리소그래피 장비 시장 규모, 점유율, 성장 및 세계 산업 분석 : 유형별, 용도별, 지역별 인사이트 및 예측(2024-2032년)

Growth Factors of lithography equipment Market

The global lithography equipment market continues to expand rapidly as semiconductor manufacturers push toward smaller nodes, advanced packaging, and higher-performance integrated circuits. According to industry estimates, the market size reached USD 27.66 billion in 2024, is projected to grow to USD 29.76 billion in 2025, and is expected to surge to USD 55.13 billion by 2032, reflecting a steady CAGR of 9.2% over the forecast period. Europe led the global market with a 42.55% share in 2024, driven largely by the presence of ASML and strong research and development ecosystems dedicated to advanced lithography technologies.

Lithography equipment plays a crucial role in semiconductor manufacturing by transferring circuit patterns from photomasks onto silicon wafers. This process is essential for producing microprocessors, memory chips, power devices, MEMS, LEDs, and advanced packaging architectures. As chipmakers pursue higher transistor density and superior performance, the need for extreme ultraviolet (EUV), advanced deep ultraviolet (DUV), and multi-patterning lithography systems is increasing sharply.

Generative AI Influence on Lithography Innovation

Generative AI is significantly shaping the lithography ecosystem by improving mask design, exposure optimization, lens simulation, and overall system efficiency. AI algorithms evaluate millions of design permutations to reduce distortions, enhance overlay accuracy, and shorten development cycles. For EUV lithography, generative AI optimizes mask structures and exposure parameters, reducing trial-and-error engineering and improving yield rates. These improvements strengthen the value proposition of high-end lithography equipment and support faster adoption across advanced semiconductor fabs.

Market Trends

One of the strongest trends in 2024-2025 is the growing demand for advanced lithography technologies, especially for cutting-edge nodes used in mobile processors, AI accelerators, automotive ICs, and edge computing devices. The need for smaller feature sizes and higher circuit densities is pushing manufacturers toward EUV systems and multiple patterning DUV systems.

For example, in December 2023, Nikon Corporation launched the NSR-S636E ArF immersion scanner featuring advanced distortion correction and high throughput capabilities. Such innovations are accelerating the transition toward more sophisticated IC designs and strengthening demand for lithography tools.

Growth Drivers

The expanding demand for semiconductor integrated circuits across mobile devices, electric vehicles, data centers, telecommunications, and automation technologies remains the strongest driver of market growth. Each new generation of chips requires substantially more intricate lithographic steps, pushing fabs to invest in both EUV and high-precision DUV technologies.

The rise of advanced packaging, including 3D ICs, 2.5D interposers, and fan-out wafer-level packaging (FO WLP), requires more complex lithography equipment capable of handling heterogeneous integration. As the shift toward chiplet-based architectures accelerates, lithography systems that support advanced packaging will be in increasingly high demand.

Restraints

Despite strong growth prospects, the market faces challenges stemming from the high complexity and cost of next-generation lithography systems. EUV machines require sophisticated optics, powerful light sources, advanced materials, and highly precise control systems. The technological barriers associated with mask defects, source power limitations, and process stability pose additional challenges. These factors contribute to long development cycles and significant capital investment requirements, limiting access to only the largest global foundries.

Segmentation Overview

In 2024, DUV lithography dominated due to its maturity, lower cost, and suitability for a wide range of manufacturing steps. However, EUV lithography is projected to grow at the highest CAGR as manufacturers adopt smaller nodes for high-performance applications.

By technology, ArF immersion held the largest share due to its ability to produce sub-45nm features with high throughput. Meanwhile, mask aligners are expected to grow fastest due to demand across MEMS, optoelectronics, and small-scale fabrication.

In applications, advanced packaging accounted for the highest share, while the LED segment is projected to expand fastest due to the long lifespan and efficiency of LED light sources.

Regional Insights

Europe held USD 11.77 billion in market value in 2024 and continues to lead worldwide adoption due to ASML's dominance in EUV technology and strong R&D partnerships. North America shows steady growth, driven by investments in semiconductor fabrication capacity and supply chain strengthening. Asia Pacific is expected to record the highest CAGR, supported by major foundries such as TSMC, Samsung, and SMIC, which require advanced lithography systems for next-generation chips.

Conclusion

With global demand for advanced semiconductors accelerating and generative AI enhancing innovation, the lithography equipment market is set for robust expansion-reaching USD 55.13 billion by 2032. As manufacturers pursue higher performance and smaller nodes, lithography will remain the cornerstone of semiconductor production worldwide.

Segmentation By Type

• EUV
• DUV

By Technology

• ArF Scanners
• KrF Steppers
• i-line Steppers
• ArF Immersion
• Mask Aligners
• Others (Laser Direct Imaging)

By Applications

• Advanced Packaging
• LED
• MEMs
• Power Devices

By Packaging Platforms

• 3D IC
• 2.5D Interposer
• Wafer Level Chip Scale Packaging (WLCSP)
• FO WLP Wafer
• 3D WLP
• Others (Glass Panel Imposer)

By Region

• North America (By Type, By Technology, By Applications, By Packaging Platforms, and By Country)
  • U.S.
  • Canada
  • Mexico
• South America (By Type, By Technology, By Applications, By Packaging Platforms, and By Country)
  • Brazil
  • Argentina
  • Rest of South America
• Europe (By Type, By Technology, By Applications, By Packaging Platforms, and By Country)
  • Germany
  • France
  • Italy
  • Spain
  • Russia
  • Benelux
  • Nordics
  • Rest of Europe
• Middle East & Africa (By Type, By Technology, By Applications, By Packaging Platforms, and By Country)
  • Turkey
  • Israel
  • GCC
  • South Africa
  • North Africa
  • Rest of the Middle East & Africa
• Asia Pacific (By Type, By Technology, By Applications, By Packaging Platforms, and By Country)
  • China
  • India
  • Japan
  • South Korea
  • ASEAN
  • Oceania
  • Rest of Asia Pacific

Table of Content

1. Introduction

• 1.1. Definition, By Segment
• 1.2. Research Methodology/Approach
• 1.3. Data Sources

2. Executive Summary

3. Market Dynamics

• 3.1. Macro and Micro Economic Indicators
• 3.2. Drivers, Restraints, Opportunities and Trends
• 3.3. Impact of Generative AI

4. Competition Landscape

• 4.1. Business Strategies Adopted by Key Players
• 4.2. Consolidated SWOT Analysis of Key Players
• 4.3. Global Lithography Equipment Key Players (Top 3 - 5) Market Share/Ranking, 2024

5. Global Lithography Equipment Market Size Estimates and Forecasts, By Segments, 2019-2032

• 5.1. Key Findings
• 5.2. By Type (USD)
  • 5.2.1. EUV
  • 5.2.2. DUV
• 5.3. By Technology (USD)
  • 5.3.1. ArF Scanners
  • 5.3.2. KrF Steppers
  • 5.3.3. i-line Steppers
  • 5.3.4. ArF Immersion
  • 5.3.5. Mask Aligners
  • 5.3.6. Others (Laser Direct Imaging, etc.)
• 5.4. By Applications (USD)
  • 5.4.1. Advanced Packaging
  • 5.4.2. LED
  • 5.4.3. MEMs
  • 5.4.4. Power Devices
• 5.5. By Packaging Platforms (USD)
  • 5.5.1. 3D IC
  • 5.5.2. 2.5D Interposer
  • 5.5.3. Wafer Level Chip Scale Packaging (WLCSP)
  • 5.5.4. FO WLP Wafer
  • 5.5.5. 3D WLP
  • 5.5.6. Others (Glass Panel Imposer, etc.)
• 5.6. By Region (USD)
  • 5.6.1. North America
  • 5.6.2. South America
  • 5.6.3. Europe
  • 5.6.4. Middle East & Africa
  • 5.6.5. Asia Pacific

6. North America Lithography Equipment Market Size Estimates and Forecasts, By Segments, 2019-2032

• 6.1. Key Findings
• 6.2. By Type (USD)
  • 6.2.1. EUV
  • 6.2.2. DUV
• 6.3. By Technology (USD)
  • 6.3.1. ArF Scanners
  • 6.3.2. KrF Steppers
  • 6.3.3. i-line Steppers
  • 6.3.4. ArF Immersion
  • 6.3.5. Mask Aligners
  • 6.3.6. Others (Laser Direct Imaging, etc.)
• 6.4. By Applications (USD)
  • 6.4.1. Advanced Packaging
  • 6.4.2. LED
  • 6.4.3. MEMs
  • 6.4.4. Power Devices
• 6.5. By Packaging Platforms (USD)
  • 6.5.1. 3D IC
  • 6.5.2. 2.5D Interposer
  • 6.5.3. Wafer Level Chip Scale Packaging (WLCSP)
  • 6.5.4. FO WLP Wafer
  • 6.5.5. 3D WLP
  • 6.5.6. Others (Glass Panel Imposer, etc.)
• 6.6. By Country (USD)
  • 6.6.1. United States
  • 6.6.2. Canada
  • 6.6.3. Mexico

7. South America Lithography Equipment Market Size Estimates and Forecasts, By Segments, 2019-2032

• 7.1. Key Findings
• 7.2. By Type (USD)
  • 7.2.1. EUV
  • 7.2.2. DUV
• 7.3. By Technology (USD)
  • 7.3.1. ArF Scanners
  • 7.3.2. KrF Steppers
  • 7.3.3. i-line Steppers
  • 7.3.4. ArF Immersion
  • 7.3.5. Mask Aligners
  • 7.3.6. Others (Laser Direct Imaging, etc.)
• 7.4. By Applications (USD)
  • 7.4.1. Advanced Packaging
  • 7.4.2. LED
  • 7.4.3. MEMs
  • 7.4.4. Power Devices
• 7.5. By Packaging Platforms (USD)
  • 7.5.1. 3D IC
  • 7.5.2. 2.5D Interposer
  • 7.5.3. Wafer Level Chip Scale Packaging (WLCSP)
  • 7.5.4. FO WLP Wafer
  • 7.5.5. 3D WLP
  • 7.5.6. Others (Glass Panel Imposer, etc.)
• 7.6. By Country (USD)
  • 7.6.1. Brazil
  • 7.6.2. Argentina
  • 7.6.3. Rest of South America

8. Europe Lithography Equipment Market Size Estimates and Forecasts, By Segments, 2019-2032

• 8.1. Key Findings
• 8.2. By Type (USD)
  • 8.2.1. EUV
  • 8.2.2. DUV
• 8.3. By Technology (USD)
  • 8.3.1. ArF Scanners
  • 8.3.2. KrF Steppers
  • 8.3.3. i-line Steppers
  • 8.3.4. ArF Immersion
  • 8.3.5. Mask Aligners
  • 8.3.6. Others (Laser Direct Imaging, etc.)
• 8.4. By Applications (USD)
  • 8.4.1. Advanced Packaging
  • 8.4.2. LED
  • 8.4.3. MEMs
  • 8.4.4. Power Devices
• 8.5. By Packaging Platforms (USD)
  • 8.5.1. 3D IC
  • 8.5.2. 2.5D Interposer
  • 8.5.3. Wafer Level Chip Scale Packaging (WLCSP)
  • 8.5.4. FO WLP Wafer
  • 8.5.5. 3D WLP
  • 8.5.6. Others (Glass Panel Imposer, etc.)
• 8.6. By Country (USD)
  • 8.6.1. United Kingdom
  • 8.6.2. Germany
  • 8.6.3. France
  • 8.6.4. Italy
  • 8.6.5. Spain
  • 8.6.6. Russia
  • 8.6.7. Benelux
  • 8.6.8. Nordics
  • 8.6.9. Rest of Europe

9. Middle East & Africa Lithography Equipment Market Size Estimates and Forecasts, By Segments, 2019-2032

• 9.1. Key Findings
• 9.2. By Type (USD)
  • 9.2.1. EUV
  • 9.2.2. DUV
• 9.3. By Technology (USD)
  • 9.3.1. ArF Scanners
  • 9.3.2. KrF Steppers
  • 9.3.3. i-line Steppers
  • 9.3.4. ArF Immersion
  • 9.3.5. Mask Aligners
  • 9.3.6. Others (Laser Direct Imaging, etc.)
• 9.4. By Applications (USD)
  • 9.4.1. Advanced Packaging
  • 9.4.2. LED
  • 9.4.3. MEMs
  • 9.4.4. Power Devices
• 9.5. By Packaging Platforms (USD)
  • 9.5.1. 3D IC
  • 9.5.2. 2.5D Interposer
  • 9.5.3. Wafer Level Chip Scale Packaging (WLCSP)
  • 9.5.4. FO WLP Wafer
  • 9.5.5. 3D WLP
  • 9.5.6. Others (Glass Panel Imposer, etc.)
• 9.6. By Country (USD)
  • 9.6.1. Turkey
  • 9.6.2. Israel
  • 9.6.3. GCC
  • 9.6.4. North Africa
  • 9.6.5. South Africa
  • 9.6.6. Rest of MEA

10. Asia Pacific Lithography Equipment Market Size Estimates and Forecasts, By Segments, 2019-2032

• 10.1. Key Findings
• 10.2. By Type (USD)
  • 10.2.1. EUV
  • 10.2.2. DUV
• 10.3. By Technology (USD)
  • 10.3.1. ArF Scanners
  • 10.3.2. KrF Steppers
  • 10.3.3. i-line Steppers
  • 10.3.4. ArF Immersion
  • 10.3.5. Mask Aligners
  • 10.3.6. Others (Laser Direct Imaging, etc.)
• 10.4. By Applications (USD)
  • 10.4.1. Advanced Packaging
  • 10.4.2. LED
  • 10.4.3. MEMs
  • 10.4.4. Power Devices
• 10.5. By Packaging Platforms (USD)
  • 10.5.1. 3D IC
  • 10.5.2. 2.5D Interposer
  • 10.5.3. Wafer Level Chip Scale Packaging (WLCSP)
  • 10.5.4. FO WLP Wafer
  • 10.5.5. 3D WLP
  • 10.5.6. Others (Glass Panel Imposer, etc.)
• 10.6. By Country (USD)
  • 10.6.1. China
  • 10.6.2. India
  • 10.6.3. Japan
  • 10.6.4. South Korea
  • 10.6.5. ASEAN
  • 10.6.6. Oceania
  • 10.6.7. Rest of Asia Pacific

11. Company Profiles for Top 10 Players (Based on data availability in public domain and/or on paid databases)

• 11.1. ASML Holding NV
  • 11.1.1. Overview
    • 11.1.1.1. Key Management
    • 11.1.1.2. Headquarters
    • 11.1.1.3. Offerings/Business Segments
  • 11.1.2. Key Details (Key details are consolidated data and not product/service specific)
    • 11.1.2.1. Employee Size
    • 11.1.2.2. Past and Current Revenue
    • 11.1.2.3. Geographical Share
    • 11.1.2.4. Business Segment Share
    • 11.1.2.5. Recent Developments
• 11.2. Nikon Corporation
  • 11.2.1. Overview
    • 11.2.1.1. Key Management
    • 11.2.1.2. Headquarters
    • 11.2.1.3. Offerings/Business Segments
  • 11.2.2. Key Details (Key details are consolidated data and not product/service specific)
    • 11.2.2.1. Employee Size
    • 11.2.2.2. Past and Current Revenue
    • 11.2.2.3. Geographical Share
    • 11.2.2.4. Business Segment Share
    • 11.2.2.5. Recent Developments
• 11.3. Canon, Inc.
  • 11.3.1. Overview
    • 11.3.1.1. Key Management
    • 11.3.1.2. Headquarters
    • 11.3.1.3. Offerings/Business Segments
  • 11.3.2. Key Details (Key details are consolidated data and not product/service specific)
    • 11.3.2.1. Employee Size
    • 11.3.2.2. Past and Current Revenue
    • 11.3.2.3. Geographical Share
    • 11.3.2.4. Business Segment Share
    • 11.3.2.5. Recent Developments
• 11.4. EV Group
  • 11.4.1. Overview
    • 11.4.1.1. Key Management
    • 11.4.1.2. Headquarters
    • 11.4.1.3. Offerings/Business Segments
  • 11.4.2. Key Details (Key details are consolidated data and not product/service specific)
    • 11.4.2.1. Employee Size
    • 11.4.2.2. Past and Current Revenue
    • 11.4.2.3. Geographical Share
    • 11.4.2.4. Business Segment Share
    • 11.4.2.5. Recent Developments
• 11.5. Veeco Instruments Inc.
  • 11.5.1. Overview
    • 11.5.1.1. Key Management
    • 11.5.1.2. Headquarters
    • 11.5.1.3. Offerings/Business Segments
  • 11.5.2. Key Details (Key details are consolidated data and not product/service specific)
    • 11.5.2.1. Employee Size
    • 11.5.2.2. Past and Current Revenue
    • 11.5.2.3. Geographical Share
    • 11.5.2.4. Business Segment Share
    • 11.5.2.5. Recent Developments
• 11.6. SUSS MicroTec SE
  • 11.6.1. Overview
    • 11.6.1.1. Key Management
    • 11.6.1.2. Headquarters
    • 11.6.1.3. Offerings/Business Segments
  • 11.6.2. Key Details (Key details are consolidated data and not product/service specific)
    • 11.6.2.1. Employee Size
    • 11.6.2.2. Past and Current Revenue
    • 11.6.2.3. Geographical Share
    • 11.6.2.4. Business Segment Share
    • 11.6.2.5. Recent Developments
• 11.7. Shanghai Micro Electronics Equipment (Group) Co. Ltd.
  • 11.7.1. Overview
    • 11.7.1.1. Key Management
    • 11.7.1.2. Headquarters
    • 11.7.1.3. Offerings/Business Segments
  • 11.7.2. Key Details (Key details are consolidated data and not product/service specific)
    • 11.7.2.1. Employee Size
    • 11.7.2.2. Past and Current Revenue
    • 11.7.2.3. Geographical Share
    • 11.7.2.4. Business Segment Share
    • 11.7.2.5. Recent Developments
• 11.8. Neutronix Quintel Inc.
  • 11.8.1. Overview
    • 11.8.1.1. Key Management
    • 11.8.1.2. Headquarters
    • 11.8.1.3. Offerings/Business Segments
  • 11.8.2. Key Details (Key details are consolidated data and not product/service specific)
    • 11.8.2.1. Employee Size
    • 11.8.2.2. Past and Current Revenue
    • 11.8.2.3. Geographical Share
    • 11.8.2.4. Business Segment Share
    • 11.8.2.5. Recent Developments
• 11.9. JEOL Ltd.
  • 11.9.1. Overview
    • 11.9.1.1. Key Management
    • 11.9.1.2. Headquarters
    • 11.9.1.3. Offerings/Business Segments
  • 11.9.2. Key Details (Key details are consolidated data and not product/service specific)
    • 11.9.2.1. Employee Size
    • 11.9.2.2. Past and Current Revenue
    • 11.9.2.3. Geographical Share
    • 11.9.2.4. Business Segment Share
    • 11.9.2.5. Recent Developments
• 11.10. Onto Innovation
  • 11.10.1. Overview
    • 11.10.1.1. Key Management
    • 11.10.1.2. Headquarters
    • 11.10.1.3. Offerings/Business Segments
  • 11.10.2. Key Details (Key details are consolidated data and not product/service specific)
    • 11.10.2.1. Employee Size
    • 11.10.2.2. Past and Current Revenue
    • 11.10.2.3. Geographical Share
    • 11.10.2.4. Business Segment Share
    • 11.10.2.5. Recent Developments

12. Key Takeaways