3D IC 및 2.5D IC 시장 : 세계 산업 분석, 규모, 점유율, 성장, 동향 및 예측(2024-2032년)

Persistence Market Research has recently released a comprehensive report on the worldwide market for 3D IC and 2.5D IC technologies. The report offers a thorough assessment of crucial market dynamics, including drivers, trends, opportunities, and challenges, providing detailed insights into the market structure.

Key Insights:

• 3D IC and 2.5D IC Market Size (2024E): USD 176 Billion
• Projected Market Value (2032F): USD 196.8 Billion
• Global Market Growth Rate (CAGR 2024 to 2032): 1.4%

3D IC and 2.5D IC Market - Report Scope:

3D IC (three-dimensional integrated circuits) and 2.5D IC (two-and-a-half-dimensional integrated circuits) technologies are pivotal in the advancement of semiconductor performance, allowing for higher functionality, increased speed, and reduced power consumption. These technologies integrate multiple IC layers into a single device, significantly enhancing performance and efficiency compared to traditional planar ICs. The market encompasses various applications, including consumer electronics, telecommunications, automotive, healthcare, and aerospace, driven by the demand for compact, high-performance, and energy-efficient electronic devices.

Market Growth Drivers:

The global 3D IC and 2.5D IC market is propelled by several key factors, including the rising demand for advanced electronic devices with enhanced performance and energy efficiency. The growing adoption of these technologies in consumer electronics, such as smartphones, tablets, and wearables, significantly contributes to market expansion. Furthermore, the increasing need for high-speed data processing and storage capabilities in data centers and telecommunications accelerates the adoption of 3D IC and 2.5D IC solutions. Technological advancements, such as the development of Through-Silicon Via (TSV) technology and innovative packaging techniques, enhance the performance, reliability, and cost-effectiveness of these integrated circuits, fostering market growth.

Market Restraints:

Despite promising growth prospects, the 3D IC and 2.5D IC market faces challenges related to manufacturing complexities, high production costs, and thermal management issues. The intricate fabrication processes involved in stacking multiple IC layers pose technical difficulties and increase production costs, limiting market penetration, particularly in cost-sensitive applications. Additionally, efficient thermal management is crucial to prevent overheating and ensure the reliability of 3D IC and 2.5D IC devices, requiring advanced cooling solutions and design innovations. Addressing these technical and economic barriers is essential to promote wider adoption and sustainable growth in the market.

Market Opportunities:

The 3D IC and 2.5D IC market presents significant growth opportunities driven by ongoing technological advancements, the proliferation of IoT (Internet of Things) devices, and the increasing demand for AI (artificial intelligence) and machine learning applications. The integration of AI and machine learning capabilities in various industries, such as healthcare, automotive, and industrial automation, necessitates high-performance and energy-efficient computing solutions, driving the adoption of 3D IC and 2.5D IC technologies. Furthermore, the expanding IoT ecosystem, with its diverse range of connected devices, creates new avenues for market growth, as these integrated circuits offer compact and efficient solutions for IoT applications.

Key Questions Answered in the Report:

• What are the primary factors driving the growth of the 3D IC and 2.5D IC market globally?
• Which applications are driving the adoption of 3D IC and 2.5D IC technologies across different sectors?
• How are technological advancements reshaping the competitive landscape of the 3D IC and 2.5D IC market?
• Who are the key players contributing to the 3D IC and 2.5D IC market, and what strategies are they employing to maintain market relevance?
• What are the emerging trends and future prospects in the global 3D IC and 2.5D IC market?

Competitive Intelligence and Business Strategy:

Leading players in the global 3D IC and 2.5D IC market, including TSMC, Intel Corporation, and Samsung Electronics, focus on innovation, product differentiation, and strategic partnerships to gain a competitive edge. These companies invest in R&D to develop advanced integrated circuit solutions, including TSV technology and innovative packaging techniques, catering to diverse application requirements. Collaborations with semiconductor manufacturers, technology providers, and research institutions facilitate market access and promote technology adoption. Moreover, emphasis on cost-effective manufacturing processes, efficient thermal management solutions, and performance optimization fosters market growth and enhances product reliability in the rapidly evolving 3D IC and 2.5D IC landscape.

Key Companies Profiled:

• Taiwan Semiconductor Manufacturing Company
• Intel Corporation
• United Microelectronics Corporation
• Samsung Electronics Co., Ltd.
• ASE Group
• Amkor Technology
• ST Microelectronics NV
• Broadcom Ltd.
• Jiangsu Changjiang Electronics Technology Co., Ltd
• Toshiba Corporation

3D IC and 2.5D IC Market Segmentation

By Packaging Technology

• 3D Wafer-level Chip-scale Packaging
• 3D Through-silicon Via
• 2.5D

By Application

• Logic
• Imaging and Optoelectronics
• Memory
• Micro-electromechanical Systems/Sensors
• Light-emitting Diode
• Power
• Analog & Mixed Signal
• Radio Frequency
• Photonics

By End User

• Consumer Electronics
• Telecommunication
• Industry Sector
• Automotive
• Military and Aerospace
• Smart Technologies
• Medical Devices

By Region

• North America
• Latin America
• Europe
• Asia Pacific
• Middle East and Africa

Table of Contents

1. Executive Summary

• 1.1. Global Market Outlook
• 1.2. Demand-side Trends
• 1.3. Supply-side Trends
• 1.4. Technology Roadmap Analysis
• 1.5. Analysis and Recommendations

2. Market Overview

• 2.1. Market Coverage / Taxonomy
• 2.2. Market Definition / Scope / Limitations

3. Market Background

• 3.1. Market Dynamics
  • 3.1.1. Drivers
  • 3.1.2. Restraints
  • 3.1.3. Opportunity
  • 3.1.4. Trends
• 3.2. Scenario Forecast
  • 3.2.1. Demand in Optimistic Scenario
  • 3.2.2. Demand in Likely Scenario
  • 3.2.3. Demand in Conservative Scenario
• 3.3. Opportunity Map Analysis
• 3.4. Investment Feasibility Matrix
• 3.5. PESTLE and Porter's Analysis
• 3.6. Regulatory Landscape
  • 3.6.1. By Key Regions
  • 3.6.2. By Key Countries
• 3.7. Regional Parent Market Outlook

4. Global 3D IC and 2.5D IC Market Analysis 2019-2023 and Forecast, 2024-2032

• 4.1. Historical Market Size Value (US$ trillion) Analysis, 2019-2023
• 4.2. Current and Future Market Size Value (US$ trillion) Projections, 2024-2032
  • 4.2.1. Y-o-Y Growth Trend Analysis
  • 4.2.2. Absolute $ Opportunity Analysis

5. Global 3D IC and 2.5D IC Market Analysis 2019-2023 and Forecast 2024-2032, By Packaging Technology

• 5.1. Introduction / Key Findings
• 5.2. Historical Market Size Value (US$ trillion) Analysis By Packaging Technology, 2019-2023
• 5.3. Current and Future Market Size Value (US$ trillion) Analysis and Forecast By Packaging Technology, 2024-2032
  • 5.3.1. 3D Wafer-level Chip-scale Packaging
  • 5.3.2. 3D Through-silicon Via
  • 5.3.3. 2.5D
• 5.4. Y-o-Y Growth Trend Analysis By Packaging Technology, 2019-2023
• 5.5. Absolute $ Opportunity Analysis By Packaging Technology, 2024-2032

6. Global 3D IC and 2.5D IC Market Analysis 2019-2023 and Forecast 2024-2032, By Application

• 6.1. Introduction / Key Findings
• 6.2. Historical Market Size Value (US$ trillion) Analysis By Application, 2019-2023
• 6.3. Current and Future Market Size Value (US$ trillion) Analysis and Forecast By Application, 2024-2032
  • 6.3.1. Logic
  • 6.3.2. Imaging & Optoelectronics
  • 6.3.3. Memory
  • 6.3.4. Micro-electromechanical Systems/Sensors
  • 6.3.5. Light-emitting Diode
  • 6.3.6. Power
  • 6.3.7. Analog & Mixed Signal
  • 6.3.8. Radio Frequency
  • 6.3.9. Photonics
• 6.4. Y-o-Y Growth Trend Analysis By Application, 2019-2023
• 6.5. Absolute $ Opportunity Analysis By Application, 2024-2032

7. Global 3D IC and 2.5D IC Market Analysis 2019-2023 and Forecast 2024-2032, By End Use

• 7.1. Introduction / Key Findings
• 7.2. Historical Market Size Value (US$ trillion) Analysis By End Use , 2019-2023
• 7.3. Current and Future Market Size Value (US$ trillion) Analysis and Forecast By End Use , 2024-2032
  • 7.3.1. Consumer Electronics
  • 7.3.2. Telecommunication
  • 7.3.3. Industry Sector
  • 7.3.4. Automotive
  • 7.3.5. Military & Aerospace
  • 7.3.6. Smart Technologies
  • 7.3.7. Medical Devices
• 7.4. Y-o-Y Growth Trend Analysis By End Use , 2019-2023
• 7.5. Absolute $ Opportunity Analysis By End Use , 2024-2032

8. Global 3D IC and 2.5D IC Market Analysis 2019-2023 and Forecast 2024-2032, By Region

• 8.1. Introduction
• 8.2. Historical Market Size Value (US$ trillion) Analysis By Region, 2019-2023
• 8.3. Current Market Size Value (US$ trillion) Analysis and Forecast By Region, 2024-2032
  • 8.3.1. North America
  • 8.3.2. Latin America
  • 8.3.3. Europe
  • 8.3.4. Asia Pacific
  • 8.3.5. Middle East and Africa
• 8.4. Market Attractiveness Analysis By Region

9. North America 3D IC and 2.5D IC Market Analysis 2019-2023 and Forecast 2024-2032, By Country

• 9.1. Historical Market Size Value (US$ trillion) Trend Analysis By Market Taxonomy, 2019-2023
• 9.2. Market Size Value (US$ trillion) Forecast By Market Taxonomy, 2024-2032
  • 9.2.1. By Country
    • 9.2.1.1. USA
    • 9.2.1.2. Canada
  • 9.2.2. By Packaging Technology
  • 9.2.3. By Application
  • 9.2.4. By End Use
• 9.3. Market Attractiveness Analysis
  • 9.3.1. By Country
  • 9.3.2. By Packaging Technology
  • 9.3.3. By Application
  • 9.3.4. By End Use
• 9.4. Key Takeaways

10. Latin America 3D IC and 2.5D IC Market Analysis 2019-2023 and Forecast 2024-2032, By Country

• 10.1. Historical Market Size Value (US$ trillion) Trend Analysis By Market Taxonomy, 2019-2023
• 10.2. Market Size Value (US$ trillion) Forecast By Market Taxonomy, 2024-2032
  • 10.2.1. By Country
    • 10.2.1.1. Brazil
    • 10.2.1.2. Mexico
    • 10.2.1.3. Rest of Latin America
  • 10.2.2. By Packaging Technology
  • 10.2.3. By Application
  • 10.2.4. By End Use
• 10.3. Market Attractiveness Analysis
  • 10.3.1. By Country
  • 10.3.2. By Packaging Technology
  • 10.3.3. By Application
  • 10.3.4. By End Use
• 10.4. Key Takeaways

11. Europe 3D IC and 2.5D IC Market Analysis 2019-2023 and Forecast 2024-2032, By Country

• 11.1. Historical Market Size Value (US$ trillion) Trend Analysis By Market Taxonomy, 2019-2023
• 11.2. Market Size Value (US$ trillion) Forecast By Market Taxonomy, 2024-2032
  • 11.2.1. By Country
    • 11.2.1.1. Germany
    • 11.2.1.2. United Kingdom
    • 11.2.1.3. France
    • 11.2.1.4. Spain
    • 11.2.1.5. Italy
    • 11.2.1.6. Rest of Europe
  • 11.2.2. By Packaging Technology
  • 11.2.3. By Application
  • 11.2.4. By End Use
• 11.3. Market Attractiveness Analysis
  • 11.3.1. By Country
  • 11.3.2. By Packaging Technology
  • 11.3.3. By Application
  • 11.3.4. By End Use
• 11.4. Key Takeaways

12. Asia Pacific 3D IC and 2.5D IC Market Analysis 2019-2023 and Forecast 2024-2032, By Country

• 12.1. Historical Market Size Value (US$ trillion) Trend Analysis By Market Taxonomy, 2019-2023
• 12.2. Market Size Value (US$ trillion) Forecast By Market Taxonomy, 2024-2032
  • 12.2.1. By Country
    • 12.2.1.1. China
    • 12.2.1.2. Japan
    • 12.2.1.3. South Korea
    • 12.2.1.4. Singapore
    • 12.2.1.5. Thailand
    • 12.2.1.6. Indonesia
    • 12.2.1.7. Australia
    • 12.2.1.8. New Zealand
    • 12.2.1.9. Rest of Asia Pacific
  • 12.2.2. By Packaging Technology
  • 12.2.3. By Application
  • 12.2.4. By End Use
• 12.3. Market Attractiveness Analysis
  • 12.3.1. By Country
  • 12.3.2. By Packaging Technology
  • 12.3.3. By Application
  • 12.3.4. By End Use
• 12.4. Key Takeaways

13. Middle East and Africa 3D IC and 2.5D IC Market Analysis 2019-2023 and Forecast 2024-2032, By Country

• 13.1. Historical Market Size Value (US$ trillion) Trend Analysis By Market Taxonomy, 2019-2023
• 13.2. Market Size Value (US$ trillion) Forecast By Market Taxonomy, 2024-2032
  • 13.2.1. By Country
    • 13.2.1.1. Gulf Cooperation Council Countries
    • 13.2.1.2. South Africa
    • 13.2.1.3. Israel
    • 13.2.1.4. Rest of Middle East and Africa
  • 13.2.2. By Packaging Technology
  • 13.2.3. By Application
  • 13.2.4. By End Use
• 13.3. Market Attractiveness Analysis
  • 13.3.1. By Country
  • 13.3.2. By Packaging Technology
  • 13.3.3. By Application
  • 13.3.4. By End Use
• 13.4. Key Takeaways

14. Key Countries 3D IC and 2.5D IC Market Analysis

• 14.1. USA
  • 14.1.1. Pricing Analysis
  • 14.1.2. Market Share Analysis, 2024
    • 14.1.2.1. By Packaging Technology
    • 14.1.2.2. By Application
    • 14.1.2.3. By End Use
• 14.2. Canada
  • 14.2.1. Pricing Analysis
  • 14.2.2. Market Share Analysis, 2024
    • 14.2.2.1. By Packaging Technology
    • 14.2.2.2. By Application
    • 14.2.2.3. By End Use
• 14.3. Brazil
  • 14.3.1. Pricing Analysis
  • 14.3.2. Market Share Analysis, 2024
    • 14.3.2.1. By Packaging Technology
    • 14.3.2.2. By Application
    • 14.3.2.3. By End Use
• 14.4. Mexico
  • 14.4.1. Pricing Analysis
  • 14.4.2. Market Share Analysis, 2024
    • 14.4.2.1. By Packaging Technology
    • 14.4.2.2. By Application
    • 14.4.2.3. By End Use
• 14.5. Germany
  • 14.5.1. Pricing Analysis
  • 14.5.2. Market Share Analysis, 2024
    • 14.5.2.1. By Packaging Technology
    • 14.5.2.2. By Application
    • 14.5.2.3. By End Use
• 14.6. United Kingdom
  • 14.6.1. Pricing Analysis
  • 14.6.2. Market Share Analysis, 2024
    • 14.6.2.1. By Packaging Technology
    • 14.6.2.2. By Application
    • 14.6.2.3. By End Use
• 14.7. France
  • 14.7.1. Pricing Analysis
  • 14.7.2. Market Share Analysis, 2024
    • 14.7.2.1. By Packaging Technology
    • 14.7.2.2. By Application
    • 14.7.2.3. By End Use
• 14.8. Spain
  • 14.8.1. Pricing Analysis
  • 14.8.2. Market Share Analysis, 2024
    • 14.8.2.1. By Packaging Technology
    • 14.8.2.2. By Application
    • 14.8.2.3. By End Use
• 14.9. Italy
  • 14.9.1. Pricing Analysis
  • 14.9.2. Market Share Analysis, 2024
    • 14.9.2.1. By Packaging Technology
    • 14.9.2.2. By Application
    • 14.9.2.3. By End Use
• 14.10. China
  • 14.10.1. Pricing Analysis
  • 14.10.2. Market Share Analysis, 2024
    • 14.10.2.1. By Packaging Technology
    • 14.10.2.2. By Application
    • 14.10.2.3. By End Use
• 14.11. Japan
  • 14.11.1. Pricing Analysis
  • 14.11.2. Market Share Analysis, 2024
    • 14.11.2.1. By Packaging Technology
    • 14.11.2.2. By Application
    • 14.11.2.3. By End Use
• 14.12. South Korea
  • 14.12.1. Pricing Analysis
  • 14.12.2. Market Share Analysis, 2024
    • 14.12.2.1. By Packaging Technology
    • 14.12.2.2. By Application
    • 14.12.2.3. By End Use
• 14.13. Singapore
  • 14.13.1. Pricing Analysis
  • 14.13.2. Market Share Analysis, 2024
    • 14.13.2.1. By Packaging Technology
    • 14.13.2.2. By Application
    • 14.13.2.3. By End Use
• 14.14. Thailand
  • 14.14.1. Pricing Analysis
  • 14.14.2. Market Share Analysis, 2024
    • 14.14.2.1. By Packaging Technology
    • 14.14.2.2. By Application
    • 14.14.2.3. By End Use
• 14.15. Indonesia
  • 14.15.1. Pricing Analysis
  • 14.15.2. Market Share Analysis, 2024
    • 14.15.2.1. By Packaging Technology
    • 14.15.2.2. By Application
    • 14.15.2.3. By End Use
• 14.16. Australia
  • 14.16.1. Pricing Analysis
  • 14.16.2. Market Share Analysis, 2024
    • 14.16.2.1. By Packaging Technology
    • 14.16.2.2. By Application
    • 14.16.2.3. By End Use
• 14.17. New Zealand
  • 14.17.1. Pricing Analysis
  • 14.17.2. Market Share Analysis, 2024
    • 14.17.2.1. By Packaging Technology
    • 14.17.2.2. By Application
    • 14.17.2.3. By End Use
• 14.18. Gulf Cooperation Council Countries
  • 14.18.1. Pricing Analysis
  • 14.18.2. Market Share Analysis, 2024
    • 14.18.2.1. By Packaging Technology
    • 14.18.2.2. By Application
    • 14.18.2.3. By End Use
• 14.19. South Africa
  • 14.19.1. Pricing Analysis
  • 14.19.2. Market Share Analysis, 2024
    • 14.19.2.1. By Packaging Technology
    • 14.19.2.2. By Application
    • 14.19.2.3. By End Use
• 14.20. Israel
  • 14.20.1. Pricing Analysis
  • 14.20.2. Market Share Analysis, 2024
    • 14.20.2.1. By Packaging Technology
    • 14.20.2.2. By Application
    • 14.20.2.3. By End Use

15. Market Structure Analysis

• 15.1. Competition Dashboard
• 15.2. Competition Benchmarking
• 15.3. Market Share Analysis of Top Players
  • 15.3.1. By Regional
  • 15.3.2. By Packaging Technology
  • 15.3.3. By Application
  • 15.3.4. By End Use

16. Competition Analysis

• 16.1. Competition Deep Dive
  • 16.1.1. Taiwan Semiconductor Manufacturing Company Limited
    • 16.1.1.1. Overview
    • 16.1.1.2. Product Portfolio
    • 16.1.1.3. Profitability by Market Segments
    • 16.1.1.4. Sales Footprint
    • 16.1.1.5. Strategy Overview
      • 16.1.1.5.1. Marketing Strategy
  • 16.1.2. Samsung Electronics Co., Ltd.
    • 16.1.2.1. Overview
    • 16.1.2.2. Product Portfolio
    • 16.1.2.3. Profitability by Market Segments
    • 16.1.2.4. Sales Footprint
    • 16.1.2.5. Strategy Overview
      • 16.1.2.5.1. Marketing Strategy
  • 16.1.3. Toshiba Corp.
    • 16.1.3.1. Overview
    • 16.1.3.2. Product Portfolio
    • 16.1.3.3. Profitability by Market Segments
    • 16.1.3.4. Sales Footprint
    • 16.1.3.5. Strategy Overview
      • 16.1.3.5.1. Marketing Strategy
  • 16.1.4. ASE Group
    • 16.1.4.1. Overview
    • 16.1.4.2. Product Portfolio
    • 16.1.4.3. Profitability by Market Segments
    • 16.1.4.4. Sales Footprint
    • 16.1.4.5. Strategy Overview
      • 16.1.4.5.1. Marketing Strategy
  • 16.1.5. Amkor Technology
    • 16.1.5.1. Overview
    • 16.1.5.2. Product Portfolio
    • 16.1.5.3. Profitability by Market Segments
    • 16.1.5.4. Sales Footprint
    • 16.1.5.5. Strategy Overview
      • 16.1.5.5.1. Marketing Strategy
  • 16.1.6. United Microelectronics Corp.
    • 16.1.6.1. Overview
    • 16.1.6.2. Product Portfolio
    • 16.1.6.3. Profitability by Market Segments
    • 16.1.6.4. Sales Footprint
    • 16.1.6.5. Strategy Overview
      • 16.1.6.5.1. Marketing Strategy
  • 16.1.7. STMicroelectronics Nv
    • 16.1.7.1. Overview
    • 16.1.7.2. Product Portfolio
    • 16.1.7.3. Profitability by Market Segments
    • 16.1.7.4. Sales Footprint
    • 16.1.7.5. Strategy Overview
      • 16.1.7.5.1. Marketing Strategy
  • 16.1.8. Broadcom Ltd.
    • 16.1.8.1. Overview
    • 16.1.8.2. Product Portfolio
    • 16.1.8.3. Profitability by Market Segments
    • 16.1.8.4. Sales Footprint
    • 16.1.8.5. Strategy Overview
      • 16.1.8.5.1. Marketing Strategy
  • 16.1.9. Intel Corporation
    • 16.1.9.1. Overview
    • 16.1.9.2. Product Portfolio
    • 16.1.9.3. Profitability by Market Segments
    • 16.1.9.4. Sales Footprint
    • 16.1.9.5. Strategy Overview
      • 16.1.9.5.1. Marketing Strategy
  • 16.1.10. Jiangsu Changjiang Electronics Technology Co., Ltd.
    • 16.1.10.1. Overview
    • 16.1.10.2. Product Portfolio
    • 16.1.10.3. Profitability by Market Segments
    • 16.1.10.4. Sales Footprint
    • 16.1.10.5. Strategy Overview
      • 16.1.10.5.1. Marketing Strategy

17. Assumptions & Acronyms Used

18. Research Methodology