시장보고서
상품코드
1875784

서멀 인터페이스 재료(TIM) : 세계 시장 점유율과 순위, 총판매량 및 수요 예측(2025-2031년)

Thermal Interface Material (TIM) - Global Market Share and Ranking, Overall Sales and Demand Forecast 2025-2031

발행일: | 리서치사: QYResearch | 페이지 정보: 영문 | 배송안내 : 2-3일 (영업일 기준)

    
    
    




■ 보고서에 따라 최신 정보로 업데이트하여 보내드립니다. 배송일정은 문의해 주시기 바랍니다.

세계의 열계면재료(TIM) 시장 규모는 2024년에 20억 1,200만 달러로 추정되며, 2025-2031년의 예측 기간 중 CAGR 10.7%로 성장하며, 2031년까지 41억 4,700만 달러로 확대할 것으로 예측됩니다.

열 인터페이스 재료(TIM)는 두 접합면 사이의 열전도율을 높이기 위해 사용되는 특수한 물질로, 효율적인 방열이 중요한 전자부품 등에 일반적으로 사용됩니다. 이러한 재료는 표면의 거칠기로 인해 발생하는 미세한 공기 간극을 메워 단열재 역할을 하는 것을 방지합니다. TIM은 열 갭 패드, 열 그리스, 상변화물질, 열전도성 접착제, 젤 등 다양한 형태로 제공됩니다. 이상적인 TIM은 접착력, 점도, 열팽창계수(CTE), 본딩 라인 두께, 재작업성, 장기 안정성 등의 특성이 균형을 이루어야 합니다. 그러나 가장 중요한 성능 지표는 열전도율과 열 접촉 저항이며, 이는 부품과 방열판 사이의 열 전달 효율에 직접적인 영향을 미칩니다.

진화하는 소재와 고성능화 요구

전자기기가 고밀도 집적회로(IC) 설계와 고출력 밀도를 계속 채택함에 따라 보다 효율적이고 신뢰할 수 있으며 열전도율이 높은 TIM에 대한 수요가 빠르게 증가하고 있습니다. 최근 시장의 관심은 우수한 열전도율과 전기전도도를 보이는 첨단 탄소계 재료로 옮겨가고 있습니다. 여기에는 흑연, 탄소나노튜브(CNTs), 피치 유래 탄소섬유, 다양한 형태의 그래핀 등이 포함됩니다. 이러한 재료는 고분자 매트릭스에 내장된 전도성 필러 또는 단독 열 계면층으로 연구되고 있습니다. 특히 수직배향 탄소나노튜브(VACNT) 어레이는 그 독특한 구조와 열적 특성으로 인해 널리 연구되고 있습니다. 그러나 업계는 여전히 실제 응용 분야에서 확장 가능한 성장, 균일한 전사, 일관된 접촉 저항의 실현과 같은 기술적 과제에 직면해 있습니다. 이러한 장벽에도 불구하고 탄소 기반 TIM은 LED 패키징, 기지국 전자기기, 고성능 컴퓨팅, 군용 열 관리 시스템 등 하이엔드 분야에서 큰 잠재력을 보여주고 있습니다.

시장 시장 성장 촉진요인 및 전망

열 계면 재료(TIM) 시장은 AI 서버, 엣지 컴퓨팅 인프라, 첨단 자율주행 시스템의 성장에 힘입어 강력한 모멘텀을 보이고 있습니다. 이러한 응용 분야에서는 높은 열전도율과 장기적인 신뢰성을 겸비한 소재가 요구됩니다. 그 결과, 차세대 TIM, 특히 그래핀, CNT 등 탄소나노소재를 활용한 제품이 주목받고 있습니다. 그래핀 기반 TIM은 페이스트, 필름, 수직배향 시트 등 어떤 형태로든 우수한 면내 전도성과 낮은 열저항으로 특히 주목받고 있습니다. 규제와 환경에 대한 고려도 재료 선택에 영향을 미치고 있으며, 기존의 실리콘 기반 화합물에서 보다 지속가능하고 고효율적인 솔루션으로 전환하고 있습니다. 향후 전망은 성능에 대한 요구 증가와 나노탄소 기술의 지속적인 혁신이 결합되어 TIM 산업이 크게 성장할 것으로 예측됩니다. 특히 자동차용 일렉트로닉스 및 차세대 데이터센터의 용도 요구사항이 엄격해짐에 따라 첨단 TIM의 개발 및 상용화는 재료과학 및 열공학의 중요한 초점 영역이 될 것입니다.

이 보고서는 세계의 열 계면 재료(TIM) 시장에 대해 총매출액, 주요 기업의 시장 점유율 및 순위에 초점을 맞추고 지역/국가, 유형 및 용도별 분석을 종합적으로 제시하는 것을 목적으로 합니다.

열 계면 재료(TIM) 시장 규모 추정 및 예측은 매출액 기준으로 제시되며, 2024년을 기준 연도로 하여 2020-2031년의 과거 데이터와 예측 데이터를 포함합니다. 정량적, 정성적 분석을 통해 독자들이 비즈니스/성장 전략 수립, 시장 경쟁 평가, 현재 시장에서의 포지셔닝 분석, 열 인터페이스 재료(TIM)에 대한 정보에 입각한 비즈니스 의사결정을 내릴 수 있도록 도와드립니다.

시장 세분화

기업별

  • DuPont
  • Dow
  • Shin-Etsu Chemical
  • Parker Hannifin
  • Fujipoly
  • Henkel
  • Wacker
  • 3M
  • Nano TIM
  • Zhongshi Technology
  • Shenzhen FRD Science and Technology
  • Shenzhen HFC
  • Suzhou Tianmai Thermal Technology
  • Bornsun
  • Shenzhen Aochuan Technology
  • Jointas Chemical

유형별 부문

  • 서멀 패드
  • 서멀 페이스트
  • 서멀 접착제
  • 서멀 갭 필러
  • 기타

용도별 부문

  • LED
  • 가전제품
  • 통신
  • 전기자동차
  • 자동차용 전자기기
  • 기타

지역별

  • 북미
    • 미국
    • 캐나다
  • 아시아태평양
    • 중국
    • 일본
    • 한국
    • 동남아시아
    • 인도
    • 호주
    • 기타 아시아태평양
  • 유럽
    • 독일
    • 프랑스
    • 영국
    • 이탈리아
    • 네덜란드
    • 북유럽 국가
    • 기타 유럽
  • 라틴아메리카
    • 멕시코
    • 브라질
    • 기타 라틴아메리카
  • 중동 및 아프리카
    • 튀르키예
    • 사우디아라비아
    • 아랍에미리트
    • 기타 중동 및 아프리카
KSA 25.12.04

자주 묻는 질문

  • 열 계면 재료(TIM) 시장 규모는 어떻게 예측되나요?
  • 열 인터페이스 재료(TIM)의 주요 용도는 무엇인가요?
  • 열 계면 재료(TIM) 시장의 성장 촉진 요인은 무엇인가요?
  • 열 인터페이스 재료(TIM)의 이상적인 특성은 무엇인가요?
  • 열 계면 재료(TIM) 시장에서 주요 기업은 어디인가요?

The global market for Thermal Interface Material (TIM) was estimated to be worth US$ 2012 million in 2024 and is forecast to a readjusted size of US$ 4147 million by 2031 with a CAGR of 10.7% during the forecast period 2025-2031.

Thermal Interface Materials (TIMs) are specialized substances used to enhance thermal conductivity between two mating surfaces, typically in electronic components where efficient heat dissipation is critical. These materials fill microscopic air gaps caused by surface roughness, which would otherwise act as thermal insulators. TIMs come in a wide range of forms, including thermal gap pads, thermal greases, phase change materials, thermally conductive adhesives, and gels. The ideal TIM must exhibit a balanced combination of properties such as adhesion, viscosity, coefficient of thermal expansion (CTE), bond line thickness, reworkability, and long-term stability. However, the most crucial performance metrics are thermal conductivity and thermal contact resistance-both of which directly influence the efficiency of heat transfer between components and heatsinks.

Evolving Materials and High-Performance Demands

As electronic devices continue to adopt denser integrated circuit (IC) designs and higher power densities, the demand for more efficient, reliable, and thermally conductive TIMs is growing rapidly. In recent years, market attention has shifted toward advanced carbon-based materials, which exhibit exceptional thermal and electrical conductivity. These include graphite, carbon nanotubes (CNTs), carbon fibers derived from pitch, and various forms of graphene. Such materials are being explored either as conductive fillers embedded in polymer matrices or as standalone thermal interface layers. Particularly, vertically aligned carbon nanotube (VACNT) arrays have been extensively researched for their unique structure and thermal properties. However, the industry still faces technical challenges in achieving scalable growth, uniform transfer, and consistent contact resistance in real-world applications. Despite these hurdles, carbon-based TIMs show immense promise across high-end sectors such as LED packaging, base station electronics, high-performance computing, and military-grade thermal management systems.

Market Drivers and Outlook

The TIM market is experiencing strong momentum, driven by the growth of AI servers, edge computing infrastructure, and advanced autonomous driving systems. These applications demand materials with both high thermal conductivity and long-term reliability. As a result, next-generation TIMs, particularly those leveraging carbon nanomaterials such as graphene and CNTs, are gaining traction. Graphene-based TIMs, whether in paste, film, or vertically aligned sheet form, are especially noted for their superior in-plane conductivity and low thermal resistance. Regulatory and environmental considerations are also influencing material selection, prompting a shift away from traditional silicone-based compounds toward more sustainable and high-efficiency solutions. Looking ahead, the combination of increased performance demands and ongoing innovation in nanocarbon technologies positions the TIM industry for significant growth. As application requirements become more stringent, particularly in automotive electronics and next-gen data centers, the development and commercialization of advanced TIMs will remain a key focus area for material science and thermal engineering.

This report aims to provide a comprehensive presentation of the global market for Thermal Interface Material (TIM), focusing on the total sales revenue, key companies market share and ranking, together with an analysis of Thermal Interface Material (TIM) by region & country, by Type, and by Application.

The Thermal Interface Material (TIM) market size, estimations, and forecasts are provided in terms of sales revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. With both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Thermal Interface Material (TIM).

Market Segmentation

By Company

  • DuPont
  • Dow
  • Shin-Etsu Chemical
  • Parker Hannifin
  • Fujipoly
  • Henkel
  • Wacker
  • 3M
  • Nano TIM
  • Zhongshi Technology
  • Shenzhen FRD Science and Technology
  • Shenzhen HFC
  • Suzhou Tianmai Thermal Technology
  • Bornsun
  • Shenzhen Aochuan Technology
  • Jointas Chemical

Segment by Type

  • Thermal Pads
  • Thermal Paste
  • Thermal Adhesives
  • Thermal Gap Fillers
  • Other

Segment by Application

  • LED
  • Consumer Electronics
  • Communication
  • EV
  • Automotive Electronics
  • Other

By Region

  • North America
    • United States
    • Canada
  • Asia-Pacific
    • China
    • Japan
    • South Korea
    • Southeast Asia
    • India
    • Australia
    • Rest of Asia-Pacific
  • Europe
    • Germany
    • France
    • U.K.
    • Italy
    • Netherlands
    • Nordic Countries
    • Rest of Europe
  • Latin America
    • Mexico
    • Brazil
    • Rest of Latin America
  • Middle East & Africa
    • Turkey
    • Saudi Arabia
    • UAE
    • Rest of MEA

Chapter Outline

Chapter 1: Introduces the report scope of the report, global total market size. This chapter also provides the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.

Chapter 2: Detailed analysis of Thermal Interface Material (TIM) company competitive landscape, revenue market share, latest development plan, merger, and acquisition information, etc.

Chapter 3: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.

Chapter 4: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.

Chapter 5: Revenue of Thermal Interface Material (TIM) in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the market development, future development prospects, market space, and market size of each country in the world.

Chapter 6: Revenue of Thermal Interface Material (TIM) in country level. It provides sigmate data by Type, and by Application for each country/region.

Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product revenue, gross margin, product introduction, recent development, etc.

Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.

Chapter 9: Conclusion.

Table of Contents

1 Market Overview

  • 1.1 Thermal Interface Material (TIM) Product Introduction
  • 1.2 Global Thermal Interface Material (TIM) Market Size Forecast (2020-2031)
  • 1.3 Thermal Interface Material (TIM) Market Trends & Drivers
    • 1.3.1 Thermal Interface Material (TIM) Industry Trends
    • 1.3.2 Thermal Interface Material (TIM) Market Drivers & Opportunity
    • 1.3.3 Thermal Interface Material (TIM) Market Challenges
    • 1.3.4 Thermal Interface Material (TIM) Market Restraints
  • 1.4 Assumptions and Limitations
  • 1.5 Study Objectives
  • 1.6 Years Considered

2 Competitive Analysis by Company

  • 2.1 Global Thermal Interface Material (TIM) Players Revenue Ranking (2024)
  • 2.2 Global Thermal Interface Material (TIM) Revenue by Company (2020-2025)
  • 2.3 Key Companies Thermal Interface Material (TIM) Manufacturing Base Distribution and Headquarters
  • 2.4 Key Companies Thermal Interface Material (TIM) Product Offered
  • 2.5 Key Companies Time to Begin Mass Production of Thermal Interface Material (TIM)
  • 2.6 Thermal Interface Material (TIM) Market Competitive Analysis
    • 2.6.1 Thermal Interface Material (TIM) Market Concentration Rate (2020-2025)
    • 2.6.2 Global 5 and 10 Largest Companies by Thermal Interface Material (TIM) Revenue in 2024
    • 2.6.3 Global Top Companies by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in Thermal Interface Material (TIM) as of 2024)
  • 2.7 Mergers & Acquisitions, Expansion

3 Segmentation by Type

  • 3.1 Introduction by Type
    • 3.1.1 Thermal Pads
    • 3.1.2 Thermal Paste
    • 3.1.3 Thermal Adhesives
    • 3.1.4 Thermal Gap Fillers
    • 3.1.5 Other
  • 3.2 Global Thermal Interface Material (TIM) Sales Value by Type
    • 3.2.1 Global Thermal Interface Material (TIM) Sales Value by Type (2020 VS 2024 VS 2031)
    • 3.2.2 Global Thermal Interface Material (TIM) Sales Value, by Type (2020-2031)
    • 3.2.3 Global Thermal Interface Material (TIM) Sales Value, by Type (%) (2020-2031)

4 Segmentation by Application

  • 4.1 Introduction by Application
    • 4.1.1 LED
    • 4.1.2 Consumer Electronics
    • 4.1.3 Communication
    • 4.1.4 EV
    • 4.1.5 Automotive Electronics
    • 4.1.6 Other
  • 4.2 Global Thermal Interface Material (TIM) Sales Value by Application
    • 4.2.1 Global Thermal Interface Material (TIM) Sales Value by Application (2020 VS 2024 VS 2031)
    • 4.2.2 Global Thermal Interface Material (TIM) Sales Value, by Application (2020-2031)
    • 4.2.3 Global Thermal Interface Material (TIM) Sales Value, by Application (%) (2020-2031)

5 Segmentation by Region

  • 5.1 Global Thermal Interface Material (TIM) Sales Value by Region
    • 5.1.1 Global Thermal Interface Material (TIM) Sales Value by Region: 2020 VS 2024 VS 2031
    • 5.1.2 Global Thermal Interface Material (TIM) Sales Value by Region (2020-2025)
    • 5.1.3 Global Thermal Interface Material (TIM) Sales Value by Region (2026-2031)
    • 5.1.4 Global Thermal Interface Material (TIM) Sales Value by Region (%), (2020-2031)
  • 5.2 North America
    • 5.2.1 North America Thermal Interface Material (TIM) Sales Value, 2020-2031
    • 5.2.2 North America Thermal Interface Material (TIM) Sales Value by Country (%), 2024 VS 2031
  • 5.3 Europe
    • 5.3.1 Europe Thermal Interface Material (TIM) Sales Value, 2020-2031
    • 5.3.2 Europe Thermal Interface Material (TIM) Sales Value by Country (%), 2024 VS 2031
  • 5.4 Asia Pacific
    • 5.4.1 Asia Pacific Thermal Interface Material (TIM) Sales Value, 2020-2031
    • 5.4.2 Asia Pacific Thermal Interface Material (TIM) Sales Value by Region (%), 2024 VS 2031
  • 5.5 South America
    • 5.5.1 South America Thermal Interface Material (TIM) Sales Value, 2020-2031
    • 5.5.2 South America Thermal Interface Material (TIM) Sales Value by Country (%), 2024 VS 2031
  • 5.6 Middle East & Africa
    • 5.6.1 Middle East & Africa Thermal Interface Material (TIM) Sales Value, 2020-2031
    • 5.6.2 Middle East & Africa Thermal Interface Material (TIM) Sales Value by Country (%), 2024 VS 2031

6 Segmentation by Key Countries/Regions

  • 6.1 Key Countries/Regions Thermal Interface Material (TIM) Sales Value Growth Trends, 2020 VS 2024 VS 2031
  • 6.2 Key Countries/Regions Thermal Interface Material (TIM) Sales Value, 2020-2031
  • 6.3 United States
    • 6.3.1 United States Thermal Interface Material (TIM) Sales Value, 2020-2031
    • 6.3.2 United States Thermal Interface Material (TIM) Sales Value by Type (%), 2024 VS 2031
    • 6.3.3 United States Thermal Interface Material (TIM) Sales Value by Application, 2024 VS 2031
  • 6.4 Europe
    • 6.4.1 Europe Thermal Interface Material (TIM) Sales Value, 2020-2031
    • 6.4.2 Europe Thermal Interface Material (TIM) Sales Value by Type (%), 2024 VS 2031
    • 6.4.3 Europe Thermal Interface Material (TIM) Sales Value by Application, 2024 VS 2031
  • 6.5 China
    • 6.5.1 China Thermal Interface Material (TIM) Sales Value, 2020-2031
    • 6.5.2 China Thermal Interface Material (TIM) Sales Value by Type (%), 2024 VS 2031
    • 6.5.3 China Thermal Interface Material (TIM) Sales Value by Application, 2024 VS 2031
  • 6.6 Japan
    • 6.6.1 Japan Thermal Interface Material (TIM) Sales Value, 2020-2031
    • 6.6.2 Japan Thermal Interface Material (TIM) Sales Value by Type (%), 2024 VS 2031
    • 6.6.3 Japan Thermal Interface Material (TIM) Sales Value by Application, 2024 VS 2031
  • 6.7 South Korea
    • 6.7.1 South Korea Thermal Interface Material (TIM) Sales Value, 2020-2031
    • 6.7.2 South Korea Thermal Interface Material (TIM) Sales Value by Type (%), 2024 VS 2031
    • 6.7.3 South Korea Thermal Interface Material (TIM) Sales Value by Application, 2024 VS 2031
  • 6.8 Southeast Asia
    • 6.8.1 Southeast Asia Thermal Interface Material (TIM) Sales Value, 2020-2031
    • 6.8.2 Southeast Asia Thermal Interface Material (TIM) Sales Value by Type (%), 2024 VS 2031
    • 6.8.3 Southeast Asia Thermal Interface Material (TIM) Sales Value by Application, 2024 VS 2031
  • 6.9 India
    • 6.9.1 India Thermal Interface Material (TIM) Sales Value, 2020-2031
    • 6.9.2 India Thermal Interface Material (TIM) Sales Value by Type (%), 2024 VS 2031
    • 6.9.3 India Thermal Interface Material (TIM) Sales Value by Application, 2024 VS 2031

7 Company Profiles

  • 7.1 DuPont
    • 7.1.1 DuPont Profile
    • 7.1.2 DuPont Main Business
    • 7.1.3 DuPont Thermal Interface Material (TIM) Products, Services and Solutions
    • 7.1.4 DuPont Thermal Interface Material (TIM) Revenue (US$ Million) & (2020-2025)
    • 7.1.5 DuPont Recent Developments
  • 7.2 Dow
    • 7.2.1 Dow Profile
    • 7.2.2 Dow Main Business
    • 7.2.3 Dow Thermal Interface Material (TIM) Products, Services and Solutions
    • 7.2.4 Dow Thermal Interface Material (TIM) Revenue (US$ Million) & (2020-2025)
    • 7.2.5 Dow Recent Developments
  • 7.3 Shin-Etsu Chemical
    • 7.3.1 Shin-Etsu Chemical Profile
    • 7.3.2 Shin-Etsu Chemical Main Business
    • 7.3.3 Shin-Etsu Chemical Thermal Interface Material (TIM) Products, Services and Solutions
    • 7.3.4 Shin-Etsu Chemical Thermal Interface Material (TIM) Revenue (US$ Million) & (2020-2025)
    • 7.3.5 Shin-Etsu Chemical Recent Developments
  • 7.4 Parker Hannifin
    • 7.4.1 Parker Hannifin Profile
    • 7.4.2 Parker Hannifin Main Business
    • 7.4.3 Parker Hannifin Thermal Interface Material (TIM) Products, Services and Solutions
    • 7.4.4 Parker Hannifin Thermal Interface Material (TIM) Revenue (US$ Million) & (2020-2025)
    • 7.4.5 Parker Hannifin Recent Developments
  • 7.5 Fujipoly
    • 7.5.1 Fujipoly Profile
    • 7.5.2 Fujipoly Main Business
    • 7.5.3 Fujipoly Thermal Interface Material (TIM) Products, Services and Solutions
    • 7.5.4 Fujipoly Thermal Interface Material (TIM) Revenue (US$ Million) & (2020-2025)
    • 7.5.5 Fujipoly Recent Developments
  • 7.6 Henkel
    • 7.6.1 Henkel Profile
    • 7.6.2 Henkel Main Business
    • 7.6.3 Henkel Thermal Interface Material (TIM) Products, Services and Solutions
    • 7.6.4 Henkel Thermal Interface Material (TIM) Revenue (US$ Million) & (2020-2025)
    • 7.6.5 Henkel Recent Developments
  • 7.7 Wacker
    • 7.7.1 Wacker Profile
    • 7.7.2 Wacker Main Business
    • 7.7.3 Wacker Thermal Interface Material (TIM) Products, Services and Solutions
    • 7.7.4 Wacker Thermal Interface Material (TIM) Revenue (US$ Million) & (2020-2025)
    • 7.7.5 Wacker Recent Developments
  • 7.8 3M
    • 7.8.1 3M Profile
    • 7.8.2 3M Main Business
    • 7.8.3 3M Thermal Interface Material (TIM) Products, Services and Solutions
    • 7.8.4 3M Thermal Interface Material (TIM) Revenue (US$ Million) & (2020-2025)
    • 7.8.5 3M Recent Developments
  • 7.9 Nano TIM
    • 7.9.1 Nano TIM Profile
    • 7.9.2 Nano TIM Main Business
    • 7.9.3 Nano TIM Thermal Interface Material (TIM) Products, Services and Solutions
    • 7.9.4 Nano TIM Thermal Interface Material (TIM) Revenue (US$ Million) & (2020-2025)
    • 7.9.5 Nano TIM Recent Developments
  • 7.10 Zhongshi Technology
    • 7.10.1 Zhongshi Technology Profile
    • 7.10.2 Zhongshi Technology Main Business
    • 7.10.3 Zhongshi Technology Thermal Interface Material (TIM) Products, Services and Solutions
    • 7.10.4 Zhongshi Technology Thermal Interface Material (TIM) Revenue (US$ Million) & (2020-2025)
    • 7.10.5 Zhongshi Technology Recent Developments
  • 7.11 Shenzhen FRD Science and Technology
    • 7.11.1 Shenzhen FRD Science and Technology Profile
    • 7.11.2 Shenzhen FRD Science and Technology Main Business
    • 7.11.3 Shenzhen FRD Science and Technology Thermal Interface Material (TIM) Products, Services and Solutions
    • 7.11.4 Shenzhen FRD Science and Technology Thermal Interface Material (TIM) Revenue (US$ Million) & (2020-2025)
    • 7.11.5 Shenzhen FRD Science and Technology Recent Developments
  • 7.12 Shenzhen HFC
    • 7.12.1 Shenzhen HFC Profile
    • 7.12.2 Shenzhen HFC Main Business
    • 7.12.3 Shenzhen HFC Thermal Interface Material (TIM) Products, Services and Solutions
    • 7.12.4 Shenzhen HFC Thermal Interface Material (TIM) Revenue (US$ Million) & (2020-2025)
    • 7.12.5 Shenzhen HFC Recent Developments
  • 7.13 Suzhou Tianmai Thermal Technology
    • 7.13.1 Suzhou Tianmai Thermal Technology Profile
    • 7.13.2 Suzhou Tianmai Thermal Technology Main Business
    • 7.13.3 Suzhou Tianmai Thermal Technology Thermal Interface Material (TIM) Products, Services and Solutions
    • 7.13.4 Suzhou Tianmai Thermal Technology Thermal Interface Material (TIM) Revenue (US$ Million) & (2020-2025)
    • 7.13.5 Suzhou Tianmai Thermal Technology Recent Developments
  • 7.14 Bornsun
    • 7.14.1 Bornsun Profile
    • 7.14.2 Bornsun Main Business
    • 7.14.3 Bornsun Thermal Interface Material (TIM) Products, Services and Solutions
    • 7.14.4 Bornsun Thermal Interface Material (TIM) Revenue (US$ Million) & (2020-2025)
    • 7.14.5 Bornsun Recent Developments
  • 7.15 Shenzhen Aochuan Technology
    • 7.15.1 Shenzhen Aochuan Technology Profile
    • 7.15.2 Shenzhen Aochuan Technology Main Business
    • 7.15.3 Shenzhen Aochuan Technology Thermal Interface Material (TIM) Products, Services and Solutions
    • 7.15.4 Shenzhen Aochuan Technology Thermal Interface Material (TIM) Revenue (US$ Million) & (2020-2025)
    • 7.15.5 Shenzhen Aochuan Technology Recent Developments
  • 7.16 Jointas Chemical
    • 7.16.1 Jointas Chemical Profile
    • 7.16.2 Jointas Chemical Main Business
    • 7.16.3 Jointas Chemical Thermal Interface Material (TIM) Products, Services and Solutions
    • 7.16.4 Jointas Chemical Thermal Interface Material (TIM) Revenue (US$ Million) & (2020-2025)
    • 7.16.5 Jointas Chemical Recent Developments

8 Industry Chain Analysis

  • 8.1 Thermal Interface Material (TIM) Industrial Chain
  • 8.2 Thermal Interface Material (TIM) Upstream Analysis
    • 8.2.1 Key Raw Materials
    • 8.2.2 Raw Materials Key Suppliers
    • 8.2.3 Manufacturing Cost Structure
  • 8.3 Midstream Analysis
  • 8.4 Downstream Analysis (Customers Analysis)
  • 8.5 Sales Model and Sales Channels
    • 8.5.1 Thermal Interface Material (TIM) Sales Model
    • 8.5.2 Sales Channel
    • 8.5.3 Thermal Interface Material (TIM) Distributors

9 Research Findings and Conclusion

10 Appendix

  • 10.1 Research Methodology
    • 10.1.1 Methodology/Research Approach
      • 10.1.1.1 Research Programs/Design
      • 10.1.1.2 Market Size Estimation
      • 10.1.1.3 Market Breakdown and Data Triangulation
    • 10.1.2 Data Source
      • 10.1.2.1 Secondary Sources
      • 10.1.2.2 Primary Sources
  • 10.2 Author Details
  • 10.3 Disclaimer
샘플 요청 목록
0 건의 상품을 선택 중
목록 보기
전체삭제