세계의 밀폐 포장 시장 조사 보고서 : 산업 분석, 규모, 점유율, 성장, 동향, 예측(2024-2032년)

The global demand for Hermetic Packaging Market is presumed to reach the market size of nearly USD 8.23 Billion by 2032 from USD 4.51 Billion in 2023 with a CAGR of 6.92% under the study period 2024-2032.

Hermetic packaging refers to an advanced level packaging technique that has its significant applications in active and passive electronic devices and also in the semiconductor and electrics industry. Hermetic packaging gives protection to extremely sensitive electronics, including sensors, laser diodes, and optoelectronic components from humidity and corrosion. This packaging also protects the electronic systems against environmental conditions such as moisture, soil, and other hazards that could damage electrical connections or sensitive electronic components. It plays a vital role in the safe and reliable functionality of various electronic products by extending the shelf life of electrical components.

MARKET DYNAMICS

The significant factors which are driving the global hermetic packaging market growth are the increasing demand for energy globally and hermetically packaged products, especially electronic components. Many applications in areas such as space, electronics, aeronautics, and automobile components drive the growth of the market. The demand for multilayer ceramic packaging for high-frequency purposes such as wireless communication, optical communication, and data communication fuels the growth of the market. The growth and the development of the aeronautics and space industry accelerate the global market. The stringent regulatory and military policies regarding its usage impede the growth of the market.

The research report covers Porter's Five Forces Model, Market Attractiveness Analysis, and Value Chain analysis. These tools help to get a clear picture of the industry's structure and evaluate the competition attractiveness at a global level. Additionally, these tools also give an inclusive assessment of each segment in the global market of Hermetic Packaging. The growth and trends of Hermetic Packaging industry provide a holistic approach to this study.

MARKET SEGMENTATION

This section of the Hermetic Packaging market report provides detailed data on the segments at country and regional level, thereby assisting the strategist in identifying the target demographics for the respective product or services with the upcoming opportunities.

By Product

• Ceramic to Metal Sealing
• Glass to Metal Sealing
• Transponder Glass
• Reed Glass
• Passivation Glass

By Application

• Aeronautics & Space
• Military & Defense
• Automotive
• Healthcare
• Telecom
• Others

REGIONAL ANALYSIS

This section covers the regional outlook, which accentuates current and future demand for the Hermetic Packaging market across North America, Europe, Asia-Pacific, Latin America, and Middle East & Africa. Further, the report focuses on demand, estimation, and forecast for individual application segments across all the prominent regions.

The research report also covers the comprehensive profiles of the key players in the market and an in-depth view of the competitive landscape worldwide. The major players in the Hermetic Packaging market include Schott AG, Ametek Inc., NGK Spark Plug Co. Ltd., Teledyne Microelectronic Technologies, Kyocera Corporation, Egide S.A., Legacy Technologies Inc., Willow Technologies, SST International, Special Hermetic Products Inc., Sinclair Manufacturing Company, Mackin Technologies. This section consists of a holistic view of the competitive landscape that includes various strategic developments such as key mergers & acquisitions, future capacities, partnerships, financial overviews, collaborations, new product developments, new product launches, and other developments.

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TABLE OF CONTENTS

1. PREFACE

• 1.1. Report Description
  • 1.1.1 Objective
  • 1.1.2 Target Audience
  • 1.1.3 Unique Selling Proposition (USP) & offerings
• 1.2. Research Scope
• 1.3. Research Methodology
  • 1.3.1 Market Research Process
  • 1.3.2 Market Research Methodology

2. EXECUTIVE SUMMARY

• 2.1. Highlights of Market
• 2.2. Global Market Snapshot

3. HERMETIC PACKAGING - INDUSTRY ANALYSIS

• 3.1. Introduction - Market Dynamics
• 3.2. Market Drivers
• 3.3. Market Restraints
• 3.4. Opportunities
• 3.5. Industry Trends
• 3.6. Porter's Five Force Analysis
• 3.7. Market Attractiveness Analysis
  • 3.7.1 Market Attractiveness Analysis By Product
  • 3.7.2 Market Attractiveness Analysis By Application
  • 3.7.3 Market Attractiveness Analysis By Region

4. VALUE CHAIN ANALYSIS

• 4.1. Value Chain Analysis
• 4.2. Raw Material Analysis
  • 4.2.1 List of Raw Materials
  • 4.2.2 Raw Material Manufactures List
  • 4.2.3 Price Trend of Key Raw Materials
• 4.3. List of Potential Buyers
• 4.4. Marketing Channel
  • 4.4.1 Direct Marketing
  • 4.4.2 Indirect Marketing
  • 4.4.3 Marketing Channel Development Trend

5. GLOBAL HERMETIC PACKAGING MARKET ANALYSIS BY PRODUCT

• 5.1. Overview By Product
• 5.2. Historical and Forecast Data
• 5.3. Analysis By Product
• 5.4. Ceramic to Metal Sealing Historic and Forecast Sales By Regions
• 5.5. Glass to Metal Sealing Historic and Forecast Sales By Regions
• 5.6. Transponder Glass Historic and Forecast Sales By Regions
• 5.7. Reed Glass Historic and Forecast Sales By Regions
• 5.8. Passivation Glass Historic and Forecast Sales By Regions

6. GLOBAL HERMETIC PACKAGING MARKET ANALYSIS BY APPLICATION

• 6.1. Overview By Application
• 6.2. Historical and Forecast Data
• 6.3. Analysis By Application
• 6.4. Aeronautics & Space Historic and Forecast Sales By Regions
• 6.5. Military & Defense Historic and Forecast Sales By Regions
• 6.6. Automotive Historic and Forecast Sales By Regions
• 6.7. Healthcare Historic and Forecast Sales By Regions
• 6.8. Telecom Historic and Forecast Sales By Regions
• 6.9. Others Historic and Forecast Sales By Regions

7. GLOBAL HERMETIC PACKAGING MARKET ANALYSIS BY GEOGRAPHY

• 7.1. Regional Outlook
• 7.2. Introduction
• 7.3. North America Sales Analysis
  • 7.3.1 Overview, Historic and Forecast Data Sales Analysis
  • 7.3.2 North America By Segment Sales Analysis
  • 7.3.3 North America By Country Sales Analysis
  • 7.3.4 United States Sales Analysis
  • 7.3.5 Canada Sales Analysis
  • 7.3.6 Mexico Sales Analysis
• 7.4. Europe Sales Analysis
  • 7.4.1 Overview, Historic and Forecast Data Sales Analysis
  • 7.4.2 Europe By Segment Sales Analysis
  • 7.4.3 Europe By Country Sales Analysis
  • 7.4.4 United Kingdom Sales Analysis
  • 7.4.5 France Sales Analysis
  • 7.4.6 Germany Sales Analysis
  • 7.4.7 Italy Sales Analysis
  • 7.4.8 Russia Sales Analysis
  • 7.4.9 Rest Of Europe Sales Analysis
• 7.5. Asia Pacific Sales Analysis
  • 7.5.1 Overview, Historic and Forecast Data Sales Analysis
  • 7.5.2 Asia Pacific By Segment Sales Analysis
  • 7.5.3 Asia Pacific By Country Sales Analysis
  • 7.5.4 China Sales Analysis
  • 7.5.5 India Sales Analysis
  • 7.5.6 Japan Sales Analysis
  • 7.5.7 South Korea Sales Analysis
  • 7.5.8 Australia Sales Analysis
  • 7.5.9 South East Asia Sales Analysis
  • 7.5.10 Rest Of Asia Pacific Sales Analysis
• 7.6. Latin America Sales Analysis
  • 7.6.1 Overview, Historic and Forecast Data Sales Analysis
  • 7.6.2 Latin America By Segment Sales Analysis
  • 7.6.3 Latin America By Country Sales Analysis
  • 7.6.4 Brazil Sales Analysis
  • 7.6.5 Argentina Sales Analysis
  • 7.6.6 Peru Sales Analysis
  • 7.6.7 Chile Sales Analysis
  • 7.6.8 Rest of Latin America Sales Analysis
• 7.7. Middle East & Africa Sales Analysis
  • 7.7.1 Overview, Historic and Forecast Data Sales Analysis
  • 7.7.2 Middle East & Africa By Segment Sales Analysis
  • 7.7.3 Middle East & Africa By Country Sales Analysis
  • 7.7.4 Saudi Arabia Sales Analysis
  • 7.7.5 UAE Sales Analysis
  • 7.7.6 Israel Sales Analysis
  • 7.7.7 South Africa Sales Analysis
  • 7.7.8 Rest Of Middle East And Africa Sales Analysis

8. COMPETITIVE LANDSCAPE OF THE HERMETIC PACKAGING COMPANIES

• 8.1. Hermetic Packaging Market Competition
• 8.2. Partnership/Collaboration/Agreement
• 8.3. Merger And Acquisitions
• 8.4. New Product Launch
• 8.5. Other Developments

9. COMPANY PROFILES OF HERMETIC PACKAGING INDUSTRY

• 9.1. Top Companies Market Share Analysis
• 9.2. Market Concentration Rate
• 9.3. Schott AG
  • 9.3.1 Company Overview
  • 9.3.2 Company Revenue
  • 9.3.3 Products
  • 9.3.4 Recent Developments
• 9.4. Ametek Inc.
  • 9.4.1 Company Overview
  • 9.4.2 Company Revenue
  • 9.4.3 Products
  • 9.4.4 Recent Developments
• 9.5. NGK Spark Plug Co. Ltd.
  • 9.5.1 Company Overview
  • 9.5.2 Company Revenue
  • 9.5.3 Products
  • 9.5.4 Recent Developments
• 9.6. Teledyne Microelectronic Technologies
  • 9.6.1 Company Overview
  • 9.6.2 Company Revenue
  • 9.6.3 Products
  • 9.6.4 Recent Developments
• 9.7. Kyocera Corporation
  • 9.7.1 Company Overview
  • 9.7.2 Company Revenue
  • 9.7.3 Products
  • 9.7.4 Recent Developments
• 9.8. Egide S.A.
  • 9.8.1 Company Overview
  • 9.8.2 Company Revenue
  • 9.8.3 Products
  • 9.8.4 Recent Developments
• 9.9. Legacy Technologies Inc.
  • 9.9.1 Company Overview
  • 9.9.2 Company Revenue
  • 9.9.3 Products
  • 9.9.4 Recent Developments
• 9.10. Willow Technologies
  • 9.10.1 Company Overview
  • 9.10.2 Company Revenue
  • 9.10.3 Products
  • 9.10.4 Recent Developments
• 9.11. SST International
  • 9.11.1 Company Overview
  • 9.11.2 Company Revenue
  • 9.11.3 Products
  • 9.11.4 Recent Developments
• 9.12. Special Hermetic Products Inc.
  • 9.12.1 Company Overview
  • 9.12.2 Company Revenue
  • 9.12.3 Products
  • 9.12.4 Recent Developments
• 9.13. Sinclair Manufacturing Company
  • 9.13.1 Company Overview
  • 9.13.2 Company Revenue
  • 9.13.3 Products
  • 9.13.4 Recent Developments
• 9.14. Mackin Technologies
  • 9.14.1 Company Overview
  • 9.14.2 Company Revenue
  • 9.14.3 Products
  • 9.14.4 Recent Developments

Note - In company profiling, financial details and recent developments are subject to availability or might not be covered in the case of private companies