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자동차용 마이크로컨트롤러 유닛(MCU) 및 애플리케이션 시나리오 조사 보고서(2026년)

Automotive Microcontroller Unit (MCU) and Application Scenario Research Report, 2026
발행일: | 리서치사: 구분자 ResearchInChina | 페이지 정보: 영문 620 Pages | 배송안내 : 1-2일 (영업일 기준)

    
    
    



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자동차용 MCU 관련 조사 : 중복화된 보안에 대한 수요 증가로 ASIL D 준수 MCU 출하량이 1억 대를 돌파

자동차의 EEA(전자 제어 아키텍처)에서 MCU는 자동차의 다양한 기능 도메인에 광범위하게 배치되어 있으며, 기능 안전 모니터링, 실시간 제어, 센서 전처리, 통신용 전원 관리, 워치독 작업 등의 역할을 담당하고 있습니다. 기능 안전 수준은 기능 도메인이나 작업에 따라 ASIL A부터 ASIL D까지 다양합니다. 자율주행 도메인이나 섀시 도메인과 관련된 시스템은 주행 안전성에 직접적인 영향을 미치기 때문에 일반적으로 ASIL D가 요구됩니다. 또한, 서브시스템 솔루션의 발전에 따라 MCU의 대수와 이들이 담당하는 태스크는 변화해 가고 있습니다. 그러나 자동차용 MCU는 분산형 ECU 아키텍처에서 중앙 집중형 + 구역 중복형 멀티 MCU 아키텍처로 진화하는 경향을 보이고 있습니다. 또한 MCU의 성능도 끊임없이 향상되고 있습니다.

신에너지차의 보급률이 계속 상승하는 가운데, 중국의 자동차용 MCU 시장은 여전히 상승세를 보이고 있습니다. 2025년에는 중국의 승용차에 8억 5,000만-9억 개의 MCU가 탑재되어 시장 규모가 269억 1,000만 위안으로 달할 것으로 추정됩니다. 아울러 ASIL D를 준수하는 MCU의 비중도 계속 증가하고 있습니다. 중국 승용차 시장에서 ASIL D를 준수하는 MCU의 출하대수는 2025년에 약 1억 대로 추정되며, 2030년에는 1억 8,000만 대로 더욱 증가할 것으로 전망됩니다.

브레이크 바이 와이어 시스템의 기술적 진화에 따라 MCU의 중복성, 기능 안전성 및 실시간 성능에 대한 요구 사항이 크게 높아지고 있습니다.

브레이크 바이 와이어는 지능형 섀시의 핵심이 되는 실행 계층입니다. 기존의 유압 및 기계적 연결을 전자 신호로 대체하여, 제동 명령에 대해 밀리초 수준의 응답과 정밀한 제어를 실현하고, 자율주행을 위한 중복적인 안전 기반을 제공합니다. 이 분야의 기술 로드맵은 EHB에서 드라이 EMB로 진화하고 있습니다.

EHB(일렉트로-유압 브레이크) 시스템은 브레이크 페달 모듈, 제어 장치 및 유압 제어 모듈로 구성되어 있습니다. 이는 현재 시장에서 주류를 이루는 브레이크 바이 와이어 솔루션입니다. 기존 브레이크 시스템과 비교했을 때, EHB의 ‘브레이크 바이 와이어’라는 특징은 주로 운전자의 페달과 브레이크 시스템의 ECU 간의 연결이 기계적 연결에서 전기 신호에 의한 연결로 변경된 점에 나타나지만, 브레이크 액추에이터 자체는 여전히 유압 시스템을 채택하고 있습니다. EHB 시스템의 통합 수준에 따라 ‘투 박스’와 ‘원 박스’라는 두 가지 제어 전략이 있습니다.

‘투 박스’ EHB 시스템은 일반적으로 모터, 기계식 감속 기구, 마스터 실린더, 센서 및 2개의 독립적인 ECU로 구성됩니다. 따라서 일반적으로 2개의 MCU, 혹은 2개의 MCU에 더해 중복 감시를 위한 MCU 1개가 필요합니다. MCU는 ASIL-D, 실시간 폐쇄 루프, 밀리초 수준의 이중화 등의 요구 사항을 충족해야 합니다.

원박스형 EHB 시스템은 기존의 투박스형 구성을 기반으로 iBooster와 ESP를 통합한 것으로, ECU와 브레이크 유닛을 각각 1개씩만 필요로 하여 집적도가 높고 크기와 무게가 줄어듭니다. 또한, 휠 실린더의 유압을 독립적으로 제어할 수 있으므로 ABS, ESC, TCS 등의 차량 안정성 제어 기능을 구현합니다. 이 시스템은 투박스형 솔루션보다 적은 수의 MCU(1개)를 사용하지만, 성능 요구 사항은 동일합니다.

전기기계식 브레이크(EMB)는 EHB를 기반으로 브레이크 구조를 더욱 단순화했습니다. EHB의 기존 브레이크 마스터 실린더와 유압 배관을 없애고, 모터를 브레이크에 직접 통합했습니다. 모터가 브레이크 피스톤을 밀고, 브레이크 캘리퍼가 브레이크 디스크를 조여 제동을 실현합니다.

ASIL-D 요구 사항을 충족하기 위해서는 EMB 아키텍처의 설계가 매우 중요합니다. ECU, 전원, 통신 라인 및 기타 구성요소에 대해서는 이중화된 백업 설계를 채택해야 합니다. ECU 레이아웃과 관련하여, EMB 액추에이터 내에 통합된 컨트롤러를 배제하고 제어 기능을 중앙 집중식 듀플렉스 모듈에 통합하는 시스템도 소수 존재합니다. 보다 일반적인 것은 4개의 액추에이터용 ECU를 채택하는 시스템입니다. 대표적인 MCU 레이아웃 구성은 다음 표에 나와 있습니다.

현재 EMB에는 약 6개의 MCU가 필요합니다. 이러한 MCU는 높은 TOPS를 목표로 하지 않으며, 대신 200 MHz 이상의 클럭 주파수, 락스텝 코어,ASIL-D 준수, 마이크로초 수준의 FOC 전류 루프, 이중화된 멀티채널 CAN-FD/FlexRay 통신, 고분해능 PWM/ADC, 그리고 48V 지원과 같은 요구 사항이 우선시됩니다. 듀얼 전원, 듀얼 권선 모터, 그리고 기계적 셀프 락과 결합함으로써 완전한 페일 오퍼레이셔널 시스템을 구성합니다.

예를 들어, SemiDrive사는 2025년 10월, 주력 제품인 지능형 MCU ‘E3650’의 양산 개시를 발표했습니다. 이 제품은 많은 주요 OEM에서 채택되고 있으며, 차량 구역 제어, VMC, 지능형 콕핏/자율주행 도메인 제어, 파워트레인 도메인 제어라는 4가지 주요 시나리오를 포괄합니다.

주요 성능 : 600MHz ARM Cortex-R52 + 락스텝 멀티 코어 클러스터 4쌍, 16MB의 차량용 등급 MRAM, 가상화 기능. 연산 능력은 동급 제품에 비해 약 40% 향상되었습니다.

보안 수준 : AEC-Q100 Grade 1 및 ISO 26262 ASIL D, Xuanwu ultra-safe HSM, ISO 21434, Evita Full 이상의 정보 보안 규격을 준수합니다;

통신 기능 : 완전 자체 개발한 SSDPE, 패킷 손실 제로의 멀티채널 CAN FD 동시 통신을 지원하며, 섀시 바이 와이어의 멀티 센서 및 액추에이터의 고주파수 통신에 적합합니다;

크로스 도메인 통합 : 단일 칩으로 멀티 시스템(차체, 섀시, 파워트레인) 서비스의 안전한 분리 및 협력적 스케줄링을 실현하며, 섀시 바이 와이어 기능을 통합하는 ZCU의 동향에 대응하고 있습니다.

또한, 자동차의 EEA는 중앙 컴퓨팅 플랫폼으로 계속 진화하고 있습니다. 지능형 콕핏과 자율주행으로 구성된 ‘중앙 대뇌’에 더해, 차체, 커넥티비티, 파워트레인 및 섀시 동작의 협동에 관련된 차량 제어 작업은 현재의 존 계층에서 점차 상위 계층으로 수렴되어 ‘중앙 지능형 제어 소뇌’를 형성하고 있습니다. 이를 위해서는 더욱 강력하고 견고한 안전 컴퓨팅 기반이 요구됩니다.

SemiDrive는 이 복잡한 ‘중앙 소뇌’를 위한 초고성능 컴퓨팅 기반인 ‘AMU(Architecture Master Unit)’를 개발했습니다. AMU는 기존의 일반적인 MCU를 뛰어넘는 초고집적의, 더욱 강력하고 안전한 실시간 컴퓨팅 플랫폼입니다. 칩을 기반으로 SemiDrive의 심도 있는 시스템 최적화 능력과 최첨단 소프트웨어 역량을 통합하여, 각 OEM사에 소프트웨어와 하드웨어의 협업 솔루션을 제공합니다. 2026년 4월, SemiDrive는 ‘중앙 지능형 제어 소뇌’를 위한 두 가지 AMU 솔루션인 플래그십 AMU E3800과 Gemini AMU E3650-E를 발표했습니다.

E3800은 단일 칩에 10개 이상의 코어를 통합하여 강력한 보안 실시간 연산 능력을 자랑하며, 항공우주 등급의 첨단 임베디드 스토리지를 도입하여 기존 eFlash에 비해 10-20배의 성능을 발휘합니다. 중앙 소뇌의 시나리오 요구 사항을 충족하기 위해 E3800은 네트워크 통신 기능을 특별히 강화했습니다. 고대역폭 이더넷, 통합형 멀티포트 스위치 및 다층 네트워크 가속 엔진을 탑재하고 있습니다. 기반이 되는 레이어 아키텍처의 혁신을 통해 E3800은 CPU와 NPU가 파이프라인 내에서 긴밀하게 연동하여 협업 동작을 실현함으로써, 중앙 소뇌의 실시간 지능형 처리 능력을 종합적으로 향상시킵니다.

Gemini AMU는 공통 기판 위에 연결된 2개의 E3650 플래그십 칩을 결합한 것입니다. SemiDrive사의 ‘SemiLink’ 통신 최적화 기술을 채택하여 칩 간 통신 지연을 마이크로초 단위로 줄였습니다. 각 OEM 업체가 실제 고수준의 개발을 진행할 때, 싱글 칩 솔루션과 마찬가지로 최소한의 개발 노력으로 원활한 경험을 실현할 수 있습니다. Gemini AMU의 가장 큰 강점은 뛰어난 유연성에 있습니다. 이를 통해 각 OEM 업체는 블록을 조립하듯이 10코어에서 16코어로 연산 능력을 유연하게 확장할 수 있습니다. 특히 현재 차량의 EEA는 급속히 진화하고 있으며, 요구 사항도 아직 완전히 정해지지 않았습니다. Gemini AMU는 각 OEM 업체가 단계적인 개선과 애자일 검증을 수행할 수 있도록 지원하여, 새로운 아키텍처 개발을 보다 유연하게 진행하고 차량의 지능화를 위한 시간을 확보할 수 있게 해줍니다.

차세대 지능형 BMS 도메인 컨트롤러의 주류로 자리 잡을 선택지는 고성능 멀티 코어 MCU, 혹은 MCU+MPU의 이종 아키텍처로 진화하고 있습니다.

차세대 중앙 집중형 도메인 제어 BMS 아키텍처에서는 고성능 도메인 제어 머더보드(멀티 코어 MCU를 채택할 가능성 있음)를 사용하여 기존 BMU의 모든 기능을 직접 계승하는 동시에, VCU의 에너지 관리 기능 일부를 통합하고, 나아가 게이트웨이 기능까지 융합합니다.

고성능 멀티 코어 MCU : 예를 들어, Infineon사의 TC4xx는 여러 개의 록스텝 코어(ASIL-D 안전 태스크용)와 퍼포먼스 코어를 갖추고 있어, 기능 안전의 최고 수준 요구 사항을 충족할 뿐만 아니라 알고리즘 처리를 위해 상당한 연산 능력을 제공할 수 있습니다.

MCU+MPU 이종 아키텍처 : 이는 보다 미래 지향적인 선택지입니다. MCU(Cortex-R 등)는 높은 실시간성과 높은 보안성이 요구되는 태스크(OVP, 단락 보호 등) 처리에 특화되어 있습니다. 반면, MPU(Cortex-A 등)는 Linux와 같은 기능이 풍부한 운영체제를 실행하며, 복잡한 알고리즘, 네트워크 통신, 진단 서비스 및 HMI 인터페이스를 담당합니다. 이 아키텍처는 실시간 보안과 지능형 연산 처리를 모두 고려한 것입니다.

2026년, 인피니언은 전기자동차(xEV)의 고전압 리튬이온 배터리 관리를 위해 설계된 첨단 MCU인 ‘PSOC(TM)4 HVPA-SPM 1.0’을 출시했습니다. 이 MCU는 정밀도, 안전성 및 프로그래밍 용이성을 모두 갖추고 있으며, 존형 아키텍처 및 소프트웨어 정의 차량(SDV)으로의 전환을 지원합니다.

PSOC 4 HVPA-SPM 1.0은 BMS에 고도의 지능, 안전성 및 효율성을 제공하는 핵심 기능을 갖춘 완벽하게 통합된 설계를 제공합니다. 전류, 전압, 온도를 고정밀도로 모니터링하여 신뢰성 높은 배터리 성능을 확보하는 동시에, 충전 상태(SoC) 및 건강 상태(SoH)의 정확도를 향상시킵니다. ASIL D(ISO 26262) 안전 규격을 완벽하게 준수하는 이 MCU는 중요한 고전압 배터리 시스템에서 견고하고 신뢰할 수 있는 작동을 보장합니다. 내장된 Arm® Cortex®-M0+ 프로세서는 고급 엣지 인텔리전스를 구현하여 데이터 처리 속도를 높이는 동시에 중앙 전자 제어 장치(ECU)의 부하를 경감합니다. 또한, 이 MCU는 존(zone)형 아키텍처를 지원하므로, 각 OEM 업체가 특정 요구 사항에 맞춰 시스템을 맞춤화할 수 있어 개발 주기 단축과 시장 출시 기간 단축으로 이어집니다.

존형 아키텍처 하에서는 일부 시나리오에서 MCU가 없는 솔루션이 추진되고 있습니다.

도메인 컨트롤러의 성능 향상과 자동차용 이더넷을 통해 실현되는 고속이며 안정적인 장거리 통신 덕분에, 램프용 로컬 MCU를 제거하고 모든 제어를 ZCU로 이전하는 MCU 없는 솔루션이 벤더들로부터 주목받고 있습니다. 소프트웨어 정의 차량이라는 개발 동향 속에서, MCU가 없는 조명 제어 아키텍처는 조명 알고리즘을 차량의 ZCU에 통합함으로써 MCU에 대한 조명 컨트롤러의 연산 능력 요건을 회피하고, 비용, 효율 및 고집적화에 대한 고객의 수요를 충족시킵니다.

대폭적인 비용 절감 : 램프 내부의 로컬 MCU, 수정발진기, 일부 PMIC 및 기타 주변 부품이 불필요해짐에 따라 BOM 비용과 하드웨어의 복잡성이 감소합니다.

통신 속도가 대폭 향상되었습니다 : 이더넷이 CAN-FD를 대체하여 통신 대역폭을 확대하고 지연을 줄이는 동시에, 보다 복잡한 실시간 헤드라이트 제어 및 이미지 데이터 전송을 지원합니다;

MCU 없는 솔루션은 시스템 아키텍처를 재구축하여 각 OEM사가 기능적 차별화를 실현할 수 있도록 지원합니다 : MCU 없는 솔루션을 도입한 후, 제어 로직은 완전히 ZCU로 회귀합니다. 각 OEM사는 조명 로직을 독자적으로 정의하고, 자율주행 데이터를 결합함으로써 더욱 스마트한 조명 상호작용을 실현하여 진정한 ‘소프트웨어 정의형 조명’으로 나아갑니다. Tier 1 공급업체는 구동 설계 및 인터페이스에 집중할 수 있게 되어, 분업이 명확해지고 대응이 신속해집니다.

온세미의 MCU 없는 솔루션은 ‘HPC-10BASE-T1S 이더넷-RCP-LED 드라이버’라는 평면형 아키텍처를 채택하고 있습니다. HPC는 RCP에 직접 연결되며, 기존의 CAN 버스를 대신하여 10 Mbps 이더넷이 사용됩니다. 이 솔루션은 하드웨어를 대폭 최적화합니다. 노드 MCU, 리셋 회로, 수정발진기 등의 부품을 제거하여 25미터의 비차폐 트위스트 페어 케이블로 8-40개의 노드를 연결할 수 있습니다. PoDL 기술을 채택하여 2개의 와이어를 통해 전원 공급과 통신을 동시에 수행함으로써, 와이어링 하네스 비용을 50% 이상 절감하고 시스템을 간소화합니다. 성능 면에서는 10Base-T1S 이더넷의 전송 속도가 10 Mbps에 달하여 CAN/CAN FD를 훨씬 능가합니다. RCP는 gPTP 프로토콜을 통합하여 나노초 수준의 클럭 동기화를 실현함과 동시에 차량 전체 조명의 협업 제어를 보장합니다.

인피니언은 TLD7002-16ES를 사용하여 UART OVER CAN 통신 인터페이스를 채택함으로써, 비용 절감과 EMC 성능 향상을 실현하는 자동차용 조명 솔루션을 제안하고 있습니다. TLD7002-16ES는 2 Mbit/s의 HSLI 인터페이스(CAN OVER UART)를 갖춘 16채널 지능형 LED 드라이버입니다. 다른 외부 LED 드라이버를 제어하기 위한 게이트웨이로도 사용할 수 있습니다. UART-over-CAN 게이트웨이로 기능하는 TLD7002-16ES는 16개의 LED를 직접 구동하고, 외부 드라이버를 캐스케이드 연결함으로써 조명 기판상의 모든 MCU, 수정발진기, 리셋 회로를 제거하면서도 PWM, 진단, 전류 확장, 열 균형,나노초 단위의 동기화 기능을 유지하여, 자동차용 조명 ECU의 MCU 없는 아키텍처를 실현합니다. 이 설계를 통해 하드웨어의 복잡성이 40% 감소하고, 와이어링 하네스 양도 25% 감소하므로, 도메인 집중형 전기 설계 분야의 혁신을 촉진합니다. 또한, 조명 시스템에서 소프트웨어 정의 차량(SDV)의 동적 구성 요건에 더 적절하게 대응할 수 있습니다. 이 단일 칩 통합 솔루션은 기존의 디스크리트 설계를 대체하여 BOM 비용을 30% 절감합니다.

목차

제1장 자동차용 마이크로컨트롤러(MCU) 개요와 시장

제2장 콕핏 도메인의 MCU

제3장 파워트레인 및 섀시 도메인의 MCU

제4장 바디 도메인의 MCU

제5장 중국의 자동차용 MCU 벤더

제6장 타국의 자동차용 MCU 벤더

KSM 26.10.07

Automotive MCU Research: Increased demand for redundant security drives ASIL D-compliant MCU shipments to exceed 100 million units

In a vehicle EEA, MCUs are widely distributed in various functional domains of automobiles, undertaking tasks such as functional safety monitoring, real-time control, sensor preprocessing, communication power supply management, and watchdog tasks. The functional safety level ranges from ASIL A to ASIL D according to different functional domains and tasks. Systems related to the autonomous driving domain and the chassis domain generally require ASIL D as they are directly related to driving safety. Moreover, due to the evolution of subsystem solutions, the number of MCUs and the tasks they undertake will vary. However, vehicle MCUs show tend to evolve from a distributed ECU architecture to a central + zone redundant multi-MCU architecture. Moreover, MCU performance is also constantly improving.

As the penetration rate of new energy vehicles continues to increase, China's automotive-grade MCU market is still showing an upward trend. It is estimated that 850-900 million MCUs were installed in passenger cars in China in 2025, with a market size of RMB26.91 billion. Moreover, the proportion of MCUs that meet ASIL D continues to grow. The shipments of ASIL D-compliant MCUs in China's passenger car market was estimated to be around 100 million units in 2025, and the figure will further increase to 180 million units in 2030.

The technological evolution of brake-by-wire systems has significantly raised the requirements for MCU redundancy, functional safety, and real-time performance.

Brake-by-wire is the core execution layer of the intelligent chassis. It replaces traditional hydraulic/mechanical connections with electronic signals to achieve millisecond-level response to and precise control over braking commands, providing a redundant safety cornerstone for autonomous driving. The technology path herein is evolving from EHB to dry EMB.

An EHB (Electro-Hydraulic Brake) system consists of a brake pedal module, a control unit and a hydraulic control module. It is currently the mainstream brake-by-wire solution on the market. Compared with the traditional braking system, the "brake-by-wire" of EHB is mainly reflected in the fact that the connection between the driver's pedal and the ECU of the braking system has been changed from a mechanical connection to an electrical signal connection, but the brake actuator still retains the hydraulic system. According to the integration level of the EHB system, it boasts two control strategies: "Two-box" and "One-box":

A Two-box EHB system generally consists of a motor, a mechanical reduction mechanism, a master cylinder, a sensor, and two independent ECUs. Therefore, it generally requires two MCUs, or two MCUs plus a redundant monitoring MCU. MCUs should meet ASIL-D, real-time closed-loop, millisecond-level redundancy and other requirements.

A One-box EHB system integrates iBooster and ESP in the form of the original Two-box, only requiring one ECU and one braking unit, with higher integration and reduced size and weight. Moreover, it can independently regulate wheel cylinder hydraulic pressure, thereby realizing vehicle stability control functions such as ABS, ESC and TCS. The system uses one MCU, fewer than the two-box solution, yet the performance requirements remain the same.

Electro-Mechanical Brake (EMB) further simplifies the braking structure on the basis of EHB. It cancels the original brake master cylinder and hydraulic pipeline of EHB and integrates the motor directly on the brake. The motor pushes the brake piston and allows the brake caliper to clamp the brake disc to achieve braking.

In order to meet ASIL-D, EMB architecture design is critical. Redundant backup design must be adopted for ECUs, power supplies, communication lines and other components. In terms of ECU layout, a small number of systems discard the controller integrated within the EMB actuator but integrate control functions into a centralized duplex module. More commonly, systems adopt four actuator ECUs. The typical MCU layout schemes are shown in the table below.

Current EMB requires approximately six MCUs. These MCUs do not target high TOPS; instead, priorities include a 200 MHz+ clock frequency, lockstep cores, ASIL-D compliance, microsecond-level FOC current loops, redundant multi-channel CAN-FD/FlexRay communication, high-resolution PWM/ADC, and 48V compatibility. Combined with dual power supplies, dual-winding motors and mechanical self-locking, they form a complete fail-operational system.

For example, SemiDrive announced mass production of the flagship intelligent MCU, E3650, in October 2025. It has been appointed by many leading OEMs, covering four major scenarios: vehicle zonal control, VMC, intelligent cockpit/autonomous driving domain control, and powertrain domain control.

Performance highlights: 4 pairs of 600MHz ARM Cortex-R52+ lock-step multi-core clusters, 16MB automotive-grade MRAM, virtualization. The computing power is nearly 40% higher than products of the same grade;

Security level: AEC-Q100 Grade 1 and ISO 26262 ASIL D, Xuanwu ultra-safe HSM, ISO 21434, Evita Full and above information security standards;

Communication capabilities: Fully self-developed SSDPE, multi-channel CAN FD concurrency with zero packet loss, suitable for high-frequency communication of chassis-by-wire multi-sensors and actuators;

Cross-domain integration: A single chip can realize safe isolation and coordinated scheduling of multi-system (body, chassis, and powertrain) services, adapting to the trend of ZCUs integrating chassis-by-wire functions.

Moreover, the automotive EEA continues to evolve towards a central computing platform. In addition to the "central cerebrum" composed of intelligent cockpit and autonomous driving, vehicle control tasks related to body, connectivity, powertrain, and chassis motion coordination are gradually converging upward from the current zone layer to form a "central intelligent control cerebellum". This requires a more powerful and robust safety computing foundation.

SemiDrive created the "AMU (Architecture Master Unit)", a super computing power foundation for the complex central cerebellum. AMU goes beyond traditional ordinary MCUs as an ultra-highly integrated, more powerful and secure real-time computing platform. On the basis of chips, it integrates SemiDrive's deep system optimization capabilities and leading software capabilities to deliver software and hardware collaborative solutions to OEMs. In April 2026, SemiDrive launched two AMU solutions for "central intelligent control cerebellum": Flagship AMU E3800 and Gemini AMU E3650-E.

E3800 integrates more than 10 cores on a single chip, boasts strong secure real-time computing power, introduces aerospace-grade advanced embedded storage, and performs 10 to 20 times better than that of traditional eflash. For the scenario requirements of the central cerebellum, E3800 features specially enhanced network communication capabilities. It is equipped with high-bandwidth Ethernet, an integrated multi-port switch, and multi-layer network acceleration engines. Through the innovation of the underlying layer architecture, E3800 allows the CPU and NPU to realize deep coupling and collaborative work in the pipeline, comprehensively improving the real-time intelligent processing capabilities of the central cerebellum.

Gemini AMU is a combination of two E3650 flagship chips connected on a common board. Using SemiDrive's "SemiLink" communication optimization technology, the latency in cross-chip communication is reduced to microseconds. When OEMs carry out actual high-level development, they can achieve the same minimalist development and smooth experience as with a single-chip solution. The core advantage of Gemini AMU is its excellent flexibility, which allows OEMs to flexibly expand computing power from 10 to 16 cores like building blocks. Especially today, the vehicle EEA is iterating rapidly and the requirements have not yet fully converged. Gemini AMU can help OEMs conduct incremental iteration and agile verification, enabling more relaxed development of new architectures and gaining time for vehicle intelligence.

The mainstream choice for the next generation of intelligent BMS domain controllers is evolving towards high-performance multi-core MCUs or MCU+MPU heterogeneous architectures.

The next-generation centralized domain control BMS architecture uses a high-performance domain control motherboard (possibly using a multi-core MCU), which directly takes over all functions of the original BMU and integrates some of the VCU's energy management functions and even fuses gateway functions.

High-performance multi-core MCU: For example, Infineon's TC4xx, which has multiple lock-step cores (for ASIL-D safety tasks) and performance cores, can not only meet the highest requirements of functional safety, but also provide considerable computing power for algorithms.

MCU+MPU heterogeneous architecture: This is a more forward-looking choice. The MCU (such as Cortex-R) specializes in handling high-real-time, high-security tasks (such as OVP, short-circuit protection). The MPU (such as Cortex-A) runs a rich operating system (such as Linux) and is responsible for complex algorithms, network communications, diagnostic services and HMI interfaces. This architecture takes into account real-time security and intelligent computing.

In 2026, Infineon launched the PSOC(TM) 4 HVPA-SPM 1.0, an advanced MCU designed for high-voltage Li-ion battery management in electric vehicles (xEVs). This MCU combines precision, safety, and programmability, while supporting zonal architectures and the transition to Software-Defined Vehicles (SDVs).

The PSOC 4 HVPA-SPM 1.0 offers a fully integrated design with key features that bring advanced intelligence, safety, and efficiency to BMS. It provides high-precision monitoring of current, voltage, and temperature, ensuring reliable battery performance and improving the accuracy of State-of-Charge (SoC) and State-of-Health (SoH). Fully compliant with ASIL D (ISO 26262) safety standards, the MCU ensures robust and reliable operation in critical high-voltage battery systems. Its built-in Arm(R) Cortex(R)-M0+ processor delivers advanced edge intelligence, enabling faster data processing and reducing the load on the central Electronic Control Unit (ECU). Moreover, the MCU supports zonal architectures and allows OEMs to customize the system for specific requirements, leading to shorter development cycles and faster time-to-market.

Under the zonal architecture, the MCU-less solution is being promoted in some scenarios

With improved domain controller performance and high-speed, stable long-range communication enabled by automotive Ethernet, the MCU-less solutions that remove local MCUs for lamps and transfer full control to ZCUs have attracted attention from vendors. In the development trend of software-defined vehicles, the MCU-less lighting control architecture integrates lighting algorithms into the vehicle's ZCUs, avoiding the lighting controller's computing power requirements for the MCU and meeting customer demand for cost, efficiency, and high integration.

Significant cost reduction: Local MCUs, crystal oscillators, some PMICs and other peripheral components inside lamps are eliminated, cutting BOM cost and hardware complexity;

The communication rate has been greatly improved: Ethernet replaces CAN-FD to increase communication bandwidth, reduce latency, and support more complex real-time headlight control and image data transmission;

The MCU-less solution reconstructs the system architecture and helps OEMs achieve functional differentiation: After the MCU-less solution is adopted, the control logic is completely restored to ZCUs. OEMs can independently define lighting logic and combine autonomous driving data to attain smarter lighting interaction, truly moving towards "software-defined lighting". Tier 1 suppliers focus more on drive design and interfaces, with clearer division of labor and faster response.

onsemi's MCU-less solution adopts a flattened architecture of "HPC - 10BASE-T1S Ethernet - RCP - LED driver". The HPC connects directly to the RCP, with 10 Mbps Ethernet replacing the traditional CAN bus. This solution significantly optimizes hardware: it eliminates components such as node MCUs, reset circuits and crystal oscillators, and can connect 8 to 40 nodes on a 25-meter unshielded twisted pair. It uses PoDL technology for power supply and communication through two wires at the same time, reducing the wiring harness cost by more than 50% and simplifying the system. In terms of performance, the 10Base-T1S Ethernet rate reaches 10 Mbps, far exceeding CAN/CAN FD. The RCP integrates the gPTP protocol to achieve nanosecond-level clock synchronization and ensure coordinated control of the entire vehicle lighting.

With TLD7002-16ES, Infineon has proposed an automotive lighting solution that uses the UART OVER CAN communication interface to reduce costs and improve EMC performance. TLD7002-16ES is an intelligent 16-channel LED driver with a 2 Mbit/s HSLI interface (CAN OVER UART). It can be used as a gateway to control other external LED drivers. By acting as a UART-over-CAN gateway, TLD7002-16ES can directly drives 16 LEDs, and then cascades external drivers, eliminating all MCUs, crystal oscillators, and reset circuits on the light board, while retaining PWM, diagnosis, current expansion, thermal balance, and nanosecond synchronization, thus realizing the MCU-less architecture of the automotive light ECU. This design reduces hardware complexity by 40% and wiring harnesses by 25%, promoting innovation in domain-centralized electrical design. Moreover, it can better meet the dynamic configuration requirements of software-defined vehicles (SDVs) for the lighting system. The single-chip integrated solution replaces traditional discrete design and reduces BOM cost by 30%.

Table of Contents

1 Overview and Market of Automotive Microcontroller Unit (MCU)

  • 1.1 Definition and Technology Trends of Automotive MCU
  • Definition
  • Structure
  • Classification
  • Application
  • 1.2 MCU Market Size and Pattern
  • Global Automotive MCU Market Size, 2023-2030E
  • Automotive-Grade MCU Price
  • Automotive-Grade MCU BOM Cost Structure
  • Automotive MCU Demand Structure (by Application)
  • China's Passenger Car MCU Market Size, 2022-2030E (1)
  • China's Passenger Car MCU Market Size, 2022-2030E (2)
  • China's Passenger Car Autonomous Driving Domain: MCU Market Demand by Scenario, 2022-2030E (1)
  • China's Passenger Car Autonomous Driving Domain: MCU Market Demand by Scenario, 2022-2030E (2)
  • China's Passenger Car Autonomous Driving Domain: MCU Market Demand by Scenario, 2022-2030E (3)
  • China's Passenger Car Intelligent Cockpit Domain: MCU Market Demand by Scenario, 2022-2030E (1)
  • China's Passenger Car Intelligent Cockpit Domain: MCU Market Demand by Scenario, 2022-2030E (2)
  • China's Passenger Car Intelligent Cockpit Domain: MCU Market Demand by Scenario, 2022-2030E (3)
  • China's Passenger Car Chassis Domain: MCU Market Demand by Scenario, 2022-2030E (1)
  • China's Passenger Car Chassis Domain: MCU Market Demand by Scenario, 2022-2030E (2)
  • China's Passenger Car Chassis Domain: MCU Market Demand by Scenario, 2022-2030E (5)
  • China's Passenger Car Powertrain Domain: MCU Market Demand by Scenario, 2022-2030E (1)
  • China's Passenger Car Powertrain Domain: MCU Market Demand by Scenario, 2022-2030E (2)
  • China's Passenger Car Powertrain Domain: MCU Market Demand by Scenario, 2022-2030E (3)
  • China's Passenger Car Thermal Management System: MCU Market Demand by Scenario, 2022-2030E
  • China's Passenger Car Body/Zone: MCU Market Demand by Scenario, 2022-2030E (1)
  • China's Passenger Car Body/Zone: MCU Market Demand by Scenario, 2022-2030E (2)
  • 1.3 Automotive-Grade MCU Players and Product Layout
  • Automotive-Grade MCU Players (1): Traditional Automotive Chip Suppliers (1)
  • Automotive-Grade MCU Players (1): Traditional Automotive Chip Suppliers (2)
  • Automotive-Grade MCU Players (1): Traditional Automotive Chip Suppliers (3)
  • Automotive-Grade MCU Players (1): Traditional Automotive Chip Suppliers (4)
  • Automotive-Grade MCU Players (2): OEMs
  • Automotive-Grade MCU Product Line Layout of Major OEMs
  • Automotive-Grade MCU Product Line Layout of Major Suppliers (1)
  • Automotive-Grade MCU Product Line Layout of Major Suppliers (2)
  • Automotive-Grade MCU Product Line Layout of Major Suppliers (3)
  • Benchmarking of Chinese and Foreign Automotive-Grade MCUs (1)
  • Benchmarking of Chinese and Foreign Automotive-Grade MCUs (2)
  • Domestic Substitution of MCUs from Mainstream Foreign Suppliers
  • 1.4 Automotive MCU Technology Trends
  • Automotive MCU Technology Trend 1
  • Automotive MCU Technology Trend 2
  • Automotive MCU Technology Trend 6
  • Automotive MCU Technology Trend 7

2 MCU in Cockpit Domain

  • 2.1 Central + Zone
  • Central + Zonal Architecture's Demand for MCU
  • MCU Development Trends of Central + Zonal Architecture
  • Penetration Rate of Central + Zonal Architecture in Chinese Passenger Cars
  • Market Competition of MCU Vendors in Central + Zonal Architecture (Estimated)
  • MCU Competition in Central + Zonal Architecture: Summary of Vendors and Solutions (1)
  • MCU Competition in Central + Zonal Architecture: Summary of Vendors and Solutions (2)
  • 2.2 Autonomous Driving Domain Controller
  • High-Level Autonomous Driving's Demand for MCU
  • MCU Installation in Autonomous Driving Domain
  • Market Competition of MCU Vendors in Autonomous Driving Domain (Estimated)
  • Existing Application Structure of MCU in Autonomous Driving Domain: SOC+MCU
  • MCU Application Structure Trends in Autonomous Driving Domain
  • MCU Application Trends in Autonomous Driving Domain (1)
  • MCU Application Trends in Autonomous Driving Domain (2)
  • MCU Application Trends in Autonomous Driving Domain (3)
  • MCU for Autonomous Driving Domain: Summary of Vendors and Solutions (1)
  • MCU for Autonomous Driving Domain: Summary of Vendors and Solutions (2)
  • MCU for Autonomous Driving Domain: Summary of Vendors and Solutions (3)
  • 2.3 Cockpit Domain Controller
  • MCU Application in Cockpit Domain: SOC+MCU
  • Intelligent Cockpit Function Evolution Roadmap
  • MCU Installation in Intelligent Cockpit Domain
  • Market Competition of MCU Vendors in Intelligent Cockpit Domain (Estimated)
  • MCU for Cockpit Domain: Summary of Vendors and Solutions (1)
  • MCU for Cockpit Domain: Summary of Vendors and Solutions (2)
  • 2.4 LiDAR
  • LiDAR: Functional Evolution Roadmap
  • MCU Installation in LiDAR
  • Automotive LiDAR Control Strategy Solution 1: Control Module Integrated into LiDAR
  • Automotive LiDAR Control Strategy Solution 2: LiDAR's Main Computing Power Is Shifted upward to the Domain Controller
  • MCU for LiDAR: Summary of Vendors and Solutions
  • MCU Solutions for LiDAR (1)
  • MCU Solutions for LiDAR (2)
  • 2.5 Ultrasonic Radar
  • Ultrasonic Radar: Functional Evolution Roadmap
  • MCU Installation in Ultrasonic Radar
  • Parking Technology Evolution: APA/RPA/HPA/AVP (1)
  • Parking Technology Evolution: APA/RPA/HPA/AVP (2)
  • AK2 Ultrasonic Radar: Structural Composition
  • MCU Solutions for Ultrasonic Radar (1)
  • MCU Solutions for Ultrasonic Radar (2)
  • MCU Solutions for Ultrasonic Radar (3)
  • 2.6 HUD
  • HUD: Functional Evolution Roadmap
  • HUD: Evolution of MCU Control Strategy Involved
  • MCU Installation in HUD
  • AR-HUD Control Strategy Solution 1: Independent HUD Control Module
  • AR-HUD Control Strategy Solution 2: AR Engine Integrated into Cockpit Domain Controller
  • AR-HUD: Role of MCU
  • MCU for AR-HUD: Summary of Vendors and Solutions
  • MCU for AR-HUD: Comparison of Advantages and Disadvantages of Mainstream Vendors
  • MCU Solutions for AR-HUD (1)
  • MCU Solutions for AR-HUD (5)
  • MCU Solutions for AR-HUD (6)
  • 2.7 Development Trends of Next-Generation Cockpit-Driving Domain AI Vehicle Agent and MCU Demand
  • Cockpit-Driving Domain Is Developing towards AI Vehicle Agent
  • Cockpit-Driving AI Agent Application Case: Huawei WEWA 2.0
  • Cockpit-Driving AI Agent Application Case: XPeng's Second-Generation VLA
  • Development Trends of Next-Generation Cockpit-Driving Domain AI Vehicle Agent and MCU Demand

3 MCU in Powertrain and Chassis Domains

  • 3.1 Powertrain Domain Controller
  • Evolution of MCU Computing Power Requirements in Powertrain and Chassis Domains
  • MCU Localization Process in Powertrain and Chassis Domains
  • Powertrain and Chassis Domains: Evolution of MCU Technology in Chassis Domain
  • Powertrain and Chassis Domains: Evolution of MCU Technology in Powertrain Domain
  • MCU Installation in Powertrain and Chassis Domains
  • Market Competition of MCU Vendors in Powertrain and Chassis Domains (Estimated)
  • MCU Market Landscape in Powertrain Domain: All-In-One New Energy Vehicle MCU Market Competition Pattern
  • MCU for Powertrain Domain: Summary of Vendors and Solutions (1)
  • MCU for Powertrain Domain: Summary of Vendors and Solutions (2)
  • MCU for Powertrain Domain: Summary of Vendors and Solutions (5)
  • MCU for Powertrain Domain: Summary of Vendors and Solutions (6)
  • MCU Solutions for Powertrain Domain (1)
  • MCU Solutions for Powertrain Domain (2)
  • MCU Solutions for Powertrain Domain (6)
  • MCU Solutions for Powertrain Domain (7)
  • 3.2 Steering System (EPS/SBW, etc.)
  • Steering System: Evolution of MCU Technology Involved
  • MCU Installation in Steering System
  • Summary of Automotive Steering System Technology Development Trends: RWS, EPS, SWB
  • EPS: Structural Composition and Working Principle
  • EPS Control Strategy Solution 1: EPS Dedicated Controller
  • EPS Control Strategy Solution 2: Dual-MCU Redundant Control (1)
  • EPS Control Strategy Solution 2: Dual-MCU Redundant Control (2)
  • MCU for EPS (1)
  • MCU for EPS (2)
  • MCU Solutions for EPS (1)
  • MCU Solutions for EPS (2)
  • MCU Solutions for EPS (3)
  • MCU Solutions for EPS (4)
  • SBW: Structural Composition and Working Principle
  • SBW Control Strategy Solution 1: Redundancy Control (1)
  • SBW Control Strategy Solution 1: Redundancy Control (2)
  • SBW Control Strategy Solution 2: Communication Link
  • MCU for SBW: Summary of Vendors and Solutions (1)
  • MCU for SBW: Summary of Vendors and Solutions (2)
  • 3.3 Braking System (EHB/EMB, etc.)
  • Brake-by-Wire: Evolution of MCU Technology Involved
  • MCU Installation in Brake-by-Wire
  • EHB: Structural Composition and Working Principle
  • EHB Control Strategy Solution 1: Two-Box
  • EHB Control Strategy Solution 2: One-Box
  • MCU for EHB: Summary of Vendors and Solutions (1)
  • MCU for EHB: Summary of Vendors and Solutions (2)
  • MCU Solutions for EHB (1)
  • MCU Solutions for EHB (4)
  • MCU Solutions for EHB (5)
  • EMB: Structural Composition and Working Principle
  • EMB Architecture
  • EMB Control Strategy Solution 1: Upper-Level Algorithm Runs on the Central Controller, While Motor Control is implemented in the Wheel-Side Controller
  • EMB Control Strategy Solution 2: Centralized Braking Control
  • MCU for EMB: Summary of Vendors and Solutions (1)
  • MCU for EMB: Summary of Vendors and Solutions (2)
  • MCU Solutions for EMB (1)
  • MCU Solutions for EMB (2)
  • 3.4 Suspension System (Semi-Active/Fully Active)
  • Suspension-by-Wire: Evolution of MCU Technology Involved
  • MCU Installation in Suspension System
  • Semi-Active Suspension - Air Suspension: Working Principle
  • Semi-Active Suspension (Air Suspension + CDC): System Composition
  • Semi-Active Suspension Control Strategy Solution 1: The Control Algorithm Is Integrated in an Independent Suspension Controller
  • Semi-Active Suspension Control Strategy Solution 2: The Control Algorithm Is Integrated in the Chassis Domain Controller
  • Semi-Active Suspension Control Strategy Solution 3: The Control Algorithm Is Integrated in the VMC Domain
  • MCU for Semi-Active Suspension: Summary of Vendors and Solutions (1)
  • MCU for Semi-Active Suspension: Summary of Vendors and Solutions (2)
  • MCU Solutions for Semi-Active Suspension (1)
  • MCU Solutions for Semi-Active Suspension (2)
  • MCU Solutions for Semi-Active Suspension (3)
  • MCU Solutions for Semi-Active Suspension (4)
  • Fully Active Suspension: Structural Composition and Working Principle
  • Fully Active Suspension Control Strategy Solution: Active Suspension Controller
  • MCU for Fully Active Suspension: Summary of Vendors and Solutions (1)
  • MCU for Fully Active Suspension: Summary of Vendors and Solutions (2)
  • MCU Solutions for Fully Active Suspension
  • 3.5 BMS (Battery Management System)
  • BMS: Evolution of MCU Technology Involved
  • MCU Installation in BMS
  • BMS Architecture for Centralized Domain Control
  • MCU for BMS: Summary of Vendors and Solutions
  • MCU Solutions for BMS (1)
  • MCU Solutions for BMS (2)
  • 3.6 Development Trends of Next-Generation Intelligent Chassis and MCU Demand
  • Technology Background of Intelligent Chassis Development Trends
  • Current Intelligent Chassis Solutions
  • Development Trends of Next-Generation Intelligent Chassis (1)
  • Development Trends of Next-Generation Intelligent Chassis (2)
  • Development Trends of Next-Generation Intelligent Chassis and MCU Demand

4 MCU in Body Domain

  • 4.1 ZCU
  • Main Concerns of OEMs about ZCU MCU Selection (1)
  • Main Concerns of OEMs about ZCU MCU Selection (2)
  • Evolution of Zonal Control Technology: From "Control Box" to "Edge Router"
  • MCU Installation in ZCU MCU
  • MCU for ZCU: Summary of Vendors and Solutions (1)
  • MCU for ZCU: Summary of Vendors and Solutions (2)
  • MCU for ZCU: Summary of Vendors and Solutions (3)
  • MCU for ZCU: Summary of Vendors and Solutions (4)
  • ZCU MCU Cases (1)
  • ZCU MCU Cases (2)
  • ZCU MCU Cases (3)
  • ZCU MCU Cases (4)
  • 4.2 Body Domain Controller
  • Impact of Transition from Body Control to Body Domain on MCU
  • Major MCU Players in Body Domain
  • MCU Installation in Body Domain Controller
  • Market Competition of MCU Vendors in Body Domain
  • MCU for Body Domain: Summary of Vendors and Solutions (1)
  • MCU for Body Domain: Summary of Vendors and Solutions (2)
  • MCU for Body Domain: Summary of Vendors and Solutions (6)
  • MCU Solutions for Body Domain (1)
  • MCU Solutions for Body Domain (2)
  • MCU Solutions for Body Domain (5)
  • MCU Solutions for Body Domain (6)
  • 4.3 Smart Door
  • Smart Door: Evolution of MCU Technology Involved
  • MCU Installation in Smart Door
  • Smart Door: Structural Components (1)
  • Smart Door: Structural Components (2)
  • Door Control Strategy Solution 1
  • Door Control Strategy Solution 2
  • Door Control Strategy Solution 3
  • MCU for Smart Door: Summary of Vendors and Solutions (1)
  • MCU for Smart Door: Summary of Vendors and Solutions (2)
  • MCU Solutions for Smart Door (1)
  • MCU Solutions for Smart Door (2)
  • MCU Solutions for Smart Door (3)
  • 4.4 Intelligent Lighting
  • Intelligent Lighting: Evolution of MCU Technology Involved
  • MCU Installation in Intelligent Lighting
  • Intelligent Lighting Control Strategy Solution 1: LDM
  • Intelligent Lighting Control Strategy Solution 2: MCU-less Solution (Zonal Architecture)
  • Intelligent Lighting Control Strategy Solution 2: MCU-less Case - Infineon
  • Intelligent Lighting Control Strategy Solution 2: MCU-less Case - TI
  • Intelligent Lighting Control Strategy Solution 2: MCU-less Case - onsemi
  • MCU for Intelligent Lighting: Summary of Vendors and Solutions (1)
  • MCU for Intelligent Lighting: Summary of Vendors and Solutions (2)
  • MCU Solutions for Intelligent Lighting (1)
  • MCU Solutions for Intelligent Lighting (5)
  • MCU Solutions for Intelligent Lighting (6)
  • 4.5 Intelligent Seating
  • Intelligent Seating: Evolution of MCU Technology Involved
  • MCU Installation in Intelligent Seating
  • Intelligent Seating: Structural Composition and Working Principle
  • Intelligent Seating System Control Strategy Solution 1: Independent Seating Control Module
  • Intelligent Seating System Control Strategy Solution 2: Integrated Seating Domain Control
  • Intelligent Seating: MCU Deployment Methods
  • MCU for Intelligent Seating: Summary of Vendors and Solutions (1)
  • MCU for Intelligent Seating: Summary of Vendors and Solutions (2)
  • MCU Solutions for Intelligent Seating (1)
  • MCU Solutions for Intelligent Seating (2)
  • MCU Solutions for Intelligent Seating (3)
  • MCU Solutions for Intelligent Seating (7)
  • MCU Solutions for Intelligent Seating (8)
  • 4.6 Intelligent Windshield Wiper
  • Smart Wiper: Evolution of MCU Technology Involved
  • Conventional Intelligent Windshield Wiper System Architecture
  • Future Intelligent Windshield Wiper System Architecture
  • MCU for Smart Wiper: Summary of Vendors and Solutions
  • MCU Solutions for Smart Wiper (1)
  • MCU Solutions for Smart Wiper (4)
  • MCU Solutions for Smart Wiper (5)
  • 4.7 Electrically Adjustable Steering Wheel
  • Electrically Adjustable Steering Wheel: Evolution of MCU Technology Involved
  • Electrically Adjustable Steering Wheel: Structural Composition
  • Electrically Adjustable Steering Wheel Control Strategy Solution 1: Integrated into Cockpit Domain Controller (1)
  • Electrically Adjustable Steering Wheel Control Strategy Solution 1: Integrated into Cockpit Domain Controller (2)
  • Electrically Adjustable Steering Wheel Control Strategy Solution 2: Integrated into Seating Control Module
  • Electrically Adjustable Steering Wheel Control Strategy Solution 3: Independent Steering Wheel Controller
  • MCU for Electrically Adjustable Steering Wheel: Summary of Vendors and Solutions
  • MCU Solutions for Electrically Adjustable Steering Wheels (1)
  • MCU Solutions for Electrically Adjustable Steering Wheels (2)
  • 4.8 Development Trends of Next-Generation 48V Body Architecture and MCU Demand
  • 48V Low-Voltage PDN Architecture VS 12V Low-Voltage PDN Architecture in Body Domain
  • Application Advantages of 48V Low-Voltage Power Distribution Architecture (1): Higher Power Output
  • Application Advantages of 48V Low-Voltage Power Distribution Architecture (2): Lower Power Loss
  • Application Advantages of 48V Low-Voltage Power Distribution Architecture (3): Lower Wiring Harness Cost
  • Application Advantages of 48V Low-Voltage Power Distribution Architecture (4): Better Adapted to "Zone + Central" Architecture, Enabling Zonal Power Distribution
  • 48V Low-voltage Body Domain PDN Architecture Brings New Parts Opportunities
  • 48V Low-Voltage Body Domain PDN Architecture Solutions (1)
  • 48V Low-Voltage Body Domain PDN Architecture Solutions (2)
  • MCU Demand of Next-Generation 48V Body Architecture

5 Chinese Automotive MCU Vendors

  • 5.1 SemiDrive
  • Automotive-Grade MCU Layout
  • Automotive-Grade MCU E3 Series Shipments
  • Automotive-Grade MCU Product Line
  • Automotive-Grade MCU Product Line (1)
  • Automotive-Grade MCU Product Line (2)
  • Automotive-Grade MCU Product Line (3)
  • Automotive-Grade MCU Product: "Central Intelligent Control Cerebellum" AMU Solution - Flagship AMU E3800
  • Automotive-Grade MCU Product: "Central Intelligent Control Cerebellum" AMU Solution - Gemini AMU E3650-E
  • Automotive-Grade MCU Product: E3610 Chip Solution for New-Generation IO-Type ZCU Design
  • Automotive-Grade MCU Product: E3650 One-Stop Solution for Cross-Domain Integration (1)
  • Automotive-Grade MCU Product: E3650 One-Stop Solution for Cross-Domain Integration (2)
  • Automotive-Grade MCU Product: E3650 One-Stop Solution for Cross-Domain Integration (3)
  • Automotive-Grade MCU Product: E3650 One-Stop Solution for Cross-Domain Integration (4)
  • Automotive-Grade MCU Application Scenario (Zone): E3650 Adapts to New-Generation E/E Architecture
  • Automotive-Grade MCU Application Scenario (Zone): E3650 Centered on "Reconstructing Zone Control with Single Chip"
  • Automotive-Grade MCU Application Scenario (Zone): E3650 Enables Systematic Cost Reduction & Efficient Iteration
  • Automotive-Grade MCU Application Scenario (Powertrain & Chassis): Product Line for New Energy Powertrain Systems
  • Automotive-Grade MCU Application Scenario (Powertrain & Chassis): E3620P Delivers Main Control MCU Performance Innovation
  • Automotive-Grade MCU Application Scenario (Powertrain & Chassis): Advantages of E3650 in Chassis Domain Applications
  • Automotive-Grade MCU Application Scenario (Intelligent Driving): Product Line for ADAS and Cockpit-Driving Integration
  • Automotive-Grade MCU Application Scenario (Embodied Artificial Intelligence): Product Line for ADAS and Cockpit-Driving Integration
  • MCU Application Case: Joint Development of New Energy Vehicle Electric Drive Solution with SAIC-GM-Wuling and Leadrive Technology
  • MCU Application Case: Launched Automotive MCU-based HSM Cybersecurity Solution Together with ETAS
  • MCU Application Case: Suspension Controller of Mingran Technology
  • 5.2 BYD Semiconductor
  • Main Application Scenarios and Technology Implementation
  • Core Automotive-Grade Product Line
  • Automotive-Grade MCU Product Line
  • Automotive-Grade MCU (32-bit): BS9146AM64
  • Automotive-Grade MCU (8-bit): Indicators of BS9000AMXX
  • Automotive-Grade MCU (8-bit): Comparison between BS9000AMXX and Competitors
  • Automotive-Grade MCU (8-bit): Architecture of BF7006AMXX
  • Major Customers
  • 5.3 AutoChips
  • Automotive-Grade MCU Product Line Layout (1)
  • Automotive-Grade MCU Product Line Layout (2)
  • Cumulative Shipments of Automotive-Grade MCUs
  • Automotive-Grade MCU Development: Software and Hardware Integrated Ecosystem Solution Based on Basic MCU
  • Automotive-Grade MCU (High-End): Official Release of AC7870
  • Automotive-Grade MCU (High-End): Core Performance of AC7870x
  • Automotive-Grade MCU (High-End): Advantages of AC7870x Compared with Previous Products and Competitors
  • Automotive-Grade MCU (Mid-Range): AC7840x
  • Automotive-Grade MCU (Entry-Level): First MCU+ AC7801L Chip
  • Automotive-Grade MCU (Entry-Level): Architecture of AC7801L
  • Automotive-Grade MCU (Entry-Level): AC7802x
  • Automotive-Grade MCU (Entry-Level): Architecture of AC7801x
  • Automotive-Grade MCU Application: Bluetooth Digital Key
  • Automotive-Grade MCU Application: UWB Digital Key
  • Automotive-Grade MCU Application: BMS
  • 5.4 C*Core Technology
  • Automotive-Grade MCU Application covers Body Control, Cockpit, Powertrain System, etc.
  • Automotive-Grade MCU Product Line Layout (1)
  • Automotive-Grade MCU Product Line Layout (2)
  • Automotive-Grade MCU Product Line Layout (3)
  • Automotive-Grade MCU (High-End): CCRC4XXX
  • Automotive-Grade MCU (High-End): CCFC3012PT
  • Automotive-Grade MCU (High-End): Architecture of CCFC3008PT
  • Automotive-Grade MCU (High-End): Parameters and Block Diagram of CCFC3008PT
  • Automotive-Grade MCU (High-End): CCFC3007PT Is Benchmarked against NXP MPC5777M
  • Automotive-Grade MCU (Mid-to-Low-End): CCFC2012BC Is Benchmarked against NXP MPC5604/MPC5607
  • Automotive-Grade MCU (Mid-to-Low-End): CCFC2007PT Is Benchmarked against NXP MPC5674F
  • Automotive-Grade MCU (Mid-to-Low-End): CCFC2016BC Is Benchmarked against Infineon TC234L and CYT2B98
  • Technical Advantage of Automotive-Grade MCU: Self-Developed Core
  • Automotive-Grade MCU Application: "MCU+" Supporting Chips and Platform-Based Solutions
  • 5.5 GigaDevice Semiconductor
  • Revenue in 2025
  • Automotive-Grade MCU Product Line Planning
  • Automotive-Grade MCU Product Line Layout
  • Automotive-Grade MCU (High-End): Next-Generation GD32A7 (1)
  • Automotive-Grade MCU (High-End): Next-Generation GD32A7 (2)
  • Automotive-Grade MCU (High-End): Next-Generation GD32A7 (3)
  • Automotive-Grade MCU (Mid-to-Low-End): Architecture of GD32A503
  • Automotive-Grade MCU (Mid-to-Low-End): Performance of GD32A503
  • Automotive-Grade MCU (Mid-to-Low-End): Performance of GD32A490
  • Automotive-Grade MCU Application: Enter Tesla's Supply Chain
  • 5.6 ChipON
  • Electronic Automotive-Grade MCU Application Covers Body Control, Cockpit, Chassis, ADAS and Other Fields
  • Electronic Automotive-Grade MCU Planning
  • Electronic Automotive-Grade MCU Product Line (1)
  • Electronic Automotive-Grade MCU Product Line (2)
  • Electronic Automotive-Grade MCU (Mid-to-High-End): Architecture of KF32A158
  • Electronic Automotive-Grade MCU (Mid-to-High-End): KF32A156 Is Benchmarked against NXP, Renesas and AutoChips
  • Electronic Automotive-Grade MCU (Entry-Level): KF8A100 Is Benchmarked against NXP, STMicroelectronics, BYD Semiconductor, etc.
  • Advantage of electronic Automotive-Grade MCU: Self-Developed Core for Cost Control
  • 5.7 Sine Microelectronics
  • Automotive-Grade MCU Is Mainly Used in the Field of Body Control
  • Automotive-Grade MCU Product Line
  • Automotive-Grade MCU (Integrated): 32-bit MCU for High-Performance Motor Control - ASM31AM830
  • Automotive-Grade MCU (Integrated): Fully Integrated Five-in-One Micromotor Driver IC - ASM81504
  • Automotive-Grade MCU Application: MCU+ Power
  • Automotive-Grade MCU Application: Nine-Way Valve for Thermal Management
  • 5.8 Hangshun Chip
  • MCU Product Line Layout
  • Automotive-Grade SOC+MCU Strategic Planning
  • Automotive-Grade MCU Product Line Layout
  • Automotive-Grade MCU: Performance of HK32A040C8T3
  • Automotive-Grade MCU Application: Automotive Matrix Headlight Solution Based on HK32A040C8T3
  • Major Automotive-Grade MCU Customers
  • 5.9 NOVOSENSE
  • Automotive-Grade MCU Layout
  • The Reason Why TI's C2000 is the First Alternative Target for the Company's MCU Production Line
  • Steps to Replace C2000: Cooperation with ChipSine in the Mid-Range NS800RT MCU for Real-Time Control
  • Advantages of Replacing C2000
  • Automotive-Grade MCU Product Line
  • New Automotive-Grade MCU: Cost-Effective NS800RT115x MCU
  • New Automotive-Grade MCU: NS800RT113x
  • New Automotive-Grade MCU: Parameters of NS800RT113x
  • 5.10 Geehy
  • MCU Product Line
  • Automotive-Grade MCU Product Line (1)
  • Automotive-Grade MCU Product Line (2)
  • Automotive-Grade MCU: MCU for Real-Time Control - G32R501
  • Automotive-Grade MCU: MCU for Real-Time Control - Roadmap of G32R501
  • Automotive-Grade MCU: MCU for Real-Time Control - G32R501 with High-Energy-Efficiency Real-Time Control Core
  • Automotive-Grade MCU: MCU for Real-Time Control - G32R501 with Self-Developed Zidian Math Instruction Extension
  • Automotive-Grade MCU: MCU for Real-Time Control - G32R501 with Dual-Core Configuration for Efficiency Improvement
  • Automotive-Grade MCU: MCU for Real-Time Control - Ecosystem Support of G32R501
  • Automotive-Grade MCU: MCU for Real-Time Control - Some Indicators of G32R501 Have Reached the International Leading Level (1)
  • Automotive-Grade MCU: MCU for Real-Time Control - Some Indicators of G32R501 Have Reached the International Leading Level (2)
  • Automotive-Grade MCU: APM32F103
  • Automotive-Grade MCU Application: LED Lighting Solution Based on APM32F103RCT7
  • Automotive-Grade MCU Application: Solutions based on G32A1085/1065/1045 (1)
  • Automotive-Grade MCU Application: Solutions based on G32A1085/1065/1045 (2)
  • 5.11 Chipsea
  • "ADC+MCU" as the Core Strategy
  • Automotive-Grade MCU Roadmap
  • Automotive-Grade Integrated MCU: CS1795X
  • Automotive-Grade MCU: CS32F036Q
  • Automotive-Grade MCU: Architecture of CS32F116Q
  • 5.12 Fudan Microelectronics
  • Automotive-Grade MCU Product Line Layout
  • Automotive-Grade MCU (Advanced): Architecture of FM33FG0xxA
  • Automotive-Grade MCU Application: Touch Design Solution Based on FM33FT0xxA
  • 5.13 YTMicro
  • MCU Covers Scenarios such as Autonomous Driving, Cockpit, Body, Powertrain and Chassis
  • Automotive-Grade MCU Product Line (1)
  • Automotive-Grade MCU Product Line (2)
  • Automotive-Grade MCU (High-End): Architecture of YTM32B1H
  • Automotive-Grade MCU (High-End): Features and Development Threshold of YTM32B1H
  • Automotive-Grade MCU (High-End): YTM32Z1L Integrates MCU with LDO and LIN Transceivers
  • Automotive-Grade MCU (Mainstream): Architecture of YTM32B1ME
  • Automotive-Grade MCU (Mainstream): YTM32B1ME Is Benchmarked against NXP S32K14x/11x
  • Automotive-Grade MCU (Entry-Level): Architecture of YTM32B1L
  • 5.14 CVA Chip
  • Differentiated Automotive-Grade MCU Layout: TMCU Innovative Solution
  • Automotive-Grade MCU Product Line
  • Automotive-Grade MCU: Architecture of TMCU
  • Automotive-Grade MCU (Mid-Range): CVM014x Is Benchmarked against NXP S32K144
  • Automotive-Grade MCU (Mid-Range): Parameters of CVM014x
  • Automotive-Grade MCU (Mid-Range): Software Architecture of CVM014x
  • 5.15 Flagchip
  • Automotive-Grade MCU Product Line Layout (1)
  • Automotive-Grade MCU Product Line Layout (2)
  • Automotive-Grade MCU: Parameters of FC4150
  • Automotive-Grade MCU: Architecture of FC4150
  • Automotive-Grade MCU: Architecture of FC7240
  • Automotive-Grade MCU (High-End): Parameters of FC7300
  • Automotive-Grade MCU (High-End): FC7300F8MDQ Is Benchmarked against Infineon TC387
  • Automotive-Grade MCU (High-End): Architecture of FC7300F8MDT
  • Automotive-Grade MCU Application Case: Localized T-BOX Solution
  • Automotive-Grade MCU Application Case: Automotive Electric Air Conditioning Compressor
  • 5.16 Cmsemicon
  • Automotive-Grade MCU Product Line
  • Automotive-Grade MCU: BAT32A
  • Automotive-Grade MCU: Parameters of BAT32A337
  • Automotive-Grade MCU: Performance of BAT32A2
  • 5.17 HPMicro Semiconductor
  • Automotive-Grade MCU Product Line Layout
  • Automotive-Grade MCU: Architecture of HPM6800
  • Automotive-Grade MCU: Parameters of HPM6800
  • Automotive-Grade MCU: Architecture of HPM5300
  • Automotive-Grade MCU Application: HPM6750-based Automotive Cluster
  • Automotive-Grade MCU Application: HPM6800-based Automotive Cluster
  • 5.18 ChipEXT
  • Automotive-Grade MCU Roadmap
  • Automotive-Grade MCU Series
  • Automotive-Grade MCU: Architecture of CX3288
  • Automotive-Grade MCU: Information and Cybersecurity of CX3288
  • Automotive-Grade MCU: Architecture of AUTOSAR
  • 5.19 Linko Semiconductor
  • Automotive-Grade MCU Product Line Layout
  • New Automotive-Grade MCU: LKS (AT075)
  • New Automotive-Grade MCU: LKS (AT037)
  • Automotive-Grade MCU: Parameters of LKS (AT08X)
  • Automotive-Grade MCU Application: Automotive Solution based on LKS32AT075
  • Automotive-Grade MCU Application: Electronic Expansion Valve Based on AT039
  • Automotive-Grade MCU Application: Automotive Air Conditioning Compressor Based on LKS32MCAT085C8Q9
  • Automotive-Grade MCU Application: Automotive Water Pump, Oil Pump and Ventilation Fan Based on LKS32MCAT086N8Q9
  • 5.20 OmniVision Group
  • Automotive-Grade MCU Product Line
  • Automotive-Grade MCU: Next-Generation High-Performance OMX2xx MCU - OMX2x4B
  • Automotive-Grade MCU: Competitive Advantages of OMX2x4B
  • Automotive-Grade MCU: OMX14xN Product Line
  • Automotive-Grade MCU: Architecture of OMX14xN
  • Automotive-Grade MCU: Architecture of OMX14xB
  • Automotive-Grade MCU: Obvious Advantages Compared with Foreign Competitors
  • 5.21 Silergy
  • Automotive-Grade MCU Product Line
  • Automotive-Grade MCU: SA32B
  • Automotive-Grade MCU: Architecture of SA32B
  • Automotive-Grade MCU Ecosystem: Automotive-Grade SDK
  • 5.22 Megawin Technology
  • Automotive MCU Product Line
  • Automotive MCU (High Cost Performance): MG82F6D17
  • Automotive MCU (Advanced M0): MG32F02x
  • Automotive MCU (Automotive-Grade): MGEQ1C064
  • 5.23 Tongxin Microelectronics
  • Automotive Chip Planning
  • Automotive-Grade MCU Product Line Planning
  • Automotive-Grade MCU Product Line
  • Automotive-Grade MCU: The Second-Generation MCU Fully Covers Powertrain Applications
  • Automotive-Grade MCU: Hardware Security Mechanism
  • 5.24 STAR GATHER
  • Automotive-Grade Chip
  • Central + Domain Control Solution
  • 5.25 Chipways
  • Automotive-Grade MCU Product Line
  • Automotive-Grade MCU: XL660
  • Automotive-Grade MCU: Software Architecture of XL660x
  • 5.26 ESWIN
  • Automotive-Grade MCU Product Line
  • 5.27 Thinktech
  • Automotive-Grade MCU Product Line
  • Alioth MCU Process Evolution
  • Alioth MCU with High Functional Safety: Chassis Control Chip - TTA8T8X

6 Foreign Automotive MCU Vendors

  • 6.1 Renesas
  • Automotive-Grade MCU Application Covers Body, Powertrain, Chassis and Other Fields
  • Automotive-Grade MCU Product Line (1)
  • Automotive-Grade MCU Product Line (2)
  • Automotive-Grade MCU Product Line (3)
  • Latest Technological Breakthrough of Automotive-Grade MCU
  • Latest Technological Breakthrough of Automotive-Grade MCU: Higher Computing Power
  • Automotive-Grade Integrated MCU: Fifth-Generation R-Car
  • Automotive-Grade Integrated MCU: Fifth-generation R-Car X5H SoC Integrates MCU
  • Automotive-Grade Integrated MCU: Application Architecture of Fourth-Generation R-Car
  • Automotive-Grade MCU (High-End): Segmented Products of RH850
  • Automotive-Grade MCU (High-End): Product Selection of RH850
  • Automotive-Grade MCU (High-End): Technology Evolution Roadmap of RH850 F
  • Automotive-Grade MCU (High-End): Expanded Product Line of RH850 F
  • Automotive-Grade MCU (High-End): Software Support of RH850 - Hetion Software's ISDT Successfully Adapts to RH850
  • Automotive-Grade MCU (High-End): Software Support of RH850 - IAR's Cloud-Ready Platform Extends Support for RH850/U2x
  • Automotive-Grade MCU (High-End): Architecture of RH850/P
  • Automotive-Grade MCU (Entry-Level): RL78
  • Automotive-Grade MCU (Entry-Level): Architecture of RL78
  • Automotive-Grade MCU Application: Low-Cost Cockpit Cluster Based on RH850/D1x
  • Automotive-Grade MCU Application: Domain Control Based on RH850/U2x
  • Automotive-Grade MCU Application: Automotive Gateway
  • Automotive-Grade MCU Application: Digital Power Supply Solution Based on RL78/G24
  • 6.2 NXP
  • Automotive-Grade MCU Product Line Layout
  • NeuSAR OS-based CoreRide Z248 ZCU System Solution in Cooperation with Neusoft Reach
  • Automotive-Grade MCU: S32N7 (HPC + Deep AI Integration)
  • Automotive-Grade MCU: Architecture of S32N7 (HPC + Deep AI Integration)
  • Automotive-Grade MCU: Launch of the First Automotive-Grade MCU for Bluetooth Channel Detection
  • Automotive-Grade MCU: S32G
  • Automotive-Grade MCU: S32G2
  • Automotive-Grade MCU: Architecture of S32G
  • Automotive-Grade MCU: S32Z/S32E Product Line
  • Automotive-Grade MCU: S32Z/S32E Application
  • Automotive-Grade MCU: Software Architecture of S32E2
  • Automotive-Grade MCU: Application Framework of S32E2
  • Automotive-Grade MCU: Evolution of S32K
  • Automotive-Grade MCU: Release of the First 16nm Automotive-grade MCU - S32K5
  • Launch of S32 CoreRide Platform for Software-Defined Vehicles
  • Launch of S32 CoreRide Platform
  • Automotive-Grade MCU Application: Thermal Management Domain Control Solution Based on FS32K146
  • Automotive-Grade MCU Application: Powertrain Domain Reference Design Solution Based on S32E (1)
  • Automotive-Grade MCU Application: Powertrain Domain Reference Design Solution Based on S32E (2)
  • Automotive-Grade MCU Application: Powertrain Domain Reference Design Solution Based on S32E (7)
  • Automotive-Grade MCU Application: Powertrain Domain Reference Design Solution Based on S32E (8)
  • Automotive-Grade MCU Application: Powertrain Domain Reference Design Solution Based on S32E (9)
  • Automotive-Grade MCU production base
  • 6.3 STMicroelectronics (ST)
  • Automotive MCU Investment Plan
  • Automotive-Grade MCU Product Line (1)
  • Automotive-Grade MCU Product Line (2)
  • Automotive-Grade MCU: 18nm FD-SOI-based Automotive-Grade STM32 MCU in Cooperation with Samsung
  • Automotive-Grade MCU: STM32
  • Automotive-Grade MCU: Localized Supply Chain of STM32
  • Automotive-Grade MCU: STM32 Adopts PCM Technology
  • Automotive-Grade MCU: STM32 Is Upgraded to M85
  • Automotive-Grade MCU: Stellar Series Products
  • Automotive-Grade MCU: Architecture of Stellar G
  • Automotive-Grade MCU: Performance of Stellar P
  • Automotive-Grade MCU: Framework Diagram of Stellar P6
  • Automotive-Grade MCU: Framework Diagram of Stellar P7
  • Automotive-Grade MCU: Stellar E
  • Automotive-Grade MCU: SPC5 Series Products
  • Automotive-Grade MCU: Parameters of SPC5 (1)
  • Automotive-Grade MCU: Parameters of SPC5 (2)
  • Automotive-Grade MCU: Architecture of SPC56 A and M
  • Automotive-Grade MCU Ecosystem Partners
  • Automotive MCU Production Advantage: Integrated Device Manufacturers (IDMs)
  • Automotive MCU Industry Chain Layout: Launch of Cost-Effective PMIC for Automotive MCU
  • Automotive MCU Layout in Chinese Market
  • Automotive MCU Layout in Chinese Market: Localized Products
  • 6.4 Infineon
  • Automotive-Grade MCU Application Fields by Product Line
  • Automotive-Grade MCU Product Line (1)
  • Automotive-Grade MCU Product Line (2)
  • Automotive-Grade MCU: Core Technology Evolution of AURIX
  • Automotive-Grade MCU: Performance of AURIX TC4x
  • Automotive-Grade MCU: Architecture of AURIX TC4x
  • Automotive-Grade MCU: AURIX TC4x Introduces PPU (1)
  • Automotive-Grade MCU: AURIX TC4x Introduces PPU (2)
  • Automotive-Grade MCU: AI Performance of AURIX TC4x
  • Automotive-Grade MCU: Security of AURIX TC4x
  • Automotive-Grade MCU: Virtualization of AURIX TC4x
  • Automotive-Grade MCU: Ecosystem of AURIX TC4x
  • Automotive-Grade MCU: AURIX TC4x Supports AUTOSAR
  • Automotive-Grade MCU: AURIX TC3 Is Primarily Used as Safety Backup
  • Automotive-Grade MCU: Architecture of AURIX TC397
  • Automotive-Grade MCU: Traveo II
  • Automotive-Grade MCU: Key Parameters of Traveo T2G
  • Automotive-Grade MCU: Traveo T2G Seamlessly Integrates with Kanzi Micro
  • Automotive-Grade MCU Integrated into SOC: MOTIX MCU Motor Control SoCs and SiPs
  • Automotive-Grade MCU: CYT3DL
  • Automotive-Grade MCU: PSOC Control C3
  • Automotive-Grade MCU: PSoC 4
  • Automotive-Grade MCU Application: Traveo CYT3DL’s 10,000-pixel Intelligent Lighting Help Revolutionize Automotive Lighting
  • Automotive-Grade MCU Application: EPS Based on Aurix MCU
  • Technical Advantage of Automotive-Grade MCU: Self-Developed TriCore Architecture
  • Automotive-Grade MCU Technology Strategy: From TriCore to RISC-V
  • Automotive-Grade MCU Technology Strategy: Launch of RISC-V Hypervisor Prototype
  • Automotive-Grade MCU Technology Strategy: RISC-V Ecosystem Evolution Plan
  • 6.5 TI
  • Automotive-Grade MCU Product Line Layout (1)
  • Automotive-Grade MCU Product Line Layout (2)
  • Automotive-Grade MCU: Automotive-Grade MCU Certified by Bluetooth Core 6.0 Channel Sounding
  • Automotive-Grade MCU: Evolution of C2000
  • Automotive-Grade MCU: C2000 Is Upgraded to 64-bit
  • Automotive-Grade MCU: C2000 Has a Complete Ecosystem
  • Automotive-Grade MCU: TMS320F28P55x (New Product of C2000) Realizes Edge AI and Real-Time Control for the First Time
  • Automotive-Grade MCU: C2000 Becomes the Reference Standard for Other Companies to Build MCUs for Real-Time Control
  • Automotive-Grade MCU: TMS320F28P55x Effectively Reduces Cost
  • Automotive-Grade MCU: F29H85x Adopts Innovative VLIW Core Architecture
  • Automotive-Grade MCU: Application Scenarios of F29H85x
  • Automotive-Grade MCU: Sitara AM2x
  • Automotive-Grade MCU: Sitara AM2x Integrates the Features of MPU and MCU
  • Automotive-Grade MCU Applications: Jacinto SOC Integrates MCU
  • Automotive-Grade MCU Application: Difference between Jacinto Integrated with MCU and Traditional Plug-in MCU
  • Automotive-Grade MCU Application Case: BYD's All-in-One Controller
  • Production Base: Seeking Wafer Foundries in Chinese Mainland
  • 6.6 Microchip
  • Automotive-Grade MCU Product Line Layout
  • Automotive-Grade MCU (16-bit): Product Family
  • Automotive-Grade MCU (32-bit): Product Family
  • Automotive-Grade MCU (32-bit): PIC32-BZ6 Supports Bluetooth 6.0
  • Automotive-Grade MCU (32-bit): Latest PIC33A DSC
  • Automotive-Grade MCU (32-bit): Architecture of SAMDA1
  • Automotive-Grade MCU (32-bit): Architecture of SAMV70
  • Automotive-Grade MCU Ecosystem Toolchain
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