포토닉스 패키징 시장(2027-2037년)

Photonics packaging has undergone a quiet but decisive transformation, emerging from an engineering sub-discipline confined to the back end of optical transceiver manufacturing into one of the most strategically consequential sectors in global technology infrastructure. The convergence of three powerful forces - the insatiable bandwidth demands of AI-scale computing, the maturation of silicon photonics as a high-volume foundry platform, and the proliferation of new end markets from augmented reality to quantum computing - has elevated photonics packaging to a central role in the hardware stack that underpins the digital economy.

The current market is dominated by optical transceiver module packaging, which has been refined across three decades of datacom standardisation. Today's 800G coherent and direct-detection modules represent the peak of conventional pluggable transceiver packaging - cost-optimised, high-yield, and increasingly commoditised at the module assembly level by contract manufacturers such as Fabrinet, Jabil, and Luxshare. Yet this mature segment is being disrupted in real time by co-packaged optics, which requires fundamentally different packaging approaches: flip-chip bonding of silicon photonics PICs with 5nm CMOS EICs on silicon interposers, detachable fibre connectors qualified to CPO-FC interface standards, and thermal co-management with switch ASICs consuming hundreds of watts.

The CPO transition is being driven by an inescapable physics constraint. AI training and inference clusters now demand aggregate switch bandwidths exceeding 51.2 terabits per second per switch, a target that conventional PCB-level SerDes electrical interfaces cannot meet within acceptable power budgets. NVIDIA's NVLink Optical interconnect and Broadcom's Tomahawk 6 and 7 CPO switch families are the first commercial deployments of a technology that will reshape the entire photonics packaging supply chain through the 2030s. TSMC's CoWoS platform and ASE Group's VIPack co-packaging service have repositioned foundries and advanced OSATs as the new centre of gravity in a supply chain that previously revolved around module assemblers.

Looking further ahead, augmented reality display engines represent the second major growth frontier. MicroLED die transfer at sub-5 micron pixel pitch, mass transfer throughput exceeding 100 million dies per hour, and CMOS backplane integration are packaging challenges of comparable complexity to CPO, with unit economics that must reach consumer price points. Quantum technology photonics packaging - encompassing cryogenic fibre couplers, single-photon detector integration, and ultra-low-loss silicon nitride waveguide assembly - adds a further long-cycle but structurally significant growth vector.

The Global Photonics Packaging Market 2027-2037 provides a rigorous bottom-up forecast of revenues, unit shipments, and technology adoption across six major application segments over an eleven-year horizon to 2037. The report's central thesis is that photonics packaging has crossed an inflection point. The AI infrastructure build-out has made optical interconnect packaging a limiting constraint on compute cluster performance, forcing the semiconductor industry's most powerful foundries, OSAT providers, and system OEMs to rethink the design, assembly, and supply chain of photonic components from first principles. CPO is treated with particular depth, with detailed analysis of Type I, Type II, and Type III packaging structures, optical engine architectures, and a fully modelled forecast distinguishing scale-out Ethernet switch applications from scale-up GPU optical I/O, with separate unit and revenue trajectories through 2037.

Beyond AI data centres, the report provides equal rigour in its treatment of augmented reality display packaging - covering the LCoS-to-MicroLED technology transition, mass transfer yield economics, and display engine packaging revenue by technology type - as well as FMCW LiDAR for automotive, quantum photonics packaging across four hardware platforms, and a broad other-applications segment covering medical, defence, and industrial sensing. The ecosystem and supply chain chapter maps the full value chain from SOI wafer supply through system integration, with dedicated regional analyses of the Taiwanese, North American, European, and Asia-Pacific ecosystems. A competitive landscape chapter assesses vertical integration trends and M&A dynamics, and 79 company profiles provide detailed intelligence on participants spanning every tier of the value chain.

Report Contents:

• Executive Summary: key findings, market at a glance ($4.1B in 2026 to >$30B by 2037, 21.9% CAGR), and strategic implications
• Market Context and Background: historical evolution from discrete module assembly to wafer-level heterogeneous integration; the role of AI-driven bandwidth demand as a structural growth catalyst
• Technology Landscape: light source integration (hybrid, heterogeneous, MicroLED-on-Si); wafer-level packaging (WLP, FOWLP, fan-out); 2.5D and 3D packaging (silicon interposer, glass interposer, organic substrate); hybrid bonding (Cu-Cu bumpless direct bonding); fibre-to-chip coupling technologies (V-groove FAU, detachable CPO-FC, grating and edge couplers); EIC/PIC integration approaches (2D, 2.5D, 3D); module-level packaging; long-term technology roadmap 2026-2037
• Co-Packaged Optics (CPO): definition, optical engine architecture, CPO vs pluggable comparison, AI data centre network architecture (scale-out and scale-up), NVIDIA vs Broadcom strategic analysis, CPO packaging structure types I/II/III, and full market forecast (units and revenue) to 2037 covering GPU optical I/O and switch CPO separately
• Application Segments: optical transceivers (datacom and telecom); AI data centres; augmented reality displays (LCoS to MicroLED transition, microdisplay supply chain); automotive FMCW LiDAR; quantum technologies (photonic QC, trapped-ion, neutral atom); other applications (medical, defence, industrial)
• Ecosystem and Supply Chain: full value chain map from die to system; supply chain analysis by segment; regional ecosystem analysis - Taiwan, NVIDIA ecosystem, Europe, North America, Asia-Pacific
• Global Market Forecasts 2026-2037: total market, by application segment, by packaging technology, by region; segment-level forecasts with unit and revenue data for CPO, optical transceivers, AR, LiDAR, quantum, and other
• Competitive Landscape: market share analysis, vertical integration trends, M&A activity, future competitive dynamics
• 79 Company Profiles across the full photonics packaging value chain, each covering company description, recent news and funding, products and technology, and strategic significance. Companies Profiled spanning the full photonics packaging value chain include Aeva, AIM Photonics, Alcyon Photonics SL, Amkor Technology, Anello Photonics, Applied Materials, ASE Group, ASM AMICRA, ASMPT, Aurora Innovation, AyarLabs, Bay Photonics, Broadcom, CCRAFT SA, Cisco, Coherent Corp., Corning Incorporated, Diamond Photonics, DustPhotonics, Eoptolink, EV Group, Fabrinet, FEMTOprint, Ficontec, Finetech, FOXCONN, GIS (General Interface Solution), GlobalFoundries, Goertek, Google, ICON Photonics, IMEC, Innolight, IonQ, izmomicro (izmo Microsystems Private Limited), Jabil, JBD (Jade Bird Display), LAM Research, Lightmatter, LightSpeed Photonics, LioniX International, Luceda Photonics, Lumentum Holdings, Luxshare, Marvell Technology, Meta Platforms, MicroVision, Mixx Technologies, MPI Corporation, Nanoscribe, Nanosystec and more....

Table of Contents

1. EXECUTIVE SUMMARY

• 1.1 Report Overview and Key Findings
• 1.2 Market Definition and Scope
  • 1.2.1 Definition of Photonics Packaging
  • 1.2.2 Boundary Between Photonics Packaging and Broader Semiconductor Packaging
  • 1.2.3 Scope: Applications Addressed in This Report
• 1.3 Key Market Drivers and Restraints
• 1.4 Market Size and Growth
• 1.5 Photonics Packaging: From Backend Activity to Strategic Enabler
• 1.6 Photonics Packaging in the AI Era
• 1.7 The Shift to Advanced Packaging: From Module-Level to Wafer-Level Integration
• 1.8 Competitive and Ecosystem Snapshot
• 1.9 Key Conclusions and Strategic Implications

2. MARKET CONTEXT AND BACKGROUND

• 2.1 Photonics Packaging: Historical Evolution
  • 2.1.1 Origins in Optical Transceivers for Datacom and Telecom
  • 2.1.2 The Shift Toward Heterogeneous Integration
  • 2.1.3 AI-Driven Bandwidth Demand as a Structural Growth Catalyst
• 2.2 Photonics in the AI Era
  • 2.2.1 The Explosive Growth of Generative AI and LLMs
  • 2.2.2 Compute Demand Scaling and Network Bottlenecks
  • 2.2.3 The Role of Optical Interconnects in AI Infrastructure
• 2.3 Semiconductor Packaging Technology Overview
  • 2.3.1 Conventional Packaging Approaches
  • 2.3.2 Advanced Packaging Approaches
  • 2.3.3 From 1D to 3D Integration: The Packaging Evolution Continuum
• 2.4 Why Photonics Packaging Differs from Conventional Semiconductor Packaging
• 2.5 The Standardization Imperative
  • 2.5.1 PDK and ADK-Driven Design Environments
  • 2.5.2 Role of Standards Bodies and Industry Consortia
  • 2.5.3 Barriers to High-Volume Photonics Packaging Deployment

3. TECHNOLOGY LANDSCAPE

• 3.1 Light Source Integration Technologies
  • 3.1.1 Integration Approach Overview
  • 3.1.2 Hybrid Integration
  • 3.1.3 Heterogeneous Integration
  • 3.1.4 Heterogeneously Integrated Light Sources on Silicon Photonics (for Pluggables)
  • 3.1.5 MicroLED-on-Si Hybridization
• 3.2 Advanced Packaging Technologies for Photonics
  • 3.2.1 Wafer-Level Packaging (WLP)
    • 3.2.1.1 Wafer-Level Chip Scale Packaging (WLCSP)
    • 3.2.1.2 Fan-Out Wafer-Level Packaging (FO-WLP)
    • 3.2.1.3 WLP Manufacturing Processes
  • 3.2.2 2.5D and 3D Packaging
    • 3.2.2.1 Silicon Interposer 2.5D (Through-Silicon Via)
    • 3.2.2.2 Organic-Based 2.5D Packaging
    • 3.2.2.3 Glass-Based 2.5D Packaging
    • 3.2.2.4 3D Stacked Packages
  • 3.2.3 Hybrid Bonding
    • 3.2.3.1 Fusion Bond and Direct Molecular Bonding
    • 3.2.3.2 Cu-Cu Bumpless Hybrid Bonding
    • 3.2.3.3 Devices Using Hybrid Bonding
  • 3.2.4 Photonics-Compatible Advanced Packaging Platform Comparison
• 3.3 Interconnection Techniques in Photonics Packaging
  • 3.3.1 Wire Bonding
  • 3.3.2 Flip-Chip Bumping
  • 3.3.3 Micro-Bumping
  • 3.3.4 Through-Silicon Via (TSV)
  • 3.3.5 Redistribution Layer (RDL)
  • 3.3.6 Photonic Wire Bonding
• 3.4 Fiber-to-Chip Coupling
  • 3.4.1 Fiber-to-Chip Coupling Modalities Overview
  • 3.4.2 V-Groove Technology: From 260μm to 130μm Pitch
  • 3.4.3 Detachable Fiber-to-Chip Couplers
  • 3.4.4 Serviceability and Detachability Design Considerations
  • 3.4.5 Fiber Array Units (FAUs) and Connectorization
• 3.5 EIC/PIC Integration
  • 3.5.1 Photonic Integrated Circuits (PICs) - Key Concepts
    • 3.5.1.1 What are PICs? Material Platforms and Integration Levels
    • 3.5.1.2 PICs vs Silicon Photonics - Differences and Overlap
  • 3.5.2 Electronic-Photonic Integration Requirements
  • 3.5.3 2D EIC/PIC Integration
  • 3.5.4 2.5D EIC/PIC Integration
  • 3.5.5 3D EIC/PIC Integration
  • 3.5.6 3D Optical Engine Configuration Examples
    • 3.5.6.1 Configuration 1: EIC-on-PIC with Micro-Bumps
    • 3.5.6.2 Configuration 2: PIC-on-EIC with Through-Silicon Vias
    • 3.5.6.3 Configuration 3: 3D SoIC with Hybrid Bonding
  • 3.5.7 TSMC's Role in Heterogeneous EIC/PIC Integration
• 3.6 Module-Level Packaging
  • 3.6.1 Optical Transceiver Module Architecture
  • 3.6.2 Typical Process Steps and Major Equipment Suppliers
  • 3.6.3 Which Packaging Approach for Which Application?
  • 3.6.4 Solutions for Quantum Packaging
• 3.7 Technology Roadmap
  • 3.7.1 Long-Term Technology Evolution Roadmap 2026-2037
  • 3.7.2 Long-Term Evolution of Co-Packaged Optics

4. CO-PACKAGED OPTICS (CPO)

• 4.1 Introduction to Co-Packaged Optics
  • 4.1.1 Definition and Core Concepts
    • 4.1.1.1 Concept 1: Proximity Integration
    • 4.1.1.2 Concept 2: Functional Partitioning
    • 4.1.1.3 Concept 3: Coherent Ecosystem Development
  • 4.1.2 What is an Optical Engine (OE)?
    • 4.1.2.1 Optical Engine Composition and Components
    • 4.1.2.2 Optical Engine vs Pluggable Transceiver
    • 4.1.2.3 Critical Performance Parameters
  • 4.1.3 Key Technology Building Blocks for CPO
    • 4.1.3.1 Silicon Photonics PIC
    • 4.1.3.2 Electronic IC (EIC)
    • 4.1.3.3 External Laser Sources and Optical Power Supply
• 4.2 CPO vs Pluggable Optics
  • 4.2.1 Pluggable Optics - Current Status, Bottlenecks and Limitations
    • 4.2.1.1 Form Factor Constraints
    • 4.2.1.2 Electrical Interface and SerDes Limitations
    • 4.2.1.3 Thermal Management Challenges
    • 4.2.1.4 On-Board Optics (OBO) as a Transitional Step
  • 4.2.2 Power Efficiency Comparison: CPO vs Pluggable vs Copper
  • 4.2.3 Design Decisions: Choosing Between CPO and Pluggables
• 4.3 Data Centre Architecture and CPO Applications
  • 4.3.1 Modern High-Performance AI Data Centre Architecture
    • 4.3.1.1 Physical Infrastructure Hierarchy
    • 4.3.1.2 Network Architecture: Scale-Out and Scale-Up
    • 4.3.1.3 Power and Cooling Considerations
  • 4.3.2 Switches: Key Components in AI Data Centres
    • 4.3.2.1 Switch Architecture Evolution
    • 4.3.2.2 Switch ASIC Technology and Bandwidth Scaling
  • 4.3.3 Scale-Out Network Switching Applications
  • 4.3.4 Scale-Up Computing Optical I/O Applications
  • 4.3.5 NVIDIA vs Broadcom: Strategic Comparison in AI Infrastructure and CPO
    • 4.3.5.1 NVIDIA's CPO Strategy: Vertical Integration
    • 4.3.5.2 Broadcom's CPO Strategy: Open Ecosystem
    • 4.3.5.3 Competitive Dynamics
  • 4.3.6 L2 Frontside Network Architecture: CPO vs Non-CPO
  • 4.3.7 Migration from Copper to Optical Interconnects in AI Systems
• 4.4 CPO Packaging Structures
  • 4.4.1 Types of CPO + XPU/Switch ASIC Packaging Structures
    • 4.4.1.1 Type I: Optical Engines on Package Periphery
    • 4.4.1.2 Type II: Optical Engines Co-Located with ASIC on Interposer
    • 4.4.1.3 Type III: 3D Stacked Optical Engines
  • 4.4.2 System Integration of Network Switches by Packaging Technologies
  • 4.4.3 System Integration of Optical I/O by Packaging Technologies
• 4.5 CPO Market Forecasts 2026-2037
  • 4.5.1 Server Boards, CPUs and GPUs/Accelerators Shipment Forecast
  • 4.5.2 Optical I/O for AI Interconnect CPO Forecast (Units Shipped)
  • 4.5.3 Optical I/O for AI Interconnect CPO Forecast (Revenue)
  • 4.5.4 CPO Network Switches for AI Accelerators (Units Shipped)
  • 4.5.5 CPO Network Switches for AI Accelerators (Market Size)
  • 4.5.6 Total CPO Market Overview
  • 4.5.7 CPO by EIC/PIC Integration Technology (Unit Shipments)
  • 4.5.8 CPO Roadmap: Scale-Out Networks
• 4.6 CPO Challenges and Future Potential
  • 4.6.1 Technical Challenges
  • 4.6.2 Commercial and Standardization Challenges
  • 4.6.3 Future Potential and Outlook

5. APPLICATION SEGMENTS

• 5.1 Telecom and Datacom
  • 5.1.1 Optical Transceiver Market Overview
  • 5.1.2 Photonics Packaging for Optical Transceivers
  • 5.1.3 Market Forecast: Optical Transceivers 2026-2037
  • 5.1.4 Transition from Pluggable to Co-Packaged: Hybrid Period 2026-2030
  • 5.1.5 Supply Chain Concentration and Verticality Trends
• 5.2 AI Data Centres
  • 5.2.1 AI Data Centre Photonics Packaging Demand
  • 5.2.2 Hyperscaler Capex and Photonics Intensity
  • 5.2.3 Current AI System Architecture: NVIDIA DGX/HGX Platforms
  • 5.2.4 Future AI Architecture (Short to Mid-Term: 2026-2030)
  • 5.2.5 Future AI Architecture (Long-Term: 2031-2037)
• 5.3 Augmented Reality Displays
  • 5.3.1 Consumer AR Market Overview and Inflection Point (2026-2028)
  • 5.3.2 Display Engine Technologies for AR
    • 5.3.2.1 LCoS-Based Optical Engines
    • 5.3.2.2 MicroLED-Based Optical Engines
    • 5.3.2.3 Laser-Based Architectures and New Coupling Challenges
    • 5.3.2.4 LCoS to MicroLED 2026-2037
  • 5.3.3 AR Photonics Packaging: Form Factor as Key Differentiator
  • 5.3.4 Market Forecast: AR Display Volumes 2026-2037
  • 5.3.5 Market Forecast: AR Packaging Revenue 2026-2037
  • 5.3.6 Microdisplay Supply Chain: MicroLED Focus
• 5.4 Automotive: FMCW LiDAR
  • 5.4.1 FMCW LiDAR Technology and Photonics Packaging Requirements
  • 5.4.2 FMCW LiDAR Photonics Integration Challenges
  • 5.4.3 Market Forecast: FMCW LiDAR Volume and Packaging Revenue 2026-2037
• 5.5 Quantum Technologies
  • 5.5.1 Photonics as the Hidden Bottleneck in Scalable Quantum Technologies
  • 5.5.2 Photonics in Quantum Computer Architectures
    • 5.5.2.1 Photonic Quantum Computers
    • 5.5.2.2 Trapped-Ion Quantum Systems
    • 5.5.2.3 Neutral Atom Quantum Systems
  • 5.5.3 Photonics Packaging Requirements for Quantum
    • 5.5.3.1 Ultra-Low-Loss Fiber Alignment
    • 5.5.3.2 High-Density Laser Integration for Qubit Scaling
    • 5.5.3.3 Extreme Precision Assembly
  • 5.5.4 Quantum Photonics Packaging Solutions and Outlook
• 5.6 Other Application Segments

6. ECOSYSTEM AND SUPPLY CHAIN

• 6.1 Photonics Packaging Value Chain Overview
  • 6.1.1 Generic Value Chain: From Die to System
  • 6.1.2 Value Capture by Chain Segment
• 6.2 Supply Chain Analysis by Segment
  • 6.2.1 PIC Design Segment
  • 6.2.2 ASIC and xPU Design Segment
  • 6.2.3 Laser Sources Segment
  • 6.2.4 SOI Wafer and Epi-Wafer Segment
  • 6.2.5 EIC, Retimers, SerDes and PHY Segment
  • 6.2.6 Connectors and Fibers Segment
  • 6.2.7 Foundries Segment
  • 6.2.8 Packaging, Assembling and Testing Segment
  • 6.2.9 System and Equipment Segment
  • 6.2.10 End Customers (Hyperscalers) Segment
  • 6.2.11 Ecosystem Interdependencies and Strategic Implications
• 6.3 Regional Ecosystem Analysis
  • 6.3.1 The Taiwanese Ecosystem
  • 6.3.2 NVIDIA's Ecosystem
  • 6.3.3 The European Ecosystem
  • 6.3.4 North American Ecosystem
  • 6.3.5 Asia-Pacific (Excluding Taiwan) Ecosystem

7. GLOBAL MARKET FORECASTS 2026-2037

• 7.1 Overall Market Forecast
  • 7.1.1 Total Global Photonics Packaging Market: Revenue ($M) 2026-2037
  • 7.1.2 Market Revenue by Application Segment
  • 7.1.3 Market Revenue by Packaging Technology
• 7.2 Segment Forecasts
  • 7.2.1 Optical Transceivers (Datacom & Telecom)
  • 7.2.2 Co-Packaged Optics (CPO)
  • 7.2.3 Augmented Reality
  • 7.2.4 Automotive LiDAR (FMCW)
  • 7.2.5 Quantum Technologies
  • 7.2.6 Other Applications (Medical, Defense, Industrial)
• 7.3 Regional Forecasts
  • 7.3.1 Regional Analysis

8. COMPETITIVE LANDSCAPE

• 8.1 Competitive Environment Overview
• 8.2 Market Share Analysis
• 8.3 Positioning and M&A Activity
• 8.4 Vertical Integration Trends
• 8.5 Future Outlook: Competitive Dynamics 2026-2037

9. COMPANY PROFILES (79 company profiles)

10. APPENDIX

• 10.1 Definitions & Terminology
• 10.2 Research Methodology