세계의 RF 프론트엔드 모듈 시장 보고서 : 구성 요소, 응용 분야, 지역별(2024-2032년)

The global RF front end module market size reached US$ 22.9 Billion in 2023. Looking forward, IMARC Group expects the market to reach US$ 62.3 Billion by 2032, exhibiting a growth rate (CAGR) of 11.4% during 2024-2032.

A radio frequency (RF) front end module refers to a device panel that combines all circuits between the antenna and the receiver. It consists of an RF filter, amplifier, local oscillator, mixer and multiple switches. It is commonly used to minimize the image response and prevent strong out-of-band signals from saturating the input stages. The module is also used for switching between the radio signal and baseband frequency in wireless systems and frequency modulation (FM) radios to encode/decode the signals during transmission. Thus, it is widely used in the manufacturing of consumer electronics, automobiles, military equipment and wireless communication tools, such as in-home devices, smart thermostats, wearables, internet of things (IoT) devices, smart lighting, sensors and range extenders.

Rapid digitalization, along with growing industrial automation, especially in developing economies, represents one of the key factors creating a positive outlook for the market. Furthermore, with the increasing use of social networking platforms and IoT devices, there is a substantial rise in the traffic generated from data-intensive industries, such as banking, financial services and insurance (BFSI). This has enhanced the consumer preference for smart devices equipped with innovative RF front end modules, which, in turn, is contributing to the market growth. Additionally, various technological advancements, such as the development of silicon-on-insulator (SOI) substrates, are acting as other growth-inducing factors. RF-SOI substrates support the functioning of 3G, 4G/LTE and future network requirements to enable faster and reliable data transmission. Other factors, including the commercialization of 5G technology, along with significant improvements in the information technology (IT) infrastructure, are anticipated to drive the market further.

Key Market Segmentation:

IMARC Group provides an analysis of the key trends in each sub-segment of the global RF front end module market report, along with forecasts at the global, regional and country level from 2024-2032. Our report has categorized the market based on component and application.

Breakup by Component:

RF Filters

RF Switches

RF Power Amplifiers

Others

Breakup by Application:

Consumer Electronics

Automotive

Wireless Communication

Others

Breakup by Region:

North America

United States

Canada

Asia Pacific

China

Japan

India

South Korea

Australia

Indonesia

Others

Europe

Germany

France

United Kingdom

Italy

Spain

Russia

Others

Latin America

Brazil

Mexico

Others

Middle East and Africa

Competitive Landscape:

The report has also analysed the competitive landscape of the market with some of the key players being Broadcom Inc., Infineon Technologies AG, Murata Manufacturing Co. Ltd., NXP Semiconductors N.V., Qorvo Inc., Skyworks Solutions Inc., STMicroelectronics N.V., Taiyo Yuden Co. Ltd., TDK Corporation, Teradyne Inc. and Texas Instruments Incorporated.

Key Questions Answered in This Report

• 1. What was the size of the global RF front end module market in 2023?
• 2. What is the expected growth rate of the global RF front end module market during 2024-2032?
• 3. What are the key factors driving the global RF front end module market?
• 4. What has been the impact of COVID-19 on the global RF front end module market?
• 5. What is the breakup of the global RF front end module market based on the component?
• 6. What are the key regions in the global RF front end module market?
• 7. Who are the key players/companies in the global RF front end module market?

Table of Contents

1 Preface

2 Scope and Methodology

• 2.1 Objectives of the Study
• 2.2 Stakeholders
• 2.3 Data Sources
  • 2.3.1 Primary Sources
  • 2.3.2 Secondary Sources
• 2.4 Market Estimation
  • 2.4.1 Bottom-Up Approach
  • 2.4.2 Top-Down Approach
• 2.5 Forecasting Methodology

3 Executive Summary

4 Introduction

• 4.1 Overview
• 4.2 Key Industry Trends

5 Global RF Front End Module Market

• 5.1 Market Overview
• 5.2 Market Performance
• 5.3 Impact of COVID-19
• 5.4 Market Forecast

6 Market Breakup by Component

• 6.1 RF Filters
  • 6.1.1 Market Trends
  • 6.1.2 Market Forecast
• 6.2 RF Switches
  • 6.2.1 Market Trends
  • 6.2.2 Market Forecast
• 6.3 RF Power Amplifiers
  • 6.3.1 Market Trends
  • 6.3.2 Market Forecast
• 6.4 Others
  • 6.4.1 Market Trends
  • 6.4.2 Market Forecast

7 Market Breakup by Application

• 7.1 Consumer Electronics
  • 7.1.1 Market Trends
  • 7.1.2 Market Forecast
• 7.2 Automotive
  • 7.2.1 Market Trends
  • 7.2.2 Market Forecast
• 7.3 Wireless Communication
  • 7.3.1 Market Trends
  • 7.3.2 Market Forecast
• 7.4 Others
  • 7.4.1 Market Trends
  • 7.4.2 Market Forecast

8 Market Breakup by Region

• 8.1 North America
  • 8.1.1 United States
    • 8.1.1.1 Market Trends
    • 8.1.1.2 Market Forecast
  • 8.1.2 Canada
    • 8.1.2.1 Market Trends
    • 8.1.2.2 Market Forecast
• 8.2 Asia Pacific
  • 8.2.1 China
    • 8.2.1.1 Market Trends
    • 8.2.1.2 Market Forecast
  • 8.2.2 Japan
    • 8.2.2.1 Market Trends
    • 8.2.2.2 Market Forecast
  • 8.2.3 India
    • 8.2.3.1 Market Trends
    • 8.2.3.2 Market Forecast
  • 8.2.4 South Korea
    • 8.2.4.1 Market Trends
    • 8.2.4.2 Market Forecast
  • 8.2.5 Australia
    • 8.2.5.1 Market Trends
    • 8.2.5.2 Market Forecast
  • 8.2.6 Indonesia
    • 8.2.6.1 Market Trends
    • 8.2.6.2 Market Forecast
  • 8.2.7 Others
    • 8.2.7.1 Market Trends
    • 8.2.7.2 Market Forecast
• 8.3 Europe
  • 8.3.1 Germany
    • 8.3.1.1 Market Trends
    • 8.3.1.2 Market Forecast
  • 8.3.2 France
    • 8.3.2.1 Market Trends
    • 8.3.2.2 Market Forecast
  • 8.3.3 United Kingdom
    • 8.3.3.1 Market Trends
    • 8.3.3.2 Market Forecast
  • 8.3.4 Italy
    • 8.3.4.1 Market Trends
    • 8.3.4.2 Market Forecast
  • 8.3.5 Spain
    • 8.3.5.1 Market Trends
    • 8.3.5.2 Market Forecast
  • 8.3.6 Russia
    • 8.3.6.1 Market Trends
    • 8.3.6.2 Market Forecast
  • 8.3.7 Others
    • 8.3.7.1 Market Trends
    • 8.3.7.2 Market Forecast
• 8.4 Latin America
  • 8.4.1 Brazil
    • 8.4.1.1 Market Trends
    • 8.4.1.2 Market Forecast
  • 8.4.2 Mexico
    • 8.4.2.1 Market Trends
    • 8.4.2.2 Market Forecast
  • 8.4.3 Others
    • 8.4.3.1 Market Trends
    • 8.4.3.2 Market Forecast
• 8.5 Middle East and Africa
  • 8.5.1 Market Trends
  • 8.5.2 Market Breakup by Country
  • 8.5.3 Market Forecast

9 SWOT Analysis

• 9.1 Overview
• 9.2 Strengths
• 9.3 Weaknesses
• 9.4 Opportunities
• 9.5 Threats

10 Value Chain Analysis

11 Porters Five Forces Analysis

• 11.1 Overview
• 11.2 Bargaining Power of Buyers
• 11.3 Bargaining Power of Suppliers
• 11.4 Degree of Competition
• 11.5 Threat of New Entrants
• 11.6 Threat of Substitutes

12 Price Analysis

13 Competitive Landscape

• 13.1 Market Structure
• 13.2 Key Players
• 13.3 Profiles of Key Players
  • 13.3.1 Broadcom Inc.
    • 13.3.1.1 Company Overview
    • 13.3.1.2 Product Portfolio
    • 13.3.1.3 Financials
    • 13.3.1.4 SWOT Analysis
  • 13.3.2 Infineon Technologies AG
    • 13.3.2.1 Company Overview
    • 13.3.2.2 Product Portfolio
    • 13.3.2.3 Financials
    • 13.3.2.4 SWOT Analysis
  • 13.3.3 Murata Manufacturing Co. Ltd.
    • 13.3.3.1 Company Overview
    • 13.3.3.2 Product Portfolio
    • 13.3.3.3 Financials
    • 13.3.3.4 SWOT Analysis
  • 13.3.4 NXP Semiconductors N.V.
    • 13.3.4.1 Company Overview
    • 13.3.4.2 Product Portfolio
    • 13.3.4.3 Financials
    • 13.3.4.4 SWOT Analysis
  • 13.3.5 Qorvo Inc.
    • 13.3.5.1 Company Overview
    • 13.3.5.2 Product Portfolio
    • 13.3.5.3 Financials
    • 13.3.5.4 SWOT Analysis
  • 13.3.6 Skyworks Solutions Inc.
    • 13.3.6.1 Company Overview
    • 13.3.6.2 Product Portfolio
    • 13.3.6.3 Financials
    • 13.3.6.4 SWOT Analysis
  • 13.3.7 STMicroelectronics N.V.
    • 13.3.7.1 Company Overview
    • 13.3.7.2 Product Portfolio
    • 13.3.7.3 Financials
  • 13.3.8 Taiyo Yuden Co. Ltd
    • 13.3.8.1 Company Overview
    • 13.3.8.2 Product Portfolio
    • 13.3.8.3 Financials
  • 13.3.9 TDK Corporation
    • 13.3.9.1 Company Overview
    • 13.3.9.2 Product Portfolio
    • 13.3.9.3 Financials
    • 13.3.9.4 SWOT Analysis
  • 13.3.10 Teradyne Inc.
    • 13.3.10.1 Company Overview
    • 13.3.10.2 Product Portfolio
    • 13.3.10.3 Financials
    • 13.3.10.4 SWOT Analysis
  • 13.3.11 Texas Instruments Incorporated
    • 13.3.11.1 Company Overview
    • 13.3.11.2 Product Portfolio
    • 13.3.11.3 Financials
    • 13.3.11.4 SWOT Analysis