세계의 반도체 리드프레임 시장 예측(2024-2029년)

The semiconductor lead frame market is projected to grow at a CAGR of 4.99% to reach US$4.462 billion in 2029 from US$3.174 billion in 2022.

A semiconductor lead frame is a small, flat structure made of metal that supports and connects the integrated circuit (IC), discrete devices, and other components in semiconductor devices. The lead frame provides a pathway for electrical signals to pass between the IC and the peripheral environment. They are an essential component in the manufacturing of semiconductor devices as they ensure reliable connectivity and efficient performance. The growth of the semiconductor lead frame market is driven by the increasing demand for electronic devices and the growing trend towards miniaturization of electronic components since the reduction in the size and increasing complexity of electronic devices are creating a high demand for smaller and precise lead frames.

Market Drivers

• Increasing use of advanced packaging technologies is driving the market expansion.

The increasing use of advanced packaging technologies, such as wire bonding, is a significant factor driving the growth of the semiconductor lead frame market. Improving the accuracy of wire bonding technology is expected to increase its demand across the semiconductor industry. For instance, in September 2022, Henniker Plasma Company announced a new treatment based on plasma to improve the efficiency of wire bonding technology. In addition, the rising demand for LEDs driven by automotive lighting and other displays is stimulating the demand for semiconductor lead frames as semiconductor lead frames are often used in LED packaging due to their ability to accommodate the precise placement and routing of the wires to ensure the optimal electrical connectivity and performance. For instance, in September 2022, a German-based light solutions manufacturing company, OSRAM Licht AG, introduced lead-frame-based LED lighting components to its Oslon Black Flat S product range used for automotive lighting. Therefore, the rising demand for wire bonding packaging technologies driven by increasing demand for LEDs is expected to drive the semiconductor lead frame market over the forecast period.

By technology, the stamping is expected to hold a prominent market share.

Stamping technology involves pressing a metal sheet or foil against a die to create the desired pattern or shape. It is a fast and cost-effective process that can produce large volumes of lead frames quickly and efficiently and, therefore, is majorly utilized in producing lead frames for consumer electronics such as smartphones and tablets. The rising demand for smartphones and tablets is anticipated to increase the consumption of stamping technology. Further, the stamping technology sector in the semiconductor lead frame market is driven by the demand for high-performance and miniaturized electronic devices and the high demand for lead frames that are small and lightweight to accommodate the precise requirements of various electronic products.

Asia Pacific region held a substantial share in the semiconductor lead frame market

The expansion of the semiconductor industry in different countries in the Asia Pacific region is expected to drive the semiconductor lead frame market as the increasing demand for semiconductors is followed by a rise in demand for various equipment used to manufacture such semiconductors as lead frames. For instance, the semiconductor industry in Taiwan achieved sales revenues of TWD625.53 billion in the third quarter of 2022, according to data released by the World Semiconductor Trade. In addition, the Japanese semiconductor sector, as reported by the International Trade Administration, witnessed a 19.8% rise between 2020 and 2021, accounting for nearly 9% of the total world semiconductor production. Further, according to a statement released by the Press Information Bureau of the Indian government in 2022, India's semiconductor market will increase from US$15 billion in 2020 to US$63 billion by 2026.

Market Challenge

• Alternative availability and the scarcity of semiconductor components remains significant challenge to the market growth.

The increasing use of alternative packaging technologies, such as fan-out wafer-level packaging (FOWLP) and system-in-package (SiP) solutions, is limiting the semiconductor lead frame market growth since these technologies offer several advantages over traditional lead frame-based packaging, such as higher levels of integration and improved thermal performance. For instance, Samsung Electronics announced an investment of US$75 million to deploy fan-out wafer-level packaging at its production facility in Japan in April 2023. Consequently, several semiconductor and electronics companies are shifting from lead frame-based packaging solutions to these alternatives is expected to slow down the market over the forecast period.

In addition, the ongoing shortage of semiconductor components is impacting the semiconductor lead frame market as it is affecting the overall demand for semiconductor devices and the components used to manufacture them, including lead frames. The shortage is rising the prices and increasing production difficulty for certain manufacturers to secure the necessary materials and resources to produce their products.

Product Offerings:

• Semiconductor lead frame by Toppan Inc. - Toppan Inc., a Japan-based company involved in the printing business, manufactures six different lead frame products, namely Fine Pitch Leadframe, Downset Leadframe, Leadframe with Heat Spreader, Resin Adhesion Improved Package, Caulking Leadframe, and QFN Substrate under its semiconductor package substrates product division to meet the varying needs of different semiconductor processes.
• Semiconductor lead frame by Advanced Assembly Materials International Ltd. - Advanced Assembly Materials International Ltd., a Hong-Kong-based company offering specialty products to various semiconductor packaging requirements, manufactures lead frames of high-density and cost-effective nature of varying sizes up to 100x300mm as per the specifications of its customers.
• Semiconductor lead frame by SDI Group, Inc. - SDI Group Inc., a Taiwanese company generating various specialty scientific products, manufactures three different lead frame types for ICs, discrete/transistors, and other semiconductor chip applications. The discrete lead frames manufactured by the company are extensively adopted in control systems of auto-computers.

Segmentation:

By Technology

• Chemical Etching
• Stamping

By Application

• Integrated Circuit (IC)
• Discrete Devices
• Others

By Geography

• North America
• USA
• Canada
• Mexico
• South America
• Brazil
• Argentina
• Others
• Europe
• Germany
• France
• United Kingdom
• Spain
• Others
• Middle East and Africa
• Saudi Arabia
• UAE
• Israel
• Others
• Asia Pacific
• China
• Japan
• India
• South Korea
• Taiwan
• Others

TABLE OF CONTENTS

1. INTRODUCTION

• 1.1. Market Overview
• 1.2. Market Definition
• 1.3. Scope of the Study
• 1.4. Market Segmentation
• 1.5. Currency
• 1.6. Assumptions
• 1.7. Base, and Forecast Years Timeline
• 1.8. Key Benefits for the stakeholder

2. RESEARCH METHODOLOGY

• 2.1. Research Design
• 2.2. Research Processes

3. EXECUTIVE SUMMARY

• 3.1. Key Findings
• 3.2. Analyst View

4. MARKET DYNAMICS

• 4.1. Market Drivers
• 4.2. Market Restraints
• 4.3. Porter's Five Forces Analysis
  • 4.3.1. Bargaining Power of Suppliers
  • 4.3.2. Bargaining Power of Buyers
  • 4.3.3. Threat of New Entrants
  • 4.3.4. Threat of Substitutes
  • 4.3.5. Competitive Rivalry in the Industry
• 4.4. Industry Value Chain Analysis
• 4.5. Analyst View

5. SEMICONDUCTOR LEAD FRAME MARKET BY TECHNOLOGY

• 5.1. Introduction
• 5.2. Chemical Etching
  • 5.2.1. Market Trends and Opportunities
  • 5.2.2. Growth Prospects
  • 5.2.3. Geographic Lucrativeness Insights
• 5.3. Stamping
  • 5.3.1. Market Trends and Opportunities
  • 5.3.2. Growth Prospects
  • 5.3.3. Geographic Lucrativeness Insights

6. SEMICONDUCTOR LEAD FRAME MARKET BY APPLICATION

• 6.1. Introduction
• 6.2. Integrated Circuits
  • 6.2.1. Market Trends and Opportunities
  • 6.2.2. Growth Prospects
  • 6.2.3. Geographic Lucrativeness Insights
• 6.3. Discrete Devices
  • 6.3.1. Market Trends and Opportunities
  • 6.3.2. Growth Prospects
  • 6.3.3. Geographic Lucrativeness Insights
• 6.4. Others
  • 6.4.1. Market Trends and Opportunities
  • 6.4.2. Growth Prospects
  • 6.4.3. Geographic Lucrativeness Insights

7. SEMICONDUCTOR LEAD FRAME MARKET BY GEOGRAPHY

• 7.1. Introduction
• 7.2. North America
  • 7.2.1. By Technology
  • 7.2.2. By Application
  • 7.2.3. By Country
    • 7.2.3.1. USA
      • 7.2.3.1.1. Market Trends and Opportunities
      • 7.2.3.1.2. Growth Prospects
    • 7.2.3.2. Canada
      • 7.2.3.2.1. Market Trends and Opportunities
      • 7.2.3.2.2. Growth Prospects
    • 7.2.3.3. Mexico
      • 7.2.3.3.1. Market Trends and Opportunities
      • 7.2.3.3.2. Growth Prospects
• 7.3. South America
  • 7.3.1. By Technology
  • 7.3.2. By Application
  • 7.3.3. By Country
    • 7.3.3.1. Brazil
      • 7.3.3.1.1. Market Trends and Opportunities
      • 7.3.3.1.2. Growth Prospects
    • 7.3.3.2. Argentina
      • 7.3.3.2.1. Market Trends and Opportunities
      • 7.3.3.2.2. Growth Prospects
    • 7.3.3.3. Others
      • 7.3.3.3.1. Market Trends and Opportunities
      • 7.3.3.3.2. Growth Prospects
• 7.4. Europe
  • 7.4.1. By Technology
  • 7.4.2. By Application
  • 7.4.3. By Country
    • 7.4.3.1. Germany
      • 7.4.3.1.1. Market Trends and Opportunities
      • 7.4.3.1.2. Growth Prospects
    • 7.4.3.2. France
      • 7.4.3.2.1. Market Trends and Opportunities
      • 7.4.3.2.2. Growth Prospects
    • 7.4.3.3. United KIngdom
      • 7.4.3.3.1. Market Trends and Opportunities
      • 7.4.3.3.2. Growth Prospects
    • 7.4.3.4. Spain
      • 7.4.3.4.1. Market Trends and Opportunities
      • 7.4.3.4.2. Growth Prospects
    • 7.4.3.5. Others
      • 7.4.3.5.1. Market Trends and Opportunities
      • 7.4.3.5.2. Growth Prospects
• 7.5. Middle East and Africa
  • 7.5.1. By Technology
  • 7.5.2. By Application
  • 7.5.3. By Country
    • 7.5.3.1. Saudi Arabia
      • 7.5.3.1.1. Market Trends and Opportunities
      • 7.5.3.1.2. Growth Prospects
    • 7.5.3.2. UAE
      • 7.5.3.2.1. Market Trends and Opportunities
      • 7.5.3.2.2. Growth Prospects
    • 7.5.3.3. Israel
      • 7.5.3.3.1. Market Trends and Opportunities
      • 7.5.3.3.2. Growth Prospects
    • 7.5.3.4. Others
      • 7.5.3.4.1. Market Trends and Opportunities
      • 7.5.3.4.2. Growth Prospects
• 7.6. Asia Pacific
  • 7.6.1. By Technology
  • 7.6.2. By Application
  • 7.6.3. By Country
    • 7.6.3.1. China
      • 7.6.3.1.1. Market Trends and Opportunities
      • 7.6.3.1.2. Growth Prospects
    • 7.6.3.2. Japan
      • 7.6.3.2.1. Market Trends and Opportunities
      • 7.6.3.2.2. Growth Prospects
    • 7.6.3.3. India
      • 7.6.3.3.1. Market Trends and Opportunities
      • 7.6.3.3.2. Growth Prospects
    • 7.6.3.4. South Korea
      • 7.6.3.4.1. Market Trends and Opportunities
      • 7.6.3.4.2. Growth Prospects
    • 7.6.3.5. Taiwan
      • 7.6.3.5.1. Market Trends and Opportunities
      • 7.6.3.5.2. Growth Prospects
    • 7.6.3.6. Others
      • 7.6.3.6.1. Market Trends and Opportunities
      • 7.6.3.6.2. Growth Prospects

8. COMPETITIVE ENVIRONMENT AND ANALYSIS

• 8.1. Major Players and Strategy Analysis
• 8.2. Market Share Analysis
• 8.3. Mergers, Acquisitions, Agreements, and Collaborations
• 8.4. Competitive Dashboard

9. COMPANY PROFILES

• 9.1. Toppan Inc.
• 9.2. Advanced Assembly Materials International Ltd.
• 9.3. SDI Group, Inc.
• 9.4. SHINKO ELECTRIC INDUSTRIES CO., LTD. (Fujitsu)
• 9.5. Mitsui High-tec, Inc.
• 9.6. Precision Micro Ltd.
• 9.7. Amkor Technology
• 9.8. QPL Electronics Factory
• 9.9. Ningbo Kangqiang Electronics Co., LTD.