세계의 반도체 유전체 에칭 장비 시장 보고서 : 유형별, 용도별, 지역별(2025-2033년)

The global semiconductor dielectric etching equipment market size reached USD 1.3 Billion in 2024. Looking forward, IMARC Group expects the market to reach USD 1.8 Billion by 2033, exhibiting a growth rate (CAGR) of 3.09% during 2025-2033. The significant expansion in the electronics industry, the rising demand for semiconductors, and the increasing penetration of smart devices represent some of the key factors driving the market.

Semiconductor dielectric etching equipment (SDEE) refers to specialized apparatus that is employed to polish and remove various dielectric substances, such as photo-resist mask, silicon oxide, and silicon nitride, during the semiconductor manufacturing procedure. It includes wet and dry etching equipment, which is used with numerous chemicals. In some instances, carbon monoxide is also utilized in the dielectric etching procedure due to higher profile control. These products help carve out varying physical features, including high aspect ratio (HAR), deep trenches, and large cavities. SDEE offers more precision during operations, automates processes, reduces work hazards, and is easier to dispose.

Semiconductor Dielectric Etching Equipment Market Trends:

The significant expansion in the electronics sector and the increasing purchase of various high-performance consumer electronic products, such as smartphones, tablets, and desktops, represent a major factor driving the market toward growth. This can be further attributed to the ongoing trend of miniaturizing semiconductor circuits, which is facilitating the demand for dielectric etching equipment. Additionally, the recent industrial automation across the globe has prompted original equipment manufacturers (OEMs) to widely use the product to fabricate flat panel display screens and not-and (NAND) flash memory, which is acting as another growth-inducing factor. In line with this, significant technological advancements, such as the developments in the dielectric etching equipment capabilities to optimize the semiconductor production operations, are supporting the market growth. Moreover, the large-scale integration of machine learning (ML), artificial intelligence (AI) capabilities, Internet of Things (IoT), and automotive sensors to offer more precision is favoring the market growth. Furthermore, the continuous development of autonomous vehicles has further intensified the usage of semiconductors in vehicles, which is propelling the market growth. The market is also being driven by the widespread adoption of fin-shaped field effect transistor (FinFET) architecture. Since FinFET design uses dielectric etching as one of the major etching steps in its designing process, this is expected to facilitate the demand for semiconductor dielectric etching equipment. Other factors, such as the recent mergers and acquisitions (M&A) amongst key players, recent innovations to introduce more effective product variants, and extensive research and development (R&D) activities, are creating a positive outlook for the market.

Key Market Segmentation:

Type Insights:

• Wet Etching Equipment
• Dry Etching Equipment
• The report has also provided a detailed breakup and analysis of the semiconductor dielectric etching equipment market based on the type. This includes wet and dry etching equipment. According to the report, dry etching equipment represented the largest segment.

Application Insights:

• Foundries
• Integrated Device Manufacturers (IDMs)

Regional Insights:

• North America
• United States
• Canada
• Asia Pacific
• China
• Japan
• India
• South Korea
• Australia
• Indonesia
• Others
• Europe
• Germany
• France
• United Kingdom
• Italy
• Spain
• Russia
• Others
• Latin America
• Brazil
• Mexico
• Others
• Middle East and Africa
• The report has also provided a comprehensive analysis of all the major regional markets that include North America (the United States and Canada); Asia Pacific (China, Japan, India, South Korea, Australia, Indonesia, and others); Europe (Germany, France, the United Kingdom, Italy, Spain, Russia, and others); Latin America (Brazil, Mexico, and others); and the Middle East and Africa. According to the report, Asia Pacific was the largest market for semiconductor dielectric etching equipment. Some of the factors driving the Asia Pacific semiconductor dielectric etching equipment market included extensive research and development (R&D) activities, the increasing demand for smart devices, and significant technological advancements.

Competitive Landscape:

• The report has also provided a comprehensive analysis of the competitive landscape in the global semiconductor dielectric etching equipment market. Detailed profiles of all major companies have also been provided. Some of the companies covered include Advanced Micro-Fabrication Equipment Inc. China, Applied Materials Inc., Hitachi High-Technologies Corporation (Hitachi Ltd), Lam Research Corporation, Mattson Technology, Oxford Instruments, SPTS Technologies Ltd. (KLA Corporation), Tokyo Electron Limited, etc.

Key Questions Answered in This Report:

• How has the global semiconductor dielectric etching equipment market performed so far and how will it perform in the coming years?
• What are the drivers, restraints, and opportunities in the global semiconductor dielectric etching equipment market?
• What are the key regional markets?
• Which countries represent the most attractive semiconductor dielectric etching equipment market?
• What is the breakup of the market based on the type?
• What is the breakup of the market based on the application?
• What is the competitive structure of the global semiconductor dielectric etching equipment market?
• Who are the key players/companies in the global semiconductor dielectric etching equipment market?

Table of Contents

1 Preface

2 Scope and Methodology

• 2.1 Objectives of the Study
• 2.2 Stakeholders
• 2.3 Data Sources
  • 2.3.1 Primary Sources
  • 2.3.2 Secondary Sources
• 2.4 Market Estimation
  • 2.4.1 Bottom-Up Approach
  • 2.4.2 Top-Down Approach
• 2.5 Forecasting Methodology

3 Executive Summary

4 Introduction

• 4.1 Overview
• 4.2 Key Industry Trends

5 Global Semiconductor Dielectric Etching Equipment Market

• 5.1 Market Overview
• 5.2 Market Performance
• 5.3 Impact of COVID-19
• 5.4 Market Forecast

6 Market Breakup by Type

• 6.1 Wet Etching Equipment
  • 6.1.1 Market Trends
  • 6.1.2 Market Forecast
• 6.2 Dry Etching Equipment
  • 6.2.1 Market Trends
  • 6.2.2 Market Forecast

7 Market Breakup by Application

• 7.1 Foundries
  • 7.1.1 Market Trends
  • 7.1.2 Market Forecast
• 7.2 Integrated Device Manufacturer (IDMs)
  • 7.2.1 Market Trends
  • 7.2.2 Market Forecast

8 Market Breakup by Region

• 8.1 North America
  • 8.1.1 United States
    • 8.1.1.1 Market Trends
    • 8.1.1.2 Market Forecast
  • 8.1.2 Canada
    • 8.1.2.1 Market Trends
    • 8.1.2.2 Market Forecast
• 8.2 Asia-Pacific
  • 8.2.1 China
    • 8.2.1.1 Market Trends
    • 8.2.1.2 Market Forecast
  • 8.2.2 Japan
    • 8.2.2.1 Market Trends
    • 8.2.2.2 Market Forecast
  • 8.2.3 India
    • 8.2.3.1 Market Trends
    • 8.2.3.2 Market Forecast
  • 8.2.4 South Korea
    • 8.2.4.1 Market Trends
    • 8.2.4.2 Market Forecast
  • 8.2.5 Australia
    • 8.2.5.1 Market Trends
    • 8.2.5.2 Market Forecast
  • 8.2.6 Indonesia
    • 8.2.6.1 Market Trends
    • 8.2.6.2 Market Forecast
  • 8.2.7 Others
    • 8.2.7.1 Market Trends
    • 8.2.7.2 Market Forecast
• 8.3 Europe
  • 8.3.1 Germany
    • 8.3.1.1 Market Trends
    • 8.3.1.2 Market Forecast
  • 8.3.2 France
    • 8.3.2.1 Market Trends
    • 8.3.2.2 Market Forecast
  • 8.3.3 United Kingdom
    • 8.3.3.1 Market Trends
    • 8.3.3.2 Market Forecast
  • 8.3.4 Italy
    • 8.3.4.1 Market Trends
    • 8.3.4.2 Market Forecast
  • 8.3.5 Spain
    • 8.3.5.1 Market Trends
    • 8.3.5.2 Market Forecast
  • 8.3.6 Russia
    • 8.3.6.1 Market Trends
    • 8.3.6.2 Market Forecast
  • 8.3.7 Others
    • 8.3.7.1 Market Trends
    • 8.3.7.2 Market Forecast
• 8.4 Latin America
  • 8.4.1 Brazil
    • 8.4.1.1 Market Trends
    • 8.4.1.2 Market Forecast
  • 8.4.2 Mexico
    • 8.4.2.1 Market Trends
    • 8.4.2.2 Market Forecast
  • 8.4.3 Others
    • 8.4.3.1 Market Trends
    • 8.4.3.2 Market Forecast
• 8.5 Middle East and Africa
  • 8.5.1 Market Trends
  • 8.5.2 Market Breakup by Country
  • 8.5.3 Market Forecast

9 Drivers, Restraints, and Opportunities

• 9.1 Overview
• 9.2 Drivers
• 9.3 Restraints
• 9.4 Opportunities

10 Value Chain Analysis

11 Porters Five Forces Analysis

• 11.1 Overview
• 11.2 Bargaining Power of Buyers
• 11.3 Bargaining Power of Suppliers
• 11.4 Degree of Competition
• 11.5 Threat of New Entrants
• 11.6 Threat of Substitutes

12 Price Analysis

13 Competitive Landscape

• 13.1 Market Structure
• 13.2 Key Players
• 13.3 Profiles of Key Players
  • 13.3.1 Advanced Micro-Fabrication Equipment Inc. China
    • 13.3.1.1 Company Overview
    • 13.3.1.2 Product Portfolio
    • 13.3.1.3 Financials
  • 13.3.2 Applied Materials Inc.
    • 13.3.2.1 Company Overview
    • 13.3.2.2 Product Portfolio
    • 13.3.2.3 Financials
    • 13.3.2.4 SWOT Analysis
  • 13.3.3 Hitachi High-Technologies Corporation (Hitachi Ltd)
    • 13.3.3.1 Company Overview
    • 13.3.3.2 Product Portfolio
  • 13.3.4 Lam Research corporation
    • 13.3.4.1 Company Overview
    • 13.3.4.2 Product Portfolio
    • 13.3.4.3 Financials
    • 13.3.4.4 SWOT Analysis
  • 13.3.5 Mattson Technology
    • 13.3.5.1 Company Overview
    • 13.3.5.2 Product Portfolio
  • 13.3.6 Oxford Instruments
    • 13.3.6.1 Company Overview
    • 13.3.6.2 Product Portfolio
    • 13.3.6.3 Financials
    • 13.3.6.4 SWOT Analysis
  • 13.3.7 SPTS Technologies Ltd. (KLA Corporation)
    • 13.3.7.1 Company Overview
    • 13.3.7.2 Product Portfolio
  • 13.3.8 Tokyo Electron Limited
    • 13.3.8.1 Company Overview
    • 13.3.8.2 Product Portfolio
    • 13.3.8.3 Financials
    • 13.3.8.4 SWOT Analysis

Kindly note that this only represents a partial list of companies, and the complete list has been provided in the report.