중국의 고출력 LED 패키지 시장 : 점유율 분석, 업계 동향과 통계, 성장 예측(2026-2031년)

According to Mordor Intelligence, the china high-power LED package market size is projected to expand from USD 1.30 billion in 2025 and USD 1.36 billion in 2026 to USD 1.79 billion by 2031, registering a CAGR of 5.64% between 2026-2031.

This report is Segmented by Power Range (1W-3W, 3W-10W, and Above 10W), Architecture (Single-Die Packages, Multi-Die Packages, COB, and More), Application (General Lighting, Automotive Lighting, Display and Backlighting, and Specialty/Niche). The Market Forecasts are Provided in Terms of Value (USD).

China High-Power LED Package Market Trends and Insights

Rapid Mini and Micro-LED Adoption Demanding Higher Drive Currents

Mini and Micro-LED backlights now ship in premium televisions, tablets, and automotive instrument clusters, increasing per-unit LED counts ten-fold compared with edge-lit designs. Bonding tens of millions of sub-100-micrometer chips per panel pushes local heat flux above 20 W cm-2, so packagers are redesigning thermal interfaces and spreading layers to handle die currents that exceed 1 A in automotive projection modules. Domestic suppliers have installed automated mass-transfer tools and copper-core boards to cut defect density, yet wafer-to-wafer emission-wavelength uniformity remains a hurdle for seamless tiling in ultra-high-definition displays.

Growth of Adaptive Matrix Headlamps in New Energy Vehicles

China sold 12.87 million New Energy Vehicles in 2024, lifting NEV penetration to 40.9% of passenger-car sales. Each mid-range sedan already carries at least 100 controllable pixels per headlamp, and flagship models integrate more than 25,000, driving demand for chip-on-board or single-chip pixelated LEDs qualified to AEC-Q101. Vertical integration moves, such as the Sanan-Lumileds deal, trimmed chip cost nearly 30% and opened European luxury OEM supply chains to Chinese die.

Price Compression From Over-Capacity in Guangdong and Jiangxi

Large-scale capacity expansions between 2022-2024 created a supply glut that cut average selling prices 30-40%. Although precious-metal cost inflation triggered a brief price rebound in 2025-2026, margin recovery remains fragile as buyers in commodity lighting easily defer purchases or down-spec drive currents. Asset sales and mergers, such as a recent stake purchase in Purui Optoelectronics, illustrate ongoing rationalization.

Other drivers and restraints analyzed in the detailed report include:

1. LED Subsidy Roll-Offs Steering Suppliers Toward High-Efficiency Packages
2. ERP Standards Tightening for Public-Lighting Installations
3. Thermal-Management Limits Above 10 W in Compact Form Factors

For complete list of drivers and restraints, kindly check the Table Of Contents.

Segment Analysis

The China high-power LED package market size for the 1 W-3 W tier remained the largest in 2025, buoyed by retrofit downlights and streetlighting. However, improved chip efficacy lets luminaire makers replace several low-watt packages with a single Above 10 W emitter, cutting driver count and assembly labor. Packages at or above 10 W already command the fastest growth, underpinned by adaptive driving-beam modules and industrial high-bay fixtures that operate above 1 A. Ceramic substrates delivering sub-1 K W-1 thermal resistance and gold-tin die attach are becoming standard, even though they raise unit cost, because they enable long-term lumen maintenance at currents that were once impractical.

Thermal innovations are also disrupting the mid-range. Copper-core metal-core boards lower thermal resistance to roughly 1.3 K W-1 at one-third the cost of aluminum-nitride ceramics, but solder-joint fatigue emerges above 12 W during the -40 °C to 125 °C automotive test cycle. The 1 W-3 W tier therefore faces gradual share erosion as designers opt for fewer high-current nodes once thermal hurdles are cleared. The trend amplifies vertical-integration advantages enjoyed by large Chinese packagers that control substrate pressing, phosphor compounding, and driver electronics in-house.

List of Companies Covered in this Report:

1. Sanan Optoelectronics Co., Ltd.
2. Nationstar Optoelectronics Co., Ltd.
3. MLS Co., Ltd.
4. Hongli Zhihui Group Co., Ltd.
5. Refond Optoelectronics Co., Ltd.
6. Lextar Electronics Corp.
7. Everlight Electronics Co., Ltd.
8. Cree LED (Smart Global Holdings, Inc.)
9. Nichia Corporation
10. Seoul Semiconductor Co., Ltd.
11. Osram Opto Semiconductors GmbH
12. Lumileds Holding B.V.
13. Dominant Opto Technologies Sdn. Bhd.
14. Shenzhen Jufei Optoelectronics Co., Ltd.
15. Kingsun Optoelectronic Co., Ltd.
16. Sharp Corporation
17. Samsung Electronics Co., Ltd.
18. LG Innotek Co., Ltd.
19. Lite-On Technology Corporation
20. HC SemiTek Corporation

Additional Benefits:

• The market estimate (ME) sheet in Excel format
• 3 months of analyst support

TABLE OF CONTENTS

1 INTRODUCTION

• 1.1 Study Assumptions and Market Definition
• 1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET LANDSCAPE

• 4.1 Market Overview
• 4.2 Market Drivers
  • 4.2.1 LED Subsidy Roll-offs Steering Suppliers Toward High-Efficiency Packages
  • 4.2.2 Rapid Mini/Micro-LED Adoption Demanding Higher Drive Currents
  • 4.2.3 ERP Standards Tightening for Public Lighting Installations
  • 4.2.4 Growth of Adaptive Matrix Headlamps in New Energy Vehicles
  • 4.2.5 Smart Factory Retrofits Requiring High-Lux Illumination
  • 4.2.6 Surge in UV-C Disinfection Modules in Semiconductor Fabs
• 4.3 Market Restraints
  • 4.3.1 Price Compression from Over-capacity in Guangdong and Jiangxi
  • 4.3.2 Thermal-Management Limits Above 10 W in Compact Form-Factors
  • 4.3.3 High Import Dependence for Flip-Chip Gold-Bump Equipment
  • 4.3.4 PFAS Regulation Increasing Encapsulation Costs
• 4.4 Technology Analysis
• 4.5 Regulatory Landscape
• 4.6 Impact of Macroeconomic Factors
• 4.7 Porter's Five Forces Analysis
  • 4.7.1 Bargaining Power of Suppliers
  • 4.7.2 Bargaining Power of Buyers
  • 4.7.3 Threat of New Entrants
  • 4.7.4 Threat of Substitutes
  • 4.7.5 Intensity of Competitive Rivalry

5 MARKET SIZE AND GROWTH FORECASTS (VALUE)

• 5.1 By Power Range
  • 5.1.1 1 W - 3 W
  • 5.1.2 3 W - 10 W
  • 5.1.3 Above 10 W
• 5.2 By Architecture
  • 5.2.1 Single-die Packages (SMD / Discrete)
  • 5.2.2 Multi-die Packages (SMD)
  • 5.2.3 COB (Chip-on-Board)
  • 5.2.4 Others (CSP, Flip-chip, Hybrid Modules)
• 5.3 By Application
  • 5.3.1 General Lighting
  • 5.3.2 Automotive Lighting
  • 5.3.3 Display and Backlighting
  • 5.3.4 Specialty / Niche

6 COMPETITIVE LANDSCAPE

• 6.1 Market Concentration
• 6.2 Strategic Moves
• 6.3 Market Share Analysis
• 6.4 Company Profiles (includes Global Level Overview, Market Level Overview, Core Segments, Financials as available, Strategic Information, Market Rank/Share, Products and Services, Recent Developments)
  • 6.4.1 Sanan Optoelectronics Co., Ltd.
  • 6.4.2 Nationstar Optoelectronics Co., Ltd.
  • 6.4.3 MLS Co., Ltd.
  • 6.4.4 Hongli Zhihui Group Co., Ltd.
  • 6.4.5 Refond Optoelectronics Co., Ltd.
  • 6.4.6 Lextar Electronics Corp.
  • 6.4.7 Everlight Electronics Co., Ltd.
  • 6.4.8 Cree LED (Smart Global Holdings, Inc.)
  • 6.4.9 Nichia Corporation
  • 6.4.10 Seoul Semiconductor Co., Ltd.
  • 6.4.11 Osram Opto Semiconductors GmbH
  • 6.4.12 Lumileds Holding B.V.
  • 6.4.13 Dominant Opto Technologies Sdn. Bhd.
  • 6.4.14 Shenzhen Jufei Optoelectronics Co., Ltd.
  • 6.4.15 Kingsun Optoelectronic Co., Ltd.
  • 6.4.16 Sharp Corporation
  • 6.4.17 Samsung Electronics Co., Ltd.
  • 6.4.18 LG Innotek Co., Ltd.
  • 6.4.19 Lite-On Technology Corporation
  • 6.4.20 HC SemiTek Corporation

7 MARKET OPPORTUNITIES AND FUTURE OUTLOOK

• 7.1 White-Space and Unmet-Need Assessment