SRAM 및 ROM 설계용 IP : 시장 점유율 분석, 산업 동향 및 통계 데이터, 성장 예측(2026-2031년)

According to Mordor Intelligence, the SRAM and ROM Design IP market size was valued at USD 614.79 million in 2025 and estimated to grow from USD 629.42 million in 2026 to reach USD 707.98 million by 2031, at a CAGR of 2.38% during the forecast period (2026-2031).

This report is Segmented by Memory Type (SRAM, ROM, and More), Application (Consumer Electronics, Telecommunications and Networking, and More), Technology Node (<=14nm, 15-22nm, 28-40nm, and >=45nm), IP Delivery Type (Hard IP, Soft IP, and More), and Geography (North America, South America, Europe, Asia Pacific, Middle East, and Africa). The Market Forecasts are Provided in Terms of Value (USD).

Global SRAM And ROM Design IP Market Trends and Insights

Proliferation of AI-centric SoCs demanding large on-chip cache

Inference accelerators now integrate as much as 40 MB of SRAM to store weights and feature maps, far eclipsing the 8-16 MB found in general-purpose processors. Compute-in-memory variants place arithmetic operations directly inside the bit cell to reduce data movement energy, creating new compiler requirements. Sovereign-AI initiatives in multiple regions add volume by funding domestic chip programs that insist on locally verified memory IP. Three-dimensional stacking through-silicon vias further raises cache ceilings while preserving the footprint. Vendors capable of shipping multi-gigahertz, low-leakage SRAM macros with exhaustive timing corners are best positioned to capitalize on this upswing.

5G and edge-computing roll-outs accelerating low-power embedded SRAM adoption

Edge servers and IoT nodes require sub-1V memory blocks that retain data across a temperature range of -40 °C to 125 °C. Next-generation IP now posts leakage below one nanoampere per megabit by combining multi-threshold transistors with power-gating cells. Dynamic body-biasing allows designers to trade standby power for access speed on a minute-to-minute basis. In parallel, 5G baseband ASICs rely on dual-port SRAM that is finely tuned for burst packet buffering. These stringent power profiles raise the bar for characterization depth and corner validation, favoring suppliers with silicon-proven data across multiple foundries.

Pricing pressure from open-source memory compilers eroding ASPs

Community projects tied to the RISC-V ecosystem now deliver free SRAM generators for mature nodes, undercutting commercial offerings in cost-sensitive wearables and toys. Universities further seed libraries, giving fabless teams a quick path to first silicon. Vendors defend their margins by emphasizing the reduction of leakage, coverage of corners, and safety packages that open-source flows often lack. Nonetheless, entry-level revenue streams continue to compress.

Other drivers and restraints analyzed in the detailed report include:

1. Transition from eFlash to MRAM below 28 nm unlocking new licensing revenue streams
2. Automotive Grade-1 functional-safety rules boosting qualified memory IP demand
3. Export-control compliance hurdles for Chinese tape-outs

For complete list of drivers and restraints, kindly check the Table Of Contents.

Segment Analysis

SRAM retained 60.05% share of the SRAM and ROM Design IP market in 2025, a testament to its unmatched speed in cache and buffer roles. The segment climbs modestly in absolute dollars as AI accelerators and 5G switches request fatter on-die slices. In parallel, ROM families, including PROM, EPROM, and EEPROM, serve as boot code and calibration tables, but gradually shrink as system-on-chip consolidation removes discrete blocks. The SRAM and ROM Design IP market size associated with MRAM and other non-volatile newcomers remains modest, yet their position strengthens once eFlash reaches a capacity limit below 28 nm.

Licensing tied to embedded flash and alternative NVM grows at the fastest rate, with a 3.72% CAGR, because IoT microcontrollers and automotive ECUs require durable code storage. Multi-technology compilers that couple SRAM's speed with MRAM's persistence underpin hybrid arrays entering pilot production. Vendors versed in both volatility domains command a pricing premium, especially when they can map identical logical interfaces across processes, trimming firmware porting risk.

Consumer devices held 36.10% of the SRAM and ROM Design IP market share in 2025, driven by smartphones, tablets, and consoles that demand ever-richer graphics and local AI capabilities. Design cycles remain brisk, but capacity gains plateau as vendors recycle board real estate for cameras and antennas. Telecommunications ASICs rely on dual-port SRAM tuned for <1 ns latency to maintain line-rate packet forwarding, a niche that rewards compiler flexibility.

Automotive and transportation IP bookings are projected to rise at a 4.9% CAGR to 2031, driven by the demand for advanced driver-assistance systems that require multi-gigabyte on-chip arrays paired with ASIL-D diagnostics. The SRAM and ROM Design IP market size exposed to Grade-1 functional safety, therefore, increases faster than any other vertical. Aerospace and defense requests remain small in volume, yet they yield high average selling prices because radiation-hardened libraries undergo rigorous qualification.

Complete Report Scope:

• By Memory Type
  • SRAM
  • ROM (PROM / EPROM / EEPROM)
  • MRAM
  • Embedded Flash / Other NVM
• By Application
  • Consumer Electronics
  • Telecommunications and Networking
  • Automotive and Transportation
  • Industrial and IoT
  • Aerospace and Defense
  • Other Applications
• By Technology Node
  • <=14 nm
  • 15 - 22 nm
  • 28 - 40 nm
  • >=45 nm
• By IP Delivery Type
  • Hard IP
  • Soft IP
  • Parameterised Compiler IP
  • Chiplet / 3D Die-level IP
• By Geography
  • North America
    • United States
    • Canada
    • Mexico
  • South America
    • Brazil
    • Argentina
    • Rest of South America
  • Europe
    • Germany
    • United Kingdom
    • France
    • Italy
    • Spain
    • Rest of Europe
  • Asia Pacific
    • China
    • Japan
    • India
    • South Korea
    • South-East Asia
    • Rest of Asia Pacific
  • Middle East
    • Saudi Arabia
    • United Arab Emirates
    • Turkey
    • Rest of Middle East
  • Africa
    • South Africa
    • Nigeria
    • Rest of Africa

Geography Analysis

The Asia Pacific held 46.85% of the SRAM and ROM Design IP market revenue in 2025 and is projected to grow at a 3.82% CAGR through 2031. Foundry clusters in Taiwan, South Korea, and mainland China lower tape-out costs, while national subsidy schemes bankroll indigenous compiler projects. Japan contributes safety-focused macros tailored for Tier-1 automotive suppliers and industrial robotics, reinforcing regional breadth.

North America commands the lion's share of bleeding-edge design starts as Silicon Valley startups and hyperscale cloud vendors race to release proprietary AI silicon. The CHIPS Act funnels fresh capital into domestic fabs, catalyzing on-shore IP verification labs and opening grant channels for smaller houses. Automotive Tier-1s in Detroit partner with aerospace primes to request radiation-hard, ASIL-D compliant macros, tapping into high-margin niches.

Europe focuses on automotive and industrial automation, leveraging Germany's OEM ecosystem and stringent enforcement of ISO 26262. Nordic countries supply ultra-low-power memories for harsh environments, while France and Italy explore sovereign computing initiatives that favor local IP. Overall, continental demand tilts toward reliability and functional safety credentials over raw density.

1. Arm Ltd.
2. Synopsys Inc.
3. Cadence Design Systems Inc.
4. Siemens EDA (Mentor Graphics Corporation)
5. eMemory Technology Inc.
6. Silvaco Inc.
7. Dolphin Design SAS
8. VeriSilicon Holdings Co. Ltd.
9. SureCore Ltd.
10. Xilinx Inc.
11. Renesas Electronics Corporation
12. Everspin Technologies Inc.
13. Avalanche Technology Inc.
14. TDK Corporation
15. Kilopass Technology Inc.
16. Silicon Storage Technology Inc.
17. GSI Technology Inc.
18. Dolphin Technology Inc.
19. TekStart LLC
20. Flex Logix Technologies Inc.
21. Rambus Inc.

Additional Benefits:

• The market estimate (ME) sheet in Excel format
• 3 months of analyst support

TABLE OF CONTENTS

1 INTRODUCTION

• 1.1 Study Assumptions and Market Definition
• 1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET LANDSCAPE

• 4.1 Market Overview
• 4.2 Market Drivers
  • 4.2.1 Proliferation of AI-centric SoCs demanding large on-chip cache
  • 4.2.2 5G and edge-computing roll-outs accelerating low-power embedded SRAM adoption
  • 4.2.3 Transition from eFlash to MRAM below 28 nm unlocking new licensing revenue streams
  • 4.2.4 Automotive Grade-1 functional-safety rules boosting qualified memory IP demand
  • 4.2.5 Chiplet architectures standardising die-to-die memory IP requirements
  • 4.2.6 Foundry turnkey memory-compiler programs shortening time-to-market for fabless firms
• 4.3 Market Restraints
  • 4.3.1 Pricing pressure from open-source memory compilers eroding ASPs
  • 4.3.2 Emerging ReRAM/FeRAM alternatives cannibalising small ROM IP sockets
  • 4.3.3 Export-control compliance hurdles for Chinese tape-outs
  • 4.3.4 Reliability headwinds for ?7 nm SRAM bit-cells inflating qualification cost
• 4.4 Industry Ecosystem Analysis
• 4.5 Impact of Macroeconomic Factors
• 4.6 Technological Outlook
• 4.7 Porter's Five Forces Analysis
  • 4.7.1 Threat of New Entrants
  • 4.7.2 Bargaining Power of Suppliers
  • 4.7.3 Bargaining Power of Buyers
  • 4.7.4 Threat of Substitutes
  • 4.7.5 Competitive Rivalry

5 MARKET SIZE AND GROWTH FORECASTS (VALUE)

• 5.1 By Memory Type
  • 5.1.1 SRAM
  • 5.1.2 ROM (PROM / EPROM / EEPROM)
  • 5.1.3 MRAM
  • 5.1.4 Embedded Flash / Other NVM
• 5.2 By Application
  • 5.2.1 Consumer Electronics
  • 5.2.2 Telecommunications and Networking
  • 5.2.3 Automotive and Transportation
  • 5.2.4 Industrial and IoT
  • 5.2.5 Aerospace and Defense
  • 5.2.6 Other Applications
• 5.3 By Technology Node
  • 5.3.1 <=14 nm
  • 5.3.2 15 - 22 nm
  • 5.3.3 28 - 40 nm
  • 5.3.4 >=45 nm
• 5.4 By IP Delivery Type
  • 5.4.1 Hard IP
  • 5.4.2 Soft IP
  • 5.4.3 Parameterised Compiler IP
  • 5.4.4 Chiplet / 3D Die-level IP
• 5.5 By Geography
  • 5.5.1 North America
    • 5.5.1.1 United States
    • 5.5.1.2 Canada
    • 5.5.1.3 Mexico
  • 5.5.2 South America
    • 5.5.2.1 Brazil
    • 5.5.2.2 Argentina
    • 5.5.2.3 Rest of South America
  • 5.5.3 Europe
    • 5.5.3.1 Germany
    • 5.5.3.2 United Kingdom
    • 5.5.3.3 France
    • 5.5.3.4 Italy
    • 5.5.3.5 Spain
    • 5.5.3.6 Rest of Europe
  • 5.5.4 Asia Pacific
    • 5.5.4.1 China
    • 5.5.4.2 Japan
    • 5.5.4.3 India
    • 5.5.4.4 South Korea
    • 5.5.4.5 South-East Asia
    • 5.5.4.6 Rest of Asia Pacific
  • 5.5.5 Middle East
    • 5.5.5.1 Saudi Arabia
    • 5.5.5.2 United Arab Emirates
    • 5.5.5.3 Turkey
    • 5.5.5.4 Rest of Middle East
  • 5.5.6 Africa
    • 5.5.6.1 South Africa
    • 5.5.6.2 Nigeria
    • 5.5.6.3 Rest of Africa

6 COMPETITIVE LANDSCAPE

• 6.1 Market Concentration
• 6.2 Strategic Moves
• 6.3 Market Share Analysis
• 6.4 Company Profiles (includes Global level Overview, Market level overview, Core Segments, Financials as available, Strategic Information, Market Rank/Share for key companies, Products and Services, and Recent Developments)
  • 6.4.1 Arm Ltd.
  • 6.4.2 Synopsys Inc.
  • 6.4.3 Cadence Design Systems Inc.
  • 6.4.4 Siemens EDA (Mentor Graphics Corporation)
  • 6.4.5 eMemory Technology Inc.
  • 6.4.6 Silvaco Inc.
  • 6.4.7 Dolphin Design SAS
  • 6.4.8 VeriSilicon Holdings Co. Ltd.
  • 6.4.9 SureCore Ltd.
  • 6.4.10 Xilinx Inc.
  • 6.4.11 Renesas Electronics Corporation
  • 6.4.12 Everspin Technologies Inc.
  • 6.4.13 Avalanche Technology Inc.
  • 6.4.14 TDK Corporation
  • 6.4.15 Kilopass Technology Inc.
  • 6.4.16 Silicon Storage Technology Inc.
  • 6.4.17 GSI Technology Inc.
  • 6.4.18 Dolphin Technology Inc.
  • 6.4.19 TekStart LLC
  • 6.4.20 Flex Logix Technologies Inc.
  • 6.4.21 Rambus Inc.

7 MARKET OPPORTUNITIES AND FUTURE OUTLOOK

• 7.1 White-space and Unmet-Need Assessment