극자외선(EUV) 리소그래피 시장 : 구성요소별, 시스템 유형별, 최종사용자별, 용도별, 지역별 - 세계 예측(-2032년)

The global extreme ultraviolet (EUV) lithography market is expected to grow from USD 15.84 billion in 2026 to USD 30.36 billion by 2032, at a CAGR of 11.4%. The rapid advancements in consumer electronics, including smartphones, wearables, tablets, and gaming devices, are driving sustained demand for advanced semiconductor chips that offer higher performance, compact designs, and improved energy efficiency. To support faster processing, enhanced graphics, and longer battery life, manufacturers increasingly rely on EUV lithography to enable smaller transistors and higher transistor density.

The shift toward next-generation technologies, including foldable displays, augmented reality, and virtual reality, is further increasing chip complexity and reinforcing the need for high-precision EUV-based manufacturing. As performance and miniaturization requirements continue to rise across consumer electronics and autonomous applications, EUV lithography is becoming a critical enabler for producing reliable, high-performance integrated circuits at advanced nodes.

"Light sources to exhibit highest CAGR from 2026 to 2032."

Light sources are expected to witness the highest CAGR in the extreme ultraviolet (EUV) lithography market due to their direct impact on system productivity, throughput, and cost efficiency at advanced semiconductor nodes. Continuous demand for higher wafer throughput is driving the need for increased EUV source power, improved stability, and longer uptime, prompting frequent upgrades and replacements of existing light source modules. In addition, the transition toward more advanced process nodes and the gradual shift to next-generation EUV platforms are increasing performance requirements for light sources, accelerating R&D investments and adoption. The high technical complexity, limited supplier base, and strong focus on productivity-driven enhancements further support faster revenue growth for this component compared to other EUV system elements.

"Logic chips held largest share of extreme ultraviolet (EUV) lithography market in 2025."

Logic chips held the largest market share in the application segment of the extreme ultraviolet (EUV) lithography market in 2025, driven by early and widespread adoption of EUV at advanced process nodes. Leading-edge logic devices at 7 nm, 5 nm, and 3 nm require extremely fine patterning, tight overlay control, and high transistor density, all of which are more efficiently achieved using EUV compared with multi-patterning DUV techniques. The rapid growth of applications such as artificial intelligence, high-performance computing, data centers, and advanced automotive electronics is driving strong demand for high-performance logic chips, accelerating EUV tool utilization and capacity expansion. In contrast, memory manufacturers have adopted EUV more selectively, focusing on specific layers, which further reinforces the dominance of logic chips in overall extreme ultraviolet (EUV) lithography demand.

"Asia Pacific to be fastest-growing regional market for EUV lithography from 2026 to 2032."

Asia Pacific is expected to register the highest CAGR during the forecast period, driven by its strong concentration of leading semiconductor foundries and integrated device manufacturers (IDMs), as well as continuous investments in advanced-node manufacturing. The region's dominance is supported by large-scale capacity expansions at 5 nm, 3 nm, and sub-3 nm nodes, rising demand for logic chips used in AI, high-performance computing, and advanced consumer electronics, and a mature semiconductor supply chain that enables rapid EUV adoption. In addition, sustained capital expenditure, aggressive technology roadmaps, and government-backed initiatives to strengthen domestic semiconductor capabilities are accelerating EUV tool installations. These factors collectively position Asia Pacific as the primary demand center and growth engine for the global extreme ultraviolet (EUV) lithography market.

Breakdown of Primaries

Various executives from key organizations operating in the extreme ultraviolet (EUV) lithography market were interviewed in-depth, including CEOs, marketing directors, and innovation and technology directors.

• By Company Type: Tier 1-30%, Tier 2-50%, and Tier 3-20%
• By Designation: C-level Executives-25%, Directors-35%, and Others-40%
• By Region: Asia Pacific-40%, Americas-25%, and EMEA- 35%

The extreme ultraviolet (EUV) lithography market is dominated by ASML (Netherlands) as the sole manufacturer of EUV lithography products, as well as by component manufacturers such as TRUMPF (Germany), Ushio Inc. (Japan), Energetiq (US), Zeiss Group (Germany), NTT Advanced Technology Corporation (Japan), Rigaku Holdings Corporation (Japan), Edmund Optics Inc. (US), AGC Inc. (Japan), Tekscend Photomask (Japan), Lasertec Corporation (Japan), HOYA Corporation (Japan), NuFlare Technology, Inc. (Japan), KLA Corporation (US), ADVANTEST CORPORATION (Japan), SUSS MicroTec SE (Germany), Applied Materials, Inc. (US), Park Systems (South Korea), Imagine Optic (France), MKS Inc. (US), Taiwan Semiconductor Manufacturing Company Limited (TSMC) (Taiwan), Intel Corporation (US), Samsung (South Korea), SK HYNIX INC. (South Korea), and Micron Technology (US). The study includes an in-depth competitive analysis of these key players in the extreme ultraviolet (EUV) lithography market, with their company profiles, recent developments, and key market strategies.

Study Coverage

The report segments the extreme ultraviolet (EUV) lithography market and forecasts its components, system types, end users, applications, and regions. The report also discusses the drivers, restraints, opportunities, and challenges pertaining to the market. It provides a detailed view of the market across three main regions-Americas, Asia Pacific, and EMEA. The report includes a value chain analysis of the key players and their competitive analysis of the EUV lithography ecosystem.

Key Benefits of Buying the Report

• Analysis of key drivers (surging deployment of EUV lithography across leading-edge foundry nodes), restraints (high upfront capital investment), opportunities (increasing investments in advanced EUV lithography and semiconductor devices), and challenges (competition from alternative lithography techniques) influencing the growth of the extreme ultraviolet (EUV) lithography market
• Products/Solution/Service Development/Innovation: Detailed insights into upcoming components, technologies, research, and development activities in the extreme ultraviolet (EUV) lithography market
• Market Development: Comprehensive information about lucrative markets-the report analyzes the extreme ultraviolet (EUV) lithography market across varied regions
• Market Diversification: Exhaustive information about new EUV lithography in untapped geographies, recent developments, and investments in the extreme ultraviolet (EUV) lithography market
• Competitive Assessment: In-depth assessment of market shares and growth strategies, and offerings of leading players offering components of EUV lithography, such as KLA Corporation (US), ZEISS Group (Germany), TRUMPF (Germany), AGC Inc. (Japan), and Lasertec Corporation (Japan)

TABLE OF CONTENTS

1 INTRODUCTION

• 1.1 STUDY OBJECTIVES
• 1.2 MARKET DEFINITION
• 1.3 STUDY SCOPE
  • 1.3.1 MARKETS COVERED AND REGIONAL SCOPE
  • 1.3.2 INCLUSIONS AND EXCLUSIONS
  • 1.3.3 YEARS CONSIDERED
• 1.4 CURRENCY CONSIDERED
• 1.5 UNIT CONSIDERED
• 1.6 LIMITATIONS
• 1.7 STAKEHOLDERS
• 1.8 SUMMARY OF CHANGES

2 EXECUTIVE SUMMARY

• 2.1 MARKET HIGHLIGHTS AND KEY INSIGHTS
• 2.2 KEY MARKET PARTICIPANTS: MAPPING OF STRATEGIC DEVELOPMENTS
• 2.3 DISRUPTIVE TRENDS IN EXTREME ULTRAVIOLET (EUV) LITHOGRAPHY MARKET
• 2.4 HIGH-GROWTH SEGMENTS
• 2.5 REGIONAL SNAPSHOT: MARKET SIZE, GROWTH RATE, AND FORECAST

3 PREMIUM INSIGHTS

• 3.1 ATTRACTIVE OPPORTUNITIES FOR PLAYERS IN EXTREME ULTRAVIOLET (EUV) LITHOGRAPHY MARKET
• 3.2 EXTREME ULTRAVIOLET (EUV) LITHOGRAPHY MARKET, BY END USER
• 3.3 EXTREME ULTRAVIOLET (EUV) LITHOGRAPHY MARKET, BY APPLICATION
• 3.4 EXTREME ULTRAVIOLET (EUV) LITHOGRAPHY MARKET, BY REGION

4 MARKET OVERVIEW

• 4.1 INTRODUCTION
• 4.2 MARKET DYNAMICS
  • 4.2.1 DRIVERS
    • 4.2.1.1 Surging deployment of EUV lithography across leading-edge foundry nodes
    • 4.2.1.2 Elevating use of AI accelerators and deep learning processors in HPC systems
    • 4.2.1.3 Increasing complexity of integrated circuits
    • 4.2.1.4 Rapid advancements in consumer electronics
  • 4.2.2 RESTRAINTS
    • 4.2.2.1 High upfront capital investment
    • 4.2.2.2 Requirement for advanced infrastructure and skilled workforce
  • 4.2.3 OPPORTUNITIES
    • 4.2.3.1 Increasing investments in advanced EUV lithography and semiconductor devices
    • 4.2.3.2 Emerging applications of EUV lithography
    • 4.2.3.3 Advancements in memory modules and chips
    • 4.2.3.4 Integration of EUV lithography into advanced display manufacturing
    • 4.2.3.5 Application of advanced patterning technologies in photonics and optics production
    • 4.2.3.6 Commercialization of High-NA EUV lithography
  • 4.2.4 CHALLENGES
    • 4.2.4.1 Competition from alternative lithography techniques
    • 4.2.4.2 Difficulty in sustaining high source power and productivity
    • 4.2.4.3 Detecting and addressing mask defects and yield-related challenges

5 INDUSTRY TRENDS

• 5.1 INTRODUCTION
• 5.2 PORTER'S FIVE FORCES ANALYSIS
  • 5.2.1 INTENSITY OF COMPETITIVE RIVALRY
  • 5.2.2 THREAT OF NEW ENTRANTS
  • 5.2.3 THREAT OF SUBSTITUTES
  • 5.2.4 BARGAINING POWER OF BUYERS
  • 5.2.5 BARGAINING POWER OF SUPPLIERS
• 5.3 MACROECONOMIC OUTLOOK
  • 5.3.1 INTRODUCTION
  • 5.3.2 GDP TRENDS AND FORECAST
  • 5.3.3 TRENDS IN FOUNDRIES
  • 5.3.4 TRENDS IN INTEGRATED DEVICE MANUFACTURERS (IDMS)
• 5.4 VALUE CHAIN ANALYSIS
  • 5.4.1 R&D ENGINEERS
  • 5.4.2 RAW MATERIAL PROVIDERS AND COMPONENT MANUFACTURERS
  • 5.4.3 SYSTEM INTEGRATORS AND MANUFACTURERS
  • 5.4.4 MARKETING & SALES SERVICES PROVIDERS
  • 5.4.5 END USERS
• 5.5 ECOSYSTEM ANALYSIS
• 5.6 PRICING ANALYSIS
  • 5.6.1 AVERAGE SELLING PRICE TREND OF EUV LITHOGRAPHY SYSTEM TYPES, BY KEY PLAYER, 2021-2025
  • 5.6.2 AVERAGE SELLING PRICE TREND OF EUV LITHOGRAPHY SYSTEM, BY REGION, 2021-2025
• 5.7 TRADE ANALYSIS
  • 5.7.1 IMPORT SCENARIO (HS CODE 8442)
  • 5.7.2 EXPORT SCENARIO (HS CODE 8442)
• 5.8 KEY CONFERENCES AND EVENTS, 2026-2027
• 5.9 TRENDS/DISRUPTIONS IMPACTING CUSTOMER BUSINESS
• 5.10 INVESTMENT AND FUNDING SCENARIO
• 5.11 CASE STUDY ANALYSIS
  • 5.11.1 INTEL SECURES EXCLUSIVE HIGH-NA EUV LITHOGRAPHY MACHINES TO RESHAPE SUPPLY CHAIN
  • 5.11.2 TSMC DEPLOYS EUV LITHOGRAPHY SYSTEMS TO BOOST PRODUCTION CAPACITY
  • 5.11.3 SAMSUNG ELECTRONICS ADVANCES 3 NM GAA PRODUCTION USING EUV LITHOGRAPHY
• 5.12 IMPACT OF 2025 US TARIFF ON EXTREME ULTRAVIOLET (EUV) LITHOGRAPHY MARKET
  • 5.12.1 INTRODUCTION
  • 5.12.2 KEY TARIFF RATES
  • 5.12.3 PRICE IMPACT ANALYSIS
  • 5.12.4 IMPACT ON COUNTRY/REGION
    • 5.12.4.1 US
    • 5.12.4.2 Europe
    • 5.12.4.3 Asia Pacific
  • 5.12.5 IMPACT ON END USERS

6 TECHNOLOGICAL ADVANCEMENTS, AI-DRIVEN IMPACT, PATENTS, AND INNOVATIONS

• 6.1 TECHNOLOGY ANALYSIS
  • 6.1.1 KEY EMERGING TECHNOLOGIES
    • 6.1.1.1 High-NA EUV lithography technology
    • 6.1.1.2 Advanced EUV resist and patterning materials
  • 6.1.2 COMPLEMENTARY TECHNOLOGIES
    • 6.1.2.1 Mask pellicles
    • 6.1.2.2 Plasma generation
  • 6.1.3 ADJACENT TECHNOLOGIES
    • 6.1.3.1 Extreme ultraviolet reflectometry (EUVR)
    • 6.1.3.2 Atomic layer deposition (ALD)
• 6.2 TECHNOLOGY/PRODUCT ROADMAP
  • 6.2.1 SHORT-TERM (2025-2027): PRODUCTIVITY OPTIMIZATION & ADVANCED NODE SCALING
  • 6.2.2 MID-TERM (2027-2030): HIGH-NA EUV COMMERCIALIZATION & PROCESS MATURITY
  • 6.2.3 LONG-TERM (2030-2035+): FULL HIGH-NA DEPLOYMENT & NEXT-GEN LITHOGRAPHY INTEGRATION
• 6.3 PATENT ANALYSIS
• 6.4 IMPACT OF AI ON EUV LITHOGRAPHY
  • 6.4.1 TOP USE CASES AND MARKET POTENTIAL
  • 6.4.2 BEST PRACTICES IN EXTREME ULTRAVIOLET (EUV) LITHOGRAPHY MARKET
  • 6.4.3 CASE STUDIES OF AI IMPLEMENTATION IN EXTREME ULTRAVIOLET (EUV) LITHOGRAPHY MARKET
  • 6.4.4 INTERCONNECTED/ADJACENT ECOSYSTEM AND IMPACT ON MARKET PLAYERS
  • 6.4.5 CLIENTS' READINESS TO ADOPT AI IN EXTREME ULTRAVIOLET (EUV) LITHOGRAPHY MARKET

7 REGULATORY LANDSCAPE

• 7.1 INTRODUCTION
• 7.2 REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS
• 7.3 REGULATIONS
• 7.4 STANDARDS
  • 7.4.1 SEMI STANDARDS
  • 7.4.2 ISO & IEC ELECTRICAL, MECHANICAL, AND SAFETY STANDARDS
  • 7.4.3 ISO 9001:2015 QUALITY MANAGEMENT SYSTEM STANDARDS
  • 7.4.4 ISO 14001 ENVIRONMENTAL MANAGEMENT STANDARDS
  • 7.4.5 ROHS & REACH COMPLIANCE STANDARDS
  • 7.4.6 CYBERSECURITY & DATA INTEGRITY STANDARDS
• 7.5 GOVERNMENT REGULATIONS
  • 7.5.1 US
  • 7.5.2 EUROPE
  • 7.5.3 CHINA
  • 7.5.4 JAPAN
  • 7.5.5 INDIA
• 7.6 SUSTAINABILITY IMPACT AND REGULATORY POLICY INITIATIVES
• 7.7 CERTIFICATIONS, LABELING, AND ECO-STANDARDS

8 CUSTOMER LANDSCAPE AND BUYER BEHAVIOR

• 8.1 DECISION-MAKING PROCESS
• 8.2 KEY STAKEHOLDERS AND BUYING CRITERIA
  • 8.2.1 KEY STAKEHOLDERS IN BUYING PROCESS
  • 8.2.2 BUYING CRITERIA
• 8.3 ADOPTION BARRIERS AND INTERNAL CHALLENGES
• 8.4 UNMET NEEDS OF VARIOUS END USERS
• 8.5 MARKET PROFITABILITY

9 APPLICATION NODES OF EXTREME ULTRAVIOLET (EUV) LITHOGRAPHY TECHNOLOGY

• 9.1 INTRODUCTION
• 9.2 7 NM
• 9.3 5 NM
• 9.4 3 NM
• 9.5 2 NM
• 9.6 SUB-2 NM

10 EXTREME ULTRAVIOLET (EUV) LITHOGRAPHY MARKET, BY COMPONENT

• 10.1 INTRODUCTION
• 10.2 LIGHT SOURCES
  • 10.2.1 RISING FOCUS ON ENHANCING PRECISION AND THROUGHPUT IN SEMICONDUCTORS TO BOOST DEMAND
• 10.3 OPTICS
  • 10.3.1 ELEVATING DEMAND FOR HIGHER NUMERICAL APERTURE (HIGH-NA) EUV SYSTEMS TO SUPPORT SEGMENTAL GROWTH
• 10.4 MASKS
  • 10.4.1 GREATER EMPHASIS ON PROCESS EFFICIENCY AND SUSTAINABILITY IN EUV MASK PRODUCTION TO CONTRIBUTE TO SEGMENTAL GROWTH
• 10.5 OTHER COMPONENTS

11 EXTREME ULTRAVIOLET (EUV) LITHOGRAPHY MARKET, BY SYSTEM TYPE

• 11.1 INTRODUCTION
• 11.2 0.33 NA EUV SYSTEMS (NXE)
  • 11.2.1 COST EFFICIENCY AND RELIABILITY TO STIMULATE DEMAND
• 11.3 0.55 NA EUV SYSTEMS (EXE)
  • 11.3.1 ABILITY TO IMPROVE YIELD FOR ADVANCED LOGIC, MEMORY, AND AI CHIPS TO DRIVE MARKET

12 EXTREME ULTRAVIOLET (EUV) LITHOGRAPHY MARKET, BY END USER

• 12.1 INTRODUCTION
• 12.2 INTEGRATED DEVICE MANUFACTURERS (IDMS)
  • 12.2.1 INNOVATION IN ADVANCED AND ENERGY-EFFICIENT MICROCHIPS TO FOSTER MARKET GROWTH
• 12.3 FOUNDRIES
  • 12.3.1 STRONG FOCUS ON HIGH-VOLUME SEMICONDUCTOR MANUFACTURING TO SUPPORT SEGMENTAL GROWTH

13 EXTREME ULTRAVIOLET (EUV) LITHOGRAPHY MARKET, BY APPLICATION

• 13.1 INTRODUCTION
• 13.2 LOGIC CHIPS
  • 13.2.1 INCREASING COMPLEXITY AND COSTS OF LOGIC DEVICES TO BOOST DEMAND FOR EUV LITHOGRAPHY
  • 13.2.2 CPU
  • 13.2.3 GPU
  • 13.2.4 AI ACCELERATOR
  • 13.2.5 SOC
  • 13.2.6 ASIC
• 13.3 MEMORY CHIPS
  • 13.3.1 GROWING DEMAND FOR ARTIFICIAL INTELLIGENCE, CLOUD COMPUTING, AND HIGH-PERFORMANCE APPLICATIONS TO CREATE OPPORTUNITIES
  • 13.3.2 DRAM
  • 13.3.3 HBM

14 EXTREME ULTRAVIOLET (EUV) LITHOGRAPHY MARKET, BY REGION

• 14.1 INTRODUCTION
• 14.2 AMERICAS
  • 14.2.1 GROWING DEMAND FOR HIGH-PERFORMANCE, ENERGY-EFFICIENT SEMICONDUCTOR SOLUTIONS TO BOOST MARKET
• 14.3 EMEA
  • 14.3.1 EARLY-STAGE COMMERCIALIZATION OF EXTREME ULTRAVIOLET (EUV) LITHOGRAPHY TO CREATE GROWTH OPPORTUNITIES
• 14.4 ASIA PACIFIC
  • 14.4.1 CHINA
    • 14.4.1.1 Domestic semiconductor capacity building and technology localization to drive market
  • 14.4.2 JAPAN
    • 14.4.2.1 Presence of leading technology providers to contribute to market growth
  • 14.4.3 SOUTH KOREA
    • 14.4.3.1 Strong global position in memory and logic semiconductor manufacturing to foster market growth
  • 14.4.4 TAIWAN
    • 14.4.4.1 Significant investments in eco-friendly EUV system components to propel market
  • 14.4.5 REST OF ASIA PACIFIC

15 COMPETITIVE LANDSCAPE

• 15.1 OVERVIEW
• 15.2 KEY PLAYER COMPETITIVE STRATEGIES/RIGHT TO WIN, 2024-2025
• 15.3 REVENUE ANALYSIS, 2021-2025
• 15.4 MARKET SHARE ANALYSIS, 2025
• 15.5 COMPANY VALUATION AND FINANCIAL METRICS
  • 15.5.1 COMPANY VALUATION
  • 15.5.2 FINANCIAL METRICS
• 15.6 PRODUCT COMPARISON
• 15.7 COMPANY EVALUATION MATRIX: KEY PLAYERS, 2025
  • 15.7.1 STARS
  • 15.7.2 EMERGING LEADERS
  • 15.7.3 PERVASIVE PLAYERS
  • 15.7.4 PARTICIPANTS
  • 15.7.5 COMPANY FOOTPRINT: KEY PLAYERS, 2025
    • 15.7.5.1 Company footprint
    • 15.7.5.2 Region footprint
    • 15.7.5.3 End user footprint
    • 15.7.5.4 Component footprint
• 15.8 COMPANY EVALUATION MATRIX: STARTUPS/SMES, 2025
  • 15.8.1 PROGRESSIVE COMPANIES
  • 15.8.2 RESPONSIVE COMPANIES
  • 15.8.3 DYNAMIC COMPANIES
  • 15.8.4 STARTING BLOCKS
  • 15.8.5 COMPETITIVE BENCHMARKING: STARTUPS/SMES, 2025
    • 15.8.5.1 Detailed list of key startups/SMEs
    • 15.8.5.2 Competitive benchmarking of key startups/SMEs
• 15.9 COMPETITIVE SCENARIO
  • 15.9.1 PRODUCT LAUNCHES
  • 15.9.2 DEALS

16 COMPANY PROFILES

• 16.1 INTRODUCTION
• 16.2 KEY SYSTEM MANUFACTURERS
  • 16.2.1 ASML
    • 16.2.1.1 Business overview
    • 16.2.1.2 Products/Solutions/Services offered
    • 16.2.1.3 Recent developments
      • 16.2.1.3.1 Deals
    • 16.2.1.4 MnM view
      • 16.2.1.4.1 Key strengths/Right to win
      • 16.2.1.4.2 Strategic choices
      • 16.2.1.4.3 Weaknesses/Competitive threats
• 16.3 KEY COMPONENT MANUFACTURERS
  • 16.3.1 LIGHT SOURCE MANUFACTURERS
    • 16.3.1.1 TRUMPF
      • 16.3.1.1.1 Business overview
      • 16.3.1.1.2 Products/Solutions/Services offered
      • 16.3.1.1.3 MnM view
        • 16.3.1.1.3.1 Key strengths/Right to win
        • 16.3.1.1.3.2 Strategic choices
        • 16.3.1.1.3.3 Weaknesses/Competitive threats
    • 16.3.1.2 Ushio Inc.
      • 16.3.1.2.1 Business overview
      • 16.3.1.2.2 Products/Solutions/Services offered
      • 16.3.1.2.3 MnM view
        • 16.3.1.2.3.1 Key strengths/Right to win
        • 16.3.1.2.3.2 Strategic choices
        • 16.3.1.2.3.3 Weaknesses/Competitive threats
    • 16.3.1.3 Energetiq
      • 16.3.1.3.1 Business overview
      • 16.3.1.3.2 Products/Solutions/Services offered
      • 16.3.1.3.3 Recent developments
        • 16.3.1.3.3.1 Product launches
      • 16.3.1.3.4 MnM view
        • 16.3.1.3.4.1 Key strengths/Right to win
        • 16.3.1.3.4.2 Strategic choices
        • 16.3.1.3.4.3 Weaknesses/Competitive threats
  • 16.3.2 OPTICS MANUFACTURERS
    • 16.3.2.1 ZEISS Group
      • 16.3.2.1.1 Business overview
      • 16.3.2.1.2 Products/Solutions/Services offered
      • 16.3.2.1.3 Recent developments
        • 16.3.2.1.3.1 Product launches
        • 16.3.2.1.3.2 Deals
    • 16.3.2.2 NTT ADVANCED TECHNOLOGY CORPORATION
      • 16.3.2.2.1 Business overview
      • 16.3.2.2.2 Products/Solutions/Services offered
    • 16.3.2.3 Rigaku Holdings Corporation
      • 16.3.2.3.1 Business overview
      • 16.3.2.3.2 Products/Solutions/Services offered
    • 16.3.2.4 Edmund Optics Inc.
      • 16.3.2.4.1 Business overview
      • 16.3.2.4.2 Products/Solutions/Services offered
  • 16.3.3 MASK MANUFACTURERS
    • 16.3.3.1 AGC Inc.
      • 16.3.3.1.1 Business overview
      • 16.3.3.1.2 Products/Solutions/Services offered
    • 16.3.3.2 Tekscend Photomask
      • 16.3.3.2.1 Business overview
      • 16.3.3.2.2 Products/Solutions/Services offered
    • 16.3.3.3 Lasertec Corporation
      • 16.3.3.3.1 Business overview
      • 16.3.3.3.2 Products/Solutions/Services offered
      • 16.3.3.3.3 Recent developments
        • 16.3.3.3.3.1 Product launches
    • 16.3.3.4 HOYA Corporation
      • 16.3.3.4.1 Business overview
      • 16.3.3.4.2 Products/Solutions/Services offered
    • 16.3.3.5 NuFlare Technology Inc.
      • 16.3.3.5.1 Business overview
      • 16.3.3.5.2 Products/Solutions/Services offered
  • 16.3.4 OTHER COMPONENT MANUFACTURERS
    • 16.3.4.1 KLA Corporation
    • 16.3.4.2 ADVANTEST CORPORATION
    • 16.3.4.3 SUSS MicroTec SE
    • 16.3.4.4 Applied Materials, Inc.
    • 16.3.4.5 Park Systems
    • 16.3.4.6 Imagine Optic
    • 16.3.4.7 MKS Inc.
• 16.4 END USERS
  • 16.4.1 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
  • 16.4.2 INTEL CORPORATION
  • 16.4.3 SAMSUNG
  • 16.4.4 SK HYNIX INC.
  • 16.4.5 MICRON TECHNOLOGY, INC.

17 RESEARCH METHODOLOGY

• 17.1 RESEARCH DATA
• 17.2 SECONDARY AND PRIMARY RESEARCH
  • 17.2.1 SECONDARY DATA
    • 17.2.1.1 List of key secondary sources
    • 17.2.1.2 Key data from secondary sources
  • 17.2.2 PRIMARY DATA
    • 17.2.2.1 List of primary interview participants
    • 17.2.2.2 Breakdown of primaries
    • 17.2.2.3 Key data from primary sources
    • 17.2.2.4 Key industry insights
• 17.3 MARKET SIZE ESTIMATION
  • 17.3.1 BOTTOM-UP APPROACH
    • 17.3.1.1 Approach to arrive at market size using bottom-up analysis (demand side)
  • 17.3.2 TOP-DOWN APPROACH
    • 17.3.2.1 Approach to arrive at market size using top-down analysis (supply side)
• 17.4 MARKET SIZE ESTIMATION FOR BASE YEAR
• 17.5 MARKET FORECAST APPROACH
  • 17.5.1 SUPPLY SIDE
  • 17.5.2 DEMAND SIDE
• 17.6 DATA TRIANGULATION
• 17.7 RESEARCH ASSUMPTIONS
• 17.8 RESEARCH LIMITATIONS
• 17.9 RISK ANALYSIS

18 APPENDIX

• 18.1 INSIGHTS FROM INDUSTRY EXPERTS
• 18.2 DISCUSSION GUIDE
• 18.3 KNOWLEDGESTORE: MARKETSANDMARKETS' SUBSCRIPTION PORTAL
• 18.4 CUSTOMIZATION OPTIONS
• 18.5 RELATED REPORTS
• 18.6 AUTHOR DETAILS