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Global Compound Semiconductor Market 2024-2028

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  • Advanced Wireless Semiconductor Co.
  • AXT Inc.
  • Broadcom Inc.
  • Infineon Technologies AG
  • IQE Plc
  • Microchip Technology Inc.
  • Micron Technology Inc.
  • Mitsubishi Electric Corp.
  • Nichia Corp.
  • NXP Semiconductors NV
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The compound semiconductor market is forecasted to grow by USD 17.56 bn during 2023-2028, accelerating at a CAGR of 7.03% during the forecast period. The report on the compound semiconductor market provides a holistic analysis, market size and forecast, trends, growth drivers, and challenges, as well as vendor analysis covering around 25 vendors.

The report offers an up-to-date analysis regarding the current market scenario, the latest trends and drivers, and the overall market environment. The market is driven by increasing demand for enhanced power density, rising adoption of smartphones, and growing need for enhanced communication networks.

Technavio's compound semiconductor market is segmented as below:

Market Scope
Base Year2024
End Year2028
Series Year2024-2028
Growth MomentumAccelerate
YOY 20246.59%
CAGR7.03%
Incremental Value$17.56bn

By Type

  • GaAs
  • GaN
  • SiC
  • Others

By End-user

  • Consumer electronics
  • Communications
  • Defense and aerospace
  • Automotive
  • Others

By Geographical Landscape

  • APAC
  • North America
  • Europe
  • South America
  • Middle East and Africa

This study identifies the increasing adoption of EVs and HEVs as one of the prime reasons driving the compound semiconductor market growth during the next few years. Also, the growing adoption of renewable energy sources and the rise in the adoption of compound semiconductors with increasing industry automation will lead to sizable demand in the market.

The report on the compound semiconductor market covers the following areas:

  • Compound semiconductor market sizing
  • Compound semiconductor market forecast
  • Compound semiconductor market industry analysis

The robust vendor analysis is designed to help clients improve their market position, and in line with this, this report provides a detailed analysis of several leading compound semiconductor market vendors that include Advanced Wireless Semiconductor Co., AXT Inc., Broadcom Inc., Infineon Technologies AG, IQE Plc, Microchip Technology Inc., Micron Technology Inc., Mitsubishi Electric Corp., Nichia Corp., NXP Semiconductors NV, Qorvo Inc., Qualcomm Inc., Renesas Electronics Corp., Samsung Electronics Co. Ltd., Skyworks Solutions Inc., Sony Group Corp., STMicroelectronics International NV, Texas Instruments Inc., Toshiba Corp., and Wolfspeed Inc.. Also, the compound semiconductor market analysis report includes information on upcoming trends and challenges that will influence market growth. This is to help companies strategize and leverage all forthcoming growth opportunities.

The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. The report contains a comprehensive market and vendor landscape in addition to an analysis of the key vendors.

The publisher presents a detailed picture of the market by way of study, synthesis, and summation of data from multiple sources through an analysis of key parameters such as profit, pricing, competition, and promotions. It presents various market facets by identifying the key industry influencers. The data presented is comprehensive, reliable, and a result of extensive research - both primary and secondary. The market research reports provide a complete competitive landscape and an in-depth vendor selection methodology and analysis using qualitative and quantitative research to forecast accurate market growth.

Table of Contents

1 Executive Summary

  • 1.1 Market overview

2 Market Landscape

  • 2.1 Market ecosystem

3 Market Sizing

  • 3.1 Market definition
  • 3.2 Market segment analysis
  • 3.3 Market size 2023
  • 3.4 Market outlook: Forecast for 2023-2028

4 Historic Market Size

  • 4.1 Global compound semiconductor market 2018 - 2022
  • 4.2 Type Segment Analysis 2018 - 2022
  • 4.3 End-user Segment Analysis 2018 - 2022
  • 4.4 Geography Segment Analysis 2018 - 2022
  • 4.5 Country Segment Analysis 2018 - 2022

5 Five Forces Analysis

  • 5.1 Five forces summary
  • 5.2 Bargaining power of buyers
  • 5.3 Bargaining power of suppliers
  • 5.4 Threat of new entrants
  • 5.5 Threat of substitutes
  • 5.6 Threat of rivalry
  • 5.7 Market condition

6 Market Segmentation by Type

  • 6.1 Market segments
  • 6.2 Comparison by Type
  • 6.3 GaAs - Market size and forecast 2023-2028
  • 6.4 GaN - Market size and forecast 2023-2028
  • 6.5 SiC - Market size and forecast 2023-2028
  • 6.6 Others - Market size and forecast 2023-2028
  • 6.7 Market opportunity by Type

7 Market Segmentation by End-user

  • 7.1 Market segments
  • 7.2 Comparison by End-user
  • 7.3 Consumer electronics - Market size and forecast 2023-2028
  • 7.4 Communications - Market size and forecast 2023-2028
  • 7.5 Defense and aerospace - Market size and forecast 2023-2028
  • 7.6 Automotive - Market size and forecast 2023-2028
  • 7.7 Others - Market size and forecast 2023-2028
  • 7.8 Market opportunity by End-user

8 Customer Landscape

  • 8.1 Customer landscape overview

9 Geographic Landscape

  • 9.1 Geographic segmentation
  • 9.2 Geographic comparison
  • 9.3 APAC - Market size and forecast 2023-2028
  • 9.4 North America - Market size and forecast 2023-2028
  • 9.5 Europe - Market size and forecast 2023-2028
  • 9.6 South America - Market size and forecast 2023-2028
  • 9.7 Middle East and Africa - Market size and forecast 2023-2028
  • 9.8 China - Market size and forecast 2023-2028
  • 9.9 US - Market size and forecast 2023-2028
  • 9.10 Japan - Market size and forecast 2023-2028
  • 9.11 South Korea - Market size and forecast 2023-2028
  • 9.12 Germany - Market size and forecast 2023-2028
  • 9.13 Market opportunity By Geographical Landscape

10 Drivers, Challenges, and Trends

  • 10.1 Market drivers
  • 10.2 Market challenges
  • 10.3 Impact of drivers and challenges
  • 10.4 Market trends

11 Vendor Landscape

  • 11.1 Overview
  • 11.2 Vendor landscape
  • 11.3 Landscape disruption
  • 11.4 Industry risks

12 Vendor Analysis

  • 12.1 Vendors covered
  • 12.2 Market positioning of vendors
  • 12.3 Advanced Wireless Semiconductor Co.
  • 12.4 AXT Inc.
  • 12.5 Broadcom Inc.
  • 12.6 Infineon Technologies AG
  • 12.7 IQE Plc
  • 12.8 Microchip Technology Inc.
  • 12.9 Micron Technology Inc.
  • 12.10 Mitsubishi Electric Corp.
  • 12.11 Nichia Corp.
  • 12.12 NXP Semiconductors NV
  • 12.13 Qorvo Inc.
  • 12.14 Qualcomm Inc.
  • 12.15 Renesas Electronics Corp.
  • 12.16 Samsung Electronics Co. Ltd.
  • 12.17 Skyworks Solutions Inc.

13 Appendix

  • 13.1 Scope of the report
  • 13.2 Inclusions and exclusions checklist
  • 13.3 Currency conversion rates for US$
  • 13.4 Research methodology
  • 13.5 List of abbreviations
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