시장보고서
상품코드
1603297

반도체 자본 설비 시장 규모, 점유율, 성장 분석 : 유형별, 공정 유형별, 산업별, 지역별 - 산업 예측(2024-2031년)

Semiconductor Capital Equipment Market Size, Share, Growth Analysis, By Type, By Process Type, By Industry Vertical, By Region - Industry Forecast 2024-2031

발행일: | 리서치사: SkyQuest | 페이지 정보: 영문 192 Pages | 배송안내 : 3-5일 (영업일 기준)

    
    
    



※ 본 상품은 영문 자료로 한글과 영문 목차에 불일치하는 내용이 있을 경우 영문을 우선합니다. 정확한 검토를 위해 영문 목차를 참고해주시기 바랍니다.

반도체 자본 설비 세계 시장 규모는 2022년 758억 달러로 평가되며, 2023년 812억 6,000만 달러에서 2031년 1,417억 2,000만 달러로 성장하여 예측 기간(2024-2031년) 동안 7.2%의 CAGR로 성장할 것으로 예상됩니다.

세계 반도체 산업은 자동차 부문의 발전과 함께 스마트폰의 급격한 성장과 첨단 전자기기의 확대에 힘입어 괄목할 만한 성장을 이루고 있습니다. 5G 및 인공지능과 같은 기술 혁신은 이러한 변화를 촉진하고 있으며, 특히 5G 기술은 무선 성능을 향상시키고 증강현실 및 사물인터넷(IoT)과 같은 새로운 애플리케이션을 촉진하고 있습니다. 고성능이면서도 비용 효율적인 반도체에 대한 지속적인 수요는 단기, 중기, 장기 시나리오에 걸쳐 시장의 역동성을 촉진하고 있습니다. 또한, 스마트 기기 및 휴대용 기기의 부상과 다양한 산업 분야의 디지털화 추세는 반도체 소자가 내장된 디지털 전자제품의 보급에 크게 기여하고 있습니다. 소비자 및 산업용 스마트 웨어러블의 출현은 더 높은 수준의 반도체 집적도를 요구하고 있습니다. 이러한 추세는 에칭 및 웨이퍼 후면 연삭을 포함한 최첨단 가공 기술의 필요성을 강조하는 동시에 반도체 제조 전문 지식이 필요하며, AI, 머신러닝 및 IoT 기술의 통합은 첨단 로봇공학과 함께 특히 반도체 부품의 제조 환경을 재구성하고 있습니다. 기술 발전은 계속 진화하고 있으며, 세계 반도체 자본 설비 시장을 발전시키고 차세대 애플리케이션과 서비스를 지원하는 업계의 매우 중요한 역할을 강조하고 있습니다.

목차

소개

  • 조사 목적
  • 조사 범위
  • 정의

조사 방법

  • 정보 조달
  • 2차 데이터와 1차 데이터 방법
  • 시장 규모 예측
  • 시장 가정과 제한

주요 요약

  • 세계 시장 전망
  • 공급과 수요 동향 분석
  • 부문별 기회 분석

시장 역학과 전망

  • 시장 개요
  • 시장 규모
  • 시장 역학
    • 성장 촉진요인과 기회
    • 성장 억제요인과 과제
  • Porters 분석과 영향
    • 경쟁 기업 간의 경쟁 관계
    • 대체품의 위협
    • 구매자의 교섭력
    • 신규 참여업체의 위협
    • 공급 기업의 교섭력

주요 시장 인사이트

  • 핵심성공요인
  • 경쟁 정도
  • 주요 투자 기회
  • 시장 생태계
  • 기술의 진보
  • 규제 상황
  • 특허 분석
  • 밸류체인 분석
  • 사례 연구 분석
  • 고객과 구매 기준 분석
  • PESTEL 분석
  • 거시경제 지표
  • 시장 매력 지수
  • 가격 분석

반도체 자본 설비 시장 규모 : 유형별 & CAGR(2024-2031)

  • 시장 개요
  • 웨이퍼 레벨 제조 장비
    • 리소그래피 장비
    • 에칭 장비
    • 증착 장비
    • 화학 기계 평탄화(CMP) 장비
    • 세척 장비
  • 조립·포장 설비
    • 다이 본더
    • 와이어 본더
    • 플립칩 본더
    • 캡슐화 장비
  • 자동 테스트 장비(ATE)
    • 메모리 테스트 시스템
    • 비메모리 테스트 시스템
    • 개별 테스트 시스템

반도체 자본 설비 시장 규모 : 프로세스 유형별 & CAGR(2024-2031)

  • 시장 개요
    • 웨이퍼 처리
    • 표면처리
    • 화학 기계 평탄화(CMP)
    • 화학 증착법(CVD)
    • 물리 증착법(PVD)
    • 이온 주입
  • 조립과 패키징
    • 웨이퍼 본딩
    • 다이 어태치
    • 와이어 본딩
    • 캡슐화
  • 테스트
    • 전기 테스트
    • 기능 테스트
    • 번인 테스트

반도체 자본 설비 시장 규모 : 업계별 & CAGR(2024-2031)

  • 시장 개요
  • 가전
    • 스마트폰
    • 태블릿
    • 노트북
    • 웨어러블
  • 자동차
    • ADAS(첨단 운전자 보조 시스템)
    • 인포테인먼트 시스템
    • 전기자동차(EV)
    • 자율주행차
  • 헬스케어
    • 의료기기
    • 진단 기기
    • 웨어러블 헬스 모니터
  • IT·통신
    • 데이터센터
    • 네트워크 장비
    • 5G 인프라

반도체 자본 설비 시장 규모 : 지역별 & CAGR(2024-2031)

  • 북미
    • 미국
    • 캐나다
  • 유럽
    • 영국
    • 독일
    • 스페인
    • 프랑스
    • 이탈리아
    • 기타 유럽
  • 아시아태평양
    • 중국
    • 인도
    • 일본
    • 한국
    • 기타 아시아태평양
  • 라틴아메리카
    • 브라질
    • 기타 라틴아메리카
  • 중동 및 아프리카
    • GCC 국가
    • 남아프리카공화국
    • 기타 중동 및 아프리카

경쟁 정보

  • 상위 5개사의 비교
  • 주요 기업의 시장 포지셔닝(2023년)
  • 주요 시장 기업이 채용한 전략
  • 시장의 최근 동향
  • 기업의 시장 점유율 분석(2023년)
  • 주요 기업 개요
    • 기업 개요
    • 제품 포트폴리오 분석
    • 부문별 점유율 분석
    • 매출 전년비 비교(2021-2023)

주요 기업 개요

  • Applied Materials, Inc.
  • ASML Holding N.V.
  • Tokyo Electron Limited
  • Lam Research Corporation
  • KLA Corporation
  • Advantest Corporation
  • Teradyne Inc.
  • Screen Holdings Co., Ltd.
  • Hitachi High-Technologies Corporation
  • ASM International N.V.
  • Kulicke & Soffa Industries, Inc.
  • Nikon Corporation
  • Canon Inc.
  • Plasma-Therm LLC
  • Veeco Instruments Inc.
  • Nova Measuring Instruments Ltd.
  • Ontoo Innovation
  • Camtek Ltd.
  • ACCRETECH-Tokyo Seimitsu Co., Ltd.
  • Ultratech, Inc.

결론과 추천사항

ksm 24.12.12

Global Semiconductor Capital Equipment Market size was valued at USD 75.8 billion in 2022 and is poised to grow from USD 81.26 billion in 2023 to USD 141.72 billion by 2031, growing at a CAGR of 7.2% during the forecast period (2024-2031).

The global semiconductor industry is witnessing significant growth driven by the surge in smartphone usage and the expansion of advanced electronic devices, alongside the automotive sector's evolution. Innovations like 5G and artificial intelligence are catalyzing this transformation, particularly with 5G technology enhancing wireless performance and facilitating new applications, such as augmented reality and the Internet of Things (IoT). The sustained demand for high-performance yet cost-effective semiconductors is propelling market dynamics across short, medium, and long-term scenarios. Furthermore, the rise of smart and portable devices, coupled with increased digitization across various industries, is significantly contributing to the proliferation of digital electronics that incorporate semiconductor elements. The emergence of smart wearables in both consumer and industrial settings further necessitates advanced semiconductor integration. This trend underscores the need for cutting-edge processing techniques, including etching and wafer back grinding, while also requiring expertise in semiconductor manufacturing. The integration of AI, machine learning, and IoT technologies, along with advanced robotics, is reshaping the manufacturing landscape, particularly for semiconductor components. As technological advancements continue to evolve, they are set to drive the global semiconductor capital equipment market forward, highlighting the industry's pivotal role in supporting next-generation applications and services.

Top-down and bottom-up approaches were used to estimate and validate the size of the Global Semiconductor Capital Equipment market and to estimate the size of various other dependent submarkets. The research methodology used to estimate the market size includes the following details: The key players in the market were identified through secondary research, and their market shares in the respective regions were determined through primary and secondary research. This entire procedure includes the study of the annual and financial reports of the top market players and extensive interviews for key insights from industry leaders such as CEOs, VPs, directors, and marketing executives. All percentage shares split, and breakdowns were determined using secondary sources and verified through Primary sources. All possible parameters that affect the markets covered in this research study have been accounted for, viewed in extensive detail, verified through primary research, and analyzed to get the final quantitative and qualitative data.

Global Semiconductor Capital Equipment Market Segmental Analysis

Global Semiconductor Capital Equipment Market is segmented by type, process type, industry vertical and region. Based on type, the market is segmented into wafer-level manufacturing equipment (lithography equipment, etching equipment, deposition equipment, chemical mechanical planarization (CMP) equipment, cleaning equipment), assembly and packaging equipment (die bonders, wire bonders, flip chip bonders, encapsulation equipment) and automated test equipment (ATE) (memory test systems, non-memory test systems, discrete test systems). Based on process type, the market is segmented into wafer processing (surface conditioning, chemical mechanical planarization (CMP), chemical vapor deposition (CVD), physical vapor deposition (PVD), ion implantation), assembly and packaging (wafer bonding, die attach, wire bonding, encapsulation) and testing (electrical testing, functional testing, burn-in testing). Based on industrial vertical, the market is segmented into consumer electronics (smartphones, tablets, laptops, wearables), automotive (advanced driver assistance systems (ADAS), infotainment systems, electric vehicles (EVs), autonomous vehicles), healthcare (medical devices, diagnostic equipment, wearable health monitors) and IT and telecommunication (data centers, networking equipment, 5g infrastructure). Based on end user, the market is segmented into automotive, consumer electronics, healthcare, agriculture, manufacturing, and others. Based on region, the market is segmented into North America, Europe, Asia Pacific, Latin America and Middle East & and Africa.

Driver of the Global Semiconductor Capital Equipment Market

The Global Semiconductor Capital Equipment market is primarily driven by the rising demand for electrical appliances, particularly in the consumer electronics sector, which is experiencing rapid growth. This surge is largely fueled by the increasing popularity of smartphones amidst a rising global population, serving as a key catalyst for market expansion. The heightened consumption of electronic devices such as tablets, laptops, and wearable technology propels industry growth. Moreover, as semiconductor technology advances, innovative market segments, including machine learning devices, are swiftly incorporated, further elevating the demand for semiconductor capital equipment and shaping the future landscape of the industry.

Restraints in the Global Semiconductor Capital Equipment Market

Restraints in the Global Semiconductor Capital Equipment market include significant premature expenditures, which pose challenges for stakeholders. The dynamics of the copper and semiconductor segments contribute to this issue, as their operational frameworks are influenced by market conditions and external factors. These conditions, compounded by the influx of skilled labor, have a pronounced impact on investment strategies and project timelines. As a result, the interplay of these elements may lead to financial strain and inefficiencies, ultimately affecting the overall growth and stability of the semiconductor capital equipment sector in a competitive global landscape.

Market Trends of the Global Semiconductor Capital Equipment Market

The Global Semiconductor Capital Equipment market is poised for significant expansion between 2024 and 2031, largely driven by the emergence of 5G technology. This transformative period is expected to see the market size double, fueled by escalating demand for advanced applications, including autonomous vehicles and virtual reality solutions. As industries innovate and integrate high-speed connectivity into their platforms, the need for sophisticated semiconductor manufacturing equipment will surge. Consequently, players in the semiconductor capital equipment space are likely to capitalize on this trend, investing in research, development, and production capacities to meet the burgeoning requirements of next-generation technologies.

Table of Contents

Introduction

  • Objectives of the Study
  • Scope of the Report
  • Definitions

Research Methodology

  • Information Procurement
  • Secondary & Primary Data Methods
  • Market Size Estimation
  • Market Assumptions & Limitations

Executive Summary

  • Global Market Outlook
  • Supply & Demand Trend Analysis
  • Segmental Opportunity Analysis

Market Dynamics & Outlook

  • Market Overview
  • Market Size
  • Market Dynamics
    • Driver & Opportunities
    • Restraints & Challenges
  • Porters Analysis & Impact
    • Competitive rivalry
    • Threat of substitute
    • Bargaining power of buyers
    • Threat of new entrants
    • Bargaining power of suppliers

Key Market Insights

  • Key Success Factors
  • Degree of Competition
  • Top Investment Pockets
  • Market Ecosystem
  • Technological Advancement
  • Regulatory Landscape
  • Patent Analysis
  • Value Chain Analysis
  • Case Study Analysis
  • Customer & Buying Criteria Analysis
  • PESTEL Analysis
  • Macro-Economic Indicators
  • Market Attractiveness Index
  • Pricing Analysis

Semiconductor Capital Equipment Market Size by Type & CAGR (2024-2031)

  • Market Overview
  • Wafer-Level Manufacturing Equipment
    • Lithography Equipment
    • Etching Equipment
    • Deposition Equipment
    • Chemical Mechanical Planarization (CMP) Equipment
    • Cleaning Equipment
  • Assembly and Packaging Equipment
    • Die Bonders
    • Wire Bonders
    • Flip Chip Bonders
    • Encapsulation Equipment
  • Automated Test Equipment (ATE)
    • Memory Test Systems
    • Non-Memory Test Systems
    • Discrete Test Systems

Semiconductor Capital Equipment Market Size by Process Type & CAGR (2024-2031)

  • Market Overview
    • Wafer Processing
    • Surface Conditioning
    • Chemical Mechanical Planarization (CMP)
    • Chemical Vapor Deposition (CVD)
    • Physical Vapor Deposition (PVD)
    • Ion Implantation
  • Assembly and Packaging
    • Wafer Bonding
    • Die Attach
    • Wire Bonding
    • Encapsulation
  • Testing
    • Electrical Testing
    • Functional Testing
    • Burn-In Testing

Semiconductor Capital Equipment Market Size by Industry Vertical & CAGR (2024-2031)

  • Market Overview
  • Consumer Electronics
    • Smartphones
    • Tablets
    • Laptops
    • Wearables
  • Automotive
    • Advanced Driver Assistance Systems (ADAS)
    • Infotainment Systems
    • Electric Vehicles (EVs)
    • Autonomous Vehicles
  • Healthcare
    • Medical Devices
    • Diagnostic Equipment
    • Wearable Health Monitors
  • IT and Telecommunication
    • Data Centers
    • Networking Equipment
    • 5G Infrastructure

Semiconductor Capital Equipment Market Size & CAGR (2024-2031)

  • North America, (Type, Process Type, Industry Vertical)
    • US
    • Canada
  • Europe, (Type, Process Type, Industry Vertical)
    • UK
    • Germany
    • Spain
    • France
    • Italy
    • Rest of Europe
  • Asia-Pacific, (Type, Process Type, Industry Vertical)
    • China
    • India
    • Japan
    • South Korea
    • Rest of Asia Pacific
  • Latin America, (Type, Process Type, Industry Vertical)
    • Brazil
    • Rest of Latin America
  • Middle East & Africa, (Type, Process Type, Industry Vertical)
    • GCC Countries
    • South Africa
    • Rest of Middle East & Africa

Competitive Intelligence

  • Top 5 Player Comparison
  • Market Positioning of Key Players, 2023
  • Strategies Adopted by Key Market Players
  • Recent Developments in the Market
  • Company Market Share Analysis, 2023
  • Company Profiles of All Key Players
    • Company Details
    • Product Portfolio Analysis
    • Company's Segmental Share Analysis
    • Revenue Y-O-Y Comparison (2021-2023)

Key Company Profiles

  • Applied Materials, Inc.
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • ASML Holding N.V.
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Tokyo Electron Limited
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Lam Research Corporation
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • KLA Corporation
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Advantest Corporation
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Teradyne Inc.
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Screen Holdings Co., Ltd.
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Hitachi High-Technologies Corporation
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • ASM International N.V.
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Kulicke & Soffa Industries, Inc.
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Nikon Corporation
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Canon Inc.
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Plasma-Therm LLC
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Veeco Instruments Inc.
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Nova Measuring Instruments Ltd.
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Ontoo Innovation
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Camtek Ltd.
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • ACCRETECH - Tokyo Seimitsu Co., Ltd.
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Ultratech, Inc.
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments

Conclusion & Recommendation

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