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시장보고서
상품코드
1891129
첨단 패키징 시장 : 패키징 종류별, 용도별, 최종 이용 산업별, 지역별Advanced Packaging Market, By Packaging Type, By Application, By End-use Industry, By Geography |
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※ 본 상품은 영문 자료로 한글과 영문 목차에 불일치하는 내용이 있을 경우 영문을 우선합니다. 정확한 검토를 위해 영문 목차를 참고해주시기 바랍니다.
첨단 패키징 시장은 2025년에 345억 6,000만 달러 규모로 추정되며, 2032년까지 516억 2,000만 달러에 달할 것으로 전망됩니다. 2025년부터 2032년까지 CAGR은 5.9%를 기록할 전망입니다.
| 분석 범위 | 분석 상세 | ||
|---|---|---|---|
| 기준 연도 | 2024년 | 시장 규모(2025년) | 345억 6,000만 달러 |
| 실적 데이터 | 2020-2024년 | 예측 기간 | 2025-2032년 |
| 예측 기간 CAGR(2025-2032년) | 5.90% | 예측 금액(2032년) | 516억 2,000만 달러 |
세계 첨단 패키징 시장은 반도체 산업에서 중요한 분야로, 전자기기의 성능 향상, 소형화, 기능 강화를 가능하게 하는 첨단 패키징 기술을 포함하고 있습니다.
시장 역학
세계 첨단 패키징 시장은 주로 가전, 자동차 전장, 통신 분야에서 기능성이 강화된 소형 전자기기의 수요가 급격히 증가하고 있는 것에 힘입어 성장하고 있습니다. 5G 기술, 인공지능 애플리케이션, 사물인터넷(IoT) 디바이스의 확산으로 복잡한 반도체 아키텍처를 지원하면서도 최적의 열적, 전기적 성능을 유지할 수 있는 고성능 패키징 솔루션에 대한 전례 없는 수요가 발생하고 있습니다.
본 보고서의 주요 특징
- 세계의 첨단 패키징 시장에 대해 조사분석했으며, 2024년을 기준 연도로 하여 예측 기간(2025-2032년)의 시장 규모와 연평균 성장률(CAGR)에 대해 조사 분석하여 전해드립니다.
- 또한, 각 부문의 잠재적 수익 기회를 밝히고, 이 시장의 매력적인 투자 제안 매트릭스를 설명합니다.
- 또한, 시장 촉진 및 억제요인 및 기회, 신제품 출시 및 승인, 시장 동향, 지역별 전망, 주요 업체들의 경쟁 전략 등에 대한 중요한 인사이트를 제공합니다.
- 본 보고서는 세계 첨단 패키징 시장의 주요 기업 프로파일을 회사 개요, 제품 포트폴리오, 주요 특징, 재무 실적, 전략 등의 정보를 바탕으로 정리하여 수록하고 있습니다.
- 이 보고서의 인사이트를 통해 마케팅 담당자와 기업 경영진은 향후 제품 출시, 제휴, 시장 확대, 마케팅 전략에 대한 정보에 입각한 의사결정을 내릴 수 있습니다.
- 세계 첨단 패키징 시장 보고서는 투자자, 공급업체, 제품 제조업체, 유통업체, 신규 진입자, 재무 분석가 등 업계의 다양한 이해관계자를 대상으로 합니다.
- 이해관계자들은 세계 첨단 패키징 시장 분석에 사용되는 다양한 전략 매트릭스를 통해 의사결정을 용이하게 할 수 있습니다.
목차
제1장 분석 목적과 가정
- 분석 목적
- 가정
- 약어
제2장 시장 전망
- 보고서 설명
- 시장 정의와 범위
- 주요 요약
제3장 시장 역학·규제·동향 분석
- 시장 역학
- 영향 분석
- 주요 하이라이트
- 규제 환경
- 제품 발매·승인 상황
- PEST 분석
- Porters 분석
- 시장 기회
- 규제 환경
- 주요 발전
- 업계 동향
제4장 세계의 첨단 패키징 시장 : 패키징 종류별(10억 달러, 2020-2032년)
- 플립 칩
- 팬 아웃 WLP
- 임베디드 다이
- 팬 인 WLP
- 5D/3D
- 기타
제5장 세계의 첨단 패키징 시장 : 용도별(10억 달러, 2020-2032년)
- 소비자 전자제품
- 자동차
- 산업
- 의료
- 항공우주 및 방위
- 기타
제6장 세계의 첨단 패키징 시장 : 최종 이용 산업별(10억 달러, 2020-2032년)
- 반도체
- 소비재
- 식품 및 음료
- 의약품
제7장 세계의 첨단 패키징 시장 : 지역별(10억 달러, 2020-2032년)
- 북미
- 미국
- 캐나다
- 라틴아메리카
- 브라질
- 아르헨티나
- 멕시코
- 기타 라틴아메리카
- 유럽
- 독일
- 영국
- 스페인
- 프랑스
- 이탈리아
- 러시아
- 기타 유럽
- 아시아태평양
- 중국
- 인도
- 일본
- 호주
- 한국
- ASEAN
- 기타 아시아태평양
- 중동
- GCC 국가
- 이스라엘
- 기타 중동
- 아프리카
- 남아프리카공화국
- 북아프리카
- 중앙아프리카
제8장 경쟁 구도
- Amkor Technology Inc.
- Advanced Semiconductor Engineering(ASE)
- Taiwan Semiconductor Manufacturing Company(TSMC)
- Intel
- Samsung Electronics
- JCET Group
- ASMPT SMT Solutions
- IPC International, Inc.
- SEMICON
- Yole Group
- Prodrive Technologies B.V.
제9장 애널리스트의 추천사항
- 기회
- 애널리스트의 견해
- Coherent Opportunity Map(COM)
제10장 참고문헌 및 조사 방법
- 참고문헌
- 조사 방법
- 출판사 소개
Advanced Packaging Market is estimated to be valued at USD 34.56 Bn in 2025 and is expected to reach USD 51.62 Bn by 2032, growing at a compound annual growth rate (CAGR) of 5.9% from 2025 to 2032.
| Report Coverage | Report Details | ||
|---|---|---|---|
| Base Year: | 2024 | Market Size in 2025: | USD 34.56 Bn |
| Historical Data for: | 2020 To 2024 | Forecast Period: | 2025 To 2032 |
| Forecast Period 2025 to 2032 CAGR: | 5.90% | 2032 Value Projection: | USD 51.62 Bn |
The global advanced packaging market represents a critical segment within the semiconductor industry, encompassing sophisticated packaging technologies that enable enhanced performance, miniaturization, and functionality of electronic devices.
Market Dynamics
The global advanced packaging market is primarily driven by the exponential growth in demand for miniaturized electronic devices with enhanced functionality, particularly in consumer electronics, automotive electronics, and telecommunications sectors. The proliferation of 5G technology, artificial intelligence applications, and Internet of Things (IoT) devices has created unprecedented demand for high-performance packaging solutions that can accommodate complex semiconductor architectures while maintaining optimal thermal and electrical performance.
Key Features of the Study
- This report provides in-depth analysis of the global advanced packaging market, and provides market size (USD Bn) and compound annual growth rate (CAGR%) for the forecast period (2025-2032), considering 2024 as the base year
- It elucidates potential revenue opportunities across different segments and explains attractive investment proposition matrices for this market
- This study also provides key insights about market drivers, restraints, opportunities, new product launches or approvals, market trends, regional outlook, and competitive strategies adopted by key players
- It profiles key players in the global advanced packaging market based on the following parameters - company highlights, products portfolio, key highlights, financial performance, and strategies
- Key companies covered as a part of this study include Amkor Technology Inc., Advanced Semiconductor Engineering (ASE), Taiwan Semiconductor Manufacturing Company (TSMC), Intel, Samsung Electronics, JCET Group, ASMPT SMT Solutions, IPC International, Inc., SEMICON, Yole Group, and Prodrive Technologies B.V.
- Insights from this report would allow marketers and the management authorities of the companies to make informed decisions regarding their future product launches, type up-gradation, market expansion, and marketing tactics
- The global advanced packaging market report caters to various stakeholders in this industry including investors, suppliers, product manufacturers, distributors, new entrants, and financial analysts
- Stakeholders would have ease in decision-making through various strategy matrices used in analyzing the global advanced packaging market
Market Segmentation
- Packaging Type Insights (Revenue, USD Bn, 2020 - 2032)
- Flip-Chip
- Fan-Out WLP
- Embedded-Die
- Fan-In WLP
- 5D/3D
- Others
- Application Insights (Revenue, USD Bn, 2020 - 2032)
- Consumer Electronics
- Automotive
- Industrial
- Healthcare
- Aerospace & Defense
- Others
- End-use Industry Insights (Revenue, USD Bn, 2020 - 2032)
- Semiconductors
- Consumer Goods
- Food & Beverage
- Pharmaceuticals
- Regional Insights (Revenue, USD Bn, 2020 - 2032)
- North America
- U.S.
- Canada
- Latin America
- Brazil
- Argentina
- Mexico
- Rest of Latin America
- Europe
- Germany
- U.K.
- Spain
- France
- Italy
- Russia
- Rest of Europe
- Asia Pacific
- China
- India
- Japan
- Australia
- South Korea
- ASEAN
- Rest of Asia Pacific
- Middle East
- GCC Countries
- Israel
- Rest of Middle East
- Africa
- South Africa
- North Africa
- Central Africa
- Key Players Insights
- Amkor Technology Inc.
- Advanced Semiconductor Engineering (ASE)
- Taiwan Semiconductor Manufacturing Company (TSMC)
- Intel
- Samsung Electronics
- JCET Group
- ASMPT SMT Solutions
- IPC International, Inc.
- SEMICON
- Yole Group
- Prodrive Technologies B.V.
Table of Contents
1. Research Objectives and Assumptions
- Research Objectives
- Assumptions
- Abbreviations
2. Market Purview
- Report Description
- Market Definition and Scope
- Executive Summary
- Global Advanced Packaging Market, By Packaging Type
- Global Advanced Packaging Market, By Application
- Global Advanced Packaging Market, By End-use Industry
- Global Advanced Packaging Market, By Region
3. Market Dynamics, Regulations, and Trends Analysis
- Market Dynamics
- Impact Analysis
- Key Highlights
- Regulatory Scenario
- Product Launches/Approvals
- PEST Analysis
- PORTER's Analysis
- Market Opportunities
- Regulatory Scenario
- Key Developments
- Industry Trends
4. Global Advanced Packaging Market, By Packaging Type, 2020-2032, (USD Bn)
- Introduction
- Market Share Analysis, 2025 and 2032 (%)
- Y-o-Y Growth Analysis, 2021 - 2032
- Segment Trends
- Flip-Chip
- Introduction
- Market Size and Forecast, and Y-o-Y Growth, 2020-2032, (USD Bn)
- Fan-Out WLP
- Introduction
- Market Size and Forecast, and Y-o-Y Growth, 2020-2032, (USD Bn)
- Embedded-Die
- Introduction
- Market Size and Forecast, and Y-o-Y Growth, 2020-2032, (USD Bn)
- Fan-In WLP
- Introduction
- Market Size and Forecast, and Y-o-Y Growth, 2020-2032, (USD Bn)
- 5D/3D
- Introduction
- Market Size and Forecast, and Y-o-Y Growth, 2020-2032, (USD Bn)
- Others
- Introduction
- Market Size and Forecast, and Y-o-Y Growth, 2020-2032, (USD Bn)
5. Global Advanced Packaging Market, By Application, 2020-2032, (USD Bn)
- Introduction
- Market Share Analysis, 2025 and 2032 (%)
- Y-o-Y Growth Analysis, 2021 - 2032
- Segment Trends
- Consumer Electronics
- Introduction
- Market Size and Forecast, and Y-o-Y Growth, 2020-2032, (USD Bn)
- Automotive
- Introduction
- Market Size and Forecast, and Y-o-Y Growth, 2020-2032, (USD Bn)
- Industrial
- Introduction
- Market Size and Forecast, and Y-o-Y Growth, 2020-2032, (USD Bn)
- Healthcare
- Introduction
- Market Size and Forecast, and Y-o-Y Growth, 2020-2032, (USD Bn)
- Aerospace & Defense
- Introduction
- Market Size and Forecast, and Y-o-Y Growth, 2020-2032, (USD Bn)
- Others
- Introduction
- Market Size and Forecast, and Y-o-Y Growth, 2020-2032, (USD Bn)
6. Global Advanced Packaging Market, By End-use Industry, 2020-2032, (USD Bn)
- Introduction
- Market Share Analysis, 2025 and 2032 (%)
- Y-o-Y Growth Analysis, 2021 - 2032
- Segment Trends
- Semiconductors
- Introduction
- Market Size and Forecast, and Y-o-Y Growth, 2020-2032, (USD Bn)
- Consumer Goods
- Introduction
- Market Size and Forecast, and Y-o-Y Growth, 2020-2032, (USD Bn)
- Food & Beverage
- Introduction
- Market Size and Forecast, and Y-o-Y Growth, 2020-2032, (USD Bn)
- Pharmaceuticals
- Introduction
- Market Size and Forecast, and Y-o-Y Growth, 2020-2032, (USD Bn)
7. Global Advanced Packaging Market, By Region, 2020 - 2032, Value (USD Bn)
- Introduction
- Market Share (%) Analysis, 2025, 2028 & 2032, Value (USD Bn)
- Market Y-o-Y Growth Analysis (%), 2021 - 2032, Value (USD Bn)
- Regional Trends
- North America
- Introduction
- Market Size and Forecast, By Packaging Type, 2020 - 2032, Value (USD Bn)
- Market Size and Forecast, By Application, 2020 - 2032, Value (USD Bn)
- Market Size and Forecast, By End-use Industry, 2020 - 2032, Value (USD Bn)
- Market Size and Forecast, By Country, 2020 - 2032, Value (USD Bn)
- U.S.
- Canada
- Latin America
- Introduction
- Market Size and Forecast, By Packaging Type, 2020 - 2032, Value (USD Bn)
- Market Size and Forecast, By Application, 2020 - 2032, Value (USD Bn)
- Market Size and Forecast, By End-use Industry, 2020 - 2032, Value (USD Bn)
- Market Size and Forecast, By Country, 2020 - 2032, Value (USD Bn)
- Brazil
- Argentina
- Mexico
- Rest of Latin America
- Europe
- Introduction
- Market Size and Forecast, By Packaging Type, 2020 - 2032, Value (USD Bn)
- Market Size and Forecast, By Application, 2020 - 2032, Value (USD Bn)
- Market Size and Forecast, By End-use Industry, 2020 - 2032, Value (USD Bn)
- Market Size and Forecast, By Country, 2020 - 2032, Value (USD Bn)
- Germany
- U.K.
- Spain
- France
- Italy
- Russia
- Rest of Europe
- Asia Pacific
- Introduction
- Market Size and Forecast, By Packaging Type, 2020 - 2032, Value (USD Bn)
- Market Size and Forecast, By Application, 2020 - 2032, Value (USD Bn)
- Market Size and Forecast, By End-use Industry, 2020 - 2032, Value (USD Bn)
- Market Size and Forecast, By Country, 2020 - 2032, Value (USD Bn)
- China
- India
- Japan
- Australia
- South Korea
- ASEAN
- Rest of Asia Pacific
- Middle East
- Introduction
- Market Size and Forecast, By Packaging Type, 2020 - 2032, Value (USD Bn)
- Market Size and Forecast, By Application, 2020 - 2032, Value (USD Bn)
- Market Size and Forecast, By End-use Industry, 2020 - 2032, Value (USD Bn)
- Market Size and Forecast, By Country, 2020 - 2032, Value (USD Bn)
- GCC Countries
- Israel
- Rest of Middle East
- Africa
- Introduction
- Market Size and Forecast, By Packaging Type, 2020 - 2032, Value (USD Bn)
- Market Size and Forecast, By Application, 2020 - 2032, Value (USD Bn)
- Market Size and Forecast, By End-use Industry, 2020 - 2032, Value (USD Bn)
- Market Size and Forecast, By Country/Region, 2020 - 2032, Value (USD Bn)
- South Africa
- North Africa
- Central Africa
8. Competitive Landscape
- Amkor Technology Inc.
- Company Highlights
- Product Portfolio
- Key Developments
- Financial Performance
- Strategies
- Advanced Semiconductor Engineering (ASE)
- Company Highlights
- Product Portfolio
- Key Developments
- Financial Performance
- Strategies
- Taiwan Semiconductor Manufacturing Company (TSMC)
- Company Highlights
- Product Portfolio
- Key Developments
- Financial Performance
- Strategies
- Intel
- Company Highlights
- Product Portfolio
- Key Developments
- Financial Performance
- Strategies
- Samsung Electronics
- Company Highlights
- Product Portfolio
- Key Developments
- Financial Performance
- Strategies
- JCET Group
- Company Highlights
- Product Portfolio
- Key Developments
- Financial Performance
- Strategies
- ASMPT SMT Solutions
- Company Highlights
- Product Portfolio
- Key Developments
- Financial Performance
- Strategies
- IPC International, Inc.
- Company Highlights
- Product Portfolio
- Key Developments
- Financial Performance
- Strategies
- SEMICON
- Company Highlights
- Product Portfolio
- Key Developments
- Financial Performance
- Strategies
- Yole Group
- Company Highlights
- Product Portfolio
- Key Developments
- Financial Performance
- Strategies
- Prodrive Technologies B.V.
- Company Highlights
- Product Portfolio
- Key Developments
- Financial Performance
- Strategies
9. Analyst Recommendations
- Wheel of Fortune
- Analyst View
- Coherent Opportunity Map
10. References and Research Methodology
- References
- Research Methodology
- About us
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