임베디드 다이 패키징 기술 시장 : 플랫폼별, 업계별, 지역별(2025-2033년)

The global embedded die packaging technology market size reached USD 102.6 Million in 2024. Looking forward, IMARC Group expects the market to reach USD 266.1 Million by 2033, exhibiting a growth rate (CAGR) of 10.62% during 2025-2033. The increasing semiconductor industry, along with the growing sales of portable electronic devices, are propelling the market.

Embedded die packaging technology is used to embed components inside the substrate via a multi-step manufacturing process. It comprises flip-chip chip scale packaging (FC CSP) and wafer-level chip scale packaging (WL CSP) to improve the efficiency of the system. It creates more space for other components by shrinking overall solutions in the printed circuit board (PCB). It also provides surface-mount technology (SMT) integration and a flexible routing solution to reduce printed circuit board (PCB) size. It offers design flexibility that shifts from 2D to 3D while reducing distortion and power loss. As a result, embedded die packaging technology finds extensive application in electronics, information and technology (IT), automotive, healthcare, and telecommunication industries across the globe.

Embedded Die Packaging Technology Market Trends:

At present, there is an increase in the miniaturization of electronic circuits in microelectronic devices around the world. This, along with the burgeoning semiconductor industry, represents one of the key factors driving the market. Moreover, embedded die packaging technology offers several benefits, such as upgraded electrical and thermal performance, heterogeneous integration, and streamlined logistics for original equipment manufacturers (OEMs), which are contributing to the growth of the market. In addition, the increasing adoption of autonomous robots for professional services in various industries is offering lucrative growth opportunities to industry investors. Besides this, the growing utilization of embedded die packaging technology in smartphones and wearable devices to enhance the available space and integrate more components is positively influencing the market. Additionally, there is a rise in the demand for embedded die packaging technology with integrated internet of things (IoT) across the globe. This, coupled with the increasing sales of portable electronic devices, such as laptops, computers, tablets, e-readers, smartphones, MP3 players, drones, and electronic toys, is bolstering the growth of the market.

Key Market Segmentation:

Breakup by Platform:

Embedded Die in IC Package Substrate

Embedded Die in Rigid Board

Embedded Die in Flexible Board

Breakup by Industry Vertical:

Consumer Electronics

IT and Telecommunication

Automotive

Healthcare

Others

Breakup by Region:

North America

United States

Canada

Asia-Pacific

China

Japan

India

South Korea

Australia

Indonesia

Others

Europe

Germany

France

United Kingdom

Italy

Spain

Russia

Others

Latin America

Brazil

Mexico

Others

Middle East and Africa

Competitive Landscape:

The competitive landscape of the industry has also been examined along with the profiles of the key players being Amkor Technology Inc., ASE Technology Holding Co. Ltd., AT & S Austria Technologie & Systemtechnik Aktiengesellschaft, Fujikura Ltd., Infineon Technologies AG, Microsemi Corporation (Microchip Technology Inc.), Schweizer Electronic AG and TDK Electronics AG (TDK Corporation). Kindly, note that this only represents a partial list of companies, and the complete list has been provided in the report.

Key Questions Answered in This Report

• 1. What was the size of the global embedded die packaging technology market in 2024?
• 2. What is the expected growth rate of the global embedded die packaging technology market during 2025-2033?
• 3. What are the key factors driving the global embedded die packaging technology market?
• 4. What has been the impact of COVID-19 on the global embedded die packaging technology market?
• 5. What is the breakup of the global embedded die packaging technology market based on the platform?
• 6. What is the breakup of the global embedded die packaging technology market based on the industry vertical?
• 7. What are the key regions in the global embedded die packaging technology market?
• 8. Who are the key players/companies in the global embedded die packaging technology market?

Table of Contents

1 Preface

2 Scope and Methodology

• 2.1 Objectives of the Study
• 2.2 Stakeholders
• 2.3 Data Sources
  • 2.3.1 Primary Sources
  • 2.3.2 Secondary Sources
• 2.4 Market Estimation
  • 2.4.1 Bottom-Up Approach
  • 2.4.2 Top-Down Approach
• 2.5 Forecasting Methodology

3 Executive Summary

4 Introduction

• 4.1 Overview
• 4.2 Key Industry Trends

5 Global Embedded Die Packaging Technology Market

• 5.1 Market Overview
• 5.2 Market Performance
• 5.3 Impact of COVID-19
• 5.4 Market Forecast

6 Market Breakup by Platform

• 6.1 Embedded Die in IC Package Substrate
  • 6.1.1 Market Trends
  • 6.1.2 Market Forecast
• 6.2 Embedded Die in Rigid Board
  • 6.2.1 Market Trends
  • 6.2.2 Market Forecast
• 6.3 Embedded Die in Flexible Board
  • 6.3.1 Market Trends
  • 6.3.2 Market Forecast

7 Market Breakup by Industry Vertical

• 7.1 Consumer Electronics
  • 7.1.1 Market Trends
  • 7.1.2 Market Forecast
• 7.2 IT and Telecommunication
  • 7.2.1 Market Trends
  • 7.2.2 Market Forecast
• 7.3 Automotive
  • 7.3.1 Market Trends
  • 7.3.2 Market Forecast
• 7.4 Healthcare
  • 7.4.1 Market Trends
  • 7.4.2 Market Forecast
• 7.5 Others
  • 7.5.1 Market Trends
  • 7.5.2 Market Forecast

8 Market Breakup by Region

• 8.1 North America
  • 8.1.1 United States
    • 8.1.1.1 Market Trends
    • 8.1.1.2 Market Forecast
  • 8.1.2 Canada
    • 8.1.2.1 Market Trends
    • 8.1.2.2 Market Forecast
• 8.2 Asia-Pacific
  • 8.2.1 China
    • 8.2.1.1 Market Trends
    • 8.2.1.2 Market Forecast
  • 8.2.2 Japan
    • 8.2.2.1 Market Trends
    • 8.2.2.2 Market Forecast
  • 8.2.3 India
    • 8.2.3.1 Market Trends
    • 8.2.3.2 Market Forecast
  • 8.2.4 South Korea
    • 8.2.4.1 Market Trends
    • 8.2.4.2 Market Forecast
  • 8.2.5 Australia
    • 8.2.5.1 Market Trends
    • 8.2.5.2 Market Forecast
  • 8.2.6 Indonesia
    • 8.2.6.1 Market Trends
    • 8.2.6.2 Market Forecast
  • 8.2.7 Others
    • 8.2.7.1 Market Trends
    • 8.2.7.2 Market Forecast
• 8.3 Europe
  • 8.3.1 Germany
    • 8.3.1.1 Market Trends
    • 8.3.1.2 Market Forecast
  • 8.3.2 France
    • 8.3.2.1 Market Trends
    • 8.3.2.2 Market Forecast
  • 8.3.3 United Kingdom
    • 8.3.3.1 Market Trends
    • 8.3.3.2 Market Forecast
  • 8.3.4 Italy
    • 8.3.4.1 Market Trends
    • 8.3.4.2 Market Forecast
  • 8.3.5 Spain
    • 8.3.5.1 Market Trends
    • 8.3.5.2 Market Forecast
  • 8.3.6 Russia
    • 8.3.6.1 Market Trends
    • 8.3.6.2 Market Forecast
  • 8.3.7 Others
    • 8.3.7.1 Market Trends
    • 8.3.7.2 Market Forecast
• 8.4 Latin America
  • 8.4.1 Brazil
    • 8.4.1.1 Market Trends
    • 8.4.1.2 Market Forecast
  • 8.4.2 Mexico
    • 8.4.2.1 Market Trends
    • 8.4.2.2 Market Forecast
  • 8.4.3 Others
    • 8.4.3.1 Market Trends
    • 8.4.3.2 Market Forecast
• 8.5 Middle East and Africa
  • 8.5.1 Market Trends
  • 8.5.2 Market Breakup by Country
  • 8.5.3 Market Forecast

9 SWOT Analysis

• 9.1 Overview
• 9.2 Strengths
• 9.3 Weaknesses
• 9.4 Opportunities
• 9.5 Threats

10 Value Chain Analysis

11 Porters Five Forces Analysis

• 11.1 Overview
• 11.2 Bargaining Power of Buyers
• 11.3 Bargaining Power of Suppliers
• 11.4 Degree of Competition
• 11.5 Threat of New Entrants
• 11.6 Threat of Substitutes

12 Price Analysis

13 Competitive Landscape

• 13.1 Market Structure
• 13.2 Key Players
• 13.3 Profiles of Key Players
  • 13.3.1 Amkor Technology Inc.
    • 13.3.1.1 Company Overview
    • 13.3.1.2 Product Portfolio
    • 13.3.1.3 Financials
    • 13.3.1.4 SWOT Analysis
  • 13.3.2 ASE Technology Holding Co. Ltd.
    • 13.3.2.1 Company Overview
    • 13.3.2.2 Product Portfolio
    • 13.3.2.3 Financials
  • 13.3.3 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
    • 13.3.3.1 Company Overview
    • 13.3.3.2 Product Portfolio
    • 13.3.3.3 Financials
  • 13.3.4 Fujikura Ltd.
    • 13.3.4.1 Company Overview
    • 13.3.4.2 Product Portfolio
    • 13.3.4.3 Financials
    • 13.3.4.4 SWOT Analysis
  • 13.3.5 Infineon Technologies AG
    • 13.3.5.1 Company Overview
    • 13.3.5.2 Product Portfolio
    • 13.3.5.3 Financials
    • 13.3.5.4 SWOT Analysis
  • 13.3.6 Microsemi Corporation (Microchip Technology Inc.)
    • 13.3.6.1 Company Overview
    • 13.3.6.2 Product Portfolio
    • 13.3.6.3 SWOT Analysis
  • 13.3.7 Schweizer Electronic AG
    • 13.3.7.1 Company Overview
    • 13.3.7.2 Product Portfolio
    • 13.3.7.3 Financials
  • 13.3.8 TDK Electronics AG (TDK Corporation)
    • 13.3.8.1 Company Overview
    • 13.3.8.2 Product Portfolio

Kindly, note that this only represents a partial list of companies, and the complete list has been provided in the report