전자 패키징 시장 규모, 점유율 및 성장 분석 : 유형별, 포장재료별, 포장 기술별, 용도별, 지역별 - 업계 예측(2026-2033년)

Global Electronic Packaging Market size was valued at USD 36.28 Billion in 2024 and is poised to grow from USD 37.81 Billion in 2025 to USD 52.54 Billion by 2033, growing at a CAGR of 4.2% during the forecast period (2026-2033).

Market insights indicate that the proliferation of IoT and AI technologies, alongside the demand for advanced electronic devices in consumer electronics and the automotive industry, is significantly enhancing the global electronic packaging sector. Innovative partnerships, such as between Amcor Technology and Samsung Electronics, have led to the creation of cutting-edge solutions like the Hybrid-Substrate Cube technology, designed for high-performance semiconductor applications. The automotive segment is particularly pivotal, driven by the surge in electric and hybrid vehicles that necessitate advanced memory and processing technologies. Additionally, unique and aesthetically appealing packaging designs are becoming a growth catalyst. Meanwhile, the electric vehicle market is projected to witness substantial investment and opportunities, further propelling the evolution of electronic packaging technologies worldwide.

Top-down and bottom-up approaches were used to estimate and validate the size of the Global Electronic Packaging market and to estimate the size of various other dependent submarkets. The research methodology used to estimate the market size includes the following details: The key players in the market were identified through secondary research, and their market shares in the respective regions were determined through primary and secondary research. This entire procedure includes the study of the annual and financial reports of the top market players and extensive interviews for key insights from industry leaders such as CEOs, VPs, directors, and marketing executives. All percentage shares split, and breakdowns were determined using secondary sources and verified through Primary sources. All possible parameters that affect the markets covered in this research study have been accounted for, viewed in extensive detail, verified through primary research, and analyzed to get the final quantitative and qualitative data.

Global Electronic Packaging Market Segments Analysis

Global Electronic Packaging Market is segmented by Type, Packaging Material, Packaging Technology, Application and region. Based on Type, the market is segmented into Corrugated Boxes, Paperboard Boxes, Thermoformed Trays, Bags and Pouches, Blister packs and Clamshell, Protective, Flexible Packaging and Rigid Packaging. Based on Packaging Material, the market is segmented into Plastic, Metal, Glass and Paperboard. Based on Packaging Technology, the market is segmented into Thermal Packaging, Protective Packaging and Modified Atmosphere Packaging. Based on Application, the market is segmented into Consumer Electronics, Industrial Electronics, Telecommunications and Automotive Electronics. Based on region, the market is segmented into North America, Europe, Asia Pacific, Latin America and Middle East & Africa.

Driver of the Global Electronic Packaging Market

The Global Electronic Packaging market is primarily fueled by the increasing demand for compact electronics, such as smartphones and wearable IoT devices. As consumers seek sleeker and lighter devices, manufacturers are compelled to adopt advanced semiconductor packaging techniques that facilitate miniaturization. This trend not only enhances the size and weight efficiency of electronics but also boosts their overall performance. Furthermore, cutting-edge packaging technologies enable the integration of multiple functions within a smaller footprint, allowing for innovative product designs and improved user experiences, thereby driving the market forward and fostering continuous advancements in electronic packaging solutions.

Restraints in the Global Electronic Packaging Market

One of the key challenges faced by the global electronic packaging market is the high cost associated with advanced packaging technologies. These innovative solutions often involve intricate components, specialized machinery, and premium materials, all of which contribute to increased production expenses. Manufacturers also encounter financial obstacles due to the necessity for ongoing investment in evolving packaging technologies and equipment. Additionally, the competitive landscape, coupled with pricing pressures from customers, can impact profit margins and limit the willingness to embrace enhanced packaging solutions. This combination of factors presents a significant restraint on the growth and advancement of the market.

Market Trends of the Global Electronic Packaging Market

The Global Electronic Packaging market is experiencing a significant upward trend, driven by the booming demand for electronic devices and components. With a robust rise in consumer electronics and advancements in technology, manufacturers are increasingly seeking innovative packaging solutions that ensure product safety and enhance aesthetic appeal. As countries with strong regulatory frameworks support local electronics production, such as India, the packaging sector benefits from heightened production volumes. Moreover, the emphasis on sustainability and the adoption of eco-friendly materials in packaging designs further contribute to market growth. This evolving landscape creates ample opportunities for industry players to cater to diverse consumer needs effectively.

Table of Contents

Introduction

• Objectives of the Study
• Scope of the Report
• Definitions

Research Methodology

• Information Procurement
• Secondary & Primary Data Methods
• Market Size Estimation
• Market Assumptions & Limitations

Executive Summary

• Global Market Outlook
• Supply & Demand Trend Analysis
• Segmental Opportunity Analysis

Market Dynamics & Outlook

• Market Overview
• Market Size
• Market Dynamics
  • Drivers & Opportunities
  • Restraints & Challenges
• Porters Analysis
  • Competitive rivalry
  • Threat of substitute
  • Bargaining power of buyers
  • Threat of new entrants
  • Bargaining power of suppliers

Key Market Insights

• Key Success Factors
• Degree of Competition
• Top Investment Pockets
• Market Ecosystem
• Market Attractiveness Index, 2025
• PESTEL Analysis
• Macro-Economic Indicators
• Value Chain Analysis
• Pricing Analysis

Global Electronic Packaging Market Size by Type & CAGR (2026-2033)

• Market Overview
• Corrugated Boxes
• Paperboard Boxes
• Thermoformed Trays
• Bags and Pouches
• Blister packs and Clamshell
• Protective
• Flexible Packaging
• Rigid Packaging

Global Electronic Packaging Market Size by Packaging Material & CAGR (2026-2033)

• Market Overview
• Plastic
• Metal
• Glass
• Paperboard

Global Electronic Packaging Market Size by Packaging Technology & CAGR (2026-2033)

• Market Overview
• Thermal Packaging
• Protective Packaging
• Modified Atmosphere Packaging

Global Electronic Packaging Market Size by Application & CAGR (2026-2033)

• Market Overview
• Consumer Electronics
• Industrial Electronics
• Telecommunications
• Automotive Electronics

Global Electronic Packaging Market Size & CAGR (2026-2033)

• North America (Type, Packaging Material, Packaging Technology, Application)
  • US
  • Canada
• Europe (Type, Packaging Material, Packaging Technology, Application)
  • Germany
  • Spain
  • France
  • UK
  • Italy
  • Rest of Europe
• Asia Pacific (Type, Packaging Material, Packaging Technology, Application)
  • China
  • India
  • Japan
  • South Korea
  • Rest of Asia-Pacific
• Latin America (Type, Packaging Material, Packaging Technology, Application)
  • Brazil
  • Rest of Latin America
• Middle East & Africa (Type, Packaging Material, Packaging Technology, Application)
  • GCC Countries
  • South Africa
  • Rest of Middle East & Africa

Competitive Intelligence

• Top 5 Player Comparison
• Market Positioning of Key Players, 2025
• Strategies Adopted by Key Market Players
• Recent Developments in the Market
• Company Market Share Analysis, 2025
• Company Profiles of All Key Players
  • Company Details
  • Product Portfolio Analysis
  • Company's Segmental Share Analysis
  • Revenue Y-O-Y Comparison (2023-2025)

Key Company Profiles

• Amkor Technology, Inc. (United States)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• ASE Technology Holding Co., Ltd. (Taiwan)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Jabil Inc. (United States)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• BE Semiconductor Industries N.V. (Besi) (Netherlands)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Kulicke & Soffa Industries, Inc. (Singapore)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Tokyo Electron Limited (Japan)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Toppan Inc. (Japan)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Shinko Electric Industries Co., Ltd. (Japan)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Unimicron Technology Corporation (Taiwan)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Samsung Electro-Mechanics Co., Ltd. (South Korea)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• LG Innotek Co., Ltd. (South Korea)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• ASE Group (Taiwan)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• SPIL (Siliconware Precision Industries Co., Ltd.) (Taiwan)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Powertech Technology Inc. (Taiwan)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• JCET Group Co., Ltd. (China)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Tongfu Microelectronics Co., Ltd. (China)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Hana Micron Inc. (South Korea)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• ASE Technology Holding Co., Ltd. (Taiwan)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Nepes Corporation (South Korea)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments

Conclusion & Recommendations