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시장보고서
상품코드
2024678
임베디드 다이 패키징 기술 시장 규모 : 플랫폼별, 업계별, 지역별(2026-2034년)Embedded Die Packaging Technology Market Size by Platform, Industry Vertical, and Region 2026-2034 |
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세계의 임베디드 다이 패키징 기술 시장 규모는 2025년에 1억 1,350만 달러에 달했습니다. 향후에 대해 IMARC Group은 2034년까지 시장 규모가 2억 7,890만 달러에 달하며, 2026-2034년에 CAGR 10.19%로 성장할 것으로 예측하고 있습니다. 반도체 산업의 확대와 더불어 휴대용 전자기기의 판매 증가가 시장 성장을 촉진하고 있습니다.
임베디드 다이 패키징 기술은 다단계 제조 공정을 거쳐 기판 내에 부품을 내장하는 데 사용됩니다. 여기에는 시스템 효율을 향상시키기 위한 플립칩 칩 스케일 패키징(FC CSP)과 웨이퍼 레벨 칩 스케일 패키징(WL CSP)이 포함됩니다. 이를 통해 인쇄회로기판(PCB)의 전체 솔루션을 소형화하여 다른 구성 요소를 위한 공간을 확보할 수 있습니다. 또한 표면 실장 기술(SMT) 통합 및 유연한 배선 솔루션을 제공하여 인쇄회로기판(PCB)의 소형화를 실현합니다. 왜곡과 전력 손실을 줄이면서 2D에서 3D로 전환할 수 있는 설계 유연성을 제공합니다. 그 결과, 임베디드 다이 패키징 기술은 전 세계 전자, 정보기술(IT), 자동차, 의료, 통신 산업에서 폭넓게 활용되고 있습니다.
임베디드 다이 패키징 기술 시장 동향:
현재 전 세계 마이크로 전자기기에서 전자회로의 소형화가 진행되고 있습니다. 이는 급성장하는 반도체 산업과 맞물려 시장을 촉진하는 주요 요인 중 하나가 되고 있습니다. 또한 임베디드 다이 패키징 기술은 전기적 및 열적 성능 향상, 이기종 통합, OEM(주문자 상표 부착 생산업체)을 위한 물류 효율화 등 다양한 이점을 제공함으로써 시장 성장에 기여하고 있습니다. 또한 다양한 산업 분야에서 전문 서비스를 위한 자율 로봇의 채택이 확대됨에 따라 업계 투자자들에게 매력적인 성장 기회를 제공하고 있습니다. 이와 더불어, 스마트폰과 웨어러블 기기에서 임베디드 다이 패키징 기술의 사용이 증가하여 사용 가능한 공간을 확장하고 더 많은 구성 요소를 통합하는 것도 시장에 긍정적인 영향을 미치고 있습니다. 또한 전 세계에서 IoT(사물인터넷)를 통합한 임베디드 다이패키징 기술에 대한 수요가 증가하고 있습니다. 여기에 노트북, 컴퓨터, 태블릿, 전자책 리더기, 스마트폰, MP3 플레이어, 드론, 전자 장난감 등 휴대용 전자기기의 판매 증가가 맞물려 시장 성장을 촉진하고 있습니다.
목차
제1장 서문
제2장 조사 범위와 조사 방법
제3장 개요
제4장 서론
제5장 세계의 임베디드 다이 패키징 기술 시장
제6장 시장 내역 : 플랫폼별
제7장 시장 내역 : 업계별
제8장 시장 내역 : 지역별
제9장 SWOT 분석
제10장 밸류체인 분석
제11장 Porters Five Forces 분석
제12장 가격 분석
제13장 경쟁 구도
KSA 26.05.18The global embedded die packaging technology market size reached USD 113.5 Million in 2025. Looking forward, IMARC Group expects the market to reach USD 278.9 Million by 2034, exhibiting a growth rate (CAGR) of 10.19% during 2026-2034. The increasing semiconductor industry, along with the growing sales of portable electronic devices, are propelling the market.
Embedded die packaging technology is used to embed components inside the substrate via a multi-step manufacturing process. It comprises flip-chip chip scale packaging (FC CSP) and wafer-level chip scale packaging (WL CSP) to improve the efficiency of the system. It creates more space for other components by shrinking overall solutions in the printed circuit board (PCB). It also provides surface-mount technology (SMT) integration and a flexible routing solution to reduce printed circuit board (PCB) size. It offers design flexibility that shifts from 2D to 3D while reducing distortion and power loss. As a result, embedded die packaging technology finds extensive application in electronics, information and technology (IT), automotive, healthcare, and telecommunication industries across the globe.
Embedded Die Packaging Technology Market Trends:
At present, there is an increase in the miniaturization of electronic circuits in microelectronic devices around the world. This, along with the burgeoning semiconductor industry, represents one of the key factors driving the market. Moreover, embedded die packaging technology offers several benefits, such as upgraded electrical and thermal performance, heterogeneous integration, and streamlined logistics for original equipment manufacturers (OEMs), which are contributing to the growth of the market. In addition, the increasing adoption of autonomous robots for professional services in various industries is offering lucrative growth opportunities to industry investors. Besides this, the growing utilization of embedded die packaging technology in smartphones and wearable devices to enhance the available space and integrate more components is positively influencing the market. Additionally, there is a rise in the demand for embedded die packaging technology with integrated internet of things (IoT) across the globe. This, coupled with the increasing sales of portable electronic devices, such as laptops, computers, tablets, e-readers, smartphones, MP3 players, drones, and electronic toys, is bolstering the growth of the market.
Key Market Segmentation:
This report provides an analysis of the key trends in each sub-segment of the global embedded die packaging technology market report, along with forecasts at the global, regional and country level from 2026-2034. The report has categorized the market based on platform and industry vertical.
Breakup by Platform:
- Embedded Die in IC Package Substrate
- Embedded Die in Rigid Board
- Embedded Die in Flexible Board
Breakup by Industry Vertical:
- Consumer Electronics
- IT and Telecommunication
- Automotive
- Healthcare
- Others
Breakup by Region:
- North America
- United States
- Canada
- Asia-Pacific
- China
- Japan
- India
- South Korea
- Australia
- Indonesia
- Others
- Europe
- Germany
- France
- United Kingdom
- Italy
- Spain
- Russia
- Others
- Latin America
- Brazil
- Mexico
- Others
- Middle East and Africa
Competitive Landscape:
The competitive landscape of the industry has also been examined along with the profiles of the key players being Amkor Technology Inc., ASE Technology Holding Co. Ltd., AT & S Austria Technologie & Systemtechnik Aktiengesellschaft, Fujikura Ltd., Infineon Technologies AG, Microsemi Corporation (Microchip Technology Inc.), Schweizer Electronic AG and TDK Electronics AG (TDK Corporation). Kindly, note that this only represents a partial list of companies, and the complete list has been provided in the report.
Key Questions Answered in This Report
1. What was the size of the global embedded die packaging technology market in 2025?
2. What is the expected growth rate of the global embedded die packaging technology market during 2026-2034?
3. What are the key factors driving the global embedded die packaging technology market?
4. What has been the impact of COVID-19 on the global embedded die packaging technology market?
5. What is the breakup of the global embedded die packaging technology market based on the platform?
6. What is the breakup of the global embedded die packaging technology market based on the industry vertical?
7. What are the key regions in the global embedded die packaging technology market?
8. Who are the key players/companies in the global embedded die packaging technology market?
Table of Contents
1 Preface
2 Scope and Methodology
- 2.1 Objectives of the Study
- 2.2 Stakeholders
- 2.3 Data Sources
- 2.3.1 Primary Sources
- 2.3.2 Secondary Sources
- 2.4 Market Estimation
- 2.4.1 Bottom-Up Approach
- 2.4.2 Top-Down Approach
- 2.5 Forecasting Methodology
3 Executive Summary
4 Introduction
- 4.1 Overview
- 4.2 Key Industry Trends
5 Global Embedded Die Packaging Technology Market
- 5.1 Market Overview
- 5.2 Market Performance
- 5.3 Impact of COVID-19
- 5.4 Market Forecast
6 Market Breakup by Platform
- 6.1 Embedded Die in IC Package Substrate
- 6.1.1 Market Trends
- 6.1.2 Market Forecast
- 6.2 Embedded Die in Rigid Board
- 6.2.1 Market Trends
- 6.2.2 Market Forecast
- 6.3 Embedded Die in Flexible Board
- 6.3.1 Market Trends
- 6.3.2 Market Forecast
7 Market Breakup by Industry Vertical
- 7.1 Consumer Electronics
- 7.1.1 Market Trends
- 7.1.2 Market Forecast
- 7.2 IT and Telecommunication
- 7.2.1 Market Trends
- 7.2.2 Market Forecast
- 7.3 Automotive
- 7.3.1 Market Trends
- 7.3.2 Market Forecast
- 7.4 Healthcare
- 7.4.1 Market Trends
- 7.4.2 Market Forecast
- 7.5 Others
- 7.5.1 Market Trends
- 7.5.2 Market Forecast
8 Market Breakup by Region
- 8.1 North America
- 8.1.1 United States
- 8.1.1.1 Market Trends
- 8.1.1.2 Market Forecast
- 8.1.2 Canada
- 8.1.2.1 Market Trends
- 8.1.2.2 Market Forecast
- 8.1.1 United States
- 8.2 Asia-Pacific
- 8.2.1 China
- 8.2.1.1 Market Trends
- 8.2.1.2 Market Forecast
- 8.2.2 Japan
- 8.2.2.1 Market Trends
- 8.2.2.2 Market Forecast
- 8.2.3 India
- 8.2.3.1 Market Trends
- 8.2.3.2 Market Forecast
- 8.2.4 South Korea
- 8.2.4.1 Market Trends
- 8.2.4.2 Market Forecast
- 8.2.5 Australia
- 8.2.5.1 Market Trends
- 8.2.5.2 Market Forecast
- 8.2.6 Indonesia
- 8.2.6.1 Market Trends
- 8.2.6.2 Market Forecast
- 8.2.7 Others
- 8.2.7.1 Market Trends
- 8.2.7.2 Market Forecast
- 8.2.1 China
- 8.3 Europe
- 8.3.1 Germany
- 8.3.1.1 Market Trends
- 8.3.1.2 Market Forecast
- 8.3.2 France
- 8.3.2.1 Market Trends
- 8.3.2.2 Market Forecast
- 8.3.3 United Kingdom
- 8.3.3.1 Market Trends
- 8.3.3.2 Market Forecast
- 8.3.4 Italy
- 8.3.4.1 Market Trends
- 8.3.4.2 Market Forecast
- 8.3.5 Spain
- 8.3.5.1 Market Trends
- 8.3.5.2 Market Forecast
- 8.3.6 Russia
- 8.3.6.1 Market Trends
- 8.3.6.2 Market Forecast
- 8.3.7 Others
- 8.3.7.1 Market Trends
- 8.3.7.2 Market Forecast
- 8.3.1 Germany
- 8.4 Latin America
- 8.4.1 Brazil
- 8.4.1.1 Market Trends
- 8.4.1.2 Market Forecast
- 8.4.2 Mexico
- 8.4.2.1 Market Trends
- 8.4.2.2 Market Forecast
- 8.4.3 Others
- 8.4.3.1 Market Trends
- 8.4.3.2 Market Forecast
- 8.4.1 Brazil
- 8.5 Middle East and Africa
- 8.5.1 Market Trends
- 8.5.2 Market Breakup by Country
- 8.5.3 Market Forecast
9 SWOT Analysis
- 9.1 Overview
- 9.2 Strengths
- 9.3 Weaknesses
- 9.4 Opportunities
- 9.5 Threats
10 Value Chain Analysis
11 Porters Five Forces Analysis
- 11.1 Overview
- 11.2 Bargaining Power of Buyers
- 11.3 Bargaining Power of Suppliers
- 11.4 Degree of Competition
- 11.5 Threat of New Entrants
- 11.6 Threat of Substitutes
12 Price Analysis
13 Competitive Landscape
- 13.1 Market Structure
- 13.2 Key Players
- 13.3 Profiles of Key Players
- 13.3.1 Amkor Technology Inc.
- 13.3.1.1 Company Overview
- 13.3.1.2 Product Portfolio
- 13.3.1.3 Financials
- 13.3.1.4 SWOT Analysis
- 13.3.2 ASE Technology Holding Co. Ltd.
- 13.3.2.1 Company Overview
- 13.3.2.2 Product Portfolio
- 13.3.2.3 Financials
- 13.3.3 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
- 13.3.3.1 Company Overview
- 13.3.3.2 Product Portfolio
- 13.3.3.3 Financials
- 13.3.4 Fujikura Ltd.
- 13.3.4.1 Company Overview
- 13.3.4.2 Product Portfolio
- 13.3.4.3 Financials
- 13.3.4.4 SWOT Analysis
- 13.3.5 Infineon Technologies AG
- 13.3.5.1 Company Overview
- 13.3.5.2 Product Portfolio
- 13.3.5.3 Financials
- 13.3.5.4 SWOT Analysis
- 13.3.6 Microsemi Corporation (Microchip Technology Inc.)
- 13.3.6.1 Company Overview
- 13.3.6.2 Product Portfolio
- 13.3.6.3 SWOT Analysis
- 13.3.7 Schweizer Electronic AG
- 13.3.7.1 Company Overview
- 13.3.7.2 Product Portfolio
- 13.3.7.3 Financials
- 13.3.8 TDK Electronics AG (TDK Corporation)
- 13.3.8.1 Company Overview
- 13.3.8.2 Product Portfolio
- 13.3.1 Amkor Technology Inc.
