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LED 및 OLED : 시장 분석과 제조 동향

LED and OLED Lighting: Market Analysis and Manufacturing Trends

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발행일 2021년 03월 상품 코드 105450
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LED 및 OLED : 시장 분석과 제조 동향 LED and OLED Lighting: Market Analysis and Manufacturing Trends
발행일 : 2021년 03월 페이지 정보 : 영문

본 상품은 영문 자료로 한글과 영문목차에 불일치하는 내용이 있을 경우 영문을 우선합니다. 정확한 검토를 위해 영문목차를 참고해주시기 바랍니다.

세계의 LED 및 OLED 시장·산업 동향에 대해 분석했으며, 제품 개요와 제품 기본 구조·생산 방법, 주요 시장 성장 촉진·억제요인, 생산량·시장 규모 동향 전망, 제품 분야별 상세 동향, 정부 지원책, 향후 기술 진보·시장 성장 가능성 등의 정보를 정리하여 전해드립니다.

제1장 서론

제2장 고휘도 LED 기술과 응용에 관한 최근 진보

  • LED : 작동 이론
  • 지적재산(IP) 맵
  • LED 제조 기술과 비용
  • 일반조명용 LED 시장

제3장 가공 설비

  • 서론
  • 증착
    • 고체조명(SSL)용 유기금속화학증착(MOCVD) : 생산성 과제와 해결책
    • 저온 원격플라즈마화학증착(RPCVD)
  • CMP(Chemical Mechanical Planarization)
  • 결함 검사 및 시험
  • 리소그래피
    • 스테퍼

제4장 구조 재료

  • 서론
  • 발광용 GaN 기반 LED
    • 백색 LED의 효율 개선 수단
    • LED 기판 : 상품화까지 필요로 하는 시간
  • LED 형광물질 제조 과제
    • LED 형광물질의 현재 제조 공정
    • LED 형광물질의 비용

제5장 고휘도 LED 패키징 및 조립시 과제

  • 고휘도 LED(HB LED)용 패키징
    • 본딩(접속)
    • 다이/볼 본딩
    • 스크라이빙
  • 웨이퍼 레벨 패키징 : HB LED
  • 열 문제
  • 시험 및 검사

제6장 기술 혁신 촉진요인으로서의 정부 프로그램

  • DoE(미국에너지국) : SSL 제조업용 지원 정책
  • DoE : SSL 지원 계획의 사명과 목표
  • LED 관련 주요 정부 연구 프로그램
  • SSL 제조업이 직면하고 있는 과제

제7장 OLED 조명

  • 조명 제조업체의 기회
  • OLED 작동법
  • OLED 조명과 OLED 디스플레이의 차이
  • OLED 조명 기술의 이점
  • OLED 성능 지표

제8장 OLED 제조 공정

  • OLED 조명용 증착 장비 및 공정
    • 진공 증착/진공열 증착(VTE)
    • 유기 증착(OVPD)
    • 잉크젯 인쇄
    • R2R(Roll-to-Roll)
  • 범용 OLED 제조 비용에 관한 고려사항
  • 리소그래피
  • 기판과 캡슐화
    • 기판 및 캡슐화용 재료의 선택
    • 기판 코팅
    • 투명 전극
    • 캡슐화
  • 검사 및 품질 관리

제9장 세계의 OLED 시장 전망

  • 서론
  • 패시브 매트릭스(단순 매트릭스) 방식 : 생산능력과 수요량
  • 액티브 매트릭스 방식 : 생산능력과 수요량
  • OLED 조명의 비용 과제

제10장 세계의 고휘도 LED(HB LED) 시장 전망

  • HB LED 기술
  • HB LED 시장 : 개요와 동향
    • SSL 시장 성장 촉진요인
    • 노트북 PC용 LED 백라이트
    • LCD TV용 LED 백라이트
    • 기타 용도용 LED 백라이트
    • LED 조명 시장
    • 옥외용 LED 액티브 디스플레이 시장
    • LED 신호등 시장
    • 자동차용 LED 시장
    • 휴대폰용 LED 시장
KSM 20.04.22

List of Tables

  • 2.1. Color, Wavelength Material Of LED
  • 2.2. Light Source Comparison
  • 2.3. Comparison of LED, HB-LED, UHB-LED Characteristics
  • 3.1. Epitaxy Metrics from Initial Solid-State Lighting Manufacturing R&D Roadmap
  • 3.2. Process Control Metrics
  • 4.1. Production Method for Various LEDs
  • 4.2. LED Cost Model: Impact of Substrate Choice
  • 4.3. Comparison of $/klm for LED Made on Various 2" Substrates
  • 5.1. Properties of Die Bonding Processes
  • 7.1. Efficiency of Emitter Materials
  • 7.2. Status of Technology Towards Lighting Targets
  • 7.3. Cost Targets for Panels
  • 7.4. Cost Comparison OLED Display vs Lighting
  • 8.1. Cost Targets for Panels Produced by Traditional Methods
  • 10.1. Forecast of LED Backlights for Notebook PCs
  • 10.2. Forecast of LED Backlights for LCD TVs
  • 10.3. Forecast of LED Backlights for Other Application
  • 10.4. Forecast of LED Lighting Market
  • 10.5. Forecast of LED Active Outdoor Display Market
  • 10.6. Forecast of LED Signal Market
  • 10.7. Forecast of LED Automotive Market
  • 10.8. Forecast of LED Mobile Market
  • 10.9. Top 10 LED Vendors

List of Figures

  • 2.1. Operation of LED
  • 2.2. Key Intellectual Property Relationships
  • 2.3. DOE Roadmap
  • 2.4. Relative Manufacturing Costs
  • 2.5. Pareto Analysis Of SSL Manufacturing Costs
  • 2.6. Market drivers for LED Biz and Applications
  • 2.7. SSL vs. Classical Technologies
  • 2.8. LED Performance vs. Traditional Light Sources
  • 2.9. Energy Production and Use Comparison
  • 2.10. Worldwide LED Market Forecast
  • 3.1. SSL - LED manufacturing with MOCVD: productivity and Cost Analysis
  • 3.2. Larger Wafer Size: GaN LEDs
  • 3.3. Global Shipments of MOCVD Tools By Vendor
  • 3.4. Global Shipments of MOCVD Tools By Region
  • 3.5. Diagram of RPCVD Reactor
  • 3.6. Comparison between MOCVD and RPCVD
  • 3.7. CMP Process
  • 3.8. Nanoimprint Lithography System
  • 3.9. The Phlatlight Chip
  • 4.1. Regular LED (white) Front-End Steps
  • 4.2. Current Blocking Layer
  • 4.3. Regular LED (white) Production Costs for 100k wafers/year
  • 4.4. HB LED (white) Production Costs for 100k wafers/year
  • 4.5. Main Manufacturing Steps for GaN-based LED
  • 4.6. Regular LED (white) Back-End
  • 4.7. Methods to Improve White LED Efficiency
  • 4.8. Phosphor Coating - Four Approaches
  • 5.1. Hybrid Integration Approach to HD-LED Package
  • 5.2. Chain Wire Bond
  • 5.3. HB-LED with Silicon Carrier Submount
  • 5.4. Silicon interposer for MEMS / LED Applications
  • 5.5. High Brightness LED
  • 5.6. SMD Package Cost Structure
  • 5.7. Packaging Changes Result in Optical Improvements
  • 5.8. Substrate Solutions for HB/HP LEDs
  • 6.1. DOE Solid-State Lighting Program Strategy
  • 6.2. DOE Efficacy Targets
  • 6.3. Congressional Appropriations
  • 6.4. SSL R&D Project Funding
  • 6.5. Price Targets
  • 7.1. OLED Lighting Stack
  • 8.1. Schematic of VTE Deposition System
  • 8.2. Schematic of OVPD Deposition System
  • 8.3. Comparison Between VTE and OVPD Technology
  • 8.4. Schematic of Inkjet Deposition System
  • 8.5. Schematic of R2R Deposition System
  • 8.6. Illustration of Planarization Layer on OLED
  • 9.1. Schematic of PMOLED
  • 9.2. PMOLED Stack/Driving Architecture
  • 9.3. Schematic of AMOLED
  • 9.4. Passive Matrix OLED Capacity and Demand
  • 9.5. Active Matrix OLED Capacity and Demand
  • 10.1. LED Market by Sector
  • 10.2. Worldwide LED Market Forecast

The High Brightness Light Emitting Diode (HB LED) market is exploding as unit shipments continue their upward growth. LEDs are creating a niche market for conventional suppliers of semiconductor processing tools. Markets for HB LEDs, backlight LEDs, and OLEDs are forecast.

Table of Contents

Chapter 1: Introduction

Chapter 2: Recent Progress in High Brightness LED Technology and Applications

  • 2.1. LED: Theory of Operation
  • 2.2. Intellectual Property Map
  • 2.3. LED Manufacturing Technologies & Costs
  • 2.4. LED Market General Illumination

Chapter 3: Processing Equipment

  • 3.1. Introduction
  • 3.2. Deposition
    • 3.2.1. MOCVD for SSL - Productivity Challenges and Solutions
    • 3.2.2. Low temperature Remote Plasma Chemical Vapor Deposition (RPCVD)
  • 3.3. Chemical Mechanical Planarization
  • 3.4. Defect Inspection and Testing
  • 3.5. Lithography
    • 3.5.1. Steppers

Chapter 4: Materials of Construction

  • 4.1. Introduction
  • 4.2. GaN-based LED for General Lighting
    • 4.2.1. Methods to Improve White LED Efficiency
    • 4.2.2. Time-to-Market for LED substrates
  • 4.3. LED Phosphor Manufacturing Issues
    • 4.3.1. Current LED Phosphor Manufacturing
    • 4.3.2. LED Phosphor Cost

Chapter 5: Packaging and Assembly Issues for High Brightness LEDs

  • 5.1. Packaging for HB LEDs
    • 5.1.1. Bonding
    • 5.1.2. Die/Ball Bonding
    • 5.1.3. Scribing
  • 5.2. Wafer Level Packaging HB LEDs
  • 5.3. Thermal Issues
  • 5.4. Test and Inspection

Chapter 6: National Programs As Innovation Drivers

  • 6.1. DOE Solid-State Lighting Manufacturing Initiative
  • 6.2. DOE Solid-State Lighting Program Mission and Goal
  • 6.3. Major National Research Programs Pertaining to LEDs
  • 6.4. Challenges Facing SSL Manufacturing

Chapter 7: OLED Lighting

  • 7.1. Opportunities for Luminaire Manufacturers
  • 7.2. How Does an OLED Work
  • 7.3. Differences Between OLED Lighting and OLED Display
  • 7.4. Benefits of OLED Lighting Technology
  • 7.5. OLED Performance Metrics

Chapter 8: OLED Manufacturing

  • 8.1. Deposition Equipment and Processes for OLED Lighting
    • 8.1.1. Vacuum Deposition Or Vacuum Thermal Evaporation (VTE)
    • 8.1.2. Organic Vapor Deposition (OVPD)
    • 8.1.3. Inkjet Printing
    • 8.1.4. Roll-to-Roll (R2R)
  • 8.2. General OLED Manufacturing Cost Considerations
  • 8.3. Lithography
  • 8.4. Substrates and Encapsulation
    • 8.4.1. Substrate and Encapsulation Material Selection
    • 8.4.2. Substrate Coatings
    • 8.4.3. Transparent Electrodes
    • 8.4.4. Encapsulation
  • 8.5. Inspection and Quality Control

Chapter 9: Outlook for the Worldwide OLED Market

  • 9.1. Introduction
  • 9.2. Passive Matrix Capacity and Demand
  • 9.3. Active Matrix Capacity and Demand
  • 9.4. Cost Challenges for OLED Lighting

Chapter 10: Outlook for the Worldwide High-Brightness LED Market

  • 10.1. HB LED Technology
  • 10.2. HB LED Market Overview and trends
    • 10.2.1. Market Drivers for SSL
    • 10.2.2. LED Backlights for Notebook PCs
    • 10.2.3. LED Backlights for LCD TVs
    • 10.2.4. LED Backlights for Other Applications
    • 10.2.5. LED Lighting Market
    • 10.2.6. LED Active Outdoor Display Market
    • 10.2.7. LED Signal Market
    • 10.2.8. LED Automotive Market
    • 10.2.9. LED Mobile Market
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