로직 IC : 시장 점유율 분석, 업계 동향 및 통계, 성장 예측(2026-2031년)

According to Mordor Intelligence, the logic IC market size was valued at USD 245.73 billion in 2025 and estimated to grow from USD 254.58 billion in 2026 to reach USD 303.91 billion by 2031, at a CAGR of 3.60% during the forecast period (2026-2031).

This report is Segmented by IC Type (Digital Bipolar Logic, and MOS Logic), Technology Node (>=45 Nm, 20-44 Nm, 10-19 Nm, 7-9 Nm, and <=5 Nm), Wafer Size (<=150 Mm, 200 Mm, and 300 Mm), Application (Consumer Electronics, Automotive, IT and Communication Infrastructure, Computer/Data-Center, Industrial and Automation, and More), and Geography (North America, Europe, Asia-Pacific, South America, and Middle East and Africa).

Global Logic IC (Integrated Circuit) Market Trends and Insights

Edge-AI-driven demand for ultra-low-latency logic ICs

Edge AI deployment shifted inference workloads away from cloud data centers toward on-device processors that required sub-millisecond reaction times. In 2024, BrainChip's Akida Pico delivered 0.35 TOPS/W, cutting power budgets by 90% versus conventional DSPs. EdgeCortix projected that such edge AI devices could capture 40% of AI semiconductor revenue by 2027, as autonomous robots, drones, and wearables cannot tolerate 50-100 ms cloud latency. With real-time perception systems needing image and LiDAR data processed inside 10 ms, logic IC designers pivoted to sparse neural-network accelerators. The convergence of 5G edge computing and AI inference created a USD 15 billion serviceable opportunity for specialized logic by 2028, reinforcing the growth trajectory of the logic IC market.

Automotive ADAS and domain controllers require high-reliability logic.

Software-defined vehicles consolidated multiple ECUs into centralized domain controllers subject to ISO 26262 safety grades. In 2024, Renesas introduced the R-Car V4H SoC that fused real-time control, AI inference, and cybersecurity on a 28 nm die. Continental's ADCU family hit 171 TOPS with AEC-Q100 grade parts, and Tesla's Hardware 4.0 platform targeted 1,000 TOPS, demonstrating a ten-fold leap in four years. Automotive logic ICs therefore carried 3-5 x price uplifts over consumer equivalents, sustaining margin resilience even in a deflationary cycle for mature nodes. The reliability imperative drove long-lifecycle supply contracts that deepened customer lock-in and underpinned demand across the logic IC market.

Extreme-UV lithography equipment bottlenecks

ASML remained the sole supplier of EUV tools, and each High-NA machine cost USD 350 million while requiring 18 months to deliver. Limited throughput held back sub-3 nm capacity: the big three foundries needed more than 200 units by 2030, but ASML's annual output plateaued near 60 systems. Intel's 18A roadmap hinged on High-NA availability, pushing risk production toward 2027. Yield loss from sub-nanometer overlay error compounded capacity strain, curbing the supply side of the logic IC market until new tool generations matured.

Other drivers and restraints analyzed in the detailed report include:

1. Government-backed advanced-node fab incentives
2. 3D/2.5D heterogeneous integration accelerating logic IC content per package
3. Escalating <5 nm design NRE and IP licensing costs

For complete list of drivers and restraints, kindly check the Table Of Contents.

Segment Analysis

MOS special-purpose logic captured a 32.12% share of the logic IC market in 2025 and is on course for a 5.74% CAGR until 2031. This branch is spearheaded by AI accelerators that offset the inefficiency of general-purpose processors. Meta's 2024 disclosures of multiply-accumulate arrays showcased application-specific throughput gains of 10x over traditional scalar cores. The logic IC market size for AI-oriented MOS devices is projected to climb at a rate faster than the aggregate market as hyperscalers internalize custom silicon roadmaps.

Demand for MOS general-purpose logic, gate arrays, and drivers/controllers grew steadily inside consumer electronics and power-train modules. Automotive electrification injected extra volume into MOS driver ICs that oversee battery systems. Meanwhile, digital bipolar logic held niche value in radiation-hardened aerospace circuits. Samsung's 2024 rollout of non-binary AI chips reinforced the trend toward purpose-built logic, pointing to an increasingly segmented supplier landscape.

The <=5 nm cohort expanded at 11.08% CAGR through 2031, energised by AI, HPC, and premium mobile applications willing to absorb elevated wafer costs. The logic IC market size associated with <=5 nm nodes is expected to jump in tandem with advanced packaging adoption. At the same time, the 20-44 nm class retained a 37.02% share in 2025, supporting infotainment, industrial control, and cost-sensitive IoT. TSMC's 3 nm ramp in 2024 delivered 60% higher density relative to 5 nm, yet the premium contained its use to flagship products.

Nodes at 10-19 nm bridged cost and performance gaps, serving midrange smartphones and edge gateways. The >=45 nm bracket persisted as a high-volume option for analog-heavy systems in motor drives and sensors. China's industrial policy channelled billions toward 14 nm and 28 nm self-reliance, reinforcing mid-node capacity even as global attention gravitated to 2-3 nm. Consequently, the logic IC market displayed a bifurcated profile: volume resided in mature nodes, but profit pools coalesced at the leading edge.

Complete Report Scope:

• By IC Type
  • Digital Bipolar Logic
  • MOS Logic
    • General-Purpose
    • Gate Arrays
    • Drivers / Controllers
    • Standard Cells
    • Special-Purpose
• By Technology Node
  • >= 45 nm
  • 20-44 nm
  • 10-19 nm
  • 7-9 nm
  • <= 5 nm
• By Wafer Size
  • <=150 mm
  • 200 mm
  • 300 mm
• By Application
  • Consumer Electronics
  • Automotive
  • IT and Communication Infrastructure
  • Computer / Data-Center
  • Industrial and Automation
  • Medical and Healthcare Devices
  • Other Applications
• By Geography
  • North America
    • United States
    • Canada
    • Mexico
  • Europe
    • Germany
    • France
    • United Kingdom
    • Nordics
    • Rest of Europe
  • Asia-Pacific
    • China
    • Taiwan
    • South Korea
    • Japan
    • India
    • Rest of Asia-Pacific
  • South America
    • Brazil
    • Mexico
    • Argentina
    • Rest of South America
  • Middle East and Africa
    • Middle East
      • Saudi Arabia
      • United Arab Emirates
      • Turkey
      • Rest of Middle East
    • Africa
      • South Africa
      • Rest of Africa

Geography Analysis

Asia-Pacific commanded 33.05% of 2025 revenue and advanced at 4.12% CAGR, anchored by Taiwan's 64.9% foundry share and China's accelerated build-out of domestic fabs. Political friction prompted multinational customers to dual-source outside the Taiwan Strait, yet TSMC retained technical leadership at 3 nm and early 2 nm tape-outs. China invested USD 143 billion up to 2030 to elevate its foundry capability toward 7 nm, gradually narrowing but not closing the gap with leading-edge peers.

North America used the CHIPS Act to push production share from 10% in 2025 toward 22% by 2031. Intel's Ohio complex represented the largest greenfield logic facility in the region, aimed at 2 nm risk production by 2027. The United States benefited from demand in AI accelerators, aerospace-defence microelectronics, and automotive domain controllers, but a projected shortage of 67,000 skilled workers by 2030 risked hampering the ramp.

Europe positioned itself around automotive and industrial strengths. The EUR 43 billion (USD 50.56 billion) Chips Act set a target of 20% global output by 2030, leveraging clusters in Germany and France. Infineon and STMicroelectronics pivoted toward power and safety-critical logic platforms tailored for electrified transport and smart factories. Parallel investments in Japan, Israel, and the Gulf aimed to gain toeholds but remained subscale relative to the tri-polar core of East Asia, North America, and Western Europe, maintaining their roles as fast-growing demand zones rather than production hearts of the logic IC market.

1. Intel Corporation
2. Taiwan Semiconductor Manufacturing Company Limited (TSMC)
3. Samsung Electronics Co., Ltd.
4. Texas Instruments Incorporated
5. NXP Semiconductors N.V.
6. STMicroelectronics N.V.
7. onsemi (ON Semiconductor Corp.)
8. Renesas Electronics Corporation
9. Analog Devices, Inc.
10. Broadcom Inc.
11. Infineon Technologies AG
12. Microchip Technology Incorporated
13. Toshiba Electronic Devices & Storage Corp.
14. Skyworks Solutions, Inc.
15. ROHM Co., Ltd.
16. Marvell Technology, Inc.
17. MediaTek Inc.
18. Silicon Laboratories Inc.
19. Lattice Semiconductor Corporation
20. Dialog Semiconductor Plc (Renesas)

Additional Benefits:

• The market estimate (ME) sheet in Excel format
• 3 months of analyst support

TABLE OF CONTENTS

1 INTRODUCTION

• 1.1 Study Assumptions and Market Definition
• 1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET LANDSCAPE

• 4.1 Market Overview
• 4.2 Market Drivers
  • 4.2.1 Edge-AI-Driven Demand for Ultra-Low-Latency Logic ICs
  • 4.2.2 Automotive ADAS and Domain Controllers Requiring High-Reliability Logic
  • 4.2.3 Government-Backed Advanced-Node FAB Incentives (U.S. CHIPS, China IC Fund)
  • 4.2.4 3D/2.5D Heterogeneous Integration Accelerating Logic IC Content per Package
  • 4.2.5 Rapid Proliferation of Battery-Powered IoT Nodes Demanding Sub-µW Logic
• 4.3 Market Restraints
  • 4.3.1 Extreme-UV Lithography Equipment Bottlenecks
  • 4.3.2 Escalating <5 nm Design NRE and IP Licensing Costs
  • 4.3.3 Geopolitical Export Controls on EDA and Process Equipment
  • 4.3.4 Global Talent Crunch in Advanced Logic Design and Verification
• 4.4 Value Chain Analysis
• 4.5 Regulatory or Technological Outlook
• 4.6 Porter's Five Forces Analysis
  • 4.6.1 Bargaining Power of Suppliers
  • 4.6.2 Bargaining Power of Buyers
  • 4.6.3 Threat of New Entrants
  • 4.6.4 Intensity of Competitive Rivalry
  • 4.6.5 Threat of Substitutes
• 4.7 Investment Analysis
• 4.8 Impact of macroeconomic factors on the market

5 MARKET SIZE AND GROWTH FORECASTS (VALUE AND VOLUME)

• 5.1 By IC Type
  • 5.1.1 Digital Bipolar Logic
  • 5.1.2 MOS Logic
    • 5.1.2.1 General-Purpose
    • 5.1.2.2 Gate Arrays
    • 5.1.2.3 Drivers / Controllers
    • 5.1.2.4 Standard Cells
    • 5.1.2.5 Special-Purpose
• 5.2 By Technology Node
  • 5.2.1 >= 45 nm
  • 5.2.2 20-44 nm
  • 5.2.3 10-19 nm
  • 5.2.4 7-9 nm
  • 5.2.5 <= 5 nm
• 5.3 By Wafer Size
  • 5.3.1 <=150 mm
  • 5.3.2 200 mm
  • 5.3.3 300 mm
• 5.4 By Application
  • 5.4.1 Consumer Electronics
  • 5.4.2 Automotive
  • 5.4.3 IT and Communication Infrastructure
  • 5.4.4 Computer / Data-Center
  • 5.4.5 Industrial and Automation
  • 5.4.6 Medical and Healthcare Devices
  • 5.4.7 Other Applications
• 5.5 By Geography
  • 5.5.1 North America
    • 5.5.1.1 United States
    • 5.5.1.2 Canada
    • 5.5.1.3 Mexico
  • 5.5.2 Europe
    • 5.5.2.1 Germany
    • 5.5.2.2 France
    • 5.5.2.3 United Kingdom
    • 5.5.2.4 Nordics
    • 5.5.2.5 Rest of Europe
  • 5.5.3 Asia-Pacific
    • 5.5.3.1 China
    • 5.5.3.2 Taiwan
    • 5.5.3.3 South Korea
    • 5.5.3.4 Japan
    • 5.5.3.5 India
    • 5.5.3.6 Rest of Asia-Pacific
  • 5.5.4 South America
    • 5.5.4.1 Brazil
    • 5.5.4.2 Mexico
    • 5.5.4.3 Argentina
    • 5.5.4.4 Rest of South America
  • 5.5.5 Middle East and Africa
    • 5.5.5.1 Middle East
      • 5.5.5.1.1 Saudi Arabia
      • 5.5.5.1.2 United Arab Emirates
      • 5.5.5.1.3 Turkey
      • 5.5.5.1.4 Rest of Middle East
    • 5.5.5.2 Africa
      • 5.5.5.2.1 South Africa
      • 5.5.5.2.2 Rest of Africa

6 COMPETITIVE LANDSCAPE

• 6.1 Market Concentration
• 6.2 Strategic Moves
• 6.3 Market Share Analysis
• 6.4 Company Profiles (includes Global-level Overview, Market-level Overview, Core Segments, Financials, Strategic Information, Market Rank/Share, Products and Services, Recent Developments)
  • 6.4.1 Intel Corporation
  • 6.4.2 Taiwan Semiconductor Manufacturing Company Limited (TSMC)
  • 6.4.3 Samsung Electronics Co., Ltd.
  • 6.4.4 Texas Instruments Incorporated
  • 6.4.5 NXP Semiconductors N.V.
  • 6.4.6 STMicroelectronics N.V.
  • 6.4.7 onsemi (ON Semiconductor Corp.)
  • 6.4.8 Renesas Electronics Corporation
  • 6.4.9 Analog Devices, Inc.
  • 6.4.10 Broadcom Inc.
  • 6.4.11 Infineon Technologies AG
  • 6.4.12 Microchip Technology Incorporated
  • 6.4.13 Toshiba Electronic Devices & Storage Corp.
  • 6.4.14 Skyworks Solutions, Inc.
  • 6.4.15 ROHM Co., Ltd.
  • 6.4.16 Marvell Technology, Inc.
  • 6.4.17 MediaTek Inc.
  • 6.4.18 Silicon Laboratories Inc.
  • 6.4.19 Lattice Semiconductor Corporation
  • 6.4.20 Dialog Semiconductor Plc (Renesas)

7 MARKET OPPORTUNITIES AND FUTURE OUTLOOK

• 7.1 White-space and Unmet-Need Assessment