수동 및 상호접속 전자부품 시장 : 유형별, 용도별 - 세계 예측(2025-2030년)

The Passive & Interconnecting Electronic Components Market was valued at USD 227.08 billion in 2023, expected to reach USD 244.58 billion in 2024, and is projected to grow at a CAGR of 7.80%, to USD 384.19 billion by 2030.

The market for passive and interconnecting electronic components encompasses a variety of devices essential to electronic circuit functionality, including resistors, capacitors, inductors, connectors, and switches. These components are integral due to their roles in tuning frequencies, filtering signals, and enabling the smooth flow of electricity. Their application spans across consumer electronics, automotive, telecommunications, and industrial machinery, with the end-use scope extending to industries such as IT, automotive, consumer electronics, defense, and healthcare. The market is primarily influenced by the surging demand for electronics miniaturization, advancements in automotive infotainment systems, and the acceleration of internet connectivity infrastructure. Emerging opportunities lie in the adoption of advanced technologies like 5G, IoT, and electric vehicles, where robust interconnect solutions are crucial, as well as the integration of green technologies necessitating more efficient components. To capitalize on these opportunities, enterprises should invest in R&D to develop innovative products that cater to specific segments like high-frequency bands in telecommunication or high-density power applications in automotive. However, the market faces limitations such as pricing pressure, the volatility of raw material costs, and the rapid pace of technological obsolescence. Additionally, geopolitical tensions and trade restrictions pose significant challenges to supply chain continuity. Innovation areas include the development of components with enhanced thermal performance, nano-material-based capacitors offering greater efficiency, and flexible electronic connectors for wearable tech. The nature of the market is highly competitive and dynamic, characterized by continuous advancements and the need for adaptability in product offerings to cater to rapidly changing customer demands. Companies must foster strategic collaborations and focus on sustainability to maintain a competitive edge and meet evolving regulatory standards. Emphasis on localized production and supply chain resilience will be critical moving forward.

Market Dynamics: Unveiling Key Market Insights in the Rapidly Evolving Passive & Interconnecting Electronic Components Market

The Passive & Interconnecting Electronic Components Market is undergoing transformative changes driven by a dynamic interplay of supply and demand factors. Understanding these evolving market dynamics prepares business organizations to make informed investment decisions, refine strategic decisions, and seize new opportunities. By gaining a comprehensive view of these trends, business organizations can mitigate various risks across political, geographic, technical, social, and economic domains while also gaining a clearer understanding of consumer behavior and its impact on manufacturing costs and purchasing trends.

• Market Drivers
  • Significantly growing adoption of smartphones and laptops
  • Growing trend of automation in manufacturing facilities
  • Proliferation of consumer electronics such as portable music players, digital cameras, and gaming consoles
• Market Restraints
  • Rising cost of passive electronic components
• Market Opportunities
  • Advancement and incorporation of infotainment and navigation features
  • Rapidly increasing 5G network infrastructure coupled with high-speed internet
• Market Challenges
  • Complexity of passive and interconnecting electronic components

Porter's Five Forces: A Strategic Tool for Navigating the Passive & Interconnecting Electronic Components Market

Porter's five forces framework is a critical tool for understanding the competitive landscape of the Passive & Interconnecting Electronic Components Market. It offers business organizations with a clear methodology for evaluating their competitive positioning and exploring strategic opportunities. This framework helps businesses assess the power dynamics within the market and determine the profitability of new ventures. With these insights, business organizations can leverage their strengths, address weaknesses, and avoid potential challenges, ensuring a more resilient market positioning.

PESTLE Analysis: Navigating External Influences in the Passive & Interconnecting Electronic Components Market

External macro-environmental factors play a pivotal role in shaping the performance dynamics of the Passive & Interconnecting Electronic Components Market. Political, Economic, Social, Technological, Legal, and Environmental factors analysis provides the necessary information to navigate these influences. By examining PESTLE factors, businesses can better understand potential risks and opportunities. This analysis enables business organizations to anticipate changes in regulations, consumer preferences, and economic trends, ensuring they are prepared to make proactive, forward-thinking decisions.

Market Share Analysis: Understanding the Competitive Landscape in the Passive & Interconnecting Electronic Components Market

A detailed market share analysis in the Passive & Interconnecting Electronic Components Market provides a comprehensive assessment of vendors' performance. Companies can identify their competitive positioning by comparing key metrics, including revenue, customer base, and growth rates. This analysis highlights market concentration, fragmentation, and trends in consolidation, offering vendors the insights required to make strategic decisions that enhance their position in an increasingly competitive landscape.

FPNV Positioning Matrix: Evaluating Vendors' Performance in the Passive & Interconnecting Electronic Components Market

The Forefront, Pathfinder, Niche, Vital (FPNV) Positioning Matrix is a critical tool for evaluating vendors within the Passive & Interconnecting Electronic Components Market. This matrix enables business organizations to make well-informed decisions that align with their goals by assessing vendors based on their business strategy and product satisfaction. The four quadrants provide a clear and precise segmentation of vendors, helping users identify the right partners and solutions that best fit their strategic objectives.

Strategy Analysis & Recommendation: Charting a Path to Success in the Passive & Interconnecting Electronic Components Market

A strategic analysis of the Passive & Interconnecting Electronic Components Market is essential for businesses looking to strengthen their global market presence. By reviewing key resources, capabilities, and performance indicators, business organizations can identify growth opportunities and work toward improvement. This approach helps businesses navigate challenges in the competitive landscape and ensures they are well-positioned to capitalize on newer opportunities and drive long-term success.

Key Company Profiles

The report delves into recent significant developments in the Passive & Interconnecting Electronic Components Market, highlighting leading vendors and their innovative profiles. These include 3M Company, ABB Ltd., American Electronic Components, Amphenol Corporation, API Technologies, Berkshire Hathaway Group, Datronix Holding Ltd., Eaton Corporation, Fujitsu Component Limited, Hirose Electric Co., Ltd., Hosiden Corporation, Japan Aviation Electronics Industry, Ltd., Molex Incorporated, Murata Manufacturing Co., Ltd., Nichicon Corporation, Panasonic Corporation, STMicroelectronics NV, Taiyo Yuden Co., Ltd., TDK Corporation, TE Connectivity, and Vishay Intertechnology, Inc..

Market Segmentation & Coverage

This research report categorizes the Passive & Interconnecting Electronic Components Market to forecast the revenues and analyze trends in each of the following sub-markets:

• Based on Type, market is studied across Interconnects and Passive Components. The Interconnects is further studied across Connectors, Printed Circuit Boards, Relays, and Switches. The Passive Components is further studied across Capacitors, Diodes, Inductors, Resistors, and Transformers.
• Based on Application, market is studied across Automotive & Transportation, Consumer Electronics, Data Processing, Industrial Equipment, Medical Devices, Military & Aerospace Equipment, and Telecommunication.
• Based on Region, market is studied across Americas, Asia-Pacific, and Europe, Middle East & Africa. The Americas is further studied across Argentina, Brazil, Canada, Mexico, and United States. The United States is further studied across California, Florida, Illinois, New York, Ohio, Pennsylvania, and Texas. The Asia-Pacific is further studied across Australia, China, India, Indonesia, Japan, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, and Vietnam. The Europe, Middle East & Africa is further studied across Denmark, Egypt, Finland, France, Germany, Israel, Italy, Netherlands, Nigeria, Norway, Poland, Qatar, Russia, Saudi Arabia, South Africa, Spain, Sweden, Switzerland, Turkey, United Arab Emirates, and United Kingdom.

The report offers a comprehensive analysis of the market, covering key focus areas:

1. Market Penetration: A detailed review of the current market environment, including extensive data from top industry players, evaluating their market reach and overall influence.

2. Market Development: Identifies growth opportunities in emerging markets and assesses expansion potential in established sectors, providing a strategic roadmap for future growth.

3. Market Diversification: Analyzes recent product launches, untapped geographic regions, major industry advancements, and strategic investments reshaping the market.

4. Competitive Assessment & Intelligence: Provides a thorough analysis of the competitive landscape, examining market share, business strategies, product portfolios, certifications, regulatory approvals, patent trends, and technological advancements of key players.

5. Product Development & Innovation: Highlights cutting-edge technologies, R&D activities, and product innovations expected to drive future market growth.

The report also answers critical questions to aid stakeholders in making informed decisions:

1. What is the current market size, and what is the forecasted growth?

2. Which products, segments, and regions offer the best investment opportunities?

3. What are the key technology trends and regulatory influences shaping the market?

4. How do leading vendors rank in terms of market share and competitive positioning?

5. What revenue sources and strategic opportunities drive vendors' market entry or exit strategies?

Table of Contents

1. Preface

• 1.1. Objectives of the Study
• 1.2. Market Segmentation & Coverage
• 1.3. Years Considered for the Study
• 1.4. Currency & Pricing
• 1.5. Language
• 1.6. Stakeholders

2. Research Methodology

• 2.1. Define: Research Objective
• 2.2. Determine: Research Design
• 2.3. Prepare: Research Instrument
• 2.4. Collect: Data Source
• 2.5. Analyze: Data Interpretation
• 2.6. Formulate: Data Verification
• 2.7. Publish: Research Report
• 2.8. Repeat: Report Update

3. Executive Summary

4. Market Overview

5. Market Insights

• 5.1. Market Dynamics
  • 5.1.1. Drivers
    • 5.1.1.1. Significantly growing adoption of smartphones and laptops
    • 5.1.1.2. Growing trend of automation in manufacturing facilities
    • 5.1.1.3. Proliferation of consumer electronics such as portable music players, digital cameras, and gaming consoles
  • 5.1.2. Restraints
    • 5.1.2.1. Rising cost of passive electronic components
  • 5.1.3. Opportunities
    • 5.1.3.1. Advancement and incorporation of infotainment and navigation features
    • 5.1.3.2. Rapidly increasing 5G network infrastructure coupled with high-speed internet
  • 5.1.4. Challenges
    • 5.1.4.1. Complexity of passive and interconnecting electronic components
• 5.2. Market Segmentation Analysis
• 5.3. Porter's Five Forces Analysis
  • 5.3.1. Threat of New Entrants
  • 5.3.2. Threat of Substitutes
  • 5.3.3. Bargaining Power of Customers
  • 5.3.4. Bargaining Power of Suppliers
  • 5.3.5. Industry Rivalry
• 5.4. PESTLE Analysis
  • 5.4.1. Political
  • 5.4.2. Economic
  • 5.4.3. Social
  • 5.4.4. Technological
  • 5.4.5. Legal
  • 5.4.6. Environmental

6. Passive & Interconnecting Electronic Components Market, by Type

• 6.1. Introduction
• 6.2. Interconnects
  • 6.2.1. Connectors
  • 6.2.2. Printed Circuit Boards
  • 6.2.3. Relays
  • 6.2.4. Switches
• 6.3. Passive Components
  • 6.3.1. Capacitors
  • 6.3.2. Diodes
  • 6.3.3. Inductors
  • 6.3.4. Resistors
  • 6.3.5. Transformers

7. Passive & Interconnecting Electronic Components Market, by Application

• 7.1. Introduction
• 7.2. Automotive & Transportation
• 7.3. Consumer Electronics
• 7.4. Data Processing
• 7.5. Industrial Equipment
• 7.6. Medical Devices
• 7.7. Military & Aerospace Equipment
• 7.8. Telecommunication

8. Americas Passive & Interconnecting Electronic Components Market

• 8.1. Introduction
• 8.2. Argentina
• 8.3. Brazil
• 8.4. Canada
• 8.5. Mexico
• 8.6. United States

9. Asia-Pacific Passive & Interconnecting Electronic Components Market

• 9.1. Introduction
• 9.2. Australia
• 9.3. China
• 9.4. India
• 9.5. Indonesia
• 9.6. Japan
• 9.7. Malaysia
• 9.8. Philippines
• 9.9. Singapore
• 9.10. South Korea
• 9.11. Taiwan
• 9.12. Thailand
• 9.13. Vietnam

10. Europe, Middle East & Africa Passive & Interconnecting Electronic Components Market

• 10.1. Introduction
• 10.2. Denmark
• 10.3. Egypt
• 10.4. Finland
• 10.5. France
• 10.6. Germany
• 10.7. Israel
• 10.8. Italy
• 10.9. Netherlands
• 10.10. Nigeria
• 10.11. Norway
• 10.12. Poland
• 10.13. Qatar
• 10.14. Russia
• 10.15. Saudi Arabia
• 10.16. South Africa
• 10.17. Spain
• 10.18. Sweden
• 10.19. Switzerland
• 10.20. Turkey
• 10.21. United Arab Emirates
• 10.22. United Kingdom

11. Competitive Landscape

• 11.1. Market Share Analysis, 2023
• 11.2. FPNV Positioning Matrix, 2023
• 11.3. Competitive Scenario Analysis
• 11.4. Strategy Analysis & Recommendation

Companies Mentioned

• 1. 3M Company
• 2. ABB Ltd.
• 3. American Electronic Components
• 4. Amphenol Corporation
• 5. API Technologies
• 6. Berkshire Hathaway Group
• 7. Datronix Holding Ltd.
• 8. Eaton Corporation
• 9. Fujitsu Component Limited
• 10. Hirose Electric Co., Ltd.
• 11. Hosiden Corporation
• 12. Japan Aviation Electronics Industry, Ltd.
• 13. Molex Incorporated
• 14. Murata Manufacturing Co., Ltd.
• 15. Nichicon Corporation
• 16. Panasonic Corporation
• 17. STMicroelectronics NV
• 18. Taiyo Yuden Co., Ltd.
• 19. TDK Corporation
• 20. TE Connectivity
• 21. Vishay Intertechnology, Inc.