첨단 패키징 시장 : 유형별, 최종사용자별, 지역별 예측(-2030년)

Global Advanced Packaging Market Research Report Information by Type (Flip Chip Scale Package, Flip Chip Ball Grid Array, Wafer Level Chip Scale Packaging, 5D/3D, Fan Out Wafer-level Packaging and Others), by End-user (Consumer Electronics, Healthcare, Industrial, Aerospace and Defense, Automotive and Other), and by Region (North America, Europe, Asia Pacific, South America, and Middle East & Africa) -Forecast Till 2030

Market Synopsis

In 2023, the advanced packaging market was estimated to be worth USD 35,336.7 million. Over the course of the projection period, the Advanced Packaging industry is expected to increase at a compound annual growth rate (CAGR) of 5.6%. The collection and linking of Types prior to conventional integrated circuit packaging is known as advanced packaging. Multiple devices can be combined and packed as a single electrical device thanks to advanced packaging. The industrial segment that deals with creating, designing, and producing sophisticated and novel packaging solutions for a range of products is known as the advanced packaging market. Modern packaging methods are used to improve the performance, usefulness, and dependability of packaged items while guaranteeing its preservation, protection, and appearance. The increased need for embedded die packaging can also be attributed to the increasing downsizing of devices and the increasing use of micro-electromechanical systems (MEMS) in manufacturing. Although the technology has been available for some time, its low yields and high costs have restricted its applicability to specialized fields.

As technology develops, producers are moving toward producing small electronic devices for a variety of markets, including consumer electronics, healthcare, automotive, and semiconductor IC manufacture.

The main factors driving the Advanced Packaging Market are the electronics industry's explosive expansion and the rising demand for a range of consumer electronics, including wearables, laptops, desktops, smartphones, and tiny gadgets.

Market Segmentation

The Flip Chip Scale Package, Flip Chip Ball Grid Array, Wafer Level Chip Scale Packaging, 5D/3D, Fan Out Wafer-level Packaging, and Others are the segments of the Advanced Packaging Market based on type.

The Advanced Packaging Market has been divided into Consumer Electronics, Healthcare, Industrial, Aerospace and Defense, Automotive, and Other segments based on the end-user.

Regional Perspectives

The Asia-Pacific region is predicted to account for the largest share in 2022 and grow to USD 36,528.58 million by 2030. Because there are so many semiconductor production facilities in the Asia-Pacific region, the market share is substantial in that area. In order to fulfill the increased demand from fabless suppliers, manufacturers in this region are expanding their production capacity, and China is attempting to consolidate its substrate manufacturing business.

For several reasons, the advanced packaging market in North America is expanding significantly. First, the market is directly impacted by the growing demand for consumer electronics. People are using electronic gadgets more and more for communication, leisure, and work-related tasks, which means that sophisticated packaging solutions are required to fit the intricate and small designs of these devices. The market is also expanding due to the rising demand for premium chips.

The rapid expansion of the advanced packaging market, especially in wafer level packaging, driven by the rising demand for smartphones, electronics, and the Internet of Things (IoT), is responsible for the growth of the Europe Advanced Packaging Market. Providers of advanced packaging are actively creating procedures and plans to lower the total cost of advanced packaging and guarantee maximum operational effectiveness to satisfy this expanding demand.

South America's market for innovative packaging materials is expanding gradually due to a number of factors. The need for improved packaging solutions is being driven by the rising demand for sophisticated electronic gadgets like wearables, tablets, and smartphones. Advanced packaging technologies enable the production of semiconductor chips that are more compact, powerful, and energy-efficient-all necessary for these devices.

The market for advanced packaging semiconductor materials is expanding significantly in the Middle East and Africa (MEA) region. In order to enable more performance and usefulness in electronic devices, advanced packaging refers to the compact and efficient integration and encapsulation of semiconductor chips.

Principal Players

Amkor Technology Inc., ASE Technology Holding Co. Ltd., China Wafer Level CSP Co. Ltd., ChipMOS Technologies Inc., FlipChip International LLC, HANA Micron Inc., Jiangsu Changjiang Electronics Technology Co. Ltd., King Yuan Electronics Corp., Nepes Corporation, Powertech Technology Inc., and numerous other notable businesses are among those that lead the advanced packaging market.

TABLE OF CONTENTS

1 EXECUTIVE SUMMARY

• 1.1 MARKET ATTRACTIVENESS ANALYSIS
  • 1.1.1 GLOBAL ADVANCED PACKAGING MARKET, TYPE
  • 1.1.2 GLOBAL ADVANCED PACKAGING MARKET, BY END USER
  • 1.1.3 GLOBAL ADVANCED PACKAGING MARKET, BY REGION

2 MARKET INTRODUCTION

• 2.1 DEFINITION
• 2.2 SCOPE OF THE STUDY
• 2.3 RESEARCH OBJECTIVE
• 2.4 MARKET STRUCTURE
• 2.5 KEY BUYING CRITERIA

3 RESEARCH METHODOLOGY

• 3.1 RESEARCH PROCESS
• 3.2 PRIMARY RESEARCH
• 3.3 SECONDARY RESEARCH
• 3.4 MARKET SIZE ESTIMATION
• 3.5 FORECAST MODEL
• 3.6 LIST OF ASSUMPTIONS & LIMITATIONS

4 MARKET DYNAMICS

• 4.1 INTRODUCTION
• 4.2 DRIVERS
  • 4.2.1 RAPID EXPANSION IN THE ELECTRONICS SECTOR.
  • 4.2.2 GROWING DEMAND FOR MINIATURIZATION OF DEVICES BOOSTS DEMAND FOR ADVANCED PACKAGING
  • 4.2.3 DRIVERS IMPACT ANALYSIS
• 4.3 RESTRAINT
  • 4.3.1 HIGH COST CAN HINDER ADVANCED PACKAGINGS MARKET GROWTH
  • 4.3.2 RESTRAINT IMPACT ANALYSIS
• 4.4 OPPORTUNITIES
  • 4.4.1 INCREASING MINIATURIZATION OF DEVICES AND THE GROWING ADOPTION OF MICRO-ELECTROMECHANICAL SYSTEMS (MEMS)

5 MARKET FACTOR ANALYSIS

• 5.1 SUPPLY CHAIN ANALYSIS
  • 5.1.1 RAW APPLICATION SCENARIO
    • 5.1.1.1 RAW APPLICATIONS
    • 5.1.1.2 RAW APPLICATION SUPPLIERS
  • 5.1.2 MANUFACTURE
  • 5.1.3 DISTRIBUTION & SALES CHANNEL
  • 5.1.4 END USERS
• 5.2 PORTER'S FIVE FORCES MODEL
  • 5.2.1 THREAT OF NEW ENTRANTS
  • 5.2.2 BARGAINING POWER OF SUPPLIERS
  • 5.2.3 BARGAINING POWER OF BUYERS
  • 5.2.4 THREAT OF SUBSTITUTES
  • 5.2.5 INTENSITY OF RIVALRY
• 5.3 IMPACT OF THE COVID-19 OUTBREAK ON GLOBAL ADVANCED PACKAGING MARKET
  • 5.3.1 IMPACT OF COVID-19 ON SUPPLY CHAIN OF ADVANCED PACKAGING MARKET
  • 5.3.2 MAJOR GOVERMENT POLICIES TO COUNTER THE PANDEMIC
  • 5.3.3 QUALITATIVE ANALYSIS ON CHANGE IN DEMAND FROM END-USERS
• 5.4 PRICING OVERVIEW OF ADVANCED PACKAGING (2019-2021)

6 GLOBAL ADVANCED PACKAGING MARKET, TYPE

• 6.1 OVERVIEW
• 6.2 FLIP CHIP SCALE PACKAGE
• 6.3 FLIP CHIP BALL GRID ARRAY
• 6.4 WAFER LEVEL CHIP SCALE PACKAGING
• 6.5 2.5D/3D
• 6.6 FAN OUT WAFER-LEVEL PACKAGING
• 6.7 OTHERS

7 GLOBAL ADVANCED PACKAGING MARKET, BY END USER

• 7.1 OVERVIEW
• 7.2 CONSUMER ELECTRONICS
• 7.3 HEALTHCARE
• 7.4 INDUSTRIAL
• 7.5 AEROSPACE AND DEFENSE
• 7.6 AUTOMOTIVE
• 7.7 OTHER

8 GLOBAL ADVANCED PACKAGING MARKET, BY REGION

• 8.1.1 GLOBAL ADVANCED PACKAGING MARKET ESTIMATES & FORECAST, BY REGION, 2018-2030
• 8.2 NORTH AMERICA
  • 8.2.1 US
  • 8.2.2 CANADA
  • 8.2.3 MEXICO
• 8.3 EUROPE
  • 8.3.1 GERMANY
  • 8.3.2 UK
  • 8.3.3 FRANCE
  • 8.3.4 ITALY
  • 8.3.5 REST OF EUROPE
• 8.4 ASIA-PACIFIC
  • 8.4.1 CHINA
  • 8.4.2 INDIA
  • 8.4.3 JAPAN
  • 8.4.4 REST OF ASIA-PACIFIC
• 8.5 SOUTH AMERICA
  • 8.5.1 BRAZIL
  • 8.5.2 ARGENTINA
  • 8.5.3 REST OF SOUTH AMERICA
• 8.6 MIDDLE EAST & AFRICA
  • 8.6.1 SOUTH AFRICA
  • 8.6.2 SAUDI ARABIA
  • 8.6.3 UAE
  • 8.6.4 REST OF THE MIDDLE EAST & AFRICA

9 COMPETITIVE LANDSCAPE

• 9.1 INTRODUCTION
• 9.2 COMPETITIVE BENCHMARKING
• 9.3 GLOBAL MARKET STRATEGIES
• 9.4 KEY DEVELOPMENTS & GROWTH STRATEGIES
  • 9.4.1 expansions

10 COMPANY PROFILES

• 10.1 AMKOR TECHNOLOGY INC
  • 10.1.1 COMPANY OVERVIEW
  • 10.1.2 FINANCIAL OVERVIEW
  • 10.1.3 PRODUCTS/SERVICES OFFERED
  • 10.1.4 KEY DEVELOPMENTS
  • 10.1.5 SWOT ANALYSIS
  • 10.1.6 KEY STRATEGIES
• 10.2 ASE TECHNOLOGY HOLDING CO. LTD.,
  • 10.2.1 COMPANY OVERVIEW
  • 10.2.2 FINANCIAL OVERVIEW
  • 10.2.3 PRODUCTS/SERVICES OFFERED
  • 10.2.4 KEY DEVELOPMENTS
  • 10.2.5 SWOT ANALYSIS
  • 10.2.6 KEY STRATEGIES
• 10.3 CHINA WAFER LEVEL CSP CO. LTD
  • 10.3.1 COMPANY OVERVIEW
  • 10.3.2 FINANCIAL OVERVIEW
  • 10.3.3 PRODUCTS OFFERED
  • 10.3.4 KEY DEVELOPMENTS
  • 10.3.5 SWOT ANALYSIS
  • 10.3.6 KEY STRATEGIES
• 10.4 CHIPMOS TECHNOLOGIES INC.,
  • 10.4.1 COMPANY OVERVIEW
  • 10.4.2 FINANCIAL OVERVIEW
  • 10.4.3 PRODUCTS OFFERED
  • 10.4.4 KEY DEVELOPMENTS
  • 10.4.5 SWOT ANALYSIS
  • 10.4.6 KEY STRATEGIES
• 10.5 FLIPCHIP INTERNATIONAL LLC
  • 10.5.1 COMPANY OVERVIEW
  • 10.5.2 FINANCIAL OVERVIEW
  • 10.5.3 PRODUCTS OFFERED
  • 10.5.4 KEY DEVELOPMENTS
  • 10.5.5 SWOT ANALYSIS
  • 10.5.6 KEY STRATEGIES
• 10.6 HANA MICRON INC
  • 10.6.1 COMPANY OVERVIEW
  • 10.6.2 FINANCIAL OVERVIEW
  • 10.6.3 PRODUCTS OFFERED
  • 10.6.4 KEY DEVELOPMENTS
  • 10.6.5 SWOT ANALYSIS
  • 10.6.6 KEY STRATEGIES
• 10.7 JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO. LTD
  • 10.7.1 COMPANY OVERVIEW
  • 10.7.2 FINANCIAL OVERVIEW
  • 10.7.3 PRODUCTS OFFERED
  • 10.7.4 KEY DEVELOPMENTS
  • 10.7.5 SWOT ANALYSIS
  • 10.7.6 KEY STRATEGIES
• 10.8 KING YUAN ELECTRONICS CORP
  • 10.8.1 COMPANY OVERVIEW
  • 10.8.2 FINANCIAL OVERVIEW
  • 10.8.3 PRODUCTS OFFERED
  • 10.8.4 KEY DEVELOPMENTS
  • 10.8.5 SWOT ANALYSIS
  • 10.8.6 KEY STRATEGIES
• 10.9 NEPES CORPORATION
  • 10.9.1 COMPANY OVERVIEW
  • 10.9.2 FINANCIAL OVERVIEW
  • 10.9.3 PRODUCTS OFFERED
  • 10.9.4 KEY DEVELOPMENTS
  • 10.9.5 SWOT ANALYSIS
  • 10.9.6 KEY STRATEGIES
• 10.10 POWERTECH TECHNOLOGY INC
  • 10.10.1 COMPANY OVERVIEW
  • 10.10.2 FINANCIAL OVERVIEW
  • 10.10.3 PRODUCTS OFFERED
  • 10.10.4 KEY DEVELOPMENTS
  • 10.10.5 SWOT ANALYSIS
  • 10.10.6 KEY STRATEGIES