프로그래머블 ASIC 시장 : 시장 점유율 분석, 업계 동향 및 통계, 성장 예측(2026-2031년)

According to Mordor Intelligence, the programmable ASIC market size was valued at USD 20.22 billion in 2025 and estimated to grow from USD 21.99 billion in 2026 to reach USD 33.51 billion by 2031, at a CAGR of 8.79% during the forecast period (2026-2031).

This report is Segmented by ASIC Type (Structured ASIC, Full-Custom ASIC, and More), End-Use Industry (Consumer Electronics, Telecommunications and Networking, and More), Application (AI/ML Accelerators, IoT/Edge Devices, and More), Process Node (above 28 Nm, 16/14 Nm, 10/7 Nm, and 5/4/3 Nm), and Geography. The Market Forecasts are Provided in Terms of Value (USD).

Global Programmable ASIC Market Trends and Insights

Proliferation of IoT and Edge Devices

Growth in connected-sensor endpoints is prompting OEMs to favor silicon that balances low-power operation with the headroom to execute evolving algorithms. Programmable ASICs meet this need by delivering a power-per-operation profile that outperforms microcontrollers yet retains post-fabrication flexibility. Shipments of AI-enabled wearables, for example, surpassed 10 million units in 2025, illustrating volume economics that justify custom masks. Hardware-rooted security functions embedded at the metal-layer level help makers comply with pending device-authentication regulations. As smart-home appliances, industrial probes and medical wearables converge around always-on inference, the programmable ASIC market is expected to benefit from a steady migration away from purely software-defined solutions.

Adoption of AI/ML Accelerators

Cloud operators now view proprietary inference engines as a hedge against GPU supply constraints and as an efficiency lever capable of trimming total cost of ownership by up to 40% on workload-stable fleets. Customer demand for high-bandwidth memory, vector engines and low-latency interconnects has moved the center of gravity toward chiplet-enabled structured ASICs, which offer a middle path between FPGAs and full-custom silicon. Industry leaders that can pair advanced-node design with vertically integrated packaging have already secured multi-year purchase commitments, underscoring the durable pull of AI-specific devices in the programmable ASIC market.

High NRE and Mask Costs at Advanced Nodes

Steep non-recurring engineering outlays at 3 nm and below are discouraging lower-volume projects and pushing mid-tier customers toward structured or mature-node alternatives. Design teams must master complex tool chains and guard-band for variability, inflating both schedule and tape-out risk. Foundry concentration amplifies bargaining asymmetry: wafer pricing at leading nodes continues to rise as capacity books out 12 months in advance, limiting agile pivots to new designs.

Other drivers and restraints analyzed in the detailed report include:

1. Rapid Deployment of 5G Infrastructure
2. Chiplet-Based Heterogeneous Integration
3. Foundry Capacity Constraints and Supply Shocks

For complete list of drivers and restraints, kindly check the Table Of Contents.

Segment Analysis

Structured designs accounted for 38.05% of programmable ASIC market revenue in 2025, underscoring their status as the default option for projects that demand moderate customization with lower tape-out risk. Because only the top metal layers vary, mask sets can be turned around faster and at a fraction of full-custom cost, letting OEMs hit consumer-electronics rhythms without ceding performance. In contrast, RF ASICs, buoyed by 5G mmWave and satellite-link deployments, are forecast to post a 9.42% CAGR to 2031, the swiftest clip among all device classes. RF variants integrate low-noise amplifiers, phase shifters and power stages into single die, eliminating board-level tuning steps that once slowed carrier certification.

Full-custom implementations remain indispensable where watt-per-tera-operation efficiency drives hyperscale economics, but they now coexist with chiplet-sized structured blocks inside the same multichip modules. Mixed-signal flavors are gaining visibility as IoT nodes, automotive radar and smart-factory sensors all require high-accuracy ADCs stitched to digital logic. Crucially, the advent of dielectric bridge packaging is letting foundries marry analog-optimized mature nodes with bleeding-edge compute tiles, raising the ceiling on structured ASIC applicability without penalizing bill-of-materials cost.

Mobile and home-entertainment brands kept consumer electronics at the top of the revenue table in 2025, driven by demand for display engines, connectivity chipsets and battery-life optimizers that exceed the efficiency envelope of off-the-shelf processors. The shift toward edge AI audio and video enhances silicon content per device, locking in a multi-year refresh cycle favorable to the programmable ASIC market. Automotive OEMs, while smaller by shipment volume, are staging the fastest proportional gains as software-defined vehicles roll out centralized compute and zonal architectures. Safety-critical requirements under ISO 26262 necessitate deterministic timing and hardware redundancy that programmable ASICs are well-placed to deliver.

Industrial equipment builders and collaborative-robot manufacturers are also ramping custom silicon footprints, attracted by the ability to fuse real-time control loops with machine-vision acceleration inside fan-less thermal envelopes. In the medical domain, wearable biosensors and imaging modalities are leveraging ultra-low-power front-ends supplied on validated 180 nm and 110 nm nodes, reaffirming that mature-node programmability remains commercially relevant. Telecom vendors continue to lean on high-throughput network processors that embed adaptive pipelines capable of future standards upgrade, reinforcing the segment's steady mid-single-digit growth outlook.

Complete Report Scope:

• By ASIC Type
  • Structured ASIC
  • Full-Custom ASIC
  • Platform / Semi-Custom ASIC
  • Mixed-Signal ASIC
  • RF ASIC
• By End-Use Industry
  • Consumer Electronics
  • Telecommunications and Networking
  • Automotive and Transportation
  • Industrial and Robotics
  • Aerospace and Defense
  • Healthcare
  • Others
• By Application
  • AI/ML Accelerators
  • IoT / Edge Devices
  • 5G / Networking Infrastructure
  • Data Center and Cloud
  • Automotive ADAS and Electrification
  • Medical Devices
  • Industrial Control and PLCs
• By Process Node
  • above 28 nm
  • 16/14 nm
  • 10/7 nm
  • 5/4/3 nm
• By Geography
  • North America
    • United States
    • Canada
  • South America
    • Brazil
    • Argentina
    • Rest of South America
  • Europe
    • Germany
    • France
    • United Kingdom
    • Italy
    • Russia
    • Rest of Europe
  • Asia Pacific
    • China
    • Japan
    • India
    • South Korea
    • Australia
    • Rest of Asia Pacific
  • Middle East and Africa
    • Middle East
      • Saudi Arabia
      • UAE
      • Turkey
      • Rest of Middle East
    • Africa
      • South Africa
      • Nigeria
      • Kenya
      • Rest of Africa

Geography Analysis

North America topped 2025 revenue tables at a 38.20% programmable ASIC market share, an outcome propelled by hyperscale data-center investments, CHIPS Act incentives and long-standing design-service density clustered around Silicon Valley, Austin and Phoenix. Domestic foundry expansions, Intel's USD 20 billion Arizona build-out among them, strengthen local supply resilience while opening advanced-node access for defense-oriented secure devices.

Asia Pacific is primed for the quickest 2026-2031 climb at a forecast 9.61% CAGR, anchored by sovereign capacity drives in China, South Korea's vertically integrated memory-logic supercluster, and Japan's equipment and materials depth. Capital expenditure pledges north of USD 470 billion across the region through 2028 support both mature and bleeding-edge capacity adds, lowering entry hurdles for regional fab-less startups.

Europe maintains a disciplined growth trajectory, using functional-safety regulation and carbon-neutral manufacturing goals to differentiate its automotive and industrial electronics sectors. Localized wafer fabrication initiatives in Germany and the planned TSMC Dresden joint venture are expected to add downstream packaging and test ecosystems, giving EU system houses shorter supply lines and IP-protection assurances.

1. Intel Corporation
2. Broadcom Inc.
3. Marvell Technology, Inc.
4. AMD (Xilinx)
5. Microchip Technology Inc. (Microsemi)
6. Lattice Semiconductor Corporation
7. QuickLogic Corporation
8. Taiwan Semiconductor Manufacturing Co. Ltd.
9. Samsung Electronics Co., Ltd. (Samsung Foundry)
10. GlobalFoundries Inc.
11. United Microelectronics Corporation
12. Fujitsu Semiconductor Ltd.
13. STMicroelectronics N.V.
14. Infineon Technologies AG
15. NXP Semiconductors N.V.
16. onsemi Corporation
17. Texas Instruments Incorporated
18. Renesas Electronics Corporation
19. Faraday Technology Corporation
20. Global Unichip Corp.
21. Andes Technology Corporation
22. Skyworks Solutions, Inc.
23. Dialog Semiconductor plc
24. Analog Devices, Inc.

Additional Benefits:

• The market estimate (ME) sheet in Excel format
• 3 months of analyst support

TABLE OF CONTENTS

1 INTRODUCTION

• 1.1 Study Assumptions and Market Definition
• 1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET LANDSCAPE

• 4.1 Market Overview
• 4.2 Market Drivers
  • 4.2.1 Proliferation of IoT and edge devices
  • 4.2.2 Adoption of AI/ML accelerators
  • 4.2.3 Rapid deployment of 5G infrastructure
  • 4.2.4 Automotive shift toward ADAS and electrification
  • 4.2.5 Chiplet-based heterogeneous integration boosts structured ASIC uptake
  • 4.2.6 Defense push for on-shore secure reconfigurable ASICs (CHIPS Act)
• 4.3 Market Restraints
  • 4.3.1 High NRE and mask costs at advanced nodes
  • 4.3.2 Foundry capacity constraints and supply shocks
  • 4.3.3 Rising design complexity lengthening time-to-market
  • 4.3.4 Open-source hardware (RISC-V) diluting proprietary ASIC demand
• 4.4 Industry Value Chain Analysis
• 4.5 Regulatory Landscape
• 4.6 Technological Outlook
• 4.7 Porter's Five Forces Analysis
  • 4.7.1 Bargaining Power of Suppliers
  • 4.7.2 Bargaining Power of Buyers
  • 4.7.3 Threat of New Entrants
  • 4.7.4 Threat of Substitutes
  • 4.7.5 Intensity of Competitive Rivalry
• 4.8 Investment and Funding Trends
• 4.9 Impact of Macroeconomic Factors

5 MARKET SIZE AND GROWTH FORECASTS (VALUE)

• 5.1 By ASIC Type
  • 5.1.1 Structured ASIC
  • 5.1.2 Full-Custom ASIC
  • 5.1.3 Platform / Semi-Custom ASIC
  • 5.1.4 Mixed-Signal ASIC
  • 5.1.5 RF ASIC
• 5.2 By End-Use Industry
  • 5.2.1 Consumer Electronics
  • 5.2.2 Telecommunications and Networking
  • 5.2.3 Automotive and Transportation
  • 5.2.4 Industrial and Robotics
  • 5.2.5 Aerospace and Defense
  • 5.2.6 Healthcare
  • 5.2.7 Others
• 5.3 By Application
  • 5.3.1 AI/ML Accelerators
  • 5.3.2 IoT / Edge Devices
  • 5.3.3 5G / Networking Infrastructure
  • 5.3.4 Data Center and Cloud
  • 5.3.5 Automotive ADAS and Electrification
  • 5.3.6 Medical Devices
  • 5.3.7 Industrial Control and PLCs
• 5.4 By Process Node
  • 5.4.1 above 28 nm
  • 5.4.2 16/14 nm
  • 5.4.3 10/7 nm
  • 5.4.4 5/4/3 nm
• 5.5 By Geography
  • 5.5.1 North America
    • 5.5.1.1 United States
    • 5.5.1.2 Canada
  • 5.5.2 South America
    • 5.5.2.1 Brazil
    • 5.5.2.2 Argentina
    • 5.5.2.3 Rest of South America
  • 5.5.3 Europe
    • 5.5.3.1 Germany
    • 5.5.3.2 France
    • 5.5.3.3 United Kingdom
    • 5.5.3.4 Italy
    • 5.5.3.5 Russia
    • 5.5.3.6 Rest of Europe
  • 5.5.4 Asia Pacific
    • 5.5.4.1 China
    • 5.5.4.2 Japan
    • 5.5.4.3 India
    • 5.5.4.4 South Korea
    • 5.5.4.5 Australia
    • 5.5.4.6 Rest of Asia Pacific
  • 5.5.5 Middle East and Africa
    • 5.5.5.1 Middle East
      • 5.5.5.1.1 Saudi Arabia
      • 5.5.5.1.2 UAE
      • 5.5.5.1.3 Turkey
      • 5.5.5.1.4 Rest of Middle East
    • 5.5.5.2 Africa
      • 5.5.5.2.1 South Africa
      • 5.5.5.2.2 Nigeria
      • 5.5.5.2.3 Kenya
      • 5.5.5.2.4 Rest of Africa

6 COMPETITIVE LANDSCAPE

• 6.1 Market Concentration
• 6.2 Strategic Moves
• 6.3 Market Share Analysis
• 6.4 Company Profiles {(includes Global level Overview, Market level overview, Core Segments, Financials as available, Strategic Information, Market Rank/Share, Products and Services, Recent Developments)}
  • 6.4.1 Intel Corporation
  • 6.4.2 Broadcom Inc.
  • 6.4.3 Marvell Technology, Inc.
  • 6.4.4 AMD (Xilinx)
  • 6.4.5 Microchip Technology Inc. (Microsemi)
  • 6.4.6 Lattice Semiconductor Corporation
  • 6.4.7 QuickLogic Corporation
  • 6.4.8 Taiwan Semiconductor Manufacturing Co. Ltd.
  • 6.4.9 Samsung Electronics Co., Ltd. (Samsung Foundry)
  • 6.4.10 GlobalFoundries Inc.
  • 6.4.11 United Microelectronics Corporation
  • 6.4.12 Fujitsu Semiconductor Ltd.
  • 6.4.13 STMicroelectronics N.V.
  • 6.4.14 Infineon Technologies AG
  • 6.4.15 NXP Semiconductors N.V.
  • 6.4.16 onsemi Corporation
  • 6.4.17 Texas Instruments Incorporated
  • 6.4.18 Renesas Electronics Corporation
  • 6.4.19 Faraday Technology Corporation
  • 6.4.20 Global Unichip Corp.
  • 6.4.21 Andes Technology Corporation
  • 6.4.22 Skyworks Solutions, Inc.
  • 6.4.23 Dialog Semiconductor plc
  • 6.4.24 Analog Devices, Inc.

7 MARKET OPPORTUNITIES AND FUTURE OUTLOOK

• 7.1 White-space and Unmet-Need Assessment