첨단 고체 냉각 시장(2027-2037년)

Solid-state cooling is moving from specialist niche to strategic necessity. For decades, thermoelectric (Peltier) devices served applications where precision, silence and compactness mattered more than efficiency, such as laser stabilisation, scientific cameras and PCR instruments. Three forces are now changing the market. Heat is concentrating in places compressors and fans cannot reach. Refrigerant regulation has fixed deadlines. And new caloric, photonic and airflow technologies have crossed key engineering thresholds. The developments of 2025–2026 mark a turning point. AI accelerators now dissipate 1–2 kW per package, and optical transceivers, high-bandwidth memory and co-packaged optics need active thermal control. That has made thermoelectric modules a core part of AI data-centre infrastructure, with Ferrotec, Phononic and others expanding capacity and launching data-centre cooling products. In October 2026 xMEMS began mass production of all-silicon “fan-on-a-chip” cooling devices. Frore Systems reached unicorn valuation for its AirJet technology, and YPlasma and Ionic Wind introduced fanless plasma and ionic-wind modules for edge AI hardware.

Caloric cooling has advanced from laboratory to pilot. Magnotherm is trialling magnetocaloric refrigeration in supermarkets, and Magnoric showed a pre-series display cabinet at Chillventa 2026. Barocal, Pascal, Exergyn and Qurie raised institutional funding for barocaloric, elastocaloric and electrocaloric heat pumps; low-pressure barocaloric designs and compression-loaded elastocaloric alloys removed long-standing engineering barriers. Passive daytime radiative cooling entered the mainstream with 3M’s vehicle-roof Cooling Film and fast-growing Asian suppliers such as i2Cool. In quantum technologies, scarce helium-3 is driving demand for helium-3-free continuous adiabatic demagnetisation refrigerators from kiutra and others.

Looking ahead, regulation and climate will shape the next decade. The EU F-gas Regulation bans high-GWP refrigerants in small air conditioners and heat pumps in stages from 2027 to 2035, and the Kigali Amendment cuts HFC supply further. Cooling demand is rising rapidly with global warming, while 6G networks and hotter solar panels add new thermal loads. Solid-state cooling will not replace vapour compression overnight. It will gain ground first where size, silence, precision or refrigerant risk matter most: electronics, wearables, optics, sensors and quantum systems. Magnetocaloric commercial refrigeration is expected around 2028–2030 and caloric heat pumps early in the 2030s. LED-based thermophotonic cooling, a longer-term prospect, could enable chip-scale cryogenic cooling of semiconductor sensors without heat sinks or vibration. Hybrid, multimode architectures that combine solid-state and conventional cooling will define the market through 2037.

The Global Advanced Solid-State Cooling Market 2027-2037 is a comprehensive analysis of the technologies, applications, companies and commercial pathways reshaping how heat is managed. Cooling demand is escalating with AI data centres, 1 kW-plus processors, 6G communications, electrification and a warming climate. At the same time, regulation is phasing out high-GWP refrigerants. Solid-state cooling uses no circulating refrigerant gas and few or no moving parts, and is positioned to capture a growing share of this demand.

The report covers nine technology segments: thermoelectric (Peltier) modules and assemblies; solid-state airflow, including piezoelectric MEMS, ionic wind and plasma actuators; passive daytime radiative cooling materials; magnetocaloric, elastocaloric and barocaloric systems; electrocaloric devices; solid-state cryogenic cooling, including adiabatic demagnetisation refrigeration; and LED thermophotonic, optical and thermionic cooling. For each, it assesses operating principles, materials, performance, technology readiness, costs, commercialisation timelines and competitive dynamics, supported by SWOT analyses. There is in-depth coverage of LED-based cooling for semiconductor sensors and quantum applications, including performance targets, beachhead markets and public and private funding pathways.

Detailed market forecasts run from 2027 to 2037, segmented by technology, end-use market, region and operating temperature range. Eleven end-use markets are covered, from data centres, telecoms, consumer electronics and wearables to buildings and HVAC, refrigeration, automotive, medical, scientific instruments, quantum technologies, and defence and aerospace. The report examines customer requirements, adoption barriers, price-performance evolution, value chains, partnership ecosystems and the funding and M&A landscape. The report also includes 67 company profiles. They cover thermoelectric leaders, solid-state airflow innovators, caloric cooling start-ups, radiative cooling suppliers, cryogenic and quantum-cooling specialists, and the incumbent technologies they compete with. Strategy, R&D, business-development and investment teams can use it to identify where, when and how solid-state cooling will win.

Report contents include:

• Executive summary with primary conclusions, a cooling toolkit, and the leading technologies for reducing temperatures by 5–50 °C
• Analysis of cooling demand drivers: AI chips, data centres, 6G, solar panels, batteries, buildings and vehicles
• Regulatory drivers: the Kigali Amendment, the EU F-gas Regulation, the Global Cooling Pledge and the US AIM Act
• Technology chapters on thermoelectric, magnetocaloric, electrocaloric, elastocaloric, barocaloric, twistocaloric, multicaloric, LED thermophotonic, optical, thermionic, phononic, quantum dot and metamaterial cooling
• Passive radiative cooling materials, applications and suppliers
• Solid-state airflow: MEMS, ionic wind and plasma actuators
• Quantum cryogenic cooling: ADR and continuous ADR, helium-3-free solutions and cryo-CMOS
• Comparative benchmarking, TRLs, roadmaps and application suitability by temperature
• Market forecasts for 2027–2037 by technology, end use, region and temperature segment
• Customer needs, adoption criteria, funding, investment and M&A analysis
• 155 tables, 51 figures and 19 SWOT analyses
• 68 company profiles including 3M, Aegiq, Anyon Systems, Anzen Climate Wall, Barocal, Bluefors, Camfridge, Coherent, CoolIT Systems, Crystal Ltd, CryoCoax, Custom Thermoelectric, CustomChill, DBK Industrial, Delft Circuits, EIC Solutions, Exergyn, Ferrotec, Frore Systems, GE Appliances, Hamamatsu Photonics, i2Cool, Iceotope, Infleqtion, Intel, Ionic Wind Technologies, JetCool, KELK, kiutra, Magnoric, Magnotherm, Maybell Quantum, MIMiC Systems, Mingfa Tech, Montana Instruments, Octolife, Origin Quantum, Pascal, Passive Edge, Phononic and more......

Table of Contents

1 EXECUTIVE SUMMARY

• 1.1 Market opportunity and strategic overview
  • 1.1.1 The global cooling market
  • 1.1.2 Global solid-state cooling market size and growth projections (2027-2037)
  • 1.1.3 Emerging technologies market opportunity assessment and competitive positioning
• 1.2 The nature of solid-state cooling and why it is now a priority
• 1.3 Advantages of solid-state cooling
• 1.4 Technology landscape
  • 1.4.1 Established vs emerging solid-state cooling technologies
  • 1.4.2 LED-based thermophotonic cooling performance benchmarks and advantages
  • 1.4.3 Quantum cryogenic cooling requirements and market applications
• 1.5 Technology readiness levels and commercialisation timelines across all segments
• 1.6 Cooling toolkit and potential winners on current evidence
  • 1.6.1 The cooling toolkit and the trend to multimode cooling
  • 1.6.2 Best passive solid-state cooling technologies for reducing temperature by 5 °C to 40 °C, 2027-2047
  • 1.6.3 Best solid-state cooling technologies for reducing temperature by 5 °C to 50 °C, 2027-2047
  • 1.6.4 Companies commercialising solid-state cooling by technology
  • 1.6.5 Solid-state cooling: overall SWOT appraisal
• 1.7 Market segmentation and application analysis
  • 1.7.1 Primary target markets: semiconductor cooling, quantum technologies, cryogenic applications
  • 1.7.2 Application-specific market sizing with US$-value quantification by segment
• 1.8 Customer needs assessment and adoption barriers analysis
• 1.9 Temperature range segmentation (sub-100 K to 150 K+) and application mapping
• 1.10 Competitive landscape and industry structure
  • 1.10.1 Market share analysis across thermoelectric, magnetocaloric and emerging technologies
  • 1.10.2 Key player positioning: established manufacturers vs innovation-driven start-ups
  • 1.10.3 Technology differentiation strategies and competitive advantages
  • 1.10.4 Partnership ecosystems and value chain positioning opportunities
• 1.11 LED-based cooling
  • 1.11.1 Technology performance advantages over conventional Peltier and cryogenic systems
  • 1.11.2 Addressable market opportunity and penetration scenarios
  • 1.11.3 First application priorities and beachhead market strategies
  • 1.11.4 Unique value propositions for semiconductor sensor cooling and quantum applications
• 1.12 Funding and investment landscape
  • 1.12.1 Private funding trends
  • 1.12.2 Government and EU funding
  • 1.12.3 Funding pathway recommendations for LED-based cooling developers
• 1.13 Key conclusions

2 INTRODUCTION

• 2.1 The need for cooling
  • 2.1.1 General situation
  • 2.1.2 Cooling demand escalation 2027-2047
  • 2.1.3 Radical changes in requirements
  • 2.1.4 Problems with traditional vapour compression
  • 2.1.5 Dangers of heat and localised body cooling
  • 2.1.6 Cooling buildings
  • 2.1.7 AI data centres
  • 2.1.8 Severe new microchip cooling requirements
  • 2.1.9 6G communications from
  • 2.1.10 Other cooling problems and opportunities in electronics and ICT
  • 2.1.11 Grid storage batteries
  • 2.1.12 Hot solar panels
  • 2.1.13 Fusion and high-power lasers
  • 2.1.14 Vehicles and electric vehicles
• 2.2 Regulatory and policy drivers
  • 2.2.1 Kigali Amendment to the Montreal Protocol
  • 2.2.2 EU F-gas Regulation (EU) 2024/573
  • 2.2.3 Global Cooling Pledge
  • 2.2.4 Japan Top Runner
  • 2.2.5 US AIM Act
  • 2.2.6 Public funding programmes
• 2.3 Primary answers to emerging cooling challenges
  • 2.3.1 Trend to smart materials
  • 2.3.2 Ancient passive cooling revived
  • 2.3.3 Reinventing air conditioning
  • 2.3.4 Cooling microchips and batteries, with or without solid-state
  • 2.3.5 Answers to 6G heat
  • 2.3.6 Smart textiles
• 2.4 Solid-state cooling technology fundamentals and classification
  • 2.4.1 Classification of operating principles
  • 2.4.2 Undesirable materials as an opportunity
• 2.5 Caloric cooling effects
  • 2.5.1 Physics of caloric cooling
  • 2.5.2 Magnetocaloric
  • 2.5.3 Electrocaloric
  • 2.5.4 Elastocaloric
  • 2.5.5 Barocaloric
  • 2.5.6 Twistocaloric
  • 2.5.7 Multicaloric effects
• 2.6 Market evolution and technology timeline
  • 2.6.1 Attention versus maturity
• 2.7 Scope of analysis: established vs emerging technologies
• 2.8 Value chain analysis across technologies
  • 2.8.1 Component and material suppliers
  • 2.8.2 Technology developers and IP holders
  • 2.8.3 System integrators and OEMs
  • 2.8.4 End-user customers and market channels
  • 2.8.5 Distribution and service networks
• 2.9 Competing cooling technologies
  • 2.9.1 Why solid-state will gradually displace vapour compression

3 SOLID-STATE COOLING TECHNOLOGIES

• 3.1 Thermoelectric (Peltier) cooling systems
  • 3.1.1 Technology maturity and market penetration
  • 3.1.2 Thermoelectric materials
  • 3.1.3 Performance characteristics and limitations
  • 3.1.4 Thermoelectric cooling and temperature control applications
  • 3.1.5 Wide-area and flexible thermoelectric cooling: a gap in the market
  • 3.1.6 Radiative cooling of buildings combined with thermoelectric harvesting
  • 3.1.7 The heat-removal problem of TEC and TEG and evolving solutions
  • 3.1.8 Recent advances in thermoelectric cooling
  • 3.1.9 Thermoelectric module manufacturers
  • 3.1.10 Market size
  • 3.1.11 SWOT analysis
• 3.2 Magnetocaloric cooling
  • 3.2.1 Technology principles and development status
  • 3.2.2 Commercial applications
  • 3.2.3 Performance advantages and challenges
  • 3.2.4 Magnetic materials supply and cost
  • 3.2.5 Market outlook
  • 3.2.6 SWOT analysis
• 3.3 Electrocaloric cooling
  • 3.3.1 Overview and SWOT appraisal
  • 3.3.2 Operating principles, device construction, materials and form factors
  • 3.3.3 Electric-field-induced temperature changes
  • 3.3.4 Polymer and ceramic-based materials
  • 3.3.5 Material popularity in recent research
  • 3.3.6 Giant electrocaloric effect through
  • 3.3.7 Issues to address
  • 3.3.8 Research advances 2025 and
  • 3.3.9 Current development stage and commercialisation timeline
  • 3.3.10 Scalability, market potential and applications
• 3.4 Barocaloric cooling systems
  • 3.4.1 Pressure-induced caloric effects and materials
  • 3.4.2 Mechanical pressure cycling mechanisms
  • 3.4.3 Development status and research progress
  • 3.4.4 Comparison with other caloric cooling technologies
• 3.5 Elastocaloric cooling systems
  • 3.5.1 Stress-strain induced temperature changes
  • 3.5.2 Shape-memory alloy and polymer-based materials
  • 3.5.3 Mechanical cycling and fatigue considerations
  • 3.5.4 Performance characteristics and applications
• 3.6 Twistocaloric (torsocaloric) cooling systems
  • 3.6.1 Twist-induced caloric effects
  • 3.6.2 Carbon nanotube yarns and fibre-based systems
  • 3.6.3 Rotational mechanical cycling
  • 3.6.4 Research developments and commercialisation potential
• 3.7 Solid-state phase change cooling: caloric and oriented composite phase change materials (OCPCM)
  • 3.7.1 Structural and ferroic phase change modes
  • 3.7.2 Oriented composite phase change materials (OCPCM)
• 3.8 Multicaloric cooling
• 3.9 Solid-state heat pumps and engines
  • 3.9.1 Technology convergence opportunities
  • 3.9.2 Hybrid cooling system architectures
• 3.10 Caloric cooling: comparative summary and market outlook
• 3.11 LED-based solid-state cooling technologies
  • 3.11.1 LED-based thermophotonic cooling principles
  • 3.11.2 Technical specifications and performance parameters
  • 3.11.3 Advantages over conventional methods
  • 3.11.4 Technology readiness level and development status
  • 3.11.5 Manufacturing cost analysis ($/W basis)
  • 3.11.6 Temperature range capabilities (sub-100 K to 150 K)
  • 3.11.7 Addressable market size and opportunity
  • 3.11.8 Competitive landscape within solid-state cooling
  • 3.11.9 Market entry barriers and advantages
  • 3.11.10 First application priorities and beachhead market strategies
  • 3.11.11 Technology differentiation and unique value propositions for semiconductor sensor cooling and quantum applications
  • 3.11.12 Performance advantages over Peltier systems
  • 3.11.13 Cost competitiveness vs magnetocaloric and Stirling
  • 3.11.14 Commercialisation and funding pathways
• 3.12 Optical refrigeration: laser cooling of solids and anti-Stokes fluorescence
• 3.13 Phononic cooling systems
  • 3.13.1 Solid-state phonon manipulation principles
  • 3.13.2 Technology approach and development status
  • 3.13.3 Market positioning and commercial potential
• 3.14 Quantum dot cooling technologies
  • 3.14.1 Quantum confinement effects
  • 3.14.2 Research developments
  • 3.14.3 Integration with quantum computing systems
• 3.15 Photonic crystal and metamaterial cooling
  • 3.15.1 Principles and wavelength selectivity
  • 3.15.2 Market readiness and manufacturing challenges
• 3.16 Advanced thermionic cooling
  • 3.16.1 Introduction
  • 3.16.2 Electron emission cooling mechanisms
  • 3.16.3 Recent breakthroughs and commercialisation timeline
• 3.17 Passive daytime radiative cooling (PDRC)
  • 3.17.1 Definition, origin and purpose
  • 3.17.2 Materials
  • 3.17.3 Janus and two-sided designs
  • 3.17.4 PRC paint and colour without compromise
  • 3.17.5 Applications: buildings, data centres, solar panels and more
  • 3.17.6 Companies commercialising PRC
• 3.18 Solid-state airflow: MEMS, ionic wind and plasma actuators
  • 3.18.1 Piezoelectric MEMS active cooling
  • 3.18.2 Ionic wind / electrohydrodynamic cooling
  • 3.18.3 Dielectric barrier discharge plasma actuators
  • 3.18.4 Comparison with fans, heat pipes and vapour chambers
  • 3.18.5 Applications
  • 3.18.6 Market outlook
• 3.19 Quantum cryogenic cooling technologies
  • 3.19.1 Adiabatic demagnetisation refrigeration (ADR)
  • 3.19.2 Dilution refrigeration alternatives
  • 3.19.3 Superconducting cooling technologies
  • 3.19.4 Quantum sensing and communication cooling
  • 3.19.5 Quantum cooling market context
• 3.20 Comparative technology analysis
  • 3.20.1 Performance benchmarking matrix across all technologies
  • 3.20.2 Cost competitiveness analysis by application segment
  • 3.20.3 Application suitability mapping and temperature ranges
  • 3.20.4 Technology readiness levels and commercialisation timelines
  • 3.20.5 Technology roadmap and convergence trends
  • 3.20.6 Quantum technology integration capabilities
  • 3.20.7 Winning materials and principles for solid-state cooling generally

4 GLOBAL SOLID-STATE COOLING MARKET ANALYSIS

• 4.1 Market definition, methodology and assumptions
• 4.2 Overall market segmentation and sizing
  • 4.2.1 Global solid-state cooling market overview
  • 4.2.2 Technology segment breakdown and market share
  • 4.2.3 Regional market analysis and growth patterns
  • 4.2.4 Market drivers and growth catalysts
  • 4.2.5 Market restraints and risks
• 4.3 Application-based market segmentation
  • 4.3.1 Primary market segments by temperature requirements
  • 4.3.2 Cross-technology application analysis
  • 4.3.3 Growth projections and market dynamics (5-10 year outlook)
• 4.4 Customer needs assessment across market segments
  • 4.4.1 Performance requirements by application
  • 4.4.2 Cost sensitivity and value drivers
  • 4.4.3 Technology adoption criteria and decision factors
  • 4.4.4 Adoption barriers
• 4.5 Funding and investment landscape
  • 4.5.1 Private funding trends
  • 4.5.2 Corporate investment and M&A
  • 4.5.3 Government and EU funding

5 COMPANY PROFILES (68 company profiles)

6 APPENDIX

• 6.1 Report methodology
  • 6.1.1 Research approach
  • 6.1.2 Market definition
  • 6.1.3 Forecasting method
  • 6.1.4 Limitations

7 REFERENCES