세계의 전자용 접착제 시장(2023-2030년)

Global Electronic Adhesives Market Size, Share & Trends Analysis Report by Resin Type (Epoxy, Silicone, Polyurethane (PU), Acrylic, and Others), by Product Type (Electrically Conductive Adhesives, Thermally Conductive Adhesives, and Others), and by End-Use Industry (Computers, Communications, Consumer Electronics, Industrial, Medical, Transportation and Commercial Aviation, and Defense), Forecast Period (2023-2030)

The global electronic adhesives market is anticipated to grow at a CAGR of 9.1% during the forecast period (2023-2030). Adhesives are widely used in the manufacture and assembly of electronic circuits and products. The growing demand for non-toxic and eco-friendly electronic adhesives in semiconductor & circuit assembly and die-attachment applications has led to the increasing use of electronic adhesives. The growing adoption of adhesives that can support efficient and automated assembly processes is the key factor supporting the growth of the market globally. Thermally conductive adhesives are ideal for bonding heat sinks to PCBs. These adhesives transfer heat quickly and efficiently away from sensitive electronics, whilst being electrically insulative to prevent short circuits. The market players are also focusing on introducing electronics adhesive for semiconductor manufacturers solutions that further bolster the market growth. For instance, in November 2023, DELO, launched a flexible electronics adhesive that permanently seals sensor housings airtight and thus reliably protects components such as image sensors. DELO DUALBOND BS3770 meets the stringent requirements of the semiconductor and automotive industries and helps drive innovation in autonomous driving.

Segmental Outlook

The global electronic adhesives market is segmented on the resin type, product type, and end-use industry. Based on the resin type, the market is sub-segmented into epoxy, silicone, polyurethane (pu), acrylic and others (polyamide, polycarbonate). Based on the Product Type, the market is sub-segmented into electrically conductive adhesives, thermally conductive adhesives and others (hot melt adhesives, anaerobic adhesive). Further, on the basis of end-use industry, the market is sub-segmented into computers, communications, consumer electronics, industrial, medical, transportation and commercial aviation and defense. Among the end-use industry, the consumer electronics sub-segment is anticipated to hold a considerable share of the market owing to the rise in development of adhesive for provide a strong bond while protecting components against the damaging effects of excessive vibration, heat, moisture, corrosion, mechanical shock, and extreme environmental conditions.

The Epoxy Sub-Segment is Anticipated to Hold a Considerable Share of the Global Electronic Adhesives Market

Among the resin type, the epoxy sub-segment is expected to hold a considerable share of the global electronic adhesives market. The segmental growth is attributed to the growing influence of epoxy adhesive to protect electronic components from damage caused by mechanical stress. Underfill epoxy is an essential component in the manufacturing of electronic devices such as smartphones, laptops, and other portable devices. For instance, in May 2022, DeepMaterial, a manufacturer and supplier of high-quality epoxy adhesives, launched two new products that revolutionize the chip testing and packaging industry that heavily relies on surface protection materials and various semiconductor and electronic appliances - underfill epoxy and one-component epoxy adhesive.

Regional Outlook

The global electronic adhesives market is further segmented based on geography including North America (the US, and Canada), Europe (UK, Italy, Spain, Germany, France, and the Rest of Europe), Asia-Pacific (India, China, Japan, South Korea, and Rest of Asia), and the Rest of the World (the Middle East & Africa, and Latin America). Among these, North America is anticipated to hold a prominent share of the market across the globe, owing to the development of advanced electronics adhesives used for miniaturized devices formulated with specific characteristics to meet the requirements of microelectronic applications.

Global Electronic Adhesives Market Growth, by Region 2023-2030

Source: OMR Analysis

The Asia-Pacific Region is Expected to Grow at a Significant CAGR in the Global Electronic Adhesives Market

Among all regions, the Asia-Pacific regions is anticipated to grow at a considerable CAGR over the forecast period. Regional growth is attributed to increasing demand for wearable devices is a driving the growth of the electronics adhesives market. Wearable devices have gained immense demand in region owing to their ability to integrate technology into accessories, providing convenience, connectivity, and enhanced functionalities to users.

Various adhesives based on physical properties such as solubility, compatibility, thermal properties, water absorbency and electrical properties are designed in a functional unit. For instance, in May 2022, JSR Corp. launched a new material (HAG) that is highly adhesive and dispersive to full-scale development of fifth-generation (5G) and sixth-generation (6G) mobile communications systems and autonomous driving technology, various applications and devices are being developed in the fields of communications and mobility electronics.

Market Players Outlook

The major companies serving the electronic adhesives market include 3M, DELO Industrie Klebstoffe GmbH & Co. KGaA, H.B. Fuller, Henkel AG & Co. KGaA, The Dow Chemical Company, and others. The market players are considerably contributing to the market growth by the adoption of various strategies including mergers and acquisitions, partnerships, collaborations, funding, and new product launches, to stay competitive in the market. For instance, in May 2023, Arkema acquired Polytec PT, which specialized in adhesives for batteries and electronics. This bolt-on acquisition is part of the Group's strategy to become a full system provider and support its customers to develop sustainable solutions for the batteries and electronics markets.

The Report Covers:

• Market value data analysis of 2022 and forecast to 2030.
• Annualized market revenues ($ million) for each market segment.
• Country-wise analysis of major geographical regions.
• Key companies operating in the global electronic adhesives market. Based on the availability of data, information related to new product launches, and relevant news is also available in the report.
• Analysis of business strategies by identifying the key market segments positioned for strong growth in the future.
• Analysis of market-entry and market expansion strategies.
• Competitive strategies by identifying 'who-stands-where' in the market.

Table of Contents

1. Report Summary

• Current Industry Analysis and Growth Potential Outlook
• 1.1. Research Methods and Tools
• 1.2. Market Breakdown
  • 1.2.1. By Segments
  • 1.2.2. By Region

2. Market Overview and Insights

• 2.1. Scope of the Report
• 2.2. Analyst Insight & Current Market Trends
  • 2.2.1. Key Findings
  • 2.2.2. Recommendations
  • 2.2.3. Conclusion

3. Competitive Landscape

• 3.1. Key Company Analysis
• 3.2. 3M
  • 3.2.1. Overview
  • 3.2.2. Financial Analysis
  • 3.2.3. SWOT Analysis
  • 3.2.4. Recent Developments
• 3.3. Henkel AG & Co. KGaA
  • 3.3.1. Overview
  • 3.3.2. Financial Analysis
  • 3.3.3. SWOT Analysis
  • 3.3.4. Recent Developments
• 3.4. The Dow Chemical Company
  • 3.4.1. Overview
  • 3.4.2. Financial Analysis
  • 3.4.3. SWOT Analysis
  • 3.4.4. Recent Developments
• 3.5. Key Strategy Analysis

4. Market Segmentation

• 4.1. Global Electronic Adhesives Market by Resin Type
  • 4.1.1. Epoxy
  • 4.1.2. Silicone
  • 4.1.3. Polyurethane (PU)
  • 4.1.4. Acrylic
  • 4.1.5. Others (Polyamide, Polycarbonate)
• 4.2. Global Electronic Adhesives Market by Product Type
  • 4.2.1. Electrically Conductive Adhesives
  • 4.2.2. Thermally Conductive Adhesives
  • 4.2.3. Others (Hot melt Adhesives, Anaerobic Adhesive)
• 4.3. Global Electronic Adhesives Market by End User Industry
  • 4.3.1. Computers
  • 4.3.2. Communications
  • 4.3.3. Consumer Electronics
  • 4.3.4. Industrial
  • 4.3.5. Medical
  • 4.3.6. Transportation
  • 4.3.7. Commercial Aviation and Defense

5. Regional Analysis

• 5.1. North America
  • 5.1.1. United States
  • 5.1.2. Canada
• 5.2. Europe
  • 5.2.1. UK
  • 5.2.2. Germany
  • 5.2.3. Italy
  • 5.2.4. Spain
  • 5.2.5. France
  • 5.2.6. Rest of Europe
• 5.3. Asia-Pacific
  • 5.3.1. China
  • 5.3.2. India
  • 5.3.3. Japan
  • 5.3.4. South Korea
  • 5.3.5. Rest of Asia-Pacific
• 5.4. Rest of the World

6. Company Profiles

• 6.1. Asahi Kasei Corp.
• 6.2. DELO Industrie Klebstoffe GmbH & Co. KGaA
• 6.3. EPOXY TECHNOLOGY, INC.
• 6.4. FUJI CHEMICAL INDUSTRIAL CO., LTD.
• 6.5. H.B. Fuller
• 6.6. Hexion
• 6.7. Huntsman International LLC
• 6.8. Illinois Tool Works Inc.
• 6.9. JSR Corp.
• 6.10. KANEKA CORP.
• 6.11. Kuraray Europe GmbH
• 6.12. Mitsubishi Chemical Group
• 6.13. Nagase ChemteX Corp
• 6.14. Nitto Denko Corp.
• 6.15. Shin-Etsu Chemical Co., Ltd.
• 6.16. SUMITOMO SEIKA CHEMICALS CO., LTD.