전자기기 제조 서비스 시장 : 점유율 분석, 업계 동향과 통계, 성장 예측(2026-2031년)

According to Mordor Intelligence, the electronics manufacturing services market size is projected to be USD 620.16 billion in 2025, USD 663.34 billion in 2026, and reach USD 909.32 billion by 2031, growing at a CAGR of 6.51% from 2026 to 2031.

This report is Segmented by Service Type (Electronic Manufacturing Services [PCB Assembly, Prototyping, and More], Test and Development Implementation Services, and More), Business Model (CM, ODM, and More), Manufacturing Process (SMT, THT, and More), End-User (Mobile Devices, Consumer Electronics, Lighting, and More), and Geography. The Market Forecasts are Provided in Terms of Value (USD).

Global Electronics Manufacturing Services Market Trends and Insights

OEMs Outsourcing to Focus on Core Competencies

Electronics brands are doubling down on silicon roadmaps and AI model training, shifting an expanding slice of mechanical and board-level work to external contractors. Apple's choice to farm out state-of-the-art package assembly underscores the capital-intensive nature of high-fixed-cost factories and illustrates why even vertically integrated giants see value in the Electronics manufacturing services market. Product lifecycles below 18 months in smartphones and wearables heighten this migration, because internal fabs struggle to flex to rapid model changes. Smaller industrial and medical brands extend outsourcing beyond soldering into firmware flashing and regulatory dossiers, creating a two-tier field where engineering-rich providers capture margins 8-12 points higher than commodity handlers.

Accelerated Near- and Re-Shoring of Supply Chains

Tariff uncertainty and export controls sparked a 23% jump in 2025 plant announcements across Mexico, Poland, and Vietnam. Mexico's 16% labor-cost edge versus coastal China plus USMCA duty-free status make it the preferred hub for power electronics and industrial controls. Eastern Europe secures medical-device subassemblies because EU customs harmonization trims door-to-door transit to under four days. Vietnam locks smartphone and acoustic module lines by offering decade-long corporate-tax holidays, while Thailand and Malaysia co-opt semiconductor back-end prowess to court chiplet in-package programs.

Rising Semiconductor and Passive Component Cost Volatility

Spot prices for automotive-grade multilayer ceramic capacitors swung 35-50% between Q1 2025 and Q4 2025, crushing gross margins by up to 120 basis points for Electronics manufacturing services market participants that lacked long-term allocation deals. Microcontroller lead times ballooned from 12 to 26 weeks, compelling contractors to fund two additional months of inventory and freeze working capital that could have financed capacity upgrades. Tier-1 vendors with USD 5 billion or more in annual revenue wield leverage to secure priority allocation, whereas regional firms pay 20-40% spot premiums, weakening bids on consumer electronics programs. Launch windows slipped four-to-eight weeks as engineers scrambled to redesign bills of material around scarce passives, derailing revenue recognition in the Electronics manufacturing services market.

Other drivers and restraints analyzed in the detailed report include:

1. Surge in EV Power-Electronics Requiring Advanced PCB Assembly
2. Proliferation of IIoT Edge Devices Driving HDI and Advanced Packaging
3. Competition from ODMs and OEM In-House Lines in Smartphones

For complete list of drivers and restraints, kindly check the Table Of Contents.

Segment Analysis

Electromechanical assembly and box build are forecast to expand at a 6.83% CAGR, outpacing the 6.51% headline growth of the Electronics manufacturing services market. Automotive and industrial buyers want one purchase order that covers cables, enclosures, and final test, trimming project lead time by two to three weeks. PCB assembly still held a 43.32% Electronics manufacturing services market share in 2025, but gross margins slipped below 6% on consumer-grade orders. Engineering services generate 30-50% higher revenue per program because brands need design-for-manufacturability checks and regulatory files for FDA and IEC audits.

Testing and development now command a growing budget slice as recalls in medical and automotive segments can climb past USD 100 million. Logistics add-ons such as configure-to-order fulfillment and vendor-managed inventory grant line-of-sight into constrained components, raising switching costs for customers. Prototyping with 48-hour turnarounds helps contractors lock in design wins before BOMs are frozen. Together, these value-added layers let tier-1 vendors defend margins in a core service that might otherwise commoditize. The Electronics manufacturing services market therefore tilts toward suppliers able to blend box build depth with engineering and supply-chain orchestration.

Contract manufacturing captured 62.46% of 2025 revenue, yet hybrid and turnkey models are projected to climb 7.02% each year through 2031. Start-ups without procurement muscle embrace turnkey deals even at 8-12% price premiums because they sidestep component sourcing risk. Automotive and industrial brands choose hybrid structures, supplying proprietary firmware while contractors design power stages and communication boards. This collaboration protects intellectual property and still harnesses external economies of scale.

Joint-development agreements deepen that alignment by sharing tooling costs in return for multi-year volume pledges. The structure forces customers to reveal roadmaps 18-24 months ahead, tightening vendor lock-in and stabilizing factory utilization. Original design manufacturers extend the model in consumer electronics by bundling connectors, batteries, and acoustics, which compresses the Electronics manufacturing services market size available to pure contract assemblers. Consequently, engineering depth and capital access now matter more than hourly labor rates. The landscape favors providers that can pivot among contract, hybrid, and design-rich programs without diluting returns.

Complete Report Scope:

• By Service
  • Electronic Manufacturing Services
    • PCB Assembly
    • Electromechanical Assembly/Box Build
    • Prototyping
    • Other Electronic Manufacturing Services
  • Engineering Services
  • Test and Development Implementation
  • Logistics Services
  • Other Services
• By Business Model
  • Contract Manufacturing (CM)
  • Original Design Manufacturing (ODM)
  • Hybrid / Turnkey / Other Business Models
• By Manufacturing Process
  • Surface Mount Technology (SMT)
  • Through-Hole Technology (THT)
  • Advanced Packaging / Hybrid Processes
• By End-user
  • Mobile Devices (Smartphones and Tablets)
  • Consumer Electronics
  • Computer (PCs/Desktop/Laptops)
  • Industrial
  • Automotive
  • Communication
  • Lighting
  • Medical
  • Other End-users
• By Geography
  • North America
    • United States
    • Canada
    • Mexico
  • Europe
    • Germany
    • United Kingdom
    • Rest of Europe
  • Asia-Pacific
    • China
    • Japan
    • South Korea
    • India
    • South-east Asia
    • Rest of Asia-Pacific
  • South America
  • Middle East and Africa

Geography Analysis

Asia-Pacific held 56.48% of global Electronics manufacturing services market share in 2025 and is projected to grow at a 6.63% CAGR through 2031. China provided the largest revenue base, Japan specialized in precision automotive and industrial modules, and South Korea remained dominant in display and memory-adjacent builds. India's Production Linked Incentive program, which reimburses 4-6% of incremental sales, attracted fresh smartphone and appliance lines, while Vietnam's ten-year corporate tax holidays drew acoustic modules and final assembly for premium handsets. Southeast Asian nations also upgraded packaging equipment so they can bid for chiplet integration projects that bridge semiconductor back-end and board assembly.

Near-shoring has reshaped North American activity, with Mexico capturing the bulk of new capacity thanks to USMCA tariff relief, a 16% labor-cost edge over coastal China, and two-day truck routes to Texas design centers. The United States kept high-mix, low-volume lines for aerospace, defense, and medical devices where intellectual-property security offsets a 40-60% cost premium. Canada's Ontario-Quebec corridor concentrated on automotive telematics and rugged industrial gateways, leveraging bilingual engineering talent and just-in-time logistics that meet Detroit and Midwest delivery windows. In Europe, Poland, Czech Republic, and Romania landed medical-device and automotive subassemblies because EU customs alignment allows same-week replenishment, while Germany, France, and the United Kingdom preserved flight-critical and defense electronics in domestic plants.

South America and the Middle East and Africa contributed smaller slices of Electronics manufacturing services market size but show targeted momentum. Brazil's telecommunications local-content rules and renewable-energy inverter programs anchor regional demand, encouraging contractors to localize through joint ventures with domestic distributors. South Africa's push for grid-tied solar inverters and smart-meter rollouts nurtures niche box-build orders that reward suppliers skilled in harsh-environment conformal coating. Although absolute numbers remain modest, these pockets diversify revenue streams and provide future landing zones for providers eager to spread geopolitical risk.

1. Hon Hai Precision Industry Co., Ltd. (Foxconn)
2. Pegatron Corp.
3. Flex Ltd.
4. Jabil Inc.
5. Luxshare Precision Industry Co., Ltd.
6. Wistron Corp.
7. Sanmina Corp.
8. Celestica Inc.
9. Benchmark Electronics Inc.
10. Plexus Corp.
11. Compal Electronics Inc.
12. Inventec Corp.
13. Universal Scientific Industrial Co., Ltd. (USI)
14. BYD Electronics (International) Co., Ltd.
15. Shenzhen Kaifa Technology Co., Ltd.
16. Asteelflash Group
17. Kimball Electronics Inc.
18. Sumitronics Corp.
19. Nortech Systems Inc.
20. Creation Technologies Ltd.
21. Integrated Micro-Electronics Inc.
22. Zollner Elektronik AG
23. New Kinpo Group (Cal-Comp)
24. SIIX Corp.

Additional Benefits:

• The market estimate (ME) sheet in Excel format
• 3 months of analyst support

TABLE OF CONTENTS

1 INTRODUCTION

• 1.1 Study Assumptions and Market Definition
• 1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET LANDSCAPE

• 4.1 Market Overview
• 4.2 Market Drivers
  • 4.2.1 OEMs Outsourcing to Focus on Core Competencies
  • 4.2.2 Accelerated Near-/Re-shoring of Supply Chains to Mexico, Eastern Europe and ASEAN
  • 4.2.3 Surge in EV Power-Electronics Requiring Advanced PCB Assembly Capabilities
  • 4.2.4 Proliferation of IIoT Edge Devices Driving HDI and Advanced Packaging EMS Demand
  • 4.2.5 Government Tax Incentives for Domestic EMS Facilities in India and Vietnam
  • 4.2.6 AI-Driven Digital MES Improving First-Pass Yield and Reducing Rework Costs
• 4.3 Market Restraints
  • 4.3.1 Rising Semiconductor and Passive Component Cost Volatility
  • 4.3.2 IP Protection Concerns Limiting Outsourcing in EU Aerospace and Defense
  • 4.3.3 Competition from ODMs and OEM In-house Lines in Smartphones
  • 4.3.4 Environmental Compliance (RoHS III, REACH) Raising Capex for Legacy Facilities
• 4.4 Industry Value Chain Analysis
• 4.5 Regulatory Outlook
• 4.6 Technological Outlook
  • 4.6.1 Surface-Mount Technology Roadmap
  • 4.6.2 High-Density Interconnect and Embedded Component PCB
  • 4.6.3 Advanced Packaging and System-in-Package
  • 4.6.4 Digital MES, AI Quality Inspection and Cobotics
• 4.7 Porter's Five Forces Analysis
  • 4.7.1 Bargaining Power of Suppliers
  • 4.7.2 Bargaining Power of Buyers
  • 4.7.3 Threat of New Entrants
  • 4.7.4 Threat of Substitutes
  • 4.7.5 Intensity of Competitive Rivalry
• 4.8 Impact of Macroeconomic Factors on the Market

5 MARKET SIZE AND GROWTH FORECASTS (VALUE)

• 5.1 By Service
  • 5.1.1 Electronic Manufacturing Services
    • 5.1.1.1 PCB Assembly
    • 5.1.1.2 Electromechanical Assembly/Box Build
    • 5.1.1.3 Prototyping
    • 5.1.1.4 Other Electronic Manufacturing Services
  • 5.1.2 Engineering Services
  • 5.1.3 Test and Development Implementation
  • 5.1.4 Logistics Services
  • 5.1.5 Other Services
• 5.2 By Business Model
  • 5.2.1 Contract Manufacturing (CM)
  • 5.2.2 Original Design Manufacturing (ODM)
  • 5.2.3 Hybrid / Turnkey / Other Business Models
• 5.3 By Manufacturing Process
  • 5.3.1 Surface Mount Technology (SMT)
  • 5.3.2 Through-Hole Technology (THT)
  • 5.3.3 Advanced Packaging / Hybrid Processes
• 5.4 By End-user
  • 5.4.1 Mobile Devices (Smartphones and Tablets)
  • 5.4.2 Consumer Electronics
  • 5.4.3 Computer (PCs/Desktop/Laptops)
  • 5.4.4 Industrial
  • 5.4.5 Automotive
  • 5.4.6 Communication
  • 5.4.7 Lighting
  • 5.4.8 Medical
  • 5.4.9 Other End-users
• 5.5 By Geography
  • 5.5.1 North America
    • 5.5.1.1 United States
    • 5.5.1.2 Canada
    • 5.5.1.3 Mexico
  • 5.5.2 Europe
    • 5.5.2.1 Germany
    • 5.5.2.2 United Kingdom
    • 5.5.2.3 Rest of Europe
  • 5.5.3 Asia-Pacific
    • 5.5.3.1 China
    • 5.5.3.2 Japan
    • 5.5.3.3 South Korea
    • 5.5.3.4 India
    • 5.5.3.5 South-east Asia
    • 5.5.3.6 Rest of Asia-Pacific
  • 5.5.4 South America
  • 5.5.5 Middle East and Africa

6 COMPETITIVE LANDSCAPE

• 6.1 Market Concentration
• 6.2 Strategic Moves
• 6.3 Market Share Analysis
• 6.4 Company Profiles (includes Global Level Overview, Market Level Overview, Core Segments, Financials as available, Strategic Information, Market Rank/Share, Products and Services, Recent Developments)
  • 6.4.1 Hon Hai Precision Industry Co., Ltd. (Foxconn)
  • 6.4.2 Pegatron Corp.
  • 6.4.3 Flex Ltd.
  • 6.4.4 Jabil Inc.
  • 6.4.5 Luxshare Precision Industry Co., Ltd.
  • 6.4.6 Wistron Corp.
  • 6.4.7 Sanmina Corp.
  • 6.4.8 Celestica Inc.
  • 6.4.9 Benchmark Electronics Inc.
  • 6.4.10 Plexus Corp.
  • 6.4.11 Compal Electronics Inc.
  • 6.4.12 Inventec Corp.
  • 6.4.13 Universal Scientific Industrial Co., Ltd. (USI)
  • 6.4.14 BYD Electronics (International) Co., Ltd.
  • 6.4.15 Shenzhen Kaifa Technology Co., Ltd.
  • 6.4.16 Asteelflash Group
  • 6.4.17 Kimball Electronics Inc.
  • 6.4.18 Sumitronics Corp.
  • 6.4.19 Nortech Systems Inc.
  • 6.4.20 Creation Technologies Ltd.
  • 6.4.21 Integrated Micro-Electronics Inc.
  • 6.4.22 Zollner Elektronik AG
  • 6.4.23 New Kinpo Group (Cal-Comp)
  • 6.4.24 SIIX Corp.

7 MARKET OPPORTUNITIES AND FUTURE OUTLOOK

• 7.1 White-Space and Unmet-Need Assessment