세계의 ASIC(특정 용도용 집적회로) 시장 예측(-2032년) : 유형별, 설계 방법별, 기술별, 포장·테스트별, 비즈니스 모델별, 최종사용자별, 지역별 분석

According to Stratistics MRC, the Global Application-Specific Integrated Circuits Market is accounted for $18.6 billion in 2025 and is expected to reach $28.2 billion by 2032 growing at a CAGR of 6.1% during the forecast period. Application-Specific Integrated Circuits (ASICs) are custom-designed semiconductor chips tailored for a specific function or application, offering optimized performance, power efficiency, and compact form factor. Unlike general-purpose processors, ASICs are engineered to execute predefined tasks with high precision and speed, making them ideal for industries such as telecommunications, automotive, and consumer electronics. Their fixed architecture enhances reliability and throughput, though it limits flexibility. ASICs are commonly used in high-volume production environments where specialized functionality is critical.

Market Dynamics:

Driver:

Rising demand for energy-efficient and high-performance chips

As industries transition toward smart infrastructure and IoT ecosystems, the need for customized, low-latency silicon solutions is intensifying. These chips are engineered to deliver optimized performance for specific tasks, reducing power consumption while enhancing processing speed. Moreover, ASICs are increasingly preferred in data centers and AI workloads due to their ability to outperform general-purpose processors in targeted applications. This trend is expected to sustain long-term demand for high-performance, application-specific designs.

Restraint:

Design complexity and verification challenges

Unlike general-purpose chips, ASICs require precise architectural planning tailored to specific functions, which increases the risk of design flaws and delays. Verification tools must simulate a wide range of scenarios to ensure reliability, adding to development time and cost. Additionally, the lack of standardized design frameworks across industries complicates integration and scalability. These challenges are further amplified by the need to meet stringent performance benchmarks and regulatory compliance, which can deter smaller players from entering the market.

Opportunity:

Emerging applications in quantum computing, edge AI, and neuromorphic chips

In quantum computing, ASICs are being explored to manage control systems and error correction protocols with minimal latency. Edge AI applications, such as autonomous vehicles and smart surveillance, demand real-time processing with low power footprints-an ideal use case for ASICs. Furthermore, neuromorphic computing, which mimics brain-like architectures, relies on custom silicon to replicate synaptic behavior efficiently. These emerging domains are fostering demand for highly specialized chips, encouraging R&D investments and strategic collaborations across academia and industry.

Threat:

Geopolitical tensions and export restrictions

Trade restrictions, export controls, and diplomatic conflicts particularly between major chip-producing nations can hinder access to critical fabrication technologies and raw materials. Such constraints not only delay production timelines but also inflate costs, affecting profitability. Additionally, regulatory scrutiny over intellectual property and national security concerns may limit cross-border partnerships and technology transfers. These risks are prompting companies to reassess sourcing strategies and invest in regional manufacturing capabilities to mitigate exposure.

Covid-19 Impact:

The COVID-19 pandemic disrupted semiconductor supply chains, leading to chip shortages and delayed product launches across multiple industries. However, the crisis also accelerated digital transformation, boosting demand for ASICs in remote communication, healthcare diagnostics, and cloud computing. Lockdowns and remote work environments intensified reliance on data centers and smart devices, where ASICs play a pivotal role in optimizing performance. While initial production bottlenecks affected revenue streams, the long-term outlook improved as companies prioritized resilient design strategies and diversified supplier networks.

The programmable ASIC segment is expected to be the largest during the forecast period

The programmable ASIC segment is expected to account for the largest market share during the forecast period propelled by, their flexibility and cost-effectiveness in prototyping and mid-volume production. Their adaptability makes them suitable for evolving applications in consumer electronics, industrial automation, and wireless communication. As demand for configurable hardware grows, especially in edge computing and embedded systems, programmable ASICs are emerging as the preferred choice for manufacturers seeking balance between performance and scalability.

The hardware-software co-design segment is expected to have the highest CAGR during the forecast period

Over the forecast period, the hardware-software co-design segment is predicted to witness the highest growth rate, influenced by, enhanced system-level performance, reduces debugging cycles, and accelerates deployment in complex applications such as AI inference engines and autonomous systems. The rising complexity of integrated systems is driving adoption of co-design frameworks, supported by advanced simulation tools and collaborative development platforms. As industries seek to shorten innovation cycles and improve functional efficiency, this segment is poised for rapid expansion.

Region with largest share:

During the forecast period, the Asia Pacific region is expected to hold the largest market share, driven by robust semiconductor manufacturing infrastructure and high-volume electronics production. Countries like China, South Korea, Taiwan, and Japan are home to leading foundries and design houses, enabling cost-effective fabrication and innovation. The region's strong presence in consumer electronics, automotive, and telecom sectors further amplifies demand for customized chips. Government initiatives supporting digital transformation and industrial automation are also contributing to market growth, positioning Asia Pacific as the global hub for ASIC deployment.

Region with highest CAGR:

Over the forecast period, the Asia Pacific region is anticipated to exhibit the highest CAGR, attributed to, expanding R&D investments and increasing adoption of advanced technologies. Emerging economies such as India and Vietnam are witnessing a surge in demand for smart devices, IoT solutions, and AI-powered platforms, all of which rely on ASICs for efficient processing. Strategic partnerships between local firms and global semiconductor leaders are fostering innovation and capacity building.

Key players in the market

Some of the key players in Application-Specific Integrated Circuits Market include Broadcom Inc., Qualcomm Incorporated, NVIDIA Corporation, Intel Corporation, Advanced Micro Devices (AMD), Samsung Electronics, MediaTek Inc., Marvell Technology Group, Xilinx (AMD), Lattice Semiconductor, NXP Semiconductors, STMicroelectronics, Renesas Electronics, Infineon Technologies, Analog Devices, ON Semiconductor, Microchip Technology, Texas Instruments, and Taiwan Semiconductor Manufacturing Company.

Key Developments:

In October 2025, Qualcomm unveiled its AI200 and AI250 chips to compete with AMD and NVIDIA in server-grade AI workloads. These chips support liquid-cooled rack-scale systems for enterprise AI.

In October 2025, Intel unveiled Panther Lake, its first AI PC platform built on 18A process, targeting hybrid AI workloads. This marks a leap in consumer AI computing.

In January 2025, Qualcomm partnered with Samsung to launch the Galaxy S25 series powered by Snapdragon 8 Elite, optimized for Gemini AI experiences. This marks a strategic alignment in mobile AI performance.

Types Covered:

• Full Custom ASIC
• Semi-Custom ASIC
• Programmable ASIC
• Gate Array-Based ASIC
• Standard Cell-Based ASIC
• Other Types

Design Methodologies Covered:

• RTL-to-GDSII Flow
• IP-Centric Design
• Platform-Based Design
• Hardware-Software Co-Design
• Design for Testability (DFT)
• Design for Yield and Manufacturability

Technology Nodes Covered:

• Advanced Nodes (<=7nm)
• Leading Nodes (8-14nm)
• Mature Nodes (16-28nm)
• Legacy Nodes (28-65nm)
• Older Nodes (>65nm)

Packaging & Tests Covered:

• Traditional Wire-Bond Packaging
• Advanced Packaging (2.5D, 3D-IC, SiP)
• Flip-Chip & BGA
• Test Services (Wafer Probe, Final Test)
• Burn-in & Reliability Testing
• Other Packaging & Tests

Business Models Covered:

• Fabless ASIC Companies
• Integrated Device Manufacturers (IDMs)
• Foundry Services / Custom Manufactures
• Turnkey Design & IP Licensing Models
• Design Services & ASIC-as-a-Service
• Other Business Models

End Users Covered:

• Telecom & Networking
• Data Center & Cloud Infrastructure
• Consumer Electronics
• Automotive
• Industrial Automation & IoT
• Medical Devices & Healthcare
• Aerospace & Defense
• Security & Surveillance
• Other End Users

Regions Covered:

• North America
  • US
  • Canada
  • Mexico
• Europe
  • Germany
  • UK
  • Italy
  • France
  • Spain
  • Rest of Europe
• Asia Pacific
  • Japan
  • China
  • India
  • Australia
  • New Zealand
  • South Korea
  • Rest of Asia Pacific
• South America
  • Argentina
  • Brazil
  • Chile
  • Rest of South America
• Middle East & Africa
  • Saudi Arabia
  • UAE
  • Qatar
  • South Africa
  • Rest of Middle East & Africa

What our report offers:

• Market share assessments for the regional and country-level segments
• Strategic recommendations for the new entrants
• Covers Market data for the years 2024, 2025, 2026, 2028, and 2032
• Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
• Strategic recommendations in key business segments based on the market estimations
• Competitive landscaping mapping the key common trends
• Company profiling with detailed strategies, financials, and recent developments
• Supply chain trends mapping the latest technological advancements

Free Customization Offerings:

All the customers of this report will be entitled to receive one of the following free customization options:

• Company Profiling
  • Comprehensive profiling of additional market players (up to 3)
  • SWOT Analysis of key players (up to 3)
• Regional Segmentation
  • Market estimations, Forecasts and CAGR of any prominent country as per the client's interest (Note: Depends on feasibility check)
• Competitive Benchmarking
  • Benchmarking of key players based on product portfolio, geographical presence, and strategic alliances

Table of Contents

1 Executive Summary

2 Preface

• 2.1 Abstract
• 2.2 Stake Holders
• 2.3 Research Scope
• 2.4 Research Methodology
  • 2.4.1 Data Mining
  • 2.4.2 Data Analysis
  • 2.4.3 Data Validation
  • 2.4.4 Research Approach
• 2.5 Research Sources
  • 2.5.1 Primary Research Sources
  • 2.5.2 Secondary Research Sources
  • 2.5.3 Assumptions

3 Market Trend Analysis

• 3.1 Introduction
• 3.2 Drivers
• 3.3 Restraints
• 3.4 Opportunities
• 3.5 Threats
• 3.6 End User Analysis
• 3.7 Emerging Markets
• 3.8 Impact of Covid-19

4 Porters Five Force Analysis

• 4.1 Bargaining power of suppliers
• 4.2 Bargaining power of buyers
• 4.3 Threat of substitutes
• 4.4 Threat of new entrants
• 4.5 Competitive rivalry

5 Global Application-Specific Integrated Circuits Market, By Type

• 5.1 Introduction
• 5.2 Full Custom ASIC
• 5.3 Semi-Custom ASIC
• 5.4 Programmable ASIC
• 5.5 Gate Array-Based ASIC
• 5.6 Standard Cell-Based ASIC
• 5.7 Other Types

6 Global Application-Specific Integrated Circuits Market, By Design Methodology

• 6.1 Introduction
• 6.2 RTL-to-GDSII Flow
• 6.3 IP-Centric Design
• 6.4 Platform-Based Design
• 6.5 Hardware-Software Co-Design
• 6.6 Design for Testability (DFT)
• 6.7 Design for Yield and Manufacturability

7 Global Application-Specific Integrated Circuits Market, By Technology Node

• 7.1 Introduction
• 7.2 Advanced Nodes (<=7nm)
• 7.3 Leading Nodes (8-14nm)
• 7.4 Mature Nodes (16-28nm)
• 7.5 Legacy Nodes (28-65nm)
• 7.6 Older Nodes (>65nm)

8 Global Application-Specific Integrated Circuits Market, By Packaging & Test

• 8.1 Introduction
• 8.2 Traditional Wire-Bond Packaging
• 8.3 Advanced Packaging (2.5D, 3D-IC, SiP)
• 8.4 Flip-Chip & BGA
• 8.5 Test Services (Wafer Probe, Final Test)
• 8.6 Burn-in & Reliability Testing
• 8.7 Other Packaging & Tests

9 Global Application-Specific Integrated Circuits Market, By Business Model

• 9.1 Introduction
• 9.2 Fabless ASIC Companies
• 9.3 Integrated Device Manufacturers (IDMs)
• 9.4 Foundry Services / Custom Manufactures
• 9.5 Turnkey Design & IP Licensing Models
• 9.6 Design Services & ASIC-as-a-Service
• 9.7 Other Business Models

10 Global Application-Specific Integrated Circuits Market, By End User

• 10.1 Introduction
• 10.2 Telecom & Networking
• 10.3 Data Center & Cloud Infrastructure
• 10.4 Consumer Electronics
• 10.5 Automotive
• 10.6 Industrial Automation & IoT
• 10.7 Medical Devices & Healthcare
• 10.8 Aerospace & Defense
• 10.9 Security & Surveillance
• 10.10 Other End Users

11 Global Application-Specific Integrated Circuits Market, By Geography

• 11.1 Introduction
• 11.2 North America
  • 11.2.1 US
  • 11.2.2 Canada
  • 11.2.3 Mexico
• 11.3 Europe
  • 11.3.1 Germany
  • 11.3.2 UK
  • 11.3.3 Italy
  • 11.3.4 France
  • 11.3.5 Spain
  • 11.3.6 Rest of Europe
• 11.4 Asia Pacific
  • 11.4.1 Japan
  • 11.4.2 China
  • 11.4.3 India
  • 11.4.4 Australia
  • 11.4.5 New Zealand
  • 11.4.6 South Korea
  • 11.4.7 Rest of Asia Pacific
• 11.5 South America
  • 11.5.1 Argentina
  • 11.5.2 Brazil
  • 11.5.3 Chile
  • 11.5.4 Rest of South America
• 11.6 Middle East & Africa
  • 11.6.1 Saudi Arabia
  • 11.6.2 UAE
  • 11.6.3 Qatar
  • 11.6.4 South Africa
  • 11.6.5 Rest of Middle East & Africa

12 Key Developments

• 12.1 Agreements, Partnerships, Collaborations and Joint Ventures
• 12.2 Acquisitions & Mergers
• 12.3 New Product Launch
• 12.4 Expansions
• 12.5 Other Key Strategies

13 Company Profiling

• 13.1 Broadcom Inc.
• 13.2 Qualcomm Incorporated
• 13.3 NVIDIA Corporation
• 13.4 Intel Corporation
• 13.5 Advanced Micro Devices (AMD)
• 13.6 Samsung Electronics
• 13.7 MediaTek Inc.
• 13.8 Marvell Technology Group
• 13.9 Xilinx (AMD)
• 13.10 Lattice Semiconductor
• 13.11 NXP Semiconductors
• 13.12 STMicroelectronics
• 13.13 Renesas Electronics
• 13.14 Infineon Technologies
• 13.15 Analog Devices
• 13.16 ON Semiconductor
• 13.17 Microchip Technology
• 13.18 Texas Instruments
• 13.19 Taiwan Semiconductor Manufacturing Company