙처리장치(CPU), 그래픽처리장치(GPU), 필드 프로그래머블 게이트 어레이(FPGA), 가속처리장치(APU), 특정 용도용 집적회로(ASIC)), 애플리케이션(고성능 컴퓨팅 애플리케이션, 그래픽 애플리케이션, 데이터센터 애플리케이션, 네트워킹 애플리케이션, 기타 애플리케이션)

조사 대상 기업 예시

  • Samsung Group
  • Intel Corporation
  • Micron Technology, Inc.
  • Xilinx, Inc.
  • Synopsys, Inc.
  • Cadence Design Systems, Inc.
  • SK Hynix, Inc.
  • Samsung Semiconductor, Inc.
  • Arm Ltd.
  • Rambus, Inc.
  • Open-Silicon, Inc.

AI INTEGRATIONS

검증된 전문가 컨텐츠와 AI 툴을 통해 시장 및 경쟁 정보 분석을 혁신하고 있습니다.

Market Glass, Inc.는 LLM이나 산업 특화형 SLM을 조회하는 일반적인 방식이 아닌, 전 세계 도메인 전문가들이 엄선한 컨텐츠 리포지토리를 구축했습니다. 여기에는 비디오 전사, 블로그, 검색 엔진 조사, 방대한 양의 기업, 제품/서비스, 시장 데이터 등이 포함됩니다.

관세 영향 계수

Market Glass, Inc.가 본사 소재지, 생산기지, 수출입(완제품 및 OEM)을 기준으로 기업의 경쟁력 변화를 예측하는 가운데, 이번 보고서에서는 지리적 시장에 대한 관세의 영향을 반영하였습니다. 이러한 복잡하고 다면적인 시장 현실은 매출원가(COGS) 증가, 수익성 하락, 공급망 재편 등 경쟁사에게 다양한 영향을 미치며, 미시적 및 거시적 시장 역학에도 영향을 미칩니다.

목차

제1장 조사 방법

제2장 주요 요약

  • 시장 개요
  • 주요 기업
  • 시장 동향과 촉진요인
  • 세계 시장 전망

제3장 시장 분석

  • 미국
  • 캐나다
  • 일본
  • 중국
  • 유럽
  • 프랑스
  • 독일
  • 이탈리아
  • 영국
  • 기타 유럽
  • 아시아태평양
  • 세계 기타 지역

제4장 경쟁

KSM 25.12.18

Global Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) Market to Reach US$19.1 Billion by 2030

The global market for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) estimated at US$3.8 Billion in the year 2024, is expected to reach US$19.1 Billion by 2030, growing at a CAGR of 30.9% over the analysis period 2024-2030. Hybrid Memory Cube (HMC), one of the segments analyzed in the report, is expected to record a 29.3% CAGR and reach US$10.5 Billion by the end of the analysis period. Growth in the High-Bandwidth Memory (HBM) segment is estimated at 33.2% CAGR over the analysis period.

The U.S. Market is Estimated at US$1.4 Billion While China is Forecast to Grow at 37.1% CAGR

The Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) market in the U.S. is estimated at US$1.4 Billion in the year 2024. China, the world's second largest economy, is forecast to reach a projected market size of US$4.4 Billion by the year 2030 trailing a CAGR of 37.1% over the analysis period 2024-2030. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at a CAGR of 23.0% and 25.6% respectively over the analysis period. Within Europe, Germany is forecast to grow at approximately 30.7% CAGR.

Global Hybrid Memory Cube (HMC) and High-bandwidth Memory (HBM) Market - Key Trends & Drivers Summarized

How Are Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) Reshaping the Memory Landscape?

The advent of Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) technologies marks a significant leap in memory architecture, driven by the increasing demands for faster, more efficient data transfer speeds. HMC and HBM differ substantially from traditional memory types like DDR4 and DDR5 in terms of structure and performance. HMC utilizes a 3D stacked structure, interconnected by through-silicon vias (TSVs), and communicates through a high-speed serial interface. This architecture allows HMC to deliver higher bandwidth with reduced latency, supporting scalable and parallel processing tasks. HBM, on the other hand, employs a different 3D stacking approach with wide I/O, making it particularly well-suited for use cases where power efficiency and high bandwidth are critical. HBM's close integration with processors enables it to address power constraints while still supporting massive data throughput, which is crucial for high-performance computing environments. These memory types are setting new standards, meeting the needs of a world increasingly reliant on real-time data processing and intensive workloads.

Why Are Modern Compute Systems Turning to HMC and HBM?

The proliferation of high-compute applications has driven the widespread adoption of HMC and HBM in various product types, such as Graphics Processing Units (GPUs), Central Processing Units (CPUs), Accelerated Processing Units (APUs), Field Programmable Gate Arrays (FPGAs), and Application-Specific Integrated Circuits (ASICs). GPUs, designed for parallel processing and heavy graphics rendering, benefit immensely from HBM's wide memory interface, reducing data bottlenecks. In CPUs, HMC technology enhances multi-core efficiency by delivering faster data transfers, essential for applications like data analytics and AI model training. APUs, which combine CPU and GPU functionalities, leverage HBM to manage intensive tasks with reduced power consumption. FPGAs, known for their configurability, take advantage of HMC's high data rates for applications in low-latency networking and high-speed data routing. Meanwhile, ASICs, often used in custom-designed systems for deep learning and edge computing, are empowered by the bandwidth and efficiency that HBM provides. These integrations demonstrate how diverse compute systems are increasingly reliant on advanced memory technologies to break through conventional performance barriers.

How Are HMC and HBM Technologies Transforming Various Sectors?

The capabilities of HMC and HBM are revolutionizing a range of applications including graphics, high-performance computing (HPC), networking, and data centers. In graphics, these memory technologies are pivotal for ultra-realistic rendering and immersive experiences in gaming and professional visualization, where large datasets need to be processed and displayed with minimal lag. High-performance computing is another area seeing transformative impacts, as simulations and complex computations benefit from the speed and efficiency of HBM, reducing execution times for tasks like climate modeling, genomics research, and financial simulations. Networking infrastructure has also started to rely on these memory types for low-latency data transmission and high-speed packet processing, essential in the era of 5G and cloud-based services. Data centers, the backbone of modern information infrastructure, use HMC and HBM to enhance data throughput and energy efficiency, ensuring that computational workloads from cloud services, AI, and big data analytics can be handled seamlessly. These technologies are indispensable for supporting the vast and growing demands across these sectors, delivering unparalleled performance enhancements.

What Factors Are Driving the Growth in the HMC and HBM Market?

The growth in the HMC and HBM market is driven by several factors that are tightly interwoven with the demands of contemporary technology trends and applications. Firstly, the exponential increase in data generation from AI, machine learning, and real-time analytics is pressuring data centers to adopt faster and more energy-efficient memory solutions. This demand has fueled a shift toward HBM and HMC, as traditional memory systems cannot keep up with the necessary data transfer speeds or power constraints. Secondly, the widespread integration of advanced computing systems like GPUs and FPGAs into sectors such as automotive (for autonomous driving) and healthcare (for real-time imaging and diagnostics) is catalyzing the adoption of these memory technologies. The need for high-resolution graphics and virtual reality applications has also driven significant investments in memory upgrades, especially for gaming and media industries. Additionally, the move toward 5G and edge computing infrastructure necessitates low-latency, high-bandwidth communication, where HMC and HBM provide a competitive edge. Lastly, the drive for sustainability and energy efficiency is prompting organizations to seek memory architectures that minimize power consumption while maximizing performance, making these technologies integral in green computing initiatives. Overall, the interplay of advanced computing needs, data-centric growth, and sustainability concerns is propelling the adoption of HMC and HBM in a rapidly evolving market landscape.

SCOPE OF STUDY:

The report analyzes the Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) market in terms of units by the following Segments, and Geographic Regions/Countries:

Segments:

Memory Type (Hybrid Memory Cube (HMC), High-Bandwidth Memory (HBM)); Product Type (Central Processing Unit (CPU), Graphics Processing Unit (GPU), Field-Programmable Gate Array (FPGA), Accelerated Processing Unit (APU), Application-Specific Integrated Circuit (ASIC)); Application (High-Performance Computing Application, Graphics Application, Data Centers Application, Networking Application, Other Applications)

Geographic Regions/Countries:

World; United States; Canada; Japan; China; Europe (France; Germany; Italy; United Kingdom; and Rest of Europe); Asia-Pacific; Rest of World.

Select Competitors (Total 29 Featured) -

  • Samsung Group
  • Intel Corporation
  • Micron Technology, Inc.
  • Xilinx, Inc.
  • Synopsys, Inc.
  • Cadence Design Systems, Inc.
  • SK Hynix, Inc.
  • Samsung Semiconductor, Inc. (SSI)
  • Arm Ltd.
  • Rambus, Inc.
  • Open-Silicon, Inc.

AI INTEGRATIONS

We're transforming market and competitive intelligence with validated expert content and AI tools.

Instead of following the general norm of querying LLMs and Industry-specific SLMs, we built repositories of content curated from domain experts worldwide including video transcripts, blogs, search engines research, and massive amounts of enterprise, product/service, and market data.

TARIFF IMPACT FACTOR

Our new release incorporates impact of tariffs on geographical markets as we predict a shift in competitiveness of companies based on HQ country, manufacturing base, exports and imports (finished goods and OEM). This intricate and multifaceted market reality will impact competitors by increasing the Cost of Goods Sold (COGS), reducing profitability, reconfiguring supply chains, amongst other micro and macro market dynamics.

TABLE OF CONTENTS

I. METHODOLOGY

II. EXECUTIVE SUMMARY

  • 1. MARKET OVERVIEW
    • Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM): A Prelude
    • Introduction to High-Bandwidth Memory (HBM)
    • High-Bandwidth Memory Integration in High-Performance Computing
    • Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) Market: Global Market Prospects & Outlook
    • Market Dynamics and Emerging Trends
    • Market Segmentation and Analysis
    • Regional Analysis
    • China and Emerging Regions Demonstrate Fast Paced Growth
    • Trade Shocks, Uncertainty, and the Structural Rewiring of Globalization Bring Global Economy Under Siege
    • Trade Wars, Policy Volatility & Geopolitical Upheaval Compound Pressures on Global Economic Growth: World Economic Growth Projections (Real Gross Domestic Product (GDP), Annual % Change) for the Years 2024 Through 2026
    • All Eyes on Global Inflation as Tariff Volatility Reignites Price Pressures and Emerges as a Flashpoint Risk Across Global Markets: Global Headline Inflation Rates (In %) for the Years 2019 through 2026
    • Oil Prices Take Center Stage as the Ultimate Barometer of Global Economic Health-Signaling Boom or Heralding Recession: Global Average Annual Brent Crude Oil Price (In US$ Per Barrel) for Years 2019 through 2026
    • Tariff Shockwaves Reshape the High-End Memory Market Landscape
    • Competitive Scenario
    • Select Innovations
    • Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) - Global Key Competitors Percentage Market Share in 2025 (E)
    • Competitive Market Presence - Strong/Active/Niche/Trivial for Players Worldwide in 2025 (E)
    • Recent Market Activity
    • Domain Expert Insights
  • 2. FOCUS ON SELECT PLAYERS
  • 3. MARKET TRENDS & DRIVERS
    • High-Performance Computing: Fueling Opportunities for the HMC and HBM Market
    • Rise of High Performance Computing Opens Doors for Exploiting Novel Memory Architecture & Solutions: Global High Performance Computing Market (In US$ Billion) for Years 2020, 2022, 2024 and 2026
    • Revenue Breakdown (in %) of Global High-Performance Computing by End-Use Sector
    • Global Digital Transformation Spending (In US$ Trillion) for the Years 2019 through 2025E
    • Meeting the Rising Bandwidth and Capacity Needs of Modern Datacenters
    • As Data Reservoirs, Datacenters Have Become Information Powerhouses for Modern Day Organizations Needing Novel New Generation Memory Technologies: Global Datacenter IP Traffic (In Petabytes Per Month) for Years 2017 Through 2022
    • Rising Digitalization and the Growing Demand for Advanced Datacenter Memory Solutions
    • Datacenter Industry Trends Signal Strong Growth Potential
    • Emerging Dynamics of the Hybrid Memory Cube (HMC) Market
    • Evolution and Trends in the High-Bandwidth Memory (HBM) Market
    • High-Bandwidth Memory: The Critical Role of Advanced Testing in Semiconductor Packaging
    • The Future of High-Bandwidth Memory: A Balancing Act Between Necessity and Cost
    • The Challenges and Advances of High-Bandwidth Memory 3 in High-Performance Computing
    • Designing Efficient High-Bandwidth Memory Interfaces for HBM3
    • Growing Demand for New Generation Smart ICs for Emerging Technologies like AI Bodes Well for Growth
    • Global Market for Artificial Intelligence by Region (In US$ Billion) for Years 2021, 2025, 2027
    • Global AI Semiconductor Market (In US$ Billion) for Years 2020, 2023 & 2025
    • High-Bandwidth Memory Technology: Powering the Future of AI and High-Performance Computing
    • High-Bandwidth Memory: The Hidden Power Behind AI Model Training
    • High-Bandwidth Memory Pioneers Materials Innovation for the AI Revolution
    • AI and Machine Learning Fuel the Rise of High-Bandwidth Memory Technologies
    • High-Bandwidth Memory: The Engine Driving the Generative AI Boom
    • Miniaturization of Electronic Devices Benefit Market Prospects
  • 4. GLOBAL MARKET PERSPECTIVE
    • TABLE 1: World Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) Market Analysis of Annual Sales in US$ Thousand for Years 2018 through 2030
    • TABLE 2: World Recent Past, Current & Future Analysis for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Thousand for Years 2024 through 2030 and % CAGR
    • TABLE 3: World Historic Review for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Thousand for Years 2018 through 2023 and % CAGR
    • TABLE 4: World 12-Year Perspective for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets for Years 2018, 2025 & 2030
    • TABLE 5: World Recent Past, Current & Future Analysis for Hybrid Memory Cube (HMC) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Thousand for Years 2024 through 2030 and % CAGR
    • TABLE 6: World Historic Review for Hybrid Memory Cube (HMC) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Thousand for Years 2018 through 2023 and % CAGR
    • TABLE 7: World 12-Year Perspective for Hybrid Memory Cube (HMC) by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2018, 2025 & 2030
    • TABLE 8: World Recent Past, Current & Future Analysis for High-Bandwidth Memory (HBM) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Thousand for Years 2024 through 2030 and % CAGR
    • TABLE 9: World Historic Review for High-Bandwidth Memory (HBM) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Thousand for Years 2018 through 2023 and % CAGR
    • TABLE 10: World 12-Year Perspective for High-Bandwidth Memory (HBM) by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2018, 2025 & 2030
    • TABLE 11: World Recent Past, Current & Future Analysis for Central Processing Unit (CPU) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Thousand for Years 2024 through 2030 and % CAGR
    • TABLE 12: World Historic Review for Central Processing Unit (CPU) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Thousand for Years 2018 through 2023 and % CAGR
    • TABLE 13: World 12-Year Perspective for Central Processing Unit (CPU) by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2018, 2025 & 2030
    • TABLE 14: World Recent Past, Current & Future Analysis for Graphics Processing Unit (GPU) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Thousand for Years 2024 through 2030 and % CAGR
    • TABLE 15: World Historic Review for Graphics Processing Unit (GPU) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Thousand for Years 2018 through 2023 and % CAGR
    • TABLE 16: World 12-Year Perspective for Graphics Processing Unit (GPU) by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2018, 2025 & 2030
    • TABLE 17: World Recent Past, Current & Future Analysis for Field-Programmable Gate Array (FPGA) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Thousand for Years 2024 through 2030 and % CAGR
    • TABLE 18: World Historic Review for Field-Programmable Gate Array (FPGA) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Thousand for Years 2018 through 2023 and % CAGR
    • TABLE 19: World 12-Year Perspective for Field-Programmable Gate Array (FPGA) by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2018, 2025 & 2030
    • TABLE 20: World Recent Past, Current & Future Analysis for Accelerated Processing Unit (APU) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Thousand for Years 2024 through 2030 and % CAGR
    • TABLE 21: World Historic Review for Accelerated Processing Unit (APU) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Thousand for Years 2018 through 2023 and % CAGR
    • TABLE 22: World 12-Year Perspective for Accelerated Processing Unit (APU) by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2018, 2025 & 2030
    • TABLE 23: World Recent Past, Current & Future Analysis for Application-Specific Integrated Circuit (ASIC) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Thousand for Years 2024 through 2030 and % CAGR
    • TABLE 24: World Historic Review for Application-Specific Integrated Circuit (ASIC) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Thousand for Years 2018 through 2023 and % CAGR
    • TABLE 25: World 12-Year Perspective for Application-Specific Integrated Circuit (ASIC) by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2018, 2025 & 2030
    • TABLE 26: World Recent Past, Current & Future Analysis for High-Performance Computing Application by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Thousand for Years 2024 through 2030 and % CAGR
    • TABLE 27: World Historic Review for High-Performance Computing Application by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Thousand for Years 2018 through 2023 and % CAGR
    • TABLE 28: World 12-Year Perspective for High-Performance Computing Application by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2018, 2025 & 2030
    • TABLE 29: World Recent Past, Current & Future Analysis for Graphics Application by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Thousand for Years 2024 through 2030 and % CAGR
    • TABLE 30: World Historic Review for Graphics Application by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Thousand for Years 2018 through 2023 and % CAGR
    • TABLE 31: World 12-Year Perspective for Graphics Application by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2018, 2025 & 2030
    • TABLE 32: World Recent Past, Current & Future Analysis for Data Centers Application by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Thousand for Years 2024 through 2030 and % CAGR
    • TABLE 33: World Historic Review for Data Centers Application by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Thousand for Years 2018 through 2023 and % CAGR
    • TABLE 34: World 12-Year Perspective for Data Centers Application by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2018, 2025 & 2030
    • TABLE 35: World Recent Past, Current & Future Analysis for Networking Application by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Thousand for Years 2024 through 2030 and % CAGR
    • TABLE 36: World Historic Review for Networking Application by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Thousand for Years 2018 through 2023 and % CAGR
    • TABLE 37: World 12-Year Perspective for Networking Application by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2018, 2025 & 2030
    • TABLE 38: World Recent Past, Current & Future Analysis for Other Applications by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Thousand for Years 2024 through 2030 and % CAGR
    • TABLE 39: World Historic Review for Other Applications by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Thousand for Years 2018 through 2023 and % CAGR
    • TABLE 40: World 12-Year Perspective for Other Applications by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2018, 2025 & 2030

III. MARKET ANALYSIS

  • UNITED STATES
    • Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United States for 2025 (E)
    • TABLE 41: USA Recent Past, Current & Future Analysis for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Memory Type - Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) - Independent Analysis of Annual Revenues in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 42: USA Historic Review for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Memory Type - Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) Markets - Independent Analysis of Annual Revenues in US$ Thousand for Years 2018 through 2023 and % CAGR
    • TABLE 43: USA 12-Year Perspective for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Memory Type - Percentage Breakdown of Value Revenues for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) for the Years 2018, 2025 & 2030
    • TABLE 44: USA Recent Past, Current & Future Analysis for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Product Type - Central Processing Unit (CPU), Graphics Processing Unit (GPU), Field-Programmable Gate Array (FPGA), Accelerated Processing Unit (APU) and Application-Specific Integrated Circuit (ASIC) - Independent Analysis of Annual Revenues in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 45: USA Historic Review for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Product Type - Central Processing Unit (CPU), Graphics Processing Unit (GPU), Field-Programmable Gate Array (FPGA), Accelerated Processing Unit (APU) and Application-Specific Integrated Circuit (ASIC) Markets - Independent Analysis of Annual Revenues in US$ Thousand for Years 2018 through 2023 and % CAGR
    • TABLE 46: USA 12-Year Perspective for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Product Type - Percentage Breakdown of Value Revenues for Central Processing Unit (CPU), Graphics Processing Unit (GPU), Field-Programmable Gate Array (FPGA), Accelerated Processing Unit (APU) and Application-Specific Integrated Circuit (ASIC) for the Years 2018, 2025 & 2030
    • TABLE 47: USA Recent Past, Current & Future Analysis for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Application - High-Performance Computing Application, Graphics Application, Data Centers Application, Networking Application and Other Applications - Independent Analysis of Annual Revenues in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 48: USA Historic Review for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Application - High-Performance Computing Application, Graphics Application, Data Centers Application, Networking Application and Other Applications Markets - Independent Analysis of Annual Revenues in US$ Thousand for Years 2018 through 2023 and % CAGR
    • TABLE 49: USA 12-Year Perspective for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Application - Percentage Breakdown of Value Revenues for High-Performance Computing Application, Graphics Application, Data Centers Application, Networking Application and Other Applications for the Years 2018, 2025 & 2030
  • CANADA
    • TABLE 50: Canada Recent Past, Current & Future Analysis for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Memory Type - Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) - Independent Analysis of Annual Revenues in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 51: Canada Historic Review for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Memory Type - Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) Markets - Independent Analysis of Annual Revenues in US$ Thousand for Years 2018 through 2023 and % CAGR
    • TABLE 52: Canada 12-Year Perspective for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Memory Type - Percentage Breakdown of Value Revenues for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) for the Years 2018, 2025 & 2030
    • TABLE 53: Canada Recent Past, Current & Future Analysis for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Product Type - Central Processing Unit (CPU), Graphics Processing Unit (GPU), Field-Programmable Gate Array (FPGA), Accelerated Processing Unit (APU) and Application-Specific Integrated Circuit (ASIC) - Independent Analysis of Annual Revenues in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 54: Canada Historic Review for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Product Type - Central Processing Unit (CPU), Graphics Processing Unit (GPU), Field-Programmable Gate Array (FPGA), Accelerated Processing Unit (APU) and Application-Specific Integrated Circuit (ASIC) Markets - Independent Analysis of Annual Revenues in US$ Thousand for Years 2018 through 2023 and % CAGR
    • TABLE 55: Canada 12-Year Perspective for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Product Type - Percentage Breakdown of Value Revenues for Central Processing Unit (CPU), Graphics Processing Unit (GPU), Field-Programmable Gate Array (FPGA), Accelerated Processing Unit (APU) and Application-Specific Integrated Circuit (ASIC) for the Years 2018, 2025 & 2030
    • TABLE 56: Canada Recent Past, Current & Future Analysis for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Application - High-Performance Computing Application, Graphics Application, Data Centers Application, Networking Application and Other Applications - Independent Analysis of Annual Revenues in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 57: Canada Historic Review for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Application - High-Performance Computing Application, Graphics Application, Data Centers Application, Networking Application and Other Applications Markets - Independent Analysis of Annual Revenues in US$ Thousand for Years 2018 through 2023 and % CAGR
    • TABLE 58: Canada 12-Year Perspective for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Application - Percentage Breakdown of Value Revenues for High-Performance Computing Application, Graphics Application, Data Centers Application, Networking Application and Other Applications for the Years 2018, 2025 & 2030
  • JAPAN
    • Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Japan for 2025 (E)
    • TABLE 59: Japan Recent Past, Current & Future Analysis for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Memory Type - Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) - Independent Analysis of Annual Revenues in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 60: Japan Historic Review for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Memory Type - Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) Markets - Independent Analysis of Annual Revenues in US$ Thousand for Years 2018 through 2023 and % CAGR
    • TABLE 61: Japan 12-Year Perspective for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Memory Type - Percentage Breakdown of Value Revenues for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) for the Years 2018, 2025 & 2030
    • TABLE 62: Japan Recent Past, Current & Future Analysis for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Product Type - Central Processing Unit (CPU), Graphics Processing Unit (GPU), Field-Programmable Gate Array (FPGA), Accelerated Processing Unit (APU) and Application-Specific Integrated Circuit (ASIC) - Independent Analysis of Annual Revenues in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 63: Japan Historic Review for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Product Type - Central Processing Unit (CPU), Graphics Processing Unit (GPU), Field-Programmable Gate Array (FPGA), Accelerated Processing Unit (APU) and Application-Specific Integrated Circuit (ASIC) Markets - Independent Analysis of Annual Revenues in US$ Thousand for Years 2018 through 2023 and % CAGR
    • TABLE 64: Japan 12-Year Perspective for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Product Type - Percentage Breakdown of Value Revenues for Central Processing Unit (CPU), Graphics Processing Unit (GPU), Field-Programmable Gate Array (FPGA), Accelerated Processing Unit (APU) and Application-Specific Integrated Circuit (ASIC) for the Years 2018, 2025 & 2030
    • TABLE 65: Japan Recent Past, Current & Future Analysis for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Application - High-Performance Computing Application, Graphics Application, Data Centers Application, Networking Application and Other Applications - Independent Analysis of Annual Revenues in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 66: Japan Historic Review for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Application - High-Performance Computing Application, Graphics Application, Data Centers Application, Networking Application and Other Applications Markets - Independent Analysis of Annual Revenues in US$ Thousand for Years 2018 through 2023 and % CAGR
    • TABLE 67: Japan 12-Year Perspective for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Application - Percentage Breakdown of Value Revenues for High-Performance Computing Application, Graphics Application, Data Centers Application, Networking Application and Other Applications for the Years 2018, 2025 & 2030
  • CHINA
    • Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) Market Presence - Strong/Active/Niche/Trivial - Key Competitors in China for 2025 (E)
    • TABLE 68: China Recent Past, Current & Future Analysis for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Memory Type - Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) - Independent Analysis of Annual Revenues in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 69: China Historic Review for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Memory Type - Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) Markets - Independent Analysis of Annual Revenues in US$ Thousand for Years 2018 through 2023 and % CAGR
    • TABLE 70: China 12-Year Perspective for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Memory Type - Percentage Breakdown of Value Revenues for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) for the Years 2018, 2025 & 2030
    • TABLE 71: China Recent Past, Current & Future Analysis for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Product Type - Central Processing Unit (CPU), Graphics Processing Unit (GPU), Field-Programmable Gate Array (FPGA), Accelerated Processing Unit (APU) and Application-Specific Integrated Circuit (ASIC) - Independent Analysis of Annual Revenues in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 72: China Historic Review for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Product Type - Central Processing Unit (CPU), Graphics Processing Unit (GPU), Field-Programmable Gate Array (FPGA), Accelerated Processing Unit (APU) and Application-Specific Integrated Circuit (ASIC) Markets - Independent Analysis of Annual Revenues in US$ Thousand for Years 2018 through 2023 and % CAGR
    • TABLE 73: China 12-Year Perspective for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Product Type - Percentage Breakdown of Value Revenues for Central Processing Unit (CPU), Graphics Processing Unit (GPU), Field-Programmable Gate Array (FPGA), Accelerated Processing Unit (APU) and Application-Specific Integrated Circuit (ASIC) for the Years 2018, 2025 & 2030
    • TABLE 74: China Recent Past, Current & Future Analysis for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Application - High-Performance Computing Application, Graphics Application, Data Centers Application, Networking Application and Other Applications - Independent Analysis of Annual Revenues in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 75: China Historic Review for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Application - High-Performance Computing Application, Graphics Application, Data Centers Application, Networking Application and Other Applications Markets - Independent Analysis of Annual Revenues in US$ Thousand for Years 2018 through 2023 and % CAGR
    • TABLE 76: China 12-Year Perspective for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Application - Percentage Breakdown of Value Revenues for High-Performance Computing Application, Graphics Application, Data Centers Application, Networking Application and Other Applications for the Years 2018, 2025 & 2030
  • EUROPE
    • Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Europe for 2025 (E)
    • TABLE 77: Europe Recent Past, Current & Future Analysis for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Geographic Region - France, Germany, Italy, UK and Rest of Europe Markets - Independent Analysis of Annual Revenues in US$ Thousand for Years 2024 through 2030 and % CAGR
    • TABLE 78: Europe Historic Review for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Geographic Region - France, Germany, Italy, UK and Rest of Europe Markets - Independent Analysis of Annual Revenues in US$ Thousand for Years 2018 through 2023 and % CAGR
    • TABLE 79: Europe 12-Year Perspective for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Geographic Region - Percentage Breakdown of Value Revenues for France, Germany, Italy, UK and Rest of Europe Markets for Years 2018, 2025 & 2030
    • TABLE 80: Europe Recent Past, Current & Future Analysis for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Memory Type - Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) - Independent Analysis of Annual Revenues in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 81: Europe Historic Review for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Memory Type - Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) Markets - Independent Analysis of Annual Revenues in US$ Thousand for Years 2018 through 2023 and % CAGR
    • TABLE 82: Europe 12-Year Perspective for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Memory Type - Percentage Breakdown of Value Revenues for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) for the Years 2018, 2025 & 2030
    • TABLE 83: Europe Recent Past, Current & Future Analysis for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Product Type - Central Processing Unit (CPU), Graphics Processing Unit (GPU), Field-Programmable Gate Array (FPGA), Accelerated Processing Unit (APU) and Application-Specific Integrated Circuit (ASIC) - Independent Analysis of Annual Revenues in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 84: Europe Historic Review for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Product Type - Central Processing Unit (CPU), Graphics Processing Unit (GPU), Field-Programmable Gate Array (FPGA), Accelerated Processing Unit (APU) and Application-Specific Integrated Circuit (ASIC) Markets - Independent Analysis of Annual Revenues in US$ Thousand for Years 2018 through 2023 and % CAGR
    • TABLE 85: Europe 12-Year Perspective for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Product Type - Percentage Breakdown of Value Revenues for Central Processing Unit (CPU), Graphics Processing Unit (GPU), Field-Programmable Gate Array (FPGA), Accelerated Processing Unit (APU) and Application-Specific Integrated Circuit (ASIC) for the Years 2018, 2025 & 2030
    • TABLE 86: Europe Recent Past, Current & Future Analysis for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Application - High-Performance Computing Application, Graphics Application, Data Centers Application, Networking Application and Other Applications - Independent Analysis of Annual Revenues in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 87: Europe Historic Review for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Application - High-Performance Computing Application, Graphics Application, Data Centers Application, Networking Application and Other Applications Markets - Independent Analysis of Annual Revenues in US$ Thousand for Years 2018 through 2023 and % CAGR
    • TABLE 88: Europe 12-Year Perspective for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Application - Percentage Breakdown of Value Revenues for High-Performance Computing Application, Graphics Application, Data Centers Application, Networking Application and Other Applications for the Years 2018, 2025 & 2030
  • FRANCE
    • TABLE 89: France Recent Past, Current & Future Analysis for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Memory Type - Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) - Independent Analysis of Annual Revenues in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 90: France Historic Review for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Memory Type - Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) Markets - Independent Analysis of Annual Revenues in US$ Thousand for Years 2018 through 2023 and % CAGR
    • TABLE 91: France 12-Year Perspective for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Memory Type - Percentage Breakdown of Value Revenues for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) for the Years 2018, 2025 & 2030
    • TABLE 92: France Recent Past, Current & Future Analysis for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Product Type - Central Processing Unit (CPU), Graphics Processing Unit (GPU), Field-Programmable Gate Array (FPGA), Accelerated Processing Unit (APU) and Application-Specific Integrated Circuit (ASIC) - Independent Analysis of Annual Revenues in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 93: France Historic Review for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Product Type - Central Processing Unit (CPU), Graphics Processing Unit (GPU), Field-Programmable Gate Array (FPGA), Accelerated Processing Unit (APU) and Application-Specific Integrated Circuit (ASIC) Markets - Independent Analysis of Annual Revenues in US$ Thousand for Years 2018 through 2023 and % CAGR
    • TABLE 94: France 12-Year Perspective for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Product Type - Percentage Breakdown of Value Revenues for Central Processing Unit (CPU), Graphics Processing Unit (GPU), Field-Programmable Gate Array (FPGA), Accelerated Processing Unit (APU) and Application-Specific Integrated Circuit (ASIC) for the Years 2018, 2025 & 2030
    • TABLE 95: France Recent Past, Current & Future Analysis for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Application - High-Performance Computing Application, Graphics Application, Data Centers Application, Networking Application and Other Applications - Independent Analysis of Annual Revenues in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 96: France Historic Review for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Application - High-Performance Computing Application, Graphics Application, Data Centers Application, Networking Application and Other Applications Markets - Independent Analysis of Annual Revenues in US$ Thousand for Years 2018 through 2023 and % CAGR
    • TABLE 97: France 12-Year Perspective for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Application - Percentage Breakdown of Value Revenues for High-Performance Computing Application, Graphics Application, Data Centers Application, Networking Application and Other Applications for the Years 2018, 2025 & 2030
  • GERMANY
    • TABLE 98: Germany Recent Past, Current & Future Analysis for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Memory Type - Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) - Independent Analysis of Annual Revenues in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 99: Germany Historic Review for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Memory Type - Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) Markets - Independent Analysis of Annual Revenues in US$ Thousand for Years 2018 through 2023 and % CAGR
    • TABLE 100: Germany 12-Year Perspective for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Memory Type - Percentage Breakdown of Value Revenues for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) for the Years 2018, 2025 & 2030
    • TABLE 101: Germany Recent Past, Current & Future Analysis for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Product Type - Central Processing Unit (CPU), Graphics Processing Unit (GPU), Field-Programmable Gate Array (FPGA), Accelerated Processing Unit (APU) and Application-Specific Integrated Circuit (ASIC) - Independent Analysis of Annual Revenues in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 102: Germany Historic Review for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Product Type - Central Processing Unit (CPU), Graphics Processing Unit (GPU), Field-Programmable Gate Array (FPGA), Accelerated Processing Unit (APU) and Application-Specific Integrated Circuit (ASIC) Markets - Independent Analysis of Annual Revenues in US$ Thousand for Years 2018 through 2023 and % CAGR
    • TABLE 103: Germany 12-Year Perspective for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Product Type - Percentage Breakdown of Value Revenues for Central Processing Unit (CPU), Graphics Processing Unit (GPU), Field-Programmable Gate Array (FPGA), Accelerated Processing Unit (APU) and Application-Specific Integrated Circuit (ASIC) for the Years 2018, 2025 & 2030
    • TABLE 104: Germany Recent Past, Current & Future Analysis for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Application - High-Performance Computing Application, Graphics Application, Data Centers Application, Networking Application and Other Applications - Independent Analysis of Annual Revenues in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 105: Germany Historic Review for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Application - High-Performance Computing Application, Graphics Application, Data Centers Application, Networking Application and Other Applications Markets - Independent Analysis of Annual Revenues in US$ Thousand for Years 2018 through 2023 and % CAGR
    • TABLE 106: Germany 12-Year Perspective for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Application - Percentage Breakdown of Value Revenues for High-Performance Computing Application, Graphics Application, Data Centers Application, Networking Application and Other Applications for the Years 2018, 2025 & 2030
  • ITALY
    • TABLE 107: Italy Recent Past, Current & Future Analysis for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Memory Type - Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) - Independent Analysis of Annual Revenues in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 108: Italy Historic Review for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Memory Type - Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) Markets - Independent Analysis of Annual Revenues in US$ Thousand for Years 2018 through 2023 and % CAGR
    • TABLE 109: Italy 12-Year Perspective for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Memory Type - Percentage Breakdown of Value Revenues for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) for the Years 2018, 2025 & 2030
    • TABLE 110: Italy Recent Past, Current & Future Analysis for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Product Type - Central Processing Unit (CPU), Graphics Processing Unit (GPU), Field-Programmable Gate Array (FPGA), Accelerated Processing Unit (APU) and Application-Specific Integrated Circuit (ASIC) - Independent Analysis of Annual Revenues in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 111: Italy Historic Review for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Product Type - Central Processing Unit (CPU), Graphics Processing Unit (GPU), Field-Programmable Gate Array (FPGA), Accelerated Processing Unit (APU) and Application-Specific Integrated Circuit (ASIC) Markets - Independent Analysis of Annual Revenues in US$ Thousand for Years 2018 through 2023 and % CAGR
    • TABLE 112: Italy 12-Year Perspective for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Product Type - Percentage Breakdown of Value Revenues for Central Processing Unit (CPU), Graphics Processing Unit (GPU), Field-Programmable Gate Array (FPGA), Accelerated Processing Unit (APU) and Application-Specific Integrated Circuit (ASIC) for the Years 2018, 2025 & 2030
    • TABLE 113: Italy Recent Past, Current & Future Analysis for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Application - High-Performance Computing Application, Graphics Application, Data Centers Application, Networking Application and Other Applications - Independent Analysis of Annual Revenues in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 114: Italy Historic Review for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Application - High-Performance Computing Application, Graphics Application, Data Centers Application, Networking Application and Other Applications Markets - Independent Analysis of Annual Revenues in US$ Thousand for Years 2018 through 2023 and % CAGR
    • TABLE 115: Italy 12-Year Perspective for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Application - Percentage Breakdown of Value Revenues for High-Performance Computing Application, Graphics Application, Data Centers Application, Networking Application and Other Applications for the Years 2018, 2025 & 2030
  • UNITED KINGDOM
    • TABLE 116: UK Recent Past, Current & Future Analysis for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Memory Type - Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) - Independent Analysis of Annual Revenues in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 117: UK Historic Review for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Memory Type - Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) Markets - Independent Analysis of Annual Revenues in US$ Thousand for Years 2018 through 2023 and % CAGR
    • TABLE 118: UK 12-Year Perspective for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Memory Type - Percentage Breakdown of Value Revenues for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) for the Years 2018, 2025 & 2030
    • TABLE 119: UK Recent Past, Current & Future Analysis for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Product Type - Central Processing Unit (CPU), Graphics Processing Unit (GPU), Field-Programmable Gate Array (FPGA), Accelerated Processing Unit (APU) and Application-Specific Integrated Circuit (ASIC) - Independent Analysis of Annual Revenues in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 120: UK Historic Review for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Product Type - Central Processing Unit (CPU), Graphics Processing Unit (GPU), Field-Programmable Gate Array (FPGA), Accelerated Processing Unit (APU) and Application-Specific Integrated Circuit (ASIC) Markets - Independent Analysis of Annual Revenues in US$ Thousand for Years 2018 through 2023 and % CAGR
    • TABLE 121: UK 12-Year Perspective for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Product Type - Percentage Breakdown of Value Revenues for Central Processing Unit (CPU), Graphics Processing Unit (GPU), Field-Programmable Gate Array (FPGA), Accelerated Processing Unit (APU) and Application-Specific Integrated Circuit (ASIC) for the Years 2018, 2025 & 2030
    • TABLE 122: UK Recent Past, Current & Future Analysis for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Application - High-Performance Computing Application, Graphics Application, Data Centers Application, Networking Application and Other Applications - Independent Analysis of Annual Revenues in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 123: UK Historic Review for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Application - High-Performance Computing Application, Graphics Application, Data Centers Application, Networking Application and Other Applications Markets - Independent Analysis of Annual Revenues in US$ Thousand for Years 2018 through 2023 and % CAGR
    • TABLE 124: UK 12-Year Perspective for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Application - Percentage Breakdown of Value Revenues for High-Performance Computing Application, Graphics Application, Data Centers Application, Networking Application and Other Applications for the Years 2018, 2025 & 2030
  • REST OF EUROPE
    • TABLE 125: Rest of Europe Recent Past, Current & Future Analysis for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Memory Type - Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) - Independent Analysis of Annual Revenues in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 126: Rest of Europe Historic Review for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Memory Type - Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) Markets - Independent Analysis of Annual Revenues in US$ Thousand for Years 2018 through 2023 and % CAGR
    • TABLE 127: Rest of Europe 12-Year Perspective for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Memory Type - Percentage Breakdown of Value Revenues for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) for the Years 2018, 2025 & 2030
    • TABLE 128: Rest of Europe Recent Past, Current & Future Analysis for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Product Type - Central Processing Unit (CPU), Graphics Processing Unit (GPU), Field-Programmable Gate Array (FPGA), Accelerated Processing Unit (APU) and Application-Specific Integrated Circuit (ASIC) - Independent Analysis of Annual Revenues in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 129: Rest of Europe Historic Review for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Product Type - Central Processing Unit (CPU), Graphics Processing Unit (GPU), Field-Programmable Gate Array (FPGA), Accelerated Processing Unit (APU) and Application-Specific Integrated Circuit (ASIC) Markets - Independent Analysis of Annual Revenues in US$ Thousand for Years 2018 through 2023 and % CAGR
    • TABLE 130: Rest of Europe 12-Year Perspective for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Product Type - Percentage Breakdown of Value Revenues for Central Processing Unit (CPU), Graphics Processing Unit (GPU), Field-Programmable Gate Array (FPGA), Accelerated Processing Unit (APU) and Application-Specific Integrated Circuit (ASIC) for the Years 2018, 2025 & 2030
    • TABLE 131: Rest of Europe Recent Past, Current & Future Analysis for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Application - High-Performance Computing Application, Graphics Application, Data Centers Application, Networking Application and Other Applications - Independent Analysis of Annual Revenues in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 132: Rest of Europe Historic Review for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Application - High-Performance Computing Application, Graphics Application, Data Centers Application, Networking Application and Other Applications Markets - Independent Analysis of Annual Revenues in US$ Thousand for Years 2018 through 2023 and % CAGR
    • TABLE 133: Rest of Europe 12-Year Perspective for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Application - Percentage Breakdown of Value Revenues for High-Performance Computing Application, Graphics Application, Data Centers Application, Networking Application and Other Applications for the Years 2018, 2025 & 2030
  • ASIA-PACIFIC
    • Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Asia-Pacific for 2025 (E)
    • TABLE 134: Asia-Pacific Recent Past, Current & Future Analysis for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Memory Type - Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) - Independent Analysis of Annual Revenues in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 135: Asia-Pacific Historic Review for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Memory Type - Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) Markets - Independent Analysis of Annual Revenues in US$ Thousand for Years 2018 through 2023 and % CAGR
    • TABLE 136: Asia-Pacific 12-Year Perspective for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Memory Type - Percentage Breakdown of Value Revenues for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) for the Years 2018, 2025 & 2030
    • TABLE 137: Asia-Pacific Recent Past, Current & Future Analysis for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Product Type - Central Processing Unit (CPU), Graphics Processing Unit (GPU), Field-Programmable Gate Array (FPGA), Accelerated Processing Unit (APU) and Application-Specific Integrated Circuit (ASIC) - Independent Analysis of Annual Revenues in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 138: Asia-Pacific Historic Review for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Product Type - Central Processing Unit (CPU), Graphics Processing Unit (GPU), Field-Programmable Gate Array (FPGA), Accelerated Processing Unit (APU) and Application-Specific Integrated Circuit (ASIC) Markets - Independent Analysis of Annual Revenues in US$ Thousand for Years 2018 through 2023 and % CAGR
    • TABLE 139: Asia-Pacific 12-Year Perspective for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Product Type - Percentage Breakdown of Value Revenues for Central Processing Unit (CPU), Graphics Processing Unit (GPU), Field-Programmable Gate Array (FPGA), Accelerated Processing Unit (APU) and Application-Specific Integrated Circuit (ASIC) for the Years 2018, 2025 & 2030
    • TABLE 140: Asia-Pacific Recent Past, Current & Future Analysis for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Application - High-Performance Computing Application, Graphics Application, Data Centers Application, Networking Application and Other Applications - Independent Analysis of Annual Revenues in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 141: Asia-Pacific Historic Review for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Application - High-Performance Computing Application, Graphics Application, Data Centers Application, Networking Application and Other Applications Markets - Independent Analysis of Annual Revenues in US$ Thousand for Years 2018 through 2023 and % CAGR
    • TABLE 142: Asia-Pacific 12-Year Perspective for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Application - Percentage Breakdown of Value Revenues for High-Performance Computing Application, Graphics Application, Data Centers Application, Networking Application and Other Applications for the Years 2018, 2025 & 2030
  • REST OF WORLD
    • TABLE 143: Rest of World Recent Past, Current & Future Analysis for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Memory Type - Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) - Independent Analysis of Annual Revenues in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 144: Rest of World Historic Review for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Memory Type - Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) Markets - Independent Analysis of Annual Revenues in US$ Thousand for Years 2018 through 2023 and % CAGR
    • TABLE 145: Rest of World 12-Year Perspective for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Memory Type - Percentage Breakdown of Value Revenues for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) for the Years 2018, 2025 & 2030
    • TABLE 146: Rest of World Recent Past, Current & Future Analysis for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Product Type - Central Processing Unit (CPU), Graphics Processing Unit (GPU), Field-Programmable Gate Array (FPGA), Accelerated Processing Unit (APU) and Application-Specific Integrated Circuit (ASIC) - Independent Analysis of Annual Revenues in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 147: Rest of World Historic Review for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Product Type - Central Processing Unit (CPU), Graphics Processing Unit (GPU), Field-Programmable Gate Array (FPGA), Accelerated Processing Unit (APU) and Application-Specific Integrated Circuit (ASIC) Markets - Independent Analysis of Annual Revenues in US$ Thousand for Years 2018 through 2023 and % CAGR
    • TABLE 148: Rest of World 12-Year Perspective for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Product Type - Percentage Breakdown of Value Revenues for Central Processing Unit (CPU), Graphics Processing Unit (GPU), Field-Programmable Gate Array (FPGA), Accelerated Processing Unit (APU) and Application-Specific Integrated Circuit (ASIC) for the Years 2018, 2025 & 2030
    • TABLE 149: Rest of World Recent Past, Current & Future Analysis for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Application - High-Performance Computing Application, Graphics Application, Data Centers Application, Networking Application and Other Applications - Independent Analysis of Annual Revenues in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 150: Rest of World Historic Review for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Application - High-Performance Computing Application, Graphics Application, Data Centers Application, Networking Application and Other Applications Markets - Independent Analysis of Annual Revenues in US$ Thousand for Years 2018 through 2023 and % CAGR
    • TABLE 151: Rest of World 12-Year Perspective for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Application - Percentage Breakdown of Value Revenues for High-Performance Computing Application, Graphics Application, Data Centers Application, Networking Application and Other Applications for the Years 2018, 2025 & 2030

IV. COMPETITION

샘플 요청 목록
0 건의 상품을 선택 중
목록 보기
전체삭제