인프라 및 클라이언트 디바이스용 6G 통신용 열관리 재료 : 사업 기회, 시장, 기술(2027-2047년)

Summary

Every new generation of wireless communications incurs greater thermal management challenges particularly cooling. 6G Communications will be no exception. Once again there are two main aspects. Base stations will use more power and create more heat in order to do more. Client devices will once again need to manage heat in more-confined spaces. However, this time, we must add such things as extensive self-powering calling for battery and solar panel cooling and, in the propagation path, active reconfigurable intelligent surfaces being cooled. Traditional cooling technologies like vapor compression cooling which causes much heat and environmental damage, will be inadequate. Consequently, emerging options will be eagerly adopted. What are they?

It is time for an analysis of your opportunities emerging from this big picture and it has arrived in the form of the 489-page, commercially-oriented, Zhar Research report, “6G Communications Thermal Materials for Infrastructure and Client Devices: Opportunities, Markets, Technology 2027-2047”. Its 10 chapters present 22 key conclusions, 11 pie charts, 11 SWOT appraisals, 33 infograms, roadmaps and 31 forecast lines with graphs, tables and explanation. Most of that is in the Executive Summary and Conclusions (60 pages), self-sufficient for those with limited time.

Chapter 2. Introduction (41 pages) puts in context why 6G brings a much bigger opportunity for thermal management and it is mainly cooling. See examples, new comparison tables, hype curves and your opportunities to replace troublesome materials.

Chapter 3. Passive Radiative Cooling PRC (Passive Daylight Radiative Cooling PDRC) (110 pages) takes the broad view of this form of solid-state cooling that needs no power and can be provided as paint, film, fabric and other forms. This is because 6G client devices and infrastructure are intended to take many forms beyond those seen with 5G. See the implications of many research advances 2025 through 2026 and the activities of the manufacturers and why there is scope for many more of them.

Chapter 4. PRC variants: Janus and Anti-Stokes cooling, adaptive and tunable options (17 pages) also includes 2025 and 2026 research including bioinspired, adaptive and tunable PRC advances 2025-6. Anti-Stokes includes so-called laser cooling of semiconductors.

Chapter 5. Caloric cooling (34 pages) concerns the most direct alternative to vapor compression cooling so it has the greatest market potential of the new solid-state cooling options for 6G and elsewhere. It includes 2025 and 2026 research, SWOT appraisals and materials popularity analysis.

Chapter 6. Enabling technology: Metamaterial and other advanced photonic cooling: emerging materials and devices (27 pages) has similar types of coverage then comes Chapter 7. Future thermoelectric cooling and thermoelectric harvesting as a user of and power provider for other solid-state cooling (59 pages). This has that broad scope because thermoelectric cooling will be used on 6G components but also solid-state cooling is proposed for maintaining good temperature difference for thermoelectric energy harvesting in 6G client devices including Internet of Things nodes.

Chapter 8. Future evaporative, melting and flow cooling including heat pipes, thermal hydrogels for 6G smartphones, other 6G client devices, 6G infrastructure has 39 pages covering heat pipes, vapor chambers, hydrogels and aerogels mainly useful for planned 6G client devices.

Chapter 9. Thermal Interface Materials TIM, other emerging materials for 6G conductive cooling challenges (57 pages) extensively covers these including their manufacturers and latest research advances. Then the report closes with Chapter 10. Advanced heat shielding, thermal insulation and ionogels for 6G (23 pages).

Table of Contents

1. Executive summary and conclusions

• 1.1 Purpose of this report and assumptions
• 1.2 Methodology of this analysis
• 1.3 SWOT appraisal of 6G Communications thermal material opportunities
• 1.4 Some reasons for the escalating need for cooling
• 1.5 Cooling toolkit, trend to multifunctionality with best solid-state cooling tools shown red
• 1.6 Primary conclusions: 6G thermal requirements
• 1.7 Primary conclusions: solid-state cooling and why it is now a priority for 6G and generally
• 1.8 Primary conclusions: Materials for making cold in 6G infrastructure and client devices
  • 1.8.1 General situation
  • 1.8.2 Leading candidate materials and structures compared
  • 1.8.3 Leading materials in number of latest research advances on solid state cooling
  • 1.8.4 Research pipeline of solid-state cooling by topic vs technology readiness level
  • 1.8.5 Typical best reported temperature drop achieved by technology 2000-2046 extrapolated
  • 1.8.6 14 solid-state cooling technology SWOT appraisals and supporting materials analyses
• 1.9 Primary conclusions: Materials for removing heat by conduction and convection
• 1.10 Roadmap of 6G materials and hardware 2027-2047
• 1.11 Solid state cooling roadmap by market and by technology 2027-2047
• 1.12 Market forecasts as tables, graphs, explanation in 31 lines 2027-2047
  • 1.12.1 Cooling module global market by seven technologies $ billion 2026-2047, % by industry
  • 1.12.2 Terrestrial radiative cooling performance in commercial products W/sq. m 2025-2047
  • 1.12.3 Air conditioner value market $ billion 2024-2047
  • 1.12.4 Global market for HVAC, refrigerators, freezers, other cooling $ billion 2025-2047
  • 1.12.5 Refrigerator and freezer value market $ billion 2024-2047
  • 1.12.6 Stationary battery market $ billion and cooling needs 2024-2047
  • 1.12.7 Thermal management material and structure for 6G Communications infrastructure and client devices $ billion if 6G is successful 2026-2047
  • 1.12.8 Dielectric and thermal materials for 6G value market % by location 2029-2047
  • 1.12.9 5G vs 6G thermal interface material market $ billion 2025-2047
  • 1.12.10 Market for 6G vs 5G base stations units millions yearly 2025-2047
  • 1.12.11 Market for 6G base stations market value $bn if successful 2029-2047
  • 1.12.12 Smartphone billion units sold globally 2024-2047 if 6G is successful
  • 1.12.13 Thermal meta-device market $ billion 2025-2047 by 3 application segments

2. Introduction

• 2.1 Overview
  • 2.1.1 Why 6G brings a much bigger opportunity for thermal management and it is mainly cooling
  • 2.1.2 6G cooling challenge in context of evolution of other cooling increasingly becoming laminar and solid state
  • 2.1.3 Need for cooling in general becomes much larger and often different in nature: the 6G smartphone example
  • 2.1.4 Some of the reasons for much greater need for thermal materials in 6G
  • 2.1.5 How cooling technology will trend to smart materials 2025-2046
• 2.2 Location of the primary 6G thermal management opportunities
  • 2.2.1 Situation with primary 6G infrastructure and client devices
  • 2.2.2 Example RIS for massive MIMO base station: Tsinghua University, Emerson
• 2.3 Cooling, heat barrier and advanced thermally supportive technologies for 6G covered in this report
• 2.4 Examples
  • 2.4.1 Severe new microchip cooling requirements arriving
  • 2.4.2 Cooling 6G electronic components and smartphones
  • 2.4.3 Cooling 6G base stations including their energy harvesting and storage
  • 2.4.4 Cooling solar panels and photovoltaic cladding for 6G infrastructure
  • 2.4.5 Large battery thermal management for 6G infrastructure
  • 2.4.6 Examples of advances in 2024-5
• 2.5 Twelve solid-state cooling operating principles compared by 10 capabilities
• 2.6 Attention vs maturity of cooling and thermal control technologies 3 curves 2026, 2036,
• 2.7 Comparison of traditional and emerging refrigeration technologies
• 2.8 Undesirable materials widely used and proposed: this is an opportunity for you

3. Passive Radiative Cooling (PRC) (Passive Daylight Radiative Cooling PDRC)

• 3.1 Overview with SWOT appraisal, 2027 maturity curve
• 3.2 PRC basics: Definition, origin, purpose, six aspects compared
• 3.3 Materials analysis 2025, 2026 including paint and multi-mode, multifunctional PRC advances
  • 3.3.1 Overall materials analysis with commercial implications
  • 3.3.2 PRC paint and color without compromise
  • 3.3.3 Aerogel and porous material approaches
  • 3.3.4 Environmental and inexpensive PRC materials development
  • 3.3.5 Advanced thermal insulation for PRC: polymer, ceramic, 3DP
• 3.4 Emerging PRC applications: datacenters, buildings, water harvesting, solar panels, apparel, flexible electronics, other
  • 3.4.1 Overall opportunity and progress including proposals for datacenters
  • 3.4.2 PRC for buildings, solar panels and windows: progress in 2025-6
  • 3.4.3 Textile, fabric, wearable PRC: commercial implications of 2025-6 advances and SWOT
  • 3.4.4 PRC cold side boosting power of thermoelectric generators in 2026 and earlier
  • 3.4.5 Cooling of photovoltaics: solid-state options in context 2026 and earlier
  • 3.4.6 Other 2025-6 research related to PRC
• 3.5 Profiles of 12 manufacturers of PRC

4. PRC variants: Janus and Anti-Stokes cooling, adaptive and tunable options

• 4.1 Overview
• 4.2 Two-sided Janus option with SWOT and 2025, 2026 advances appraised
  • 4.2.1 General
  • 4.2.2 SWOT appraisal of Janus effect for thermal management
  • 4.2.3 2025 and 2026 advances appraised
• 4.3 Anti Stokes fluorescence cooling with latest advances appraised and SWOT appraisal
  • 4.3.1 General
  • 4.3.2 SWOT appraisal of Anti-Stokes fluorescence cooling
  • 4.3.3 2025 and 2026 advances appraised
• 4.4 Bioinspired, adaptive and tunable PRC advances 2025-6
  • 4.4.1 Biomimetic approaches that emerged in
  • 4.4.2 Adaptive and tunable radiative cooling and passive thermoregulation

5. Caloric cooling

• 5.1 Structural and ferroic phase change cooling modes and materials
• 5.2 Solid-state phase-change cooling potentially competing with other forms in named applications
• 5.3 The physical principles adjoining caloric cooling
• 5.4 Operating principles for and relative benefits for caloric cooling
• 5.5 Analysis of research and commercialisation of caloric cooling (4 pie charts)
• 5.6 SWOT appraisals and materials analysis pie charts for four main options of caloric cooling
  • 5.6.1 SWOT appraisal of electrocaloric cooling and materials analysis
  • 5.6.2 SWOT appraisal of magnetocaloric cooling and materials analysis
  • 5.6.3 SWOT appraisal of elastocaloric cooling and materials analysis
  • 5.6.4 SWOT appraisal of barocaloric cooling and materials analysis
• 5.7 COP comparison of the four caloric leading technologies vs vapor compression
• 5.8 Seven emerging manufacturers of caloric cooling
• 5.9 Further reading

6. Enabling technology: Metamaterial and other advanced photonic cooling: emerging materials and devices

• 6.1 Metamaterials
  • 6.1.1 Metamaterial and metasurface basics and thermal metamaterial advances in
  • 6.1.2 The meta-atom, patterning and functional options
  • 6.1.3 SWOT assessment for metamaterials and metasurfaces generally
  • 6.1.4 Metamaterial energy harvesting may power 6G active cooling
  • 6.1.5 Thermal metamaterial with 14 advances in 2025 and
• 6.2 Advanced photonic cooling and prevention of heating

7. Future thermoelectric cooling and thermoelectric harvesting as a user of and power provider for other solid-state cooling

• 7.1 Basics
  • 7.1.1 Operation, examples, SWOT appraisal
  • 7.1.2 Thermoelectric cooling and temperature control applications 2027 and
  • 7.1.3 SWOT appraisal of thermoelectric cooling, temperature control and harvesting
• 7.2 Thermoelectric materials
  • 7.2.1 Requirements
  • 7.2.2 Useful and misleading metrics
  • 7.2.3 Quest for better zT performance which is often the wrong approach
  • 7.2.4 Some alternatives to bismuth telluride being considered
  • 7.2.5 Non-toxic and less toxic thermoelectric materials, some lower cost
  • 7.2.6 Ferron and spin driven thermoelectrics
• 7.3 Wide area and flexible thermoelectric cooling is a gap in the market for you to address
  • 7.3.1 The need and general approaches
  • 7.3.2 Advances in flexible and wide area thermoelectric cooling in 2025 and earlier
  • 7.3.3 Wide area or flexible TEG research 40 examples that may lead to similar TEC
• 7.4 Radiation cooling of buildings: multifunctional with thermoelectric harvesting
• 7.5 The heat removal problem of TEC and TEG – evolving solutions
• 7.6 20 advances in thermoelectric cooling and harvesting involving cooling and a review
• 7.7 Earlier advances
• 7.8 82 Manufactures of Peltier thermoelectric modules and products

8. Future evaporative, melting and flow cooling including heat pipes, thermal hydrogels for 6G smartphones, other 6G client devices, 6G infrastructure

• 8.1 Overview: 6G smartphone vapor cooling and hydrogel cooling for 6G
• 8.2 Background to phase change cooling
• 8.3 Heat pipes and vapor chambers
  • 8.3.1 Definitions and relevance to 6G infrastructure and client devices
  • 8.3.2 Focus of vapor chamber research relevant to 6G success
  • 8.3.3 Research on relevant heat pipes, vapor chambers and allied: 39 advances
  • 8.3.4 Thermal storage heat pipes: nano-enhanced phase change material (NEPCM) for device thermal management
• 8.4 Hydrogels for 6G Communications
  • 8.4.1 Thermal hydrogels: context, ambitions and limitations
  • 8.4.2 Hydrogels cooling suitable for 6G microelectronics and solar panels: Five advances
  • 8.4.3 Thermogalvanic hydrogel for synchronous evaporative cooling
  • 8.4.4 Hydrogels in architectural cooling that can involve 6G functions: advances
  • 8.4.5 Aerogel and hydrogel together for cooling
  • 8.4.6 Other emerging cooling hydrogels for 6G microchips, power electronics, data centers, large batteries, cell towers and buildings

9. Thermal Interface Materials TIM and emerging materials for 6G conductive cooling challenges

• 9.1 Overview: current practice to thermal graphene, tridymite, OPCPM and more for 6G
  • 9.1.1 TIM, heat spreaders from micro to heavy industrial: activity of 17 companies
  • 9.1.2 17 examples of research advances in 2025 and 2024 relevant to 6G transistors up to buildings
  • 9.1.3 Annealed pyrolytic graphite: progress in 2025 and 2024 as microelectronic TIM
  • 9.1.4 Oriented composite phase change material (OCPCM)
  • 9.1.5 Thermally conductive concrete and allied work
• 9.2 Important considerations when solving thermal challenges with conductive materials
  • 9.2.1 Bonding or non-bonding
  • 9.2.2 Varying heat
  • 9.2.3 Electrically conductive or not
  • 9.2.4 Placement
  • 9.2.5 Environmental attack
  • 9.2.6 Choosing a thermal structure
  • 9.2.7 Research on embedded cooling
• 9.3 Thermal Interface Material TIM
  • 9.3.1 General
  • 9.3.2 Seven current options compared against nine parameters
  • 9.3.3 Nine important research advances in 2025 and 2024 relevant to 6G
  • 9.3.4 Thermal pastes compared
  • 9.3.5 TIM and other examples today: Henkel, Momentive, ShinEtsu, Sekisui, Fujitsu, Suzhou Dasen
  • 9.3.6 37 examples of TIM manufacturers
  • 9.3.7 Thermal interface material trends as needs change: graphene, liquid metals etc.
• 9.4 Polymer choices: silicones or carbon-based
  • 9.4.1 Comparison
  • 9.4.2 Silicone parameters, ShinEtsu, patents
  • 9.4.3 SWOT appraisal for silicone thermal conduction materials
• 9.5 Thermally conductive polymer advances in 2025 and earlier
  • 9.5.1 Overview
  • 9.5.2 Examples of companies making thermally conductive additives
  • 9.5.3 Thermally conductive polymers: pie charts of host materials and particulates prioritised in research
  • 9.5.4 Important progress in 2025 and earlier

  10. Advanced heat shielding, thermal insulation and ionogels for 6G

  • 10.1 Overview
  • 10.2 Inorganic, organic and composite thermal insulation for 6G
  • 10.3 Heat shield film and multipurpose thermally insulating windows
  • 10.4 Thermal insulation for heat spreaders and other passive cooling
    • 10.4.1 W.L.Gore enhancing graphite heat spreader performance
    • 10.4.2 Protecting smartphones from heat
    • 10.4.3 20 companies involved in silica aerogel thermal insulation of devices
  • 10.5 Ionogels for 6G applications including electrically conductive thermal insulation
    • 10.5.1 Basics for 6G
    • 10.5.2 Eight ionogel advances in 2025 and 2024

  11. Thermal metamaterials – the big picture

  • 11.1 Purpose of this chapter
    • 11.1.1 General
    • 11.1.2 Types of metamaterial thermal management materials by function
    • 11.1.3 Applications analysed from sensors to surgical robots and spacecraft
    • 11.1.4 Three families of metamaterials overlap
  • 1.2 Thermal metamaterials
    • 11.2.1 Some of the drivers of commercialisation of thermal metamaterials
    • 11.2.2 Cooling toolkit, 7 metamaterial-enabled options in blue text, trend to multifunctionality
    • 11.2.3 Examples of thermal metamaterials in 2025 advances
  • 11.3 Primary conclusions; market positioning
  • 11.4 Primary conclusions: leading formulations, functionality and manufacturing technologies
  • 11.5 Popularity by formulation in 132 examples of latest thermal metamaterial research
  • 11.6 Static to dynamic heat transfer using metamaterials
  • 11.7 Static radiative cooling materials showing metamaterials as one of many options
  • 11.8 Thermal metamaterial and cooling roadmap by market and by technology 2025-2045
  • 11.9 Thermal meta-device market $ billion 2025-2045 by application segment
  • 11.10 Electromagnetic meta-device market $ billion 2025-2045
  • 11.11 Electromagnetic meta-device market $ billion 2025-2045 by application segment
  • 11.12 Meta-device market electromagnetic vs thermal 2025-2045