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ÇÁ·Îºê Ä«µå ½ÃÀå : À¯Çü, ÆÐµå ÇÇÄ¡, ÆÐµå ±¸Á¶, ÆÐµå ¾î·¹ÀÌ, ¿ëµµ, ÃÖÁ¾ ¿ëµµ, ¾÷Á¾º° - ¼¼°è ¿¹Ãø(2025-2030³â)

Probe Cards Market by Type (Cantilever Probe Card, MEMS Probe Card, U-Probe), Pad Pitch (100 µm, 130 µm, 55 µm), Pad Structure, Pad Array, Application, End-Use, Vertical - Global Forecast 2025-2030

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ÇÁ·Îºê Ä«µå ½ÃÀåÀº 2023³â¿¡ 32¾ï 6,000¸¸ ´Þ·¯·Î Æò°¡µÇ¾ú°í, 2024³â¿¡´Â 35¾ï 5,000¸¸ ´Þ·¯¿¡ À̸¦ °ÍÀ¸·Î ¿¹ÃøµÇ¸ç, CAGR 9.18%·Î ¼ºÀåÇϰí, 2030³â¿¡´Â 60¾ï 4,000¸¸ ´Þ·¯°¡ µÈ´Ù°í ¿¹ÃøµË´Ï´Ù.

ÇÁ·Îºê Ä«µå´Â ¹ÝµµÃ¼ µð¹ÙÀ̽º¸¦ Å×½ºÆ®ÇÏ´Â µ¥ »ç¿ëµÇ´Â Áß¿äÇÑ ±¸¼º ¿ä¼Ò·Î, ÀüÀÚ Å×½ºÆ® Àåºñ¿Í ¹ÝµµÃ¼ ¿þÀÌÆÛ °£ÀÇ ÀÎÅÍÆäÀ̽º ¿ªÇÒÀ» ÇÕ´Ï´Ù. ±â´É¼ºÀ» º¸ÀåÇÏ´Â µ¥ ¸Å¿ì Áß¿äÇÑ ¿ªÇÒÀ»ÇÕ´Ï´Ù. ÇÁ·Îºê Ä«µå°¡ ÇÊ¿äÇÑ ¹è°æ¿¡´Â ¹ÝµµÃ¼ ±â¼úÀÇ Áøº¸, ƯÈ÷ ¼ÒÇüÈ­¡¤°í±â´ÉÈ­ÀÇ µ¿Çâ¿¡ ¼ö¹ÝÇÏ´Â °íÁ¤¹Ðµµ¡¤°í½Å·Ú¼ºÀÇ ¿ä±¸°¡ ÀÖ½À´Ï´Ù. ÀÚµ¿Â÷, Åë½Å µî ´Ù¾çÇÑ ÃÖÁ¾ ¿ëµµ ºÐ¾ßÀÇ ¿þÀÌÆÛ ¼ÒÆÃÀ̳ª ÃÖÁ¾ °Ë»ç °øÁ¤¿¡¼­ ÁÖ·Î »ç¿ëµÇ°í ÀÖ½À´Ï´Ù.

ÁÖ¿ä ½ÃÀå Åë°è
±âÁسâ(2023) 32¾ï 6,000¸¸ ´Þ·¯
¿¹Ãø³â(2024) 35¾ï 5,000¸¸ ´Þ·¯
¿¹Ãø³â(2030) 60¾ï 4,000¸¸ ´Þ·¯
CAGR(%) 9.18%

ÇÁ·Îºê Ä«µå ½ÃÀåÀº IoT, AI, 5G µî ´Ù¾çÇÑ ¿ëµµ¿¡¼­ ¹ÝµµÃ¼ ¼ö¿ä°¡ ³ô¾ÆÁü¿¡ µû¶ó ¼ºÀåÇϰí ÀÖ½À´Ï´Ù. ¼¼·ÃµÈ ÇÁ·Îºê Ä«µå ¼ö¿ä¸¦ ÃËÁøÇϰí ÀÖ½À´Ï´Ù.ÀÇ Áøº¸´Â ½º¸¶Æ® µð¹ÙÀ̽º¿Í ÀÎÇÁ¶ó¿¡ ´ëÇÑ ÅõÀÚ Áõ°¡¿Í ÇÔ²² ½ÃÀå È®´ëÀÇ Å« ±âȸ¸¦ °¡Á®¿Ô½À´Ï´Ù. ±Ô¸ðÀÇ °æÁ¦´Â ±âÁ¸ ±â¾÷¿¡ À¯¸®ÇÏ¸ç ½Å±Ô ÁøÃâ±â¾÷¿¡°Ô´Â À庮ÀÌ µË´Ï´Ù.

±â¼ú Çõ½ÅÀÇ ±âȸ·Î´Â MEMS(Micro-Electro-Mechanical Systems: ¹Ì¼ÒÀü±â±â°è)¿Í °°Àº ¼ÒÀ縦 ÀÌ¿ëÇÏ¿© Á¤¹Ðµµ¿Í ¼ö¸íÀ» Çâ»ó½ÃŲ ÇÁ·Îºê Ä«µåÀÇ °³¹ßÀ» µé ¼ö ÀÖ½À´Ï´Ù. ºÎµå·´°Ô Áö¼Ó °¡´ÉÇÑ ¼ÒÀç °³¹ß¿¡ ÁßÁ¡À» µÐ ¿¬±¸µµ »ý°¢ÇÒ ¼ö ÀÖ½À´Ï´Ù. Áö۱â À§Çؼ­´Â Àü·«Àû ÆÄÆ®³Ê½Ê°ú °øµ¿ ¿¬±¸¸¦ ¸ð»öÇØ¾ß ÇÕ´Ï´Ù. ÀûÀÎ °ø±Þ¸Á °ü¸®¿Í ÃÖÁ¾ »ç¿ëÀÚ¿ëµµÀÇ ÁøÈ­ÇÏ´Â ¼ö¿ä¿¡ ´ëÇÑ ´ëÀÀÀÌ ½ÃÀå ±âȸ¸¦ Ȱ¿ëÇÏ¿© °úÁ¦¸¦ ±Øº¹ÇÏ´Â ¿­¼è°¡ µÉ °ÍÀ¸·Î º¸ÀÔ´Ï´Ù.

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ÇÁ·Îºê Ä«µå ½ÃÀåÀº ¼ö¿ä ¹× °ø±ÞÀÇ ¿ªµ¿ÀûÀÎ »óÈ£ ÀÛ¿ë¿¡ ÀÇÇØ º¯¸ð¸¦ ÀÌ·ç°í ÀÖ½À´Ï´Ù. ±×¸®°í »õ·Î¿î ºñÁî´Ï½º ±âȸ¸¦ ¾ò´Â µ¥ µµ¿òÀÌ µÉ ¼ö ÀÖ½À´Ï´Ù. ÀÌ·¯ÇÑ µ¿ÇâÀ» Á¾ÇÕÀûÀ¸·Î ÆÄ¾ÇÇÔÀ¸·Î½á ±â¾÷Àº Á¤Ä¡Àû, Áö¸®Àû, ±â¼úÀû, »çȸÀû, °æÁ¦Àû ¿µ¿ª¿¡ °ÉÄ£ ´Ù¾çÇÑ À§ÇèÀ» ¿ÏÈ­ÇÒ ¼ö ÀÖÀ¸¸ç, ¼ÒºñÀÚ Çൿ°ú ÀÌ´Â Á¦Á¶ ºñ¿ë°ú ±¸¸Å µ¿Çâ¿¡ ¹ÌÄ¡´Â ¿µÇâÀ» ´õ¿í ¸íÈ®ÇÏ°Ô ÀÌÇØÇÒ ¼ö ÀÖ½À´Ï´Ù.

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    • ÇÁ·Îºê Ä«µåÀÇ »ç¿ë¿¡ À־ÀÇ Á¤¹Ðµµ¿Í ½Å·Ú¼ºÀÇ ¹®Á¦

Porter's Five Forces: ÇÁ·Îºê Ä«µå ½ÃÀåÀ» Ž»öÇÏ´Â Àü·« µµ±¸

Porter's Five Forces ÇÁ·¹ÀÓ¿öÅ©´Â ÇÁ·Îºê Ä«µå ½ÃÀå °æÀï ±¸µµ¸¦ ÀÌÇØÇϱâ À§ÇÑ Áß¿äÇÑ µµ±¸ÀÔ´Ï´Ù. ÇÑ ±â¼úÀ» Á¦°øÇÕ´Ï´Ù. Äí´Â ±â¾÷ÀÌ ½ÃÀå ³» ¼¼·Âµµ¸¦ Æò°¡ÇÏ°í ½Å±Ô »ç¾÷ÀÇ ¼öÀͼºÀ» ÆÇ´ÜÇÏ´Â µ¥ µµ¿òÀÌ µË´Ï´Ù. ÇÇÇÒ ¼ö ÀÖÀ¸¸ç ´õ °­ÀÎÇÑ ½ÃÀå¿¡¼­ Æ÷Áö¼Å´×À» º¸Àå ÇÒ ¼ö ÀÖ½À´Ï´Ù.

PESTLE ºÐ¼® : ÇÁ·Îºê Ä«µå ½ÃÀå¿¡¼­ ¿ÜºÎ·ÎºÎÅÍÀÇ ¿µÇâ ÆÄ¾Ç

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Á¦6Àå ÇÁ·Îºê Ä«µå ½ÃÀå : À¯Çüº°

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  • U ÇÁ·Îºê
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Á¦7Àå ÇÁ·Îºê Ä«µå ½ÃÀå ÆÐµå ÇÇÄ¡

  • 100 µm
  • 130 µm
  • 55 µm
  • 60 µm
  • 80 µm

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Á¦10Àå ÇÁ·Îºê Ä«µå ½ÃÀå : ¿ëµµº°

  • DRAM
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±â¾÷ ¸ñ·Ï

  • Accuprobe Corporation
  • Chunghwa Precision Test Tech. Co., Ltd.
  • FEINMETALL GmbH
  • FICT LIMITED
  • FormFactor, Inc.
  • GGB Industries, Inc.
  • htt high tech trade GmbH
  • JAPAN ELECTRONIC MATERIALS CORPORATION
  • Jenoptik AG
  • Korea Instrument Co., Ltd.
  • Micronics Japan Co., Ltd.
  • MPI Corporation
  • Nidec SV Probe Pte. Ltd.
  • PPI Systems Inc.
  • Probe Test Solutions Ltd.
  • PROTEC MEMS Technology
  • RIKA DENSHI CO., LTD.
  • Seiken Co., Ltd.
  • Shenzhen Fastprint Circuit Tech Co.,LTD.
  • STAr Technologies Inc.
  • Suzhou Silicon Test System Co., Ltd.
  • Synergy Cad Group
  • Technoprobe SpA
  • TOHO ELECTRONICS INC.
  • TSE Co., Ltd.
  • Wentworth Laboratories, Inc.
  • WinWay Technology Co., Ltd.
  • Yamaichi Electronics Co. Ltd.
BJH 24.12.06

The Probe Cards Market was valued at USD 3.26 billion in 2023, expected to reach USD 3.55 billion in 2024, and is projected to grow at a CAGR of 9.18%, to USD 6.04 billion by 2030.

Probe cards are essential components used in semiconductor device testing, acting as interfaces between electronic test equipment and semiconductor wafers. They are crucial in ensuring the quality and functionality of semiconductor chips by conducting electrical tests to identify defects. The necessity of probe cards arises from advancing semiconductor technologies demanding high precision and reliability, especially with the trend towards miniaturization and increased functionality. In application, probe cards are predominantly used in wafer sorting and final testing processes across a variety of end-use sectors, including consumer electronics, automotive, and telecommunications.

KEY MARKET STATISTICS
Base Year [2023] USD 3.26 billion
Estimated Year [2024] USD 3.55 billion
Forecast Year [2030] USD 6.04 billion
CAGR (%) 9.18%

The probe card market is experiencing growth driven by the rising demand for semiconductors in diverse applications such as IoT, AI, and 5G. Furthermore, the shift towards advanced materials like silicon-on-insulator (SOI) and new packaging technologies is propelling the demand for sophisticated probe cards. Urbanization and technological advancements, alongside increased investments in smart devices and infrastructure, present significant opportunities for market expansion. However, high costs associated with manufacturing, coupled with complex design requirements, pose significant limitations and challenges for market players. Economies of scale favor established firms, creating barriers for new entrants.

Opportunities for innovation include the development of probe cards with enhanced precision and longevity, utilizing materials like MEMS (Micro-Electro-Mechanical Systems) for better performance. Furthermore, research could focus on reducing production costs through advancements in automated manufacturing processes and developing eco-friendly, sustainable materials. Companies should also explore strategic partnerships and collaborations to mitigate the high costs of R&D, thus maintaining competitive advantage. The market is anticipated to be increasingly competitive, with companies focusing on product differentiation and technological innovation to sustain growth. Efficient supply chain management and meeting the ever-evolving demands of end-user applications will be key to capitalizing on market opportunities and overcoming challenges.

Market Dynamics: Unveiling Key Market Insights in the Rapidly Evolving Probe Cards Market

The Probe Cards Market is undergoing transformative changes driven by a dynamic interplay of supply and demand factors. Understanding these evolving market dynamics prepares business organizations to make informed investment decisions, refine strategic decisions, and seize new opportunities. By gaining a comprehensive view of these trends, business organizations can mitigate various risks across political, geographic, technical, social, and economic domains while also gaining a clearer understanding of consumer behavior and its impact on manufacturing costs and purchasing trends.

  • Market Drivers
    • Exponential use of wireless and mobile devices and the need for high-performing ICs
    • Government initiatives encouraging semiconductor production and testing
  • Market Restraints
    • High upfront investment in research, design tools, and fabrication of probe cards
  • Market Opportunities
    • Advancements in probe card designing and testing capabilities
    • Strategic collaboration between probe card manufacturers to deliver products for new applications
  • Market Challenges
    • Accuracy and reliability issues with the usage of probe cards

Porter's Five Forces: A Strategic Tool for Navigating the Probe Cards Market

Porter's five forces framework is a critical tool for understanding the competitive landscape of the Probe Cards Market. It offers business organizations with a clear methodology for evaluating their competitive positioning and exploring strategic opportunities. This framework helps businesses assess the power dynamics within the market and determine the profitability of new ventures. With these insights, business organizations can leverage their strengths, address weaknesses, and avoid potential challenges, ensuring a more resilient market positioning.

PESTLE Analysis: Navigating External Influences in the Probe Cards Market

External macro-environmental factors play a pivotal role in shaping the performance dynamics of the Probe Cards Market. Political, Economic, Social, Technological, Legal, and Environmental factors analysis provides the necessary information to navigate these influences. By examining PESTLE factors, businesses can better understand potential risks and opportunities. This analysis enables business organizations to anticipate changes in regulations, consumer preferences, and economic trends, ensuring they are prepared to make proactive, forward-thinking decisions.

Market Share Analysis: Understanding the Competitive Landscape in the Probe Cards Market

A detailed market share analysis in the Probe Cards Market provides a comprehensive assessment of vendors' performance. Companies can identify their competitive positioning by comparing key metrics, including revenue, customer base, and growth rates. This analysis highlights market concentration, fragmentation, and trends in consolidation, offering vendors the insights required to make strategic decisions that enhance their position in an increasingly competitive landscape.

FPNV Positioning Matrix: Evaluating Vendors' Performance in the Probe Cards Market

The Forefront, Pathfinder, Niche, Vital (FPNV) Positioning Matrix is a critical tool for evaluating vendors within the Probe Cards Market. This matrix enables business organizations to make well-informed decisions that align with their goals by assessing vendors based on their business strategy and product satisfaction. The four quadrants provide a clear and precise segmentation of vendors, helping users identify the right partners and solutions that best fit their strategic objectives.

Key Company Profiles

The report delves into recent significant developments in the Probe Cards Market, highlighting leading vendors and their innovative profiles. These include Accuprobe Corporation, Chunghwa Precision Test Tech. Co., Ltd., FEINMETALL GmbH, FICT LIMITED, FormFactor, Inc., GGB Industries, Inc., htt high tech trade GmbH, JAPAN ELECTRONIC MATERIALS CORPORATION, Jenoptik AG, Korea Instrument Co., Ltd., Micronics Japan Co., Ltd., MPI Corporation, Nidec SV Probe Pte. Ltd., PPI Systems Inc., Probe Test Solutions Ltd., PROTEC MEMS Technology, RIKA DENSHI CO., LTD., Seiken Co., Ltd., Shenzhen Fastprint Circuit Tech Co.,LTD., STAr Technologies Inc., Suzhou Silicon Test System Co., Ltd., Synergy Cad Group, Technoprobe S.p.A., TOHO ELECTRONICS INC., TSE Co., Ltd., Wentworth Laboratories, Inc., WinWay Technology Co., Ltd., and Yamaichi Electronics Co. Ltd..

Market Segmentation & Coverage

This research report categorizes the Probe Cards Market to forecast the revenues and analyze trends in each of the following sub-markets:

  • Based on Type, market is studied across Cantilever Probe Card, MEMS Probe Card, U-Probe, and Vertical Probe Card.
  • Based on Pad Pitch, market is studied across 100 µm, 130 µm, 55 µm, 60 µm, and 80 µm.
  • Based on Pad Structure, market is studied across AI-Pad, Cu-pillar Bump, and Solder Bump.
  • Based on Pad Array, market is studied across Area Array and Peripheral.
  • Based on Application, market is studied across DRAM, Flash, Logic, and Optical.
  • Based on End-Use, market is studied across Analog Integrated Circuits, High-Speed Integrated Circuits, Light-Emitting Diodes, Memory Chips, Microprocessors & Microcontrollers, Photovoltaic Cells, and System-on-Chip.
  • Based on Vertical, market is studied across Aerospace & Defense, Automotive, and IT & Telecommunication.
  • Based on Region, market is studied across Americas, Asia-Pacific, and Europe, Middle East & Africa. The Americas is further studied across Argentina, Brazil, Canada, Mexico, and United States. The United States is further studied across California, Florida, Illinois, New York, Ohio, Pennsylvania, and Texas. The Asia-Pacific is further studied across Australia, China, India, Indonesia, Japan, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, and Vietnam. The Europe, Middle East & Africa is further studied across Denmark, Egypt, Finland, France, Germany, Israel, Italy, Netherlands, Nigeria, Norway, Poland, Qatar, Russia, Saudi Arabia, South Africa, Spain, Sweden, Switzerland, Turkey, United Arab Emirates, and United Kingdom.

The report offers a comprehensive analysis of the market, covering key focus areas:

1. Market Penetration: A detailed review of the current market environment, including extensive data from top industry players, evaluating their market reach and overall influence.

2. Market Development: Identifies growth opportunities in emerging markets and assesses expansion potential in established sectors, providing a strategic roadmap for future growth.

3. Market Diversification: Analyzes recent product launches, untapped geographic regions, major industry advancements, and strategic investments reshaping the market.

4. Competitive Assessment & Intelligence: Provides a thorough analysis of the competitive landscape, examining market share, business strategies, product portfolios, certifications, regulatory approvals, patent trends, and technological advancements of key players.

5. Product Development & Innovation: Highlights cutting-edge technologies, R&D activities, and product innovations expected to drive future market growth.

The report also answers critical questions to aid stakeholders in making informed decisions:

1. What is the current market size, and what is the forecasted growth?

2. Which products, segments, and regions offer the best investment opportunities?

3. What are the key technology trends and regulatory influences shaping the market?

4. How do leading vendors rank in terms of market share and competitive positioning?

5. What revenue sources and strategic opportunities drive vendors' market entry or exit strategies?

Table of Contents

1. Preface

  • 1.1. Objectives of the Study
  • 1.2. Market Segmentation & Coverage
  • 1.3. Years Considered for the Study
  • 1.4. Currency & Pricing
  • 1.5. Language
  • 1.6. Stakeholders

2. Research Methodology

  • 2.1. Define: Research Objective
  • 2.2. Determine: Research Design
  • 2.3. Prepare: Research Instrument
  • 2.4. Collect: Data Source
  • 2.5. Analyze: Data Interpretation
  • 2.6. Formulate: Data Verification
  • 2.7. Publish: Research Report
  • 2.8. Repeat: Report Update

3. Executive Summary

4. Market Overview

5. Market Insights

  • 5.1. Market Dynamics
    • 5.1.1. Drivers
      • 5.1.1.1. Exponential use of wireless and mobile devices and the need for high-performing ICs
      • 5.1.1.2. Government initiatives encouraging semiconductor production and testing
    • 5.1.2. Restraints
      • 5.1.2.1. High upfront investment in research, design tools, and fabrication of probe cards
    • 5.1.3. Opportunities
      • 5.1.3.1. Advancements in probe card designing and testing capabilities
      • 5.1.3.2. Strategic collaboration between probe card manufacturers to deliver products for new applications
    • 5.1.4. Challenges
      • 5.1.4.1. Accuracy and reliability issues with the usage of probe cards
  • 5.2. Market Segmentation Analysis
    • 5.2.1. Type: Emerging adoption of MEMS probe cards due to their superior precision and scalability
    • 5.2.2. End-Use: Increasing proliferation of electronic and digital devices and the need for the integration of memory chips
    • 5.2.3. Pad Pitch: Suitability of 80 µm pad pitch for range of semiconductor devices with moderate to high density
    • 5.2.4. Pad Structure: Proliferation of Cu-pillar bumps in high-frequency applications owing to their high conductivity
    • 5.2.5. Pad Array: Preferences for peripheral configuration owing to their simplicity and cost-effectiveness
    • 5.2.6. Application: High demand for probe cards in logic devices for comprehensive testing to validate their functionality and performance
    • 5.2.7. Vertical: Increasing applicability in IT & telecommunication sector characterized by rapid innovation
  • 5.3. Porter's Five Forces Analysis
    • 5.3.1. Threat of New Entrants
    • 5.3.2. Threat of Substitutes
    • 5.3.3. Bargaining Power of Customers
    • 5.3.4. Bargaining Power of Suppliers
    • 5.3.5. Industry Rivalry
  • 5.4. PESTLE Analysis
    • 5.4.1. Political
    • 5.4.2. Economic
    • 5.4.3. Social
    • 5.4.4. Technological
    • 5.4.5. Legal
    • 5.4.6. Environmental
  • 5.5. Client Customization
    • 5.5.1. Assessment of PCB Board Layers, Materials, and Design Rules Used in Analog Integrated Circuits
    • 5.5.2. Assessment of PCB Board Layers, Materials, and Design Rules Used in High-Speed Integrated Circuits
    • 5.5.3. Assessment of PCB Board Layers, Materials, and Design Rules Used in Light-Emitting Diodes
    • 5.5.4. Assessment of PCB Board Layers, Materials, and Design Rules Used in Memory Chips
    • 5.5.5. Assessment of PCB Board Layers, Materials, and Design Rules Used in Microprocessors & Microcontrollers
    • 5.5.6. Assessment of PCB Board Layers, Materials, and Design Rules Used in Photovoltaic Cells
    • 5.5.7. Assessment of PCB Board Layers, Materials, and Design Rules Used in System-on-Chip
    • 5.5.8. Design, Performance, and Applications Assessment of Server and PC-Class CPUs and GPUs

6. Probe Cards Market, by Type

  • 6.1. Introduction
  • 6.2. Cantilever Probe Card
  • 6.3. MEMS Probe Card
  • 6.4. U-Probe
  • 6.5. Vertical Probe Card

7. Probe Cards Market, by Pad Pitch

  • 7.1. Introduction
  • 7.2. 100 µm
  • 7.3. 130 µm
  • 7.4. 55 µm
  • 7.5. 60 µm
  • 7.6. 80 µm

8. Probe Cards Market, by Pad Structure

  • 8.1. Introduction
  • 8.2. AI-Pad
  • 8.3. Cu-pillar Bump
  • 8.4. Solder Bump

9. Probe Cards Market, by Pad Array

  • 9.1. Introduction
  • 9.2. Area Array
  • 9.3. Peripheral

10. Probe Cards Market, by Application

  • 10.1. Introduction
  • 10.2. DRAM
  • 10.3. Flash
  • 10.4. Logic
  • 10.5. Optical

11. Probe Cards Market, by End-Use

  • 11.1. Introduction
  • 11.2. Analog Integrated Circuits
  • 11.3. High-Speed Integrated Circuits
  • 11.4. Light-Emitting Diodes
  • 11.5. Memory Chips
  • 11.6. Microprocessors & Microcontrollers
  • 11.7. Photovoltaic Cells
  • 11.8. System-on-Chip

12. Probe Cards Market, by Vertical

  • 12.1. Introduction
  • 12.2. Aerospace & Defense
  • 12.3. Automotive
  • 12.4. IT & Telecommunication

13. Americas Probe Cards Market

  • 13.1. Introduction
  • 13.2. Argentina
  • 13.3. Brazil
  • 13.4. Canada
  • 13.5. Mexico
  • 13.6. United States

14. Asia-Pacific Probe Cards Market

  • 14.1. Introduction
  • 14.2. Australia
  • 14.3. China
  • 14.4. India
  • 14.5. Indonesia
  • 14.6. Japan
  • 14.7. Malaysia
  • 14.8. Philippines
  • 14.9. Singapore
  • 14.10. South Korea
  • 14.11. Taiwan
  • 14.12. Thailand
  • 14.13. Vietnam

15. Europe, Middle East & Africa Probe Cards Market

  • 15.1. Introduction
  • 15.2. Denmark
  • 15.3. Egypt
  • 15.4. Finland
  • 15.5. France
  • 15.6. Germany
  • 15.7. Israel
  • 15.8. Italy
  • 15.9. Netherlands
  • 15.10. Nigeria
  • 15.11. Norway
  • 15.12. Poland
  • 15.13. Qatar
  • 15.14. Russia
  • 15.15. Saudi Arabia
  • 15.16. South Africa
  • 15.17. Spain
  • 15.18. Sweden
  • 15.19. Switzerland
  • 15.20. Turkey
  • 15.21. United Arab Emirates
  • 15.22. United Kingdom

16. Competitive Landscape

  • 16.1. Market Share Analysis, 2023
  • 16.2. FPNV Positioning Matrix, 2023
  • 16.3. Competitive Scenario Analysis
    • 16.3.1. MPI Corporation and Keysight Technologies Partnership Sets New Standards in Semiconductor Testing Innovation
    • 16.3.2. TSE Develops STO-ML for Logic Chip Probe Cards
    • 16.3.3. Gel-Pak's Strategic Advances by Introducing Probe Cleaning Solutions for Enhanced Semiconductor Testing
    • 16.3.4. Strategic Collaboration between PROTEC MEMS Technology and EV Group for Advancing Probe Card Manufacturing through Maskless Lithography
    • 16.3.5. Teradyne and Technoprobe Announce Strategic Agreements to Drive Semiconductor Test Interface Innovation and Accelerate Growth
    • 16.3.6. Innovative Advancements in Photonics Testing by Launching of Jenoptik's UFO Probe Vertical
    • 16.3.7. Camtek Enhances Its Market Presence with FRT Metrology's Integration
    • 16.3.8. WinWay Inaugurates Kaohsiung Probe Card Factory
    • 16.3.9. WinWay Technology Co. Unveils New USD 104.17 Million Probe Card Facility to Meet Surge in Testing Demand
    • 16.3.10. STAr Technologies Opens Phoenix AZ Probe Card Application Service Center
    • 16.3.11. PTSL Revolutionizes RF Probe Card Industry with Innovative PhazorRF Product Launch
    • 16.3.12. TSI Close to Commercializing Probe Card for DRAM

Companies Mentioned

  • 1. Accuprobe Corporation
  • 2. Chunghwa Precision Test Tech. Co., Ltd.
  • 3. FEINMETALL GmbH
  • 4. FICT LIMITED
  • 5. FormFactor, Inc.
  • 6. GGB Industries, Inc.
  • 7. htt high tech trade GmbH
  • 8. JAPAN ELECTRONIC MATERIALS CORPORATION
  • 9. Jenoptik AG
  • 10. Korea Instrument Co., Ltd.
  • 11. Micronics Japan Co., Ltd.
  • 12. MPI Corporation
  • 13. Nidec SV Probe Pte. Ltd.
  • 14. PPI Systems Inc.
  • 15. Probe Test Solutions Ltd.
  • 16. PROTEC MEMS Technology
  • 17. RIKA DENSHI CO., LTD.
  • 18. Seiken Co., Ltd.
  • 19. Shenzhen Fastprint Circuit Tech Co.,LTD.
  • 20. STAr Technologies Inc.
  • 21. Suzhou Silicon Test System Co., Ltd.
  • 22. Synergy Cad Group
  • 23. Technoprobe S.p.A.
  • 24. TOHO ELECTRONICS INC.
  • 25. TSE Co., Ltd.
  • 26. Wentworth Laboratories, Inc.
  • 27. WinWay Technology Co., Ltd.
  • 28. Yamaichi Electronics Co. Ltd.
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