AI 가속기용 DRAM 시장 : 시장 점유율 분석, 업계 동향 및 통계, 성장 예측(2026-2031년)

According to Mordor Intelligence, the DRAM for AI accelerator market size was valued at USD 18.8 billion in 2025 and is forecast to reach USD 82.9 billion by 2031, at a CAGR of 27.3% from 2026 to 2031.

This report is Segmented by Memory Architecture (HBM-Based DRAM, GDDR-Based DRAM, and DDR Based DRAM), AI Accelerator Type (GPU, AI Accelerator ASIC, FPGA, and CPU With AI Acceleration), Capacity Per Module/Stack (Up To 16 GB, 16 GB To 32 GB, 32 GB To 64 GB, 64 GB To 128 GB, and More), Application (Training, Inference, and More), and Geography. The Market Forecasts are Provided in Terms of Value (USD).

Global DRAM For AI Accelerator Market Trends and Insights

Rising HBM Attach Rates in AI GPU Platforms

The DRAM for AI accelerator market is being pushed higher as leading AI GPUs now treat HBM as a core requirement rather than an optional memory choice. NVIDIA's B200 carries 192 GB of HBM3e at 8 TB/s bandwidth, and the Rubin generation scales to 288 GB of HBM4 per GPU. At rack scale, NVIDIA stated that 72 Rubin GPUs pool their HBM into a 13.5 TB coherent memory fabric, demonstrating how memory capacity and interconnect design are advancing together. That architecture keeps HBM demand high even if accelerator shipment growth becomes less linear, because more memory is being attached to each deployed device. Google's June 2026 paper on TPU system evolution also confirmed a 10x increase in HBM capacity and bandwidth per training node across five generations. In the DRAM for AI accelerator market, that pattern supports sustained value growth because memory content per compute node continues to increase with each platform cycle.

Shift From General-Purpose DRAM to Bandwidth-Optimized Memory Stacks

The DRAM for AI accelerator market is also advancing because the memory discussion has shifted from raw capacity toward bandwidth efficiency and stack architecture. JEDEC released the JESD270-4 HBM4 standard in April 2025, defining a 2,048-bit interface, 32 independent channels, data rates up to 8 Gbps, and support for up to 64 GB per stack. That publication matters because it gives buyers and system designers a clear interoperability baseline for the next memory generation. The same standards path continued in December 2025, when JEDEC disclosed work on SPHBM4 to deliver HBM4-level throughput with reduced pin count. As a result, DRAM for AI accelerator market is benefiting from a more formal migration toward bandwidth-optimized stacks rather than repeated tuning of conventional DRAM formats. This change also supports longer product cycles for HBM platforms because customers can now plan around standards-based scaling rather than one-off implementation paths.

HBM Packaging Bottlenecks and Limited Advanced Substrate Capacity

The DRAM for AI accelerator market continues to face a real cap from advanced packaging and substrate readiness, even as memory demand remains strong. Samsung's commercial HBM4 program uses a 4nm base die and achieves up to 3.3 TB/s per stack, demonstrating the level of process integration now required for leading AI memory products. In July 2026, Samsung Electronics and SK Hynix committed KRW 240 trillion (USD 155 billion) in the Chungcheong region to new HBM fabrication plants and advanced packaging facilities, underscoring the extent of downstream capacity that still needs to be built. The scale of that investment shows that packaging remains a bottleneck large enough to shape supplier strategy and regional capital allocation. When packaging lines lag wafer output, memory dies alone do not translate into a finished accelerator supply. That is why the DRAM for AI accelerator market still faces near-term supply friction, even while spending on capacity is accelerating.

Other drivers and restraints analyzed in the detailed report include:

1. Rapid Growth in AI Server Cluster Memory Density Requirements
2. Increase in Multi-GPU Server Configurations and Memory Pooling Demand
3. High Qualification Barriers for New DRAM Suppliers

For complete list of drivers and restraints, kindly check the Table Of Contents.

Segment Analysis

HBM-Based DRAM held 78.4% of the DRAM for AI accelerator market share in 2025, and is also projected to expand at a 28.2% CAGR through 2031. That lead reflects how AI accelerator memory is now being selected on bandwidth, density, and system efficiency rather than on conventional cost-per-bit logic alone. Google's June 2026 TPU paper showed a 10x increase in HBM capacity and bandwidth per training node across five generations, which helps explain why HBM has moved from a premium option to a core platform requirement. JEDEC's HBM4 standard also formalized the next step in this migration, with up to 64 GB per stack and a much wider interface structure for high-throughput computing. In the DRAM for AI accelerator industry, that combination makes HBM the reference architecture for frontier AI deployments.

GDDR-Based DRAM remains relevant in the DRAM for AI accelerator market, where cost-sensitive inference systems need a lower memory bill than HBM-heavy training hardware. Its role is strongest in workloads that can accept lower packaging complexity while still requiring meaningful bandwidth. DDR-Based DRAM continues to sit in the system memory layer of AI servers, where it supports orchestration, data movement, and host-side buffering rather than direct high-bandwidth accelerator execution. As rack-scale AI systems become more coherent, DDR still matters, but its strategic role is shifting from core accelerator memory toward support memory across the full server design. The result is that the DRAM for AI accelerator market is not moving entirely away from other memory types, but it is clearly assigning them narrower roles within an HBM-centered architecture stack.

GPU platforms accounted for 74.4% of the DRAM for AI accelerator market size in 2025, while AI accelerator ASICs are forecast to grow at 28.2% through 2031. GPUs keep the lead because they remain the default choice for hyperscaler training clusters and broad AI software compatibility. At the same time, custom ASIC programs are gaining traction because large cloud providers want better cost control and tighter alignment between memory, interconnect, and model-serving behavior. Google's TPU 8i features 288 GB of HBM and 8,601 GB/s of bandwidth, demonstrating how quickly proprietary accelerator programs are closing the capability gap with mainstream GPU platforms. In the DRAM for AI accelerator market, this means procurement growth is expanding beyond a single dominant accelerator category, even as GPUs still control the largest installed base.

FPGA-based accelerators hold a smaller position, but they retain value in low-latency communications, financial computing, and targeted deployment environments where reconfigurability remains important. CPUs with AI acceleration also maintain a place in enterprise inference setups that prioritize compatibility with established server infrastructure and broader software support. That keeps the DRAM for AI accelerator market tied to multiple compute paths rather than a single hardware template. Even so, the strongest growth pressure is still shifting toward products that can support large HBM footprints and high parallel memory throughput. The net effect is that GPUs continue to define present-day volume, while ASICs are shaping where future memory demand expands fastest in the DRAM for AI accelerator market.

Complete Report Scope:

• By Memory Architecture
  • HBM Based DRAM
  • GDDR Based DRAM
  • DDR Based DRAM
• By AI Accelerator Type
  • GPU
  • AI Accelerator ASIC
  • FPGA
  • CPU with AI Acceleration
• By Capacity Per Module or Stack
  • Up to 16 GB
  • 16 GB to 32 GB
  • 32 GB to 64 GB
  • 64 GB to 128 GB
  • Above 128 GB
• By Application
  • Training
  • Inference
  • High Performance Computing
  • Professional Visualization
• By End User
  • Hyperscale Cloud Service Providers
  • AI Server and System OEMs
  • Semiconductor Companies
  • Research and Academic Institutions
• By Geography
  • North America
  • Europe
  • Asia Pacific
    • China
    • Japan
    • South Korea
    • Taiwan
    • Rest of Asia Pacific
  • Rest of the World

Geography Analysis

North America represented 44.9% of the DRAM for AI accelerator market size in 2025. The region leads because the largest hyperscaler capital programs remain concentrated in the United States, where model development and AI infrastructure build-outs are still centered. That demand pattern keeps the DRAM for AI accelerator market closely tied to the purchasing behavior of Microsoft, Google, Amazon, and Meta, even when production takes place elsewhere. The United States also shapes the regulatory environment for advanced memory. The Bureau of Industry and Security added HBM to ECCN 3A090.c in its December 2024 rule and extended related export controls to shipments involving China and Macau, thereby reinforcing North America's central role in the allied-country supply chain.

Europe remains a smaller regional block in the DRAM for AI accelerator market, and its demand is rising from a lower starting base. The region is supported by sovereign AI programs, local data center investments, and enterprise interest in inference infrastructure that meets data residency requirements. That gives Europe a steadier adoption profile, with greater emphasis on controlled deployment and compliance-readiness than on the largest frontier training clusters. The region does not yet match North America on spending scale, but it remains relevant because local deployment requirements continue to create demand for high-bandwidth AI systems.

Asia-Pacific is the fastest-growing regional segment in the DRAM for AI accelerator market, with a projected CAGR of 28.1% through 2031. The region plays a dual role as both the main production base for advanced DRAM and a rising demand center for AI compute infrastructure. In July 2026, Samsung Electronics and SK Hynix committed KRW 240 trillion, or USD 155 billion, in South Korea's Chungcheong region for new HBM fabrication plants and advanced packaging facilities. Micron also broke ground on its Hiroshima expansion in July 2026 to strengthen HBM production capacity in Japan. The Rest of the World segment remains early-stage, but sovereign AI spending in parts of the Middle East is beginning to pull more of the DRAM for AI accelerator market into new deployment geographies.

1. SK Hynix Inc.
2. Samsung Electronics Co., Ltd.
3. Micron Technology, Inc.
4. NVIDIA Corporation
5. Advanced Micro Devices, Inc.
6. Intel Corporation
7. SK Hynix System IC Inc.
8. Rambus Inc.
9. United Microelectronics Corporation
10. Taiwan Semiconductor Manufacturing Company Limited
11. Amkor Technology, Inc.
12. ASE Technology Holding Co., Ltd.
13. Micron Semiconductor Asia Pte. Ltd.
14. Samsung Semiconductor, Inc.
15. Kingston Technology Company, Inc.
16. G.SKILL International Enterprise Co., Ltd.
17. Corsair Gaming, Inc.
18. Team Group Inc.
19. Powerchip Semiconductor Manufacturing Corporation
20. Nanya Technology Corporation

Additional Benefits:

• The market estimate (ME) sheet in Excel format
• 3 months of analyst support

TABLE OF CONTENTS

1 INTRODUCTION

• 1.1 Study Assumptions and Market Definition
• 1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET LANDSCAPE

• 4.1 Market Overview
• 4.2 Market Drivers
  • 4.2.1 Rising HBM Attach Rates in AI GPU Platforms
  • 4.2.2 Shift From General Purpose DRAM to Bandwidth Optimized Memory Stacks
  • 4.2.3 Rapid Growth in AI Server Cluster Memory Density Requirements
  • 4.2.4 Increase in Multi-GPU Server Configurations and Memory Pooling Demand
  • 4.2.5 Yield Improvement and Capacity Expansion in HBM Supply Chains
  • 4.2.6 Expanding Use of GDDR in Cost Sensitive AI Inference GPUs
• 4.3 Market Restraints
  • 4.3.1 HBM Packaging Bottlenecks and Limited Advanced Substrate Capacity
  • 4.3.2 High Qualification Barriers for New DRAM Suppliers
  • 4.3.3 Memory Allocation Competition From General Server DDR Demand
  • 4.3.4 Export Controls and Geopolitical Constraints on Advanced Memory Supply
• 4.4 Industry Supply Chain Analysis
• 4.5 Regulatory Landscape
• 4.6 Technological Outlook
• 4.7 Impact of Macroeconomic Factors on the Market
• 4.8 Porter's Five Forces Analysis
  • 4.8.1 Bargaining Power of Suppliers
  • 4.8.2 Bargaining Power of Buyers
  • 4.8.3 Threat of New Entrants
  • 4.8.4 Threat of Substitutes
  • 4.8.5 Intensity of Competitive Rivalry

5 MARKET SIZE AND GROWTH FORECASTS (VALUE)

• 5.1 By Memory Architecture
  • 5.1.1 HBM Based DRAM
  • 5.1.2 GDDR Based DRAM
  • 5.1.3 DDR Based DRAM
• 5.2 By AI Accelerator Type
  • 5.2.1 GPU
  • 5.2.2 AI Accelerator ASIC
  • 5.2.3 FPGA
  • 5.2.4 CPU with AI Acceleration
• 5.3 By Capacity Per Module or Stack
  • 5.3.1 Up to 16 GB
  • 5.3.2 16 GB to 32 GB
  • 5.3.3 32 GB to 64 GB
  • 5.3.4 64 GB to 128 GB
  • 5.3.5 Above 128 GB
• 5.4 By Application
  • 5.4.1 Training
  • 5.4.2 Inference
  • 5.4.3 High Performance Computing
  • 5.4.4 Professional Visualization
• 5.5 By End User
  • 5.5.1 Hyperscale Cloud Service Providers
  • 5.5.2 AI Server and System OEMs
  • 5.5.3 Semiconductor Companies
  • 5.5.4 Research and Academic Institutions
• 5.6 By Geography
  • 5.6.1 North America
  • 5.6.2 Europe
  • 5.6.3 Asia Pacific
    • 5.6.3.1 China
    • 5.6.3.2 Japan
    • 5.6.3.3 South Korea
    • 5.6.3.4 Taiwan
    • 5.6.3.5 Rest of Asia Pacific
  • 5.6.4 Rest of the World

6 COMPETITIVE LANDSCAPE

• 6.1 Market Concentration
• 6.2 Strategic Moves
• 6.3 Market Share Analysis
• 6.4 Company Profiles (includes Global Level Overview, Market Level Overview, Core Segments, Financials as available, Strategic Information, Products and Services, Recent Developments)
  • 6.4.1 SK Hynix Inc.
  • 6.4.2 Samsung Electronics Co., Ltd.
  • 6.4.3 Micron Technology, Inc.
  • 6.4.4 NVIDIA Corporation
  • 6.4.5 Advanced Micro Devices, Inc.
  • 6.4.6 Intel Corporation
  • 6.4.7 SK Hynix System IC Inc.
  • 6.4.8 Rambus Inc.
  • 6.4.9 United Microelectronics Corporation
  • 6.4.10 Taiwan Semiconductor Manufacturing Company Limited
  • 6.4.11 Amkor Technology, Inc.
  • 6.4.12 ASE Technology Holding Co., Ltd.
  • 6.4.13 Micron Semiconductor Asia Pte. Ltd.
  • 6.4.14 Samsung Semiconductor, Inc.
  • 6.4.15 Kingston Technology Company, Inc.
  • 6.4.16 G.SKILL International Enterprise Co., Ltd.
  • 6.4.17 Corsair Gaming, Inc.
  • 6.4.18 Team Group Inc.
  • 6.4.19 Powerchip Semiconductor Manufacturing Corporation
  • 6.4.20 Nanya Technology Corporation

7 MARKET OPPORTUNITIES AND FUTURE OUTLOOK

• 7.1 White-Space and Unmet-Need Assessment