미국의 고출력 LED 패키지 시장 : 점유율 분석, 업계 동향과 통계, 성장 예측(2026-2031년)

According to Mordor Intelligence, the united states high-power LED package market size is expected to increase from USD 0.86 billion in 2025 to USD 0.88 billion in 2026 and reach USD 1.03 billion by 2031, growing at a CAGR of 3.16% over 2026-2031.

This report is Segmented by Power Range (1 W To 3 W, 3 W To 10 W, and Above 10 W), Architecture (Single-Die Packages, Multi-Die Packages, COB, and More), and Application (General Lighting, Automotive Lighting, Display and Backlighting, and More). The Market Forecasts are Provided in Terms of Value (USD).

United States High-Power LED Package Market Trends and Insights

Surge In Miniaturized High-Power LED Adoption For Horticulture Lighting

In controlled-environment agriculture, the shift toward compact LED packages with wall-plug efficiencies above 80% is reshaping vertical farming economics. These advanced packages deliver photosynthetic photon flux densities exceeding 2,000 µmol m-2 s-1, while second-generation emitters now achieve an impressive 4.1 µmol J-1. As a result, growers can reduce the number of fixtures required, lower HVAC loads due to improved efficiency, and realize payback periods of less than 18 months, making high-performance LEDs a cornerstone of sustainable indoor farming.

Energy-Efficiency Mandates Driving Retrofit Demand In Commercial Buildings

The Department of Energy has set a minimum standard of 45 lumens per watt for general-service lamps. In California, Title 24's open-ADR rules, combined with widespread utility rebates, have successfully incentivized 78% of the state's population. These measures have led to a significant pivot towards networked luminaires. These advanced luminaires now commonly integrate 3 to 10-watt packages equipped with demand-response capabilities. This shift is enabling quicker recovery of initial costs, even with the impending June 2026 expiration of Section 179D deductions.

Thermal Management Challenges Above 10 W Limiting Reliability

Packages that cross the 10-watt threshold face significant thermal management challenges, as heat dissipation becomes non-linear without advanced substrates like aluminum nitride (AlN) or silicon nitride (Si3N4). When these substrates are absent, the elevated junction temperatures can cause luminous efficacy to decline by roughly 5% for every 10 °C increase, which directly undermines performance in demanding applications. This thermal stress also compromises long-term reliability, with LM-80 testing often failing to project the desired 50,000-hour L90 lifetime, making substrate choice a critical determinant of both efficiency and durability.

Other drivers and restraints analyzed in the detailed report include:

1. Declining Cost Of High Thermal Conductivity Substrates
2. Advances In Flip-Chip Architecture Enabling Higher Lumen Density
3. Patent Litigation Risk Around CSP And Flip-Chip Packages

For complete list of drivers and restraints, kindly check the Table Of Contents.

Segment Analysis

Packages of 1 W-3 W retained 48.77% of the United States high-power LED package market share in 2025, anchored in downlights and troffers that value mature footprints and price competition. Growth, however, is shifting upward: the above 10 W band is on a 3.58% CAGR trajectory to 2031 as vertical farms and matrix headlamps demand superior photon density. The United States high-power LED package market size for the above 10 W class benefits from premium pricing that offsets the 40-60% material uplift tied to aluminum nitride substrates.

Controlled-environment cultivators in California and Arizona tolerate higher capex because a single-percentage-point jump in efficacy can shave USD 8,000-12,000 from annual energy bills. Automotive OEMs echo this dynamic, Tesla's 2026 matrix system deploys dozens of high-flux dies to paint glare-free beams, a feature impossible with lower-wattage devices. Suppliers that can secure high-conductivity substrates and meet AEC-Q102 grades are therefore outpacing commodity package makers.

List of Companies Covered in this Report:

1. Nichia Corporation
2. Cree LED, an SGH Company
3. Lumileds Holding B.V.
4. Osram Opto Semiconductors GmbH
5. Seoul Semiconductor Co., Ltd.
6. Samsung Electronics Co., Ltd.
7. LG Innotek Co., Ltd.
8. Everlight Electronics Co., Ltd.
9. Luminus Devices, Inc.
10. Bridgelux, Inc.
11. Lite-On Technology Corporation
12. Toyoda Gosei Co., Ltd.
13. Epistar Corporation
14. Dominant Opto Technologies Sdn. Bhd.
15. Edison Opto Corporation
16. Citizen Electronics Co., Ltd.
17. ProPhotonix Limited
18. Crystal IS Inc.
19. TT Electronics plc
20. Advanced Optoelectronic Technology Inc.

Additional Benefits:

• The market estimate (ME) sheet in Excel format
• 3 months of analyst support

TABLE OF CONTENTS

1 INTRODUCTION

• 1.1 Study Assumptions and Market Definition
• 1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET LANDSCAPE

• 4.1 Market Overview
• 4.2 Industry Supply-Chain Analysis
• 4.3 Market Drivers
  • 4.3.1 Surge in Miniaturized High-Power LED Adoption for Horticulture Lighting
  • 4.3.2 Energy-Efficiency Mandates Driving Retrofit Demand in Commercial Buildings
  • 4.3.3 Declining Cost of High Thermal Conductivity Substrates
  • 4.3.4 Advances in Flip-Chip Architecture Enabling Higher Lumen Density
  • 4.3.5 Automotive Adaptive Headlamp Regulations (FMVSS-108 Updates)
  • 4.3.6 Integration of Smart Controls with High-Power LED Modules in Street Lighting
• 4.4 Market Restraints
  • 4.4.1 Thermal Management Challenges Above 10 W Limiting Reliability
  • 4.4.2 Patent Litigation Risk Around CSP and Flip-Chip Packages
  • 4.4.3 Volatility in Gallium Nitride Wafer Pricing
  • 4.4.4 Slowdown in LCD Backlight Replacement Cycle Due to OLED Penetration
• 4.5 Regulatory Landscape
• 4.6 Technological Outlook
• 4.7 Impact of Macroeconomic Factors
• 4.8 Porter's Five Forces Analysis
  • 4.8.1 Bargaining Power of Suppliers
  • 4.8.2 Bargaining Power of Buyers
  • 4.8.3 Threat of New Entrants
  • 4.8.4 Threat of Substitutes
  • 4.8.5 Intensity of Competitive Rivalry

5 MARKET SIZE AND GROWTH FORECASTS (VALUE)

• 5.1 By Power Range
  • 5.1.1 1 W - 3 W
  • 5.1.2 3 W - 10 W
  • 5.1.3 Above 10 W
• 5.2 By Architecture
  • 5.2.1 Single-die Packages (SMD / Discrete)
  • 5.2.2 Multi-die Packages (SMD)
  • 5.2.3 COB (Chip-on-Board)
  • 5.2.4 Others (CSP, Flip-Chip, Hybrid Modules)
• 5.3 By Application
  • 5.3.1 General Lighting
  • 5.3.2 Automotive Lighting
  • 5.3.3 Display and Backlighting
  • 5.3.4 Specialty / Niche

6 COMPETITIVE LANDSCAPE

• 6.1 Market Concentration
• 6.2 Strategic Moves
• 6.3 Market Share Analysis
• 6.4 Company Profiles (includes Global Level Overview, Market Level Overview, Core Segments, Financials as available, Strategic Information, Market Rank/Share, Products and Services, Recent Developments)
  • 6.4.1 Nichia Corporation
  • 6.4.2 Cree LED, an SGH Company
  • 6.4.3 Lumileds Holding B.V.
  • 6.4.4 Osram Opto Semiconductors GmbH
  • 6.4.5 Seoul Semiconductor Co., Ltd.
  • 6.4.6 Samsung Electronics Co., Ltd.
  • 6.4.7 LG Innotek Co., Ltd.
  • 6.4.8 Everlight Electronics Co., Ltd.
  • 6.4.9 Luminus Devices, Inc.
  • 6.4.10 Bridgelux, Inc.
  • 6.4.11 Lite-On Technology Corporation
  • 6.4.12 Toyoda Gosei Co., Ltd.
  • 6.4.13 Epistar Corporation
  • 6.4.14 Dominant Opto Technologies Sdn. Bhd.
  • 6.4.15 Edison Opto Corporation
  • 6.4.16 Citizen Electronics Co., Ltd.
  • 6.4.17 ProPhotonix Limited
  • 6.4.18 Crystal IS Inc.
  • 6.4.19 TT Electronics plc
  • 6.4.20 Advanced Optoelectronic Technology Inc.

7 MARKET OPPORTUNITIES AND FUTURE OUTLOOK

• 7.1 White-Space and Unmet-Need Assessment