자동차용 반도체 시장: 시장 점유율 분석, 산업 동향, 통계, 성장 예측(2025-2030년)

The automotive semiconductor market size reached USD 100.48 billion in 2025 and is forecast to expand at a 7.29% CAGR, lifting the market value to USD 142.87 billion in 2030.

Mounting electrification mandates, rapid adoption of advanced driver-assistance features, and the pivot toward software-defined vehicles are pushing silicon content higher across every vehicle class. Automakers are racing to secure long-term foundry capacity, and the spread of zonal architectures is concentrating spend on high-performance processors, memory, and power devices. Supply-chain resiliency programs combined with multi-sourcing strategies are reshaping procurement, while wide-bandgap devices and integrated power modules open fresh design-in opportunities that sustain pricing power even as mature-node components normalize.

Global Automotive Semiconductor Market Trends and Insights

Electrification Boosting Semiconductor Content Per Vehicle

Battery-electric platforms add power electronics, battery-management ICs, and thermal-management controllers absent in internal-combustion models. The transition from 400 V to 800 V electrical systems demands silicon-carbide (SiC) MOSFETs that sustain higher voltages with lower switching losses. Infineon's trench-based SiC super-junction devices deliver 40% lower resistance and 25% higher current capability, enabling smaller traction inverters and faster charging times. NXP's ultra-wideband wireless battery-management system removes heavy cabling, trims vehicle weight, and frees space for higher energy-density packs. Higher-voltage architectures also need reinforced isolation, gate drivers, and precision current sensors that command premium average selling prices. Collectively, these factors lift semiconductor dollar content per EV to multiples of conventional vehicles.

Rising Demand for Advanced Safety and Comfort Systems

Level 2+ driver-assistance packages integrate multi-modal sensor suites-radar, LiDAR, and high-resolution cameras-producing terabytes of data per hour. Real-time sensor-fusion workloads require application-specific processors and embedded neural-network accelerators. NXP's 28 nm RFCMOS radar one-chip family now offers 360-degree coverage and built-in AI object classification, cutting bill-of-materials and simplifying system architecture. Complementary optical innovations, such as ams OSRAM's eight-channel pulsed lasers, deliver 1,000 W peak optical power, extending LiDAR range for highway autopilot features. Regulatory demands under ISO 26262 reinforce the adoption of redundant compute paths and safety diagnostics, further elevating silicon spend.

Persistent Supply-Chain Constraints and Chip Shortages

Automotive lead times remain longer than consumer electronics norms, especially for mature-node microcontrollers, sensors, and analog components. Specialized automotive-grade packaging capacity is heavily concentrated in East Asia, creating single points of failure. To address geographic risk, GlobalFoundries and NXP broadened their collaboration on 22FDX production split between Dresden and New York, giving automakers a dual-sourced pathway that meets Grade 1 qualification.Automakers are now embedding foundry capacity clauses into long-term supply agreements to shield vehicle launches from component shortages.

Other drivers and restraints analyzed in the detailed report include:

1. Zonal E/E Architectures and Software-Defined Vehicles Spur High-End Processors
2. SiC and GaN Power Devices Adoption in EV Powertrains
3. Scarcity and Cost of Wide-Bandgap Substrates (SiC/GaN)

For complete list of drivers and restraints, kindly check the Table Of Contents.

Segment Analysis

Integrated circuits represented USD 86.6 billion of the automotive semiconductor market size in 2024 and are forecast to post an 8.5% CAGR through 2030. Microcontrollers lead the pack as gateway, body, and powertrain domains migrate to higher clock speeds and expanded memory footprints. Infineon captured 28.5% share of the automotive semiconductor market within microcontrollers by expanding its AURIX family to a RISC-V architecture, reinforcing the segment's technological churn. Analog ICs retain a pivotal role in power management, sensor interfacing, and voltage regulation, although system-on-chip consolidation exerts price pressure on older node devices.

Discrete devices, optoelectronics, and sensor/MEMS categories account for the balance. Discrete IGBTs and MOSFETs underpin traction inverters and relay-replacement switches, but design-ins increasingly favor integrated power modules that collapse multiple dies into a single substrate. Optoelectronics benefit from adaptive LED lighting and emerging LiDAR units, while MEMS accelerometers, gyros, and pressure sensors proliferate across ADAS and comfort features. Zonal architectures bundle former standalone components into higher-value ICs, explaining why integrated circuits continue to outpace the wider automotive semiconductor market.

Automotive Semiconductor Market Report is Segmented by Device Type (Discrete Semiconductors [Diodes, and More], Optoelectronics [Laser Diodes, and More], Sensors and MEMS [Pressure, Actuators, and More], and Integrated Circuits), Business Model (IDM, and Design/ Fabless Vendor), and Geography (North America, South America, Europe, Asia-Pacific, and Middle East and Africa). The Market Forecasts are Provided in Terms of Value (USD).

Geography Analysis

Asia-Pacific commanded 71.5% of automotive semiconductor shipments in 2024 and is expected to grow at a 7.8% CAGR to 2030. China's new-energy vehicle penetration surpassed 39% in 2024, and more than 300 domestic chip design firms were established that year to chase Beijing's 100% sourcing target. Shanghai-based Horizon Robotics secured major design wins, claiming 33.97% share of local ADAS processor volume, while foundry SMIC set a 10% automotive revenue goal for 2026 production. India is scaling its semiconductor ecosystem under the USD 76,000 crore India Semiconductor Mission; approved proposals total USD 21 billion, including display and ultralow-power AI partnerships between Tata Electronics, Himax, and PSMC.

North America ranks second, buoyed by the USD 39 billion CHIPS and Science Act incentives and marquee projects such as TSMC's USD 6.6 billion Arizona expansion. Tesla inked a USD 16.5 billion, eight-year wafer-supply pact with Samsung, locking in advanced-node capacity for autonomous-driving silicon manufactured in Texas. Canada's Semiconductor Council added Infineon as a member to drive policy alignment on electric-mobility value chains.

Europe pursues strategic autonomy via the EUR 43 billion (USD 48.6 billion) EU Chips Act, aiming to capture 20% global output by 2030. STMicroelectronics broke ground on an integrated SiC fab in Catania, Italy, while a Dresden consortium secured EUR 5 billion (USD 5.7 billion) in state aid for a new logic facility. Automakers such as Stellantis co-develop power-conversion systems with Infineon, ensuring preferential access to SiC MOSFET supply. The Middle East, Africa, and South America remain nascent but exhibit double-digit EV adoption trajectories, positioning them as future growth nodes once local supply chains mature.

1. NXP Semiconductors N.V.
2. Infineon Technologies AG
3. Renesas Electronics Corporation
4. STMicroelectronics N.V.
5. Texas Instruments Inc.
6. Toshiba Electronic Devices & Storage Corp.
7. Micron Technology Inc.
8. onsemi
9. Analog Devices Inc.
10. Robert Bosch GmbH (Semiconductor Division)
11. ROHM Co., Ltd.
12. NVIDIA Corporation
13. Qualcomm Technologies Inc.
14. Intel Corporation (Mobileye)
15. Samsung Electronics Co., Ltd. (System LSI)
16. MediaTek Inc.
17. BYD Semiconductor Co. Ltd.
18. Semtech Corporation
19. Diodes Incorporated
20. Microchip Technology Inc.
21. Melexis NV
22. Elmos Semiconductor SE
23. Allegro Microsystems, Inc.
24. Skyworks Solutions, Inc.
25. Ambarella Inc.
26. Wolfspeed Inc.

Additional Benefits:

• The market estimate (ME) sheet in Excel format
• 3 months of analyst support

TABLE OF CONTENTS

1 INTRODUCTION

• 1.1 Study Assumptions and Market Definition
• 1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET LANDSCAPE

• 4.1 Market Overview
• 4.2 Market Drivers
  • 4.2.1 Increasing vehicle production in emerging economies
  • 4.2.2 Rising demand for advanced safety and comfort systems
  • 4.2.3 Electrification boosting semiconductor content per vehicle
  • 4.2.4 Zonal E/E architectures and software-defined vehicles spur high-end processors
  • 4.2.5 Government subsidies for auto-grade foundry capacity
  • 4.2.6 SiC and GaN power devices adoption in EV powertrains
• 4.3 Market Restraints
  • 4.3.1 High cost of advanced-feature vehicles
  • 4.3.2 Persistent supply-chain constraints and chip shortages
  • 4.3.3 Scarcity and cost of wide-bandgap substrates (SiC/GaN)
  • 4.3.4 Lengthy automotive qualification cycles slow time-to-market
• 4.4 Industry Value Chain Analysis
• 4.5 Regulatory Landscape
• 4.6 Technological Outlook
• 4.7 RF Device Demand in Autonomous Vehicles
• 4.8 Porter's Five Forces Analysis
  • 4.8.1 Bargaining Power of Suppliers
  • 4.8.2 Bargaining Power of Buyers
  • 4.8.3 Threat of New Entrants
  • 4.8.4 Threat of Substitute Products
  • 4.8.5 Intensity of Competitive Rivalry
• 4.9 Investment Analysis
• 4.10 Impact of Macroeconomic Trends

5 MARKET SIZE AND GROWTH FORECASTS (VALUE)

• 5.1 By Device Type (Shipment Volume for Device Type is Complementary)
  • 5.1.1 Discrete Semiconductors
    • 5.1.1.1 Diodes
    • 5.1.1.2 Transistors
    • 5.1.1.3 Power Transistors
    • 5.1.1.4 Rectifier and Thyristor
    • 5.1.1.5 Other Discrete Devices
  • 5.1.2 Optoelectronics
    • 5.1.2.1 Light-Emitting Diodes (LEDs)
    • 5.1.2.2 Laser Diodes
    • 5.1.2.3 Image Sensors
    • 5.1.2.4 Optocouplers
    • 5.1.2.5 Other Device Types
  • 5.1.3 Sensors and MEMS
    • 5.1.3.1 Pressure
    • 5.1.3.2 Magnetic Field
    • 5.1.3.3 Actuators
    • 5.1.3.4 Acceleration and Yaw Rate
    • 5.1.3.5 Temperature and Others
  • 5.1.4 Integrated Circuits
    • 5.1.4.1 By Integrated Circuit Type
    • 5.1.4.1.1 Analog
    • 5.1.4.1.2 Micro
    • 5.1.4.1.2.1 Microprocessors (MPU)
    • 5.1.4.1.2.2 Microcontrollers (MCU)
    • 5.1.4.1.2.3 Digital Signal Processors
    • 5.1.4.1.3 Logic
    • 5.1.4.1.4 Memory
    • 5.1.4.2 By Technology Node (Shipment Volume Not Applicable)
    • 5.1.4.2.1 < 3nm
    • 5.1.4.2.2 3nm
    • 5.1.4.2.3 5nm
    • 5.1.4.2.4 7nm
    • 5.1.4.2.5 16nm
    • 5.1.4.2.6 28nm
    • 5.1.4.2.7 > 28nm
• 5.2 By Business Model
  • 5.2.1 IDM
  • 5.2.2 Design/ Fabless Vendor
• 5.3 By Geography
  • 5.3.1 North America
    • 5.3.1.1 United States
    • 5.3.1.2 Canada
    • 5.3.1.3 Mexico
  • 5.3.2 South America
    • 5.3.2.1 Brazil
    • 5.3.2.2 Argentina
    • 5.3.2.3 Rest of South America
  • 5.3.3 Europe
    • 5.3.3.1 Germany
    • 5.3.3.2 United Kingdom
    • 5.3.3.3 France
    • 5.3.3.4 Italy
    • 5.3.3.5 Spain
    • 5.3.3.6 Rest of Europe
  • 5.3.4 Asia-Pacific
    • 5.3.4.1 China
    • 5.3.4.2 Japan
    • 5.3.4.3 South Korea
    • 5.3.4.4 India
    • 5.3.4.5 Rest of Asia-Pacific
  • 5.3.5 Middle East and Africa
    • 5.3.5.1 Middle East
    • 5.3.5.1.1 Saudi Arabia
    • 5.3.5.1.2 United Arab Emirates
    • 5.3.5.1.3 Turkey
    • 5.3.5.1.4 Rest of Middle East
    • 5.3.5.2 Africa
    • 5.3.5.2.1 South Africa
    • 5.3.5.2.2 Nigeria
    • 5.3.5.2.3 Egypt
    • 5.3.5.2.4 Rest of Africa

6 COMPETITIVE LANDSCAPE

• 6.1 Market Concentration
• 6.2 Strategic Moves
• 6.3 Market Share Analysis
• 6.4 Company Profiles {(includes Global level Overview, Market level overview, Core Segments, Financials as available, Strategic Information, Market Rank/Share for key companies, Products and Services, and Recent Developments)}
  • 6.4.1 NXP Semiconductors N.V.
  • 6.4.2 Infineon Technologies AG
  • 6.4.3 Renesas Electronics Corporation
  • 6.4.4 STMicroelectronics N.V.
  • 6.4.5 Texas Instruments Inc.
  • 6.4.6 Toshiba Electronic Devices & Storage Corp.
  • 6.4.7 Micron Technology Inc.
  • 6.4.8 onsemi
  • 6.4.9 Analog Devices Inc.
  • 6.4.10 Robert Bosch GmbH (Semiconductor Division)
  • 6.4.11 ROHM Co., Ltd.
  • 6.4.12 NVIDIA Corporation
  • 6.4.13 Qualcomm Technologies Inc.
  • 6.4.14 Intel Corporation (Mobileye)
  • 6.4.15 Samsung Electronics Co., Ltd. (System LSI)
  • 6.4.16 MediaTek Inc.
  • 6.4.17 BYD Semiconductor Co. Ltd.
  • 6.4.18 Semtech Corporation
  • 6.4.19 Diodes Incorporated
  • 6.4.20 Microchip Technology Inc.
  • 6.4.21 Melexis NV
  • 6.4.22 Elmos Semiconductor SE
  • 6.4.23 Allegro Microsystems, Inc.
  • 6.4.24 Skyworks Solutions, Inc.
  • 6.4.25 Ambarella Inc.
  • 6.4.26 Wolfspeed Inc.

7 MARKET OPPORTUNITIES AND FUTURE OUTLOOK

• 7.1 White-space and Unmet-Need Assessment