SOI(Silicon-on-Insulator) 시장 - 예측(2024-2029년)

The silicon-on-insulator (SOI) market is evaluated at US$1,353.442 million for the year 2022 and is projected to grow at a CAGR of 19.80% to reach a market size of US$4,595.902 million by the year 2029.

Integrated circuit (IC) performance and efficiency are improved by the novel semiconductor fabrication process known as silicon-on-insulator (SOI) technology. A thin layer of silicon, known as the active layer, is formed on top of an insulating substrate in silicon oxide (SiO2) or sapphire technology. The insulating layer separates the active silicon layer from the substrate electrically in this "sandwich" structure created via fabrication. Compared to conventional bulk silicon substrates, this separation lowers parasitic capacitance and enhances IC speed, power efficiency, and noise immunity.

Additionally, SOI-based ICs' radiation hardness and noise immunity are improved by the isolation offered by the insulating substrate, which qualifies them for use in hostile environments like those found in automobiles and aircraft.

MARKET TRENDS:

The major factors driving the silicon on insulator market growth include the rising incorporation of 5G technology, majorly in the developing economies of the globe. The growing internet penetration has been a major factor in the budding investments in 5G technology, which is anticipated to further augment the demand for new interface and component technologies, thereby positively impacting the demand for silicon-on-insulators (SOI).

The expanding adoption of SOI wafers across the consumer electronics industry is also projected to be one of the important factors driving the market growth, as the adoption of smart appliances and connected appliances, along with investments in home automation, especially in the developed economies, is further widening the opportunities for the market growth. However, the availability of substitute technology is anticipated to hamper the market's growth in the coming years.

MARKET DRIVERS:

• The rising incorporation of 5G technology is anticipated to drive the market's growth.

The growing internet penetration coupled with rapid advancements in wireless technology is expected to propel the market growth during the forecast period. The growing number of internet users globally is further leading to budding investments by the service providers for the development of faster and more advanced services to meet the requirements of the users by providing better services and gaining an advantage over other providers.

The emergence of 5G technology is further expected to drive the growth of the market during the projected period. Moreover, 5G is expected to operate on much higher frequencies, which is further anticipated to enable the adoption of new interface and component technologies.

• Participation of key market players is predicted to boost the market.

The participation of key market players in the form of R&D investments, product launches, partnerships, and expansion investments further shows the potential for the market to grow in the coming years. For instance, in November 2021, Soitec acquired the advanced technology company, NOVASiC to enhance its SiC wafer technology. Further, in July 2022, STMicroelectronics and GlobalFoundries announced the signing of a memorandum of understanding according to which, the market giants would set up a 300mm manufacturing facility in Crolles, France for the production of FD-SOI.

• The RF-SOI market is projected to grow rapidly

By product, the silicon in the insulator market is segmented as RF-SOI, PD-SOI, FD-SOI, power SOI, and others. The RF-SOI market is expected to grow during the forecast period due to rising demand from the consumer electronics sector and networking applications to improve the capabilities of technologies such as mmWave and 5G, among others.

The growing usage of silicon wafers in PD-SOI (Partially depleted) to support the fabrication and development of microprocessors, due to the rising usage in different electronics and semiconductor applications.

In addition, the FD-SOI segment is expected to hold a significant share over the forecast period owing to the burgeoning demand for advanced and enhanced devices from various end-user industries for catering to the various ultra-low-power applications such as FDSOI MOSFETS and multi-gate MOSFETS to aid in the development of the electronics industry.

Asia-Pacific is estimated to hold a significant share of the market

By geography, the silicon on insulator market is segmented into North America, South America, Europe, the Middle East and Africa, and Asia Pacific. Asia-Pacific is estimated to hold a significant share in the base year and is anticipated to grow at a rapid pace as a result of rising investment in smartphone and telecommunication manufacturing in the region. Simultaneously, the growing focus by the government of the United States to promote domestic manufacturing is anticipated to drive the market's growth in the country, while the European market is projected to grow at a steady pace during the forecast period.

The RF-SOI market in Asia-Pacific is projected to grow at a rapid rate as major smartphone manufacturers start incorporating 5G technology. Toshiba Electronic Device & Storage Corporation launched "TaRF11" in February 2020, its latest generation of RF-SOI that has been specifically optimized for RF switches and low-noise amplifiers in 5G mobile devices.

Key Developments:

• In March 2023, for its 200 mm Bonded Silicon-On-Insulator BSOI and E-SOI(R) wafers, Okmetic, the industry leader in advanced silicon wafer supply for the production of MEMS, sensor, RF, and power devices, has announced the availability of Terrace Free SOI capabilities.
• In September 2022, the new GRF6402 digital step attenuator (DSA) was launched by Guerrilla RF, Inc. The company is prepared to proceed the production with mass-producing its first silicon-on-insulator (SOI) product after sampling and receiving positive validation from its strategic customer base. This is a significant milestone for Guerrilla RF (GRF), as it signifies the expansion of its current portfolio to now include cutting-edge silicon from one of the top semiconductor foundries in the business.

Segmentation:

By Wafer Size

• Less than 200mm
• 200mm
• 300mm

By Technology

• Smart Cut
• Bonding
• Layer Transfer

By Product

• RF-SOI
• PD-SOI
• FD-SOI
• Power-SOI
• Others

By End-User Industry

• Consumer Electronics
• Automotive
• Telecommunication
• Military and Defense
• Others

By Geography

• North America
• USA
• Canada
• Mexico
• South America
• Brazil
• Argentina
• Others
• Europe
• United Kingdom
• Germany
• France
• Spain
• Others
• Middle East and Africa
• Saudi Arabia
• UAE
• Israel
• Others
• Asia Pacific
• China
• Japan
• India
• South Korea
• Taiwan
• Thailand
• Indonesia
• Others

TABLE OF CONTENTS

1. INTRODUCTION

• 1.1. Market Overview
• 1.2. Market Definition
• 1.3. Scope of the Study
• 1.4. Market Segmentation
• 1.5. Currency
• 1.6. Assumptions
• 1.7. Base, and Forecast Years Timeline
• 1.8. Key Benefits for the stakeholder

2. RESEARCH METHODOLOGY

• 2.1. Research Design
• 2.2. Research Processes

3. EXECUTIVE SUMMARY

• 3.1. Key Findings
• 3.2. Analyst View

4. MARKET DYNAMICS

• 4.1. Market Drivers
• 4.2. Market Restraints
• 4.3. Porter's Five Forces Analysis
  • 4.3.1. Bargaining Power of Suppliers
  • 4.3.2. Bargaining Power of Buyers
  • 4.3.3. Threat of New Entrants
  • 4.3.4. Threat of Substitutes
  • 4.3.5. Competitive Rivalry in the Industry
• 4.4. Industry Value Chain Analysis
• 4.5. Analyst View

5. SILICON ON INSULATOR (SOI) MARKET, BY WAFER SIZE

• 5.1. Introduction
• 5.2. Less than 200mm
  • 5.2.1. Market Trends and Opportunities
  • 5.2.2. Growth Prospects
  • 5.2.3. Geographic Lucrativeness
• 5.3. 200 mm
  • 5.3.1. Market Trends and Opportunities
  • 5.3.2. Growth Prospects
  • 5.3.3. Geographic Lucrativeness
• 5.4. 300 mm
  • 5.4.1. Market Trends and Opportunities
  • 5.4.2. Growth Prospects
  • 5.4.3. Geographic Lucrativeness

6. SILICON ON INSULATOR (SOI) MARKET, BY TECHNOLOGY

• 6.1. Introduction
• 6.2. Smart Cut
  • 6.2.1. Market Trends and Opportunities
  • 6.2.2. Growth Prospects
  • 6.2.3. Geographic Lucrativeness
• 6.3. Bonding
  • 6.3.1. Market Trends and Opportunities
  • 6.3.2. Growth Prospects
  • 6.3.3. Geographic Lucrativeness
• 6.4. Layer Transfer
  • 6.4.1. Market Trends and Opportunities
  • 6.4.2. Growth Prospects
  • 6.4.3. Geographic Lucrativeness

7. SILICON ON INSULATOR (SOI) MARKET, BY PRODUCT

• 7.1. Introduction
• 7.2. RF-SOI
  • 7.2.1. Market Trends and Opportunities
  • 7.2.2. Growth Prospects
  • 7.2.3. Geographic Lucrativeness
• 7.3. PD-SOI
  • 7.3.1. Market Trends and Opportunities
  • 7.3.2. Growth Prospects
  • 7.3.3. Geographic Lucrativeness
• 7.4. FD-SOI
  • 7.4.1. Market Trends and Opportunities
  • 7.4.2. Growth Prospects
  • 7.4.3. Geographic Lucrativeness
• 7.5. Power-SOI
  • 7.5.1. Market Trends and Opportunities
  • 7.5.2. Growth Prospects
  • 7.5.3. Geographic Lucrativeness
• 7.6. Others
  • 7.6.1. Market Trends and Opportunities
  • 7.6.2. Growth Prospects
  • 7.6.3. Geographic Lucrativeness

8. SILICON ON INSULATOR (SOI) MARKET, BY END-USER INDUSTRY

• 8.1. Introduction
• 8.2. Consumer Electronics
  • 8.2.1. Market Trends and Opportunities
  • 8.2.2. Growth Prospects
  • 8.2.3. Geographic Lucrativeness
• 8.3. Automotive
  • 8.3.1. Market Trends and Opportunities
  • 8.3.2. Growth Prospects
  • 8.3.3. Geographic Lucrativeness
• 8.4. Telecommunication
  • 8.4.1. Market Trends and Opportunities
  • 8.4.2. Growth Prospects
  • 8.4.3. Geographic Lucrativeness
• 8.5. Military and Defense
  • 8.5.1. Market Trends and Opportunities
  • 8.5.2. Growth Prospects
  • 8.5.3. Geographic Lucrativeness
• 8.6. Others
  • 8.6.1. Market Trends and Opportunities
  • 8.6.2. Growth Prospects
  • 8.6.3. Geographic Lucrativeness

9. SILICON ON INSULATOR (SOI) MARKET, BY GEOGRAPHY

• 9.1. Introduction
• 9.2. North America
  • 9.2.1. By Wafer Size
  • 9.2.2. By Technology
  • 9.2.3. By Product
  • 9.2.4. By End-User Industry
  • 9.2.5. By Country
    • 9.2.5.1. USA
      • 9.2.5.1.1. Market Trends and Opportunities
      • 9.2.5.1.2. Growth Prospects
    • 9.2.5.2. Canada
      • 9.2.5.2.1. Market Trends and Opportunities
      • 9.2.5.2.2. Growth Prospects
    • 9.2.5.3. Mexico
      • 9.2.5.3.1. Market Trends and Opportunities
      • 9.2.5.3.2. Growth Prospects
• 9.3. South America
  • 9.3.1. By Wafer Size
  • 9.3.2. By Technology
  • 9.3.3. By Product
  • 9.3.4. By End-User Industry
  • 9.3.5. By Country
    • 9.3.5.1. Brazil
      • 9.3.5.1.1. Market Trends and Opportunities
      • 9.3.5.1.2. Growth Prospects
    • 9.3.5.2. Argentina
      • 9.3.5.2.1. Market Trends and Opportunities
      • 9.3.5.2.2. Growth Prospects
    • 9.3.5.3. Others
      • 9.3.5.3.1. Market Trends and Opportunities
      • 9.3.5.3.2. Growth Prospects
• 9.4. Europe
  • 9.4.1. By Wafer Size
  • 9.4.2. By Technology
  • 9.4.3. By Product
  • 9.4.4. By End-User Industry
  • 9.4.5. By Country
    • 9.4.5.1. United Kingdom
      • 9.4.5.1.1. Market Trends and Opportunities
      • 9.4.5.1.2. Growth Prospects
    • 9.4.5.2. Germany
      • 9.4.5.2.1. Market Trends and Opportunities
      • 9.4.5.2.2. Growth Prospects
    • 9.4.5.3. France
      • 9.4.5.3.1. Market Trends and Opportunities
      • 9.4.5.3.2. Growth Prospects
    • 9.4.5.4. Spain
      • 9.4.5.4.1. Market Trends and Opportunities
      • 9.4.5.4.2. Growth Prospects
    • 9.4.5.5. Others
      • 9.4.5.5.1. Market Trends and Opportunities
      • 9.4.5.5.2. Growth Prospects
• 9.5. Middle East and Africa
  • 9.5.1. By Wafer Size
  • 9.5.2. By Technology
  • 9.5.3. By Product
  • 9.5.4. By End-User Industry
  • 9.5.5. By Country
    • 9.5.5.1. Saudi Arabia
      • 9.5.5.1.1. Market Trends and Opportunities
      • 9.5.5.1.2. Growth Prospects
    • 9.5.5.2. UAE
      • 9.5.5.2.1. Market Trends and Opportunities
      • 9.5.5.2.2. Growth Prospects
    • 9.5.5.3. Israel
      • 9.5.5.3.1. Market Trends and Opportunities
      • 9.5.5.3.2. Growth Prospects
    • 9.5.5.4. Others
      • 9.5.5.4.1. Market Trends and Opportunities
      • 9.5.5.4.2. Growth Prospects
• 9.6. Asia Pacific
  • 9.6.1. By Wafer Size
  • 9.6.2. By Technology
  • 9.6.3. By Product
  • 9.6.4. By End-User Industry
  • 9.6.5. By Country
    • 9.6.5.1. China
      • 9.6.5.1.1. Market Trends and Opportunities
      • 9.6.5.1.2. Growth Prospects
    • 9.6.5.2. Japan
      • 9.6.5.2.1. Market Trends and Opportunities
      • 9.6.5.2.2. Growth Prospects
    • 9.6.5.3. India
      • 9.6.5.3.1. Market Trends and Opportunities
      • 9.6.5.3.2. Growth Prospects
    • 9.6.5.4. South Korea
      • 9.6.5.4.1. Market Trends and Opportunities
      • 9.6.5.4.2. Growth Prospects
    • 9.6.5.5. Taiwan
      • 9.6.5.5.1. Market Trends and Opportunities
      • 9.6.5.5.2. Growth Prospects
    • 9.6.5.6. Thailand
      • 9.6.5.6.1. Market Trends and Opportunities
      • 9.6.5.6.2. Growth Prospects
    • 9.6.5.7. Indonesia
      • 9.6.5.7.1. Market Trends and Opportunities
      • 9.6.5.7.2. Growth Prospects
    • 9.6.5.8. Others
      • 9.6.5.8.1. Market Trends and Opportunities
      • 9.6.5.8.2. Growth Prospects

10. COMPETITIVE ENVIRONMENT AND ANALYSIS

• 10.1. Major Players and Strategy Analysis
• 10.2. Market Share Analysis
• 10.3. Mergers, Acquisitions, Agreements, and Collaborations
• 10.4. Competitive Dashboard

11. COMPANY PROFILES

• 11.1. SOITEC
• 11.2. Sumco Corporation
• 11.3. GlobalFoundries
• 11.4. STMicroelectronics
• 11.5. NXP Semiconductor
• 11.6. Shin- Etsu Chemical Co., Ltd.
• 11.7. Qorvo, Inc.
• 11.8. Shanghai Simgui Technology Co., Ltd.