세계의 다이 본더 장비 시장(2025-2035년)

Die Bonder Equipment Market Size, Share & Trends Analysis Report by Type (Manual Die Bonders, Semiautomatic Die Bonders and Fully Automatic Die Bonders), Bonding Technique (Epoxy, Eutectic, Soft Solder and Others), Device (Optoelectronics, MEMS and MOEMS, and Power Devices) and Application (Consumer Electronics, Automotive, Industrial, Telecommunications, Healthcare, and Aerospace & Defense) Forecast Period (2025-2035)

Industry Overview

Die bonder equipment market was valued at $1,025 million in 2024 and is projected to reach $1,524 million in 2035, growing at a CAGR of 3.7% during the forecast period (2025-2035). The growing demand for high-precision semiconductor assembly solutions in innovative fields such as optoelectronics, MEMS, and power electronics is driving the market expansion. The pace of die-bonding technology usage is growing with the establishment of automated manufacturing facilities and demand for higher yields. The semiconductor fabrication plants are also witnessing rising investments, chipset-based architectures, and heterogeneous integration, which contribute to the industry's growth.

Market Dynamics

Growing Adoption of Die Bonder Equipment for High-Performance Semiconductor Devices

As technology advances in such areas as telecommunication, automobiles, and consumer electronics, semiconductor devices with increased performance are also needed. As such, semiconductor packaging requires efficient advanced die bonding, that demands high precision and reliability in terms of efficiency for such assembly processes. Die bonding is part of semiconductor packaging that essentially means the attachment of the semiconductor die to the substrate or lead frame or another die. The demand for higher-precision bonding techniques arises when the complexity and miniaturization of devices increase to keep up with the performance and yield. Smartphones, wearables, and smart appliances all need smaller and more powerful chips, consequently, the demand for more advanced die-bonding techniques for high-density integration increases.

Increasing Demand for Innovative Packaging in Semiconductor Manufacturing

The semiconductor industry is migrating towards more advanced packaging techniques to improve device performance and efficiency. Improvements in the size of electronic components point towards further important evolution of flip-chip bonding, wafer-level packaging, and 3D stacking techniques, offering better thermal management and greater functionalities in a smaller footprint. As such, there is die bonder equipment adjustment to fit new complex packaging. Manufacturers have, consequently, highlighted high-precision bonding solutions aiming at a smaller alignment offset of the bond defects and closer overall defect density between complex chip structures. There has also been increased heterogeneous integration-a trend of uniting many semiconductor components into a single package-leading to its wide adoption.

Market Segmentation

• Based on the type, the market is segmented into manual die bonders, semiautomatic die bonders, and fully automatic die bonders.
• Based on the bonding technique, the market is segmented into epoxy, eutectic, soft solder, and others (hybrid bonding).
• Based on the device, the market is segmented into optoelectronics, MEMS and MOEMS, and power devices.
• Based on the application, the market is segmented into consumer electronics, automotive, industrial, telecommunications, healthcare, and aerospace & defense.

Fully Automatic Die Bonders Segment to Lead the Market with the Largest Share

High-volume semiconductor manufacturers are requiring higher precision and production efficiency with fully automatic die bonders. Such automatic die bonders allow the continuous manufacturing of products without human involvement, which brings down erroneous incidence and results in consistency. Applications in the AI, IoT, and 5G technologies are on the rise, compelling users to profit from advanced semiconductor packaging solutions. Further, rising complexity in chip designs such as multi-chip modules and heterogeneous integration are reviving the adoption process. Fully automated systems support cost optimization also through enhanced yield rates and lesser material wastage. The momentum of smart factories and Industry 4.0 is strengthening the expansion of markets. For instance, Inseto offers advanced automatic packaging die bonder technology designed with high-precision capabilities for die attachment. This multi-processing type of tool can take on wide-ranging sizes in components while efficiently applying adhesives. The system has an automatic changeover feature on the tool, in 15 positions, allowing seamless operation and greater flexibility in production.

Consumer Electronics: A Key Segment in Market Growth

One of the most significant growth drivers for the die bonder equipment market is the rapidly increasing demand for consumer electronics. Smartphone, laptop, tablets, and wearables output is rapidly increasing, and the need for advanced semiconductor packaging solutions is continuously growing. The miniaturization of electronic devices requires precise and efficient die-bonding processes. Advancements in 5G connectivity, AI-powered gadgets, and IoT-enabled products also contribute to the growth of this market. More die bonders have been invested in high-speed, high-accuracy models to facilitate production efficiency for manufacturers. Changes toward compact energy-efficient devices make technological advancements related to bonding more rapid. Growth in consumer requirements for performance and reliability is a driver for taking up advanced semiconductor manufacturing processes.

Regional Outlook

The global die bonder equipment market is further divided by geography, including North America (the US and Canada), Europe (the UK, Germany, France, Italy, Spain, Russia, and the Rest of Europe), Asia-Pacific (India, China, Japan, South Korea, Australia and New Zealand, ASEAN Countries, and the Rest of Asia-Pacific), and the Rest of the World (the Middle East & Africa, and Latin America)

Growing Adoption of Industrial Automation Solutions in North America

The North American die bonder equipment market is on the rise with the increasing need for advanced semiconductor packaging solutions. The region accommodates a strong base of semiconductor manufacturing companies and research institutions that keep innovation at a high level. Increasing investments in AI, IoT, and high-performance computing demand precise and efficient die-bonding technologies. The increase in data centers and 5G infrastructure are also contributing factors to the market growth. Government initiatives to encourage domestic semiconductor production are strengthening the industry.

Asia-Pacific Region Dominates the Market with Major Share

The Asia-Pacific die bonder equipment market is growing significantly as the demand from the semiconductor and electronics sectors has been rising steadily. Growth is further enhanced with the increased use of advanced packaging technologies. Among the foremost nations including China, Taiwan, and South Korea, with a huge base of strong manufacturing capabilities and investments in semiconductor fabrication. Factors such as semiconductor companies in the region, a well-established supply chain, and government initiatives supporting the domestic production of semiconductors help the region. The growth of consumer electronics demand and 5G further accelerates the opportunities. Technological advancement in die-bonding processes enhances the efficiencies of the production process. For instance, ASM Pacific Technology offers a full line of die-bonding and flip-chip solutions. The solutions range from prototype development and small-lot production to high-volume manufacturing. The technology has been found to meet strict demands for precision, speed, panel size, and flexibility.

Market Players Outlook

The major companies operating in the global die bonder equipment market include ASM Pacific Technology Ltd. (ASMPT), BE Semiconductor Industries N.V., Canon Machinery Inc., Panasonic Corp. and Yamaha Robotics Holdings Co., Ltd. (SHINKAWA Electric Co., Ltd.), among others. Market players are leveraging partnerships, collaborations, mergers, and acquisition strategies for business expansion and innovative product development to maintain their market positioning.

The Report Covers:

• Market value data analysis of 2024 and forecast to 2035.
• Annualized market revenues ($ million) for each market segment.
• Country-wise analysis of major geographical regions.
• Key companies operating in the global die bonder equipment market. Based on the availability of data, information related to new products, and relevant news is also available in the report.
• Analysis of business strategies by identifying the key market segments positioned for strong growth in the future.
• Analysis of market-entry and market expansion strategies.
• Competitive strategies by identifying 'who-stands-where' in the market.

Table of Contents

1. Report Summary

• Current Industry Analysis and Growth Potential Outlook
• Global Die Bonder Equipment Market Sales Analysis - Type| Bonding Technique| Device | Application ($ Million)
• Die Bonder Equipment Market Sales Performance of Top Countries
• 1.1. Research Methodology
• Primary Research Approach
• Secondary Research Approach
• 1.2. Market Snapshot

2. Market Overview and Insights

• 2.1. Scope of the Study
• 2.2. Analyst Insight & Current Market Trends
  • 2.2.1. Key Die Bonder Equipment Industry Trends
  • 2.2.2. Market Recommendations
• 2.3. Porter's Five Forces Analysis for the Die Bonder Equipment Market
  • 2.3.1. Competitive Rivalry
  • 2.3.2. Threat of New Entrants
  • 2.3.3. Bargaining Power of Suppliers
  • 2.3.4. Bargaining Power of Buyers
  • 2.3.5. Threat of Substitutes

3. Market Determinants

• 3.1. Market Drivers
  • 3.1.1. Drivers For Global Die Bonder Equipment Market: Impact Analysis
• 3.2. Market Pain Points and Challenges
  • 3.2.1. Restraints For Global Die Bonder Equipment Market: Impact Analysis
• 3.3. Market Opportunities

4. Competitive Landscape

• 4.1. Competitive Dashboard - Die Bonder Equipment Market Revenue and Share by Manufacturers
• Die Bonder Equipment Product Comparison Analysis
• Top Market Player Ranking Matrix
• 4.2. Key Company Analysis
  • 4.2.1. ASM Pacific Technology Ltd. (ASMPT)
    • 4.2.1.1. Overview
    • 4.2.1.2. Product Portfolio
    • 4.2.1.3. Financial Analysis (Subject to Data Availability)
    • 4.2.1.4. SWOT Analysis
    • 4.2.1.5. Business Strategy
  • 4.2.2. BE Semiconductor Industries N.V.
    • 4.2.2.1. Overview
    • 4.2.2.2. Product Portfolio
    • 4.2.2.3. Financial Analysis (Subject to Data Availability)
    • 4.2.2.4. SWOT Analysis
    • 4.2.2.5. Business Strategy
  • 4.2.3. Canon Machinery Inc.
    • 4.2.3.1. Overview
    • 4.2.3.2. Product Portfolio
    • 4.2.3.3. Financial Analysis (Subject to Data Availability)
    • 4.2.3.4. SWOT Analysis
    • 4.2.3.5. Business Strategy
  • 4.2.4. Panasonic Corp.
    • 4.2.4.1. Overview
    • 4.2.4.2. Product Portfolio
    • 4.2.4.3. Financial Analysis (Subject to Data Availability)
    • 4.2.4.4. SWOT Analysis
    • 4.2.4.5. Business Strategy
  • 4.2.5. Yamaha Robotics Holdings Co., Ltd. (SHINKAWA Electric Co., Ltd.)
    • 4.2.5.1. Overview
    • 4.2.5.2. Product Portfolio
    • 4.2.5.3. Financial Analysis (Subject to Data Availability)
    • 4.2.5.4. SWOT Analysis
    • 4.2.5.5. Business Strategy
• 4.3. Top Winning Strategies by Market Players
  • 4.3.1. Merger and Acquisition
  • 4.3.2. Product Launch
  • 4.3.3. Partnership And Collaboration

5. Global Die Bonder Equipment Market Sales Analysis by Type ($ Million)

• 5.1. Manual Die Bonders
• 5.2. Semiautomatic Die Bonders
• 5.3. Fully Automatic Die Bonders

6. Global Die Bonder Equipment Market Sales Analysis by Bonding Technique ($ Million)

• 6.1. Epoxy
• 6.2. Eutectic
• 6.3. Soft Solder
• 6.4. Others (Hybrid Bonding)

7. Global Die Bonder Equipment Market Sales Analysis by Device ($ Million)

• 7.1. Optoelectronics
• 7.2. MEMS and MOEMS
• 7.3. Power Devices

8. Global Die Bonder Equipment Market Sales Analysis by Application ($ Million)

• 8.1. Aerospace & Defense
• 8.2. Automotive
• 8.3. Consumer Electronics
• 8.4. Healthcare
• 8.5. Industrial
• 8.6. Other
• 8.7. Telecommunications

9. Regional Analysis

• 9.1. North American Die Bonder Equipment Market Sales Analysis - Type |Bonding Technique| Device| Application |Country ($ Million)
• Macroeconomic Factors for North America
  • 9.1.1. United States
  • 9.1.2. Canada
• 9.2. European Die Bonder Equipment Market Sales Analysis - Type |Bonding Technique| Device| Application |Country ($ Million)
• Macroeconomic Factors for Europe
  • 9.2.1. UK
  • 9.2.2. Germany
  • 9.2.3. Italy
  • 9.2.4. Spain
  • 9.2.5. France
  • 9.2.6. Russia
  • 9.2.7. Rest of Europe
• 9.3. Asia-Pacific Die Bonder Equipment Market Sales Analysis - Type |Bonding Technique| Device| Application |Country ($ Million)
• Macroeconomic Factors for Asia-Pacific
  • 9.3.1. China
  • 9.3.2. Japan
  • 9.3.3. South Korea
  • 9.3.4. India
  • 9.3.5. Australia & New Zealand
  • 9.3.6. ASEAN Countries (Thailand, Indonesia, Vietnam, Singapore, And Other)
  • 9.3.7. Rest of Asia-Pacific
• 9.4. Rest of the World Die Bonder Equipment Market Sales Analysis - Type |Bonding Technique| Device| Application |Country ($ Million)
• Macroeconomic Factors for the Rest of the World
  • 9.4.1. Latin America
  • 9.4.2. Middle East and Africa

10. Company Profiles

• 10.1. ASM Pacific Technology Ltd. (ASMPT)
  • 10.1.1. Quick Facts
  • 10.1.2. Company Overview
  • 10.1.3. Product Portfolio
  • 10.1.4. Business Strategies
• 10.2. BE Semiconductor Industries N.V.
  • 10.2.1. Quick Facts
  • 10.2.2. Company Overview
  • 10.2.3. Product Portfolio
  • 10.2.4. Business Strategies
• 10.3. Canon Machinery Inc.
  • 10.3.1. Quick Facts
  • 10.3.2. Company Overview
  • 10.3.3. Product Portfolio
  • 10.3.4. Business Strategies
• 10.4. DIAS Automatic (HK) Ltd.
  • 10.4.1. Quick Facts
  • 10.4.2. Company Overview
  • 10.4.3. Product Portfolio
  • 10.4.4. Business Strategies
• 10.5. Dr. Tresky AG
  • 10.5.1. Quick Facts
  • 10.5.2. Company Overview
  • 10.5.3. Product Portfolio
  • 10.5.4. Business Strategies
• 10.6. E-Globaledge Corp.
  • 10.6.1. Quick Facts
  • 10.6.2. Company Overview
  • 10.6.3. Product Portfolio
  • 10.6.4. Business Strategies
• 10.7. Fasford Technology Co., Ltd.
  • 10.7.1. Quick Facts
  • 10.7.2. Company Overview
  • 10.7.3. Product Portfolio
  • 10.7.4. Business Strategies
• 10.8. Finetech GmbH & Co. KG
  • 10.8.1. Quick Facts
  • 10.8.2. Company Overview
  • 10.8.3. Product Portfolio
  • 10.8.4. Business Strategies
• 10.9. FOUR TECHNOS Co., Ltd.
  • 10.9.1. Quick Facts
  • 10.9.2. Company Overview
  • 10.9.3. Product Portfolio
  • 10.9.4. Business Strategies
• 10.10. Guangzhou Minder-Hightech Co., Ltd.
  • 10.10.1. Quick Facts
  • 10.10.2. Company Overview
  • 10.10.3. Product Portfolio
  • 10.10.4. Business Strategies
• 10.11. HYBOND, Inc.
  • 10.11.1. Quick Facts
  • 10.11.2. Company Overview
  • 10.11.3. Product Portfolio
  • 10.11.4. Business Strategies
• 10.12. Kulicke & Soffa Industries, Inc.
  • 10.12.1. Quick Facts
  • 10.12.2. Company Overview
  • 10.12.3. Product Portfolio
  • 10.12.4. Business Strategies
• 10.13. JFP Microtechnic
  • 10.13.1. Quick Facts
  • 10.13.2. Company Overview
  • 10.13.3. Product Portfolio
  • 10.13.4. Business Strategies
• 10.14. Leadshine Technology Co., Ltd.
  • 10.14.1. Quick Facts
  • 10.14.2. Company Overview
  • 10.14.3. Product Portfolio
  • 10.14.4. Business Strategies
• 10.15. MicroAssembly Technologies, Ltd.
  • 10.15.1. Quick Facts
  • 10.15.2. Company Overview
  • 10.15.3. Product Portfolio
  • 10.15.4. Business Strategies
• 10.16. Mycronic AB
  • 10.16.1. Quick Facts
  • 10.16.2. Company Overview
  • 10.16.3. Product Portfolio
  • 10.16.4. Business Strategies
• 10.17. Palomar Technologies, Inc.
  • 10.17.1. Quick Facts
  • 10.17.2. Company Overview
  • 10.17.3. Product Portfolio
  • 10.17.4. Business Strategies
• 10.18. Panasonic Corp.
  • 10.18.1. Quick Facts
  • 10.18.2. Company Overview
  • 10.18.3. Product Portfolio
  • 10.18.4. Business Strategies
• 10.19. Setna, LLC
  • 10.19.1. Quick Facts
  • 10.19.2. Company Overview
  • 10.19.3. Product Portfolio
  • 10.19.4. Business Strategies
• 10.20. SHIBUYA CORP.
  • 10.20.1. Quick Facts
  • 10.20.2. Company Overview
  • 10.20.3. Product Portfolio
  • 10.20.4. Business Strategies
• 10.21. Toray Engineering Co., Ltd.
  • 10.21.1. Quick Facts
  • 10.21.2. Company Overview
  • 10.21.3. Product Portfolio
  • 10.21.4. Business Strategies
• 10.22. TPT Wire Bonder GmbH & Co. KG
  • 10.22.1. Quick Facts
  • 10.22.2. Company Overview
  • 10.22.3. Product Portfolio
  • 10.22.4. Business Strategies
• 10.23. West*Bond, Inc.
  • 10.23.1. Quick Facts
  • 10.23.2. Company Overview
  • 10.23.3. Product Portfolio
  • 10.23.4. Business Strategies
• 10.24. Yamaha Robotics Holdings Co., Ltd. (SHINKAWA Electric Co., Ltd.)
  • 10.24.1. Quick Facts
  • 10.24.2. Company Overview
  • 10.24.3. Product Portfolio
  • 10.24.4. Business Strategies