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Passive Electronic Components Market Report by Type (Capacitor, Inductor, Resistor), End Use Industry (Aerospace and Defense, Consumer Electronics, Information Technology, Automotive, Industrial, and Others), and Region 2024-2032

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    • Eaton Corporation PLC
    • KOA Corporation
    • Kyocera Corporation
    • Murata Manufacturing Co. Ltd.
    • Panasonic Corporation
    • Samsung Electro-Mechanics Co. Ltd.
    • Taiyo Yuden Co. Ltd.
    • TDK Corporation
    • TE Connectivity
    • TT Electronics Plc
    • Vishay Intertechnology Inc.
    • Yageo Corporation
BJH 24.08.22

The global passive electronic components market size reached US$ 38.3 Billion in 2023. Looking forward, IMARC Group expects the market to reach US$ 55.6 Billion by 2032, exhibiting a growth rate (CAGR) of 4.1% during 2024-2032.

Passive electronic components refer to electrical parts that do not generate power and are incapable of power gain. They consist of capacitors, resistors, transformers, inductors and coils. They are manufactured using tantalum, ceramic, aluminum electrolytic, paper and plastic films. Passive electronic components absorb energy and do not require electrical power to operate. They are commonly used in various electronic devices, such as computers, home appliances, smartphones and gaming consoles. They are reliable, easy to design, cost-effective and can easily handle large voltage currents and power without the requirement of a power supply and amplifying elements. As a result, passive electronic components are widely used across medical, automotive, aerospace, energy, telecommunications, defense, and data storage industries.

Passive Electronic Components Market Trends:

Significant growth in the automotive industry across the globe is creating a positive outlook for the market. Passive electronic components are widely used in specialized and high-performing components, such as emergency brake assistance systems and infotainment. In line with this, the increasing demand for electric vehicles (EVs) due to environmental and emission concerns is favoring the market growth. Additionally, various new product innovations, such as the introduction of wire wound and metal oxide high-power resistors that assists in monitoring circuits and diagnosing and testing sensors, are providing an impetus to the market growth. Furthermore, the growing miniaturization of passive electrical components that can easily be used in consumer electronics, such as smartphones, cameras and speakers, is positively impacting the market growth. Apart from this, the widespread product utilization in medical devices integrated with sensors to collect data about patients, extensive research and development (RD&D) activities and the introduction of various shapes and geometries of inductors are anticipated to drive the market toward growth.

Key Market Segmentation:

IMARC Group provides an analysis of the key trends in each sub-segment of the global passive electronic components market report, along with forecasts at the global, regional and country level from 2024-2032. Our report has categorized the market based on type and end use industry.

Breakup by Type:

Capacitor

Ceramic Capacitors

Tantalum Capacitors

Aluminum Electrolytic Capacitors

Paper and Plastic Film Capacitors

Supercapacitors

Inductor

Power

Frequency

Resistor

Surface-mounted Chips

Network

Wirewound

Film/Oxide/Foil

Carbon

Breakup by End Use Industry:

Aerospace and Defense

Consumer Electronics

Information Technology

Automotive

Industrial

Others

Breakup by Region:

North America

United States

Canada

Asia-Pacific

China

Japan

India

South Korea

Australia

Indonesia

Others

Europe

Germany

France

United Kingdom

Italy

Spain

Russia

Others

Latin America

Brazil

Mexico

Others

Middle East and Africa

Competitive Landscape:

The competitive landscape of the industry has also been examined along with the profiles of the key players being Eaton Corporation PLC, KOA Corporation, Kyocera Corporation, Murata Manufacturing Co. Ltd., Panasonic Corporation, Samsung Electro-Mechanics Co. Ltd., Taiyo Yuden Co. Ltd., TDK Corporation, TE Connectivity, TT Electronics Plc, Vishay Intertechnology Inc. and Yageo Corporation.

Key Questions Answered in This Report

  • 1. What was the size of the global passive electronic components market in 2023?
  • 2. What is the expected growth rate of the global passive electronic components market during 2024-2032?
  • 3. What are the key factors driving the global passive electronic components market?
  • 4. What has been the impact of COVID-19 on the global passive electronic components market?
  • 5. What is the breakup of the global passive electronic components market based on the type?
  • 6. What is the breakup of the global passive electronic components market based on the end use industry?
  • 7. What are the key regions in the global passive electronic components market?
  • 8. Who are the key players/companies in the global passive electronic components market?

Table of Contents

1 Preface

2 Scope and Methodology

  • 2.1 Objectives of the Study
  • 2.2 Stakeholders
  • 2.3 Data Sources
    • 2.3.1 Primary Sources
    • 2.3.2 Secondary Sources
  • 2.4 Market Estimation
    • 2.4.1 Bottom-Up Approach
    • 2.4.2 Top-Down Approach
  • 2.5 Forecasting Methodology

3 Executive Summary

4 Introduction

  • 4.1 Overview
  • 4.2 Key Industry Trends

5 Global Passive Electronic Components Market

  • 5.1 Market Overview
  • 5.2 Market Performance
  • 5.3 Impact of COVID-19
  • 5.4 Market Forecast

6 Market Breakup by Type

  • 6.1 Capacitor
    • 6.1.1 Market Trends
    • 6.1.2 Key Segments
      • 6.1.2.1 Ceramic Capacitors
      • 6.1.2.2 Tantalum Capacitors
      • 6.1.2.3 Aluminum Electrolytic Capacitors
      • 6.1.2.4 Paper and Plastic Film Capacitors
      • 6.1.2.5 Supercapacitors
    • 6.1.3 Market Forecast
  • 6.2 Inductor
    • 6.2.1 Market Trends
    • 6.2.2 Key Segments
      • 6.2.2.1 Power
      • 6.2.2.2 Frequency
    • 6.2.3 Market Forecast
  • 6.3 Resistor
    • 6.3.1 Market Trends
    • 6.3.2 Key Segments
      • 6.3.2.1 Surface-mounted Chips
      • 6.3.2.2 Network
      • 6.3.2.3 Wirewound
      • 6.3.2.4 Film/Oxide/Foil
      • 6.3.2.5 Carbon
    • 6.3.3 Market Forecast

7 Market Breakup by End Use Industry

  • 7.1 Aerospace and Defense
    • 7.1.1 Market Trends
    • 7.1.2 Market Forecast
  • 7.2 Consumer Electronics
    • 7.2.1 Market Trends
    • 7.2.2 Market Forecast
  • 7.3 Information Technology
    • 7.3.1 Market Trends
    • 7.3.2 Market Forecast
  • 7.4 Automotive
    • 7.4.1 Market Trends
    • 7.4.2 Market Forecast
  • 7.5 Industrial
    • 7.5.1 Market Trends
    • 7.5.2 Market Forecast
  • 7.6 Others
    • 7.6.1 Market Trends
    • 7.6.2 Market Forecast

8 Market Breakup by Region

  • 8.1 North America
    • 8.1.1 United States
      • 8.1.1.1 Market Trends
      • 8.1.1.2 Market Forecast
    • 8.1.2 Canada
      • 8.1.2.1 Market Trends
      • 8.1.2.2 Market Forecast
  • 8.2 Asia-Pacific
    • 8.2.1 China
      • 8.2.1.1 Market Trends
      • 8.2.1.2 Market Forecast
    • 8.2.2 Japan
      • 8.2.2.1 Market Trends
      • 8.2.2.2 Market Forecast
    • 8.2.3 India
      • 8.2.3.1 Market Trends
      • 8.2.3.2 Market Forecast
    • 8.2.4 South Korea
      • 8.2.4.1 Market Trends
      • 8.2.4.2 Market Forecast
    • 8.2.5 Australia
      • 8.2.5.1 Market Trends
      • 8.2.5.2 Market Forecast
    • 8.2.6 Indonesia
      • 8.2.6.1 Market Trends
      • 8.2.6.2 Market Forecast
    • 8.2.7 Others
      • 8.2.7.1 Market Trends
      • 8.2.7.2 Market Forecast
  • 8.3 Europe
    • 8.3.1 Germany
      • 8.3.1.1 Market Trends
      • 8.3.1.2 Market Forecast
    • 8.3.2 France
      • 8.3.2.1 Market Trends
      • 8.3.2.2 Market Forecast
    • 8.3.3 United Kingdom
      • 8.3.3.1 Market Trends
      • 8.3.3.2 Market Forecast
    • 8.3.4 Italy
      • 8.3.4.1 Market Trends
      • 8.3.4.2 Market Forecast
    • 8.3.5 Spain
      • 8.3.5.1 Market Trends
      • 8.3.5.2 Market Forecast
    • 8.3.6 Russia
      • 8.3.6.1 Market Trends
      • 8.3.6.2 Market Forecast
    • 8.3.7 Others
      • 8.3.7.1 Market Trends
      • 8.3.7.2 Market Forecast
  • 8.4 Latin America
    • 8.4.1 Brazil
      • 8.4.1.1 Market Trends
      • 8.4.1.2 Market Forecast
    • 8.4.2 Mexico
      • 8.4.2.1 Market Trends
      • 8.4.2.2 Market Forecast
    • 8.4.3 Others
      • 8.4.3.1 Market Trends
      • 8.4.3.2 Market Forecast
  • 8.5 Middle East and Africa
    • 8.5.1 Market Trends
    • 8.5.2 Market Breakup by Country
    • 8.5.3 Market Forecast

9 SWOT Analysis

  • 9.1 Overview
  • 9.2 Strengths
  • 9.3 Weaknesses
  • 9.4 Opportunities
  • 9.5 Threats

10 Value Chain Analysis

11 Porters Five Forces Analysis

  • 11.1 Overview
  • 11.2 Bargaining Power of Buyers
  • 11.3 Bargaining Power of Suppliers
  • 11.4 Degree of Competition
  • 11.5 Threat of New Entrants
  • 11.6 Threat of Substitutes

12 Price Analysis

13 Competitive Landscape

  • 13.1 Market Structure
  • 13.2 Key Players
  • 13.3 Profiles of Key Players
    • 13.3.1 Eaton Corporation PLC
      • 13.3.1.1 Company Overview
      • 13.3.1.2 Product Portfolio
      • 13.3.1.3 Financials
      • 13.3.1.4 SWOT Analysis
    • 13.3.2 KOA Corporation
      • 13.3.2.1 Company Overview
      • 13.3.2.2 Product Portfolio
      • 13.3.2.3 Financials
    • 13.3.3 Kyocera Corporation
      • 13.3.3.1 Company Overview
      • 13.3.3.2 Product Portfolio
      • 13.3.3.3 Financials
      • 13.3.3.4 SWOT Analysis
    • 13.3.4 Murata Manufacturing Co. Ltd.
      • 13.3.4.1 Company Overview
      • 13.3.4.2 Product Portfolio
      • 13.3.4.3 Financials
      • 13.3.4.4 SWOT Analysis
    • 13.3.5 Panasonic Corporation
      • 13.3.5.1 Company Overview
      • 13.3.5.2 Product Portfolio
      • 13.3.5.3 Financials
      • 13.3.5.4 SWOT Analysis
    • 13.3.6 Samsung Electro-Mechanics Co. Ltd.
      • 13.3.6.1 Company Overview
      • 13.3.6.2 Product Portfolio
      • 13.3.6.3 Financials
      • 13.3.6.4 SWOT Analysis
    • 13.3.7 Taiyo Yuden Co. Ltd.
      • 13.3.7.1 Company Overview
      • 13.3.7.2 Product Portfolio
      • 13.3.7.3 Financials
    • 13.3.8 TDK Corporation
      • 13.3.8.1 Company Overview
      • 13.3.8.2 Product Portfolio
      • 13.3.8.3 Financials
      • 13.3.8.4 SWOT Analysis
    • 13.3.9 TE Connectivity
      • 13.3.9.1 Company Overview
      • 13.3.9.2 Product Portfolio
      • 13.3.9.3 Financials
      • 13.3.9.4 SWOT Analysis
    • 13.3.10 TT Electronics Plc
      • 13.3.10.1 Company Overview
      • 13.3.10.2 Product Portfolio
      • 13.3.10.3 Financials
    • 13.3.11 Vishay Intertechnology Inc.
      • 13.3.11.1 Company Overview
      • 13.3.11.2 Product Portfolio
      • 13.3.11.3 Financials
      • 13.3.11.4 SWOT Analysis
    • 13.3.12 Yageo Corporation
      • 13.3.12.1 Company Overview
      • 13.3.12.2 Product Portfolio
      • 13.3.12.3 Financials
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