세계의 임베디드 다이 패키징 기술 시장 : 기술, 용도, 최종 사용자 산업, 재료, 부품 유형별 예측(2025-2030년)

The Embedded Die Packaging Technology Market was valued at USD 57.39 billion in 2023, expected to reach USD 69.27 billion in 2024, and is projected to grow at a CAGR of 20.58%, to USD 212.73 billion by 2030.

Embedded Die Packaging Technology refers to the integration of bare dies into a substrate package, which facilitates enhanced miniaturization, improved electrical and thermal performance, and reduced manufacturing costs. The necessity of this technology arises from the ever-increasing demand for smaller, more powerful electronic devices, including smartphones, wearables, and IoT devices. Its application mainly falls within consumer electronics, automotive, and telecommunications sectors, where space reduction and performance efficiency are crucial. The end-use scope also extends to medical devices and industrial applications, driven by the need for compact and efficient components.

The market growth for embedded die packaging technology is influenced by several factors, including the surge in demand for advanced electronic devices, rapid advancements in chip manufacturing technologies, and the push towards 5G implementation. Additionally, there are notable opportunities in sectors such as automotive electronics, particularly with the expansion of electric vehicles, and in healthcare for portable medical devices. Companies could capitalize on these opportunities by focusing on R&D to enhance material properties and improve manufacturing processes.

However, several limitations challenge market expansion, such as the high initial costs associated with technology adoption, complexities in the manufacturing processes, and stringent industry standards. Further, the need for significant investment in research and development poses a barrier, particularly for smaller market players.

In terms of innovation, areas such as advanced materials for substrates and better integration methods for multi-chip modules present promising avenues. Emerging trends such as AI-driven optimization for design and manufacturing processes hold the potential to revolutionize efficiencies in this domain. Meanwhile, partnerships and collaborations with semiconductor manufacturers and technology developers can provide a path to overcome some of the technological and financial hurdles. The market is characterized by a competitive landscape with key players continually seeking advancements in both technology and cost efficiency to maintain an edge.

Market Dynamics: Unveiling Key Market Insights in the Rapidly Evolving Embedded Die Packaging Technology Market

The Embedded Die Packaging Technology Market is undergoing transformative changes driven by a dynamic interplay of supply and demand factors. Understanding these evolving market dynamics prepares business organizations to make informed investment decisions, refine strategic decisions, and seize new opportunities. By gaining a comprehensive view of these trends, business organizations can mitigate various risks across political, geographic, technical, social, and economic domains while also gaining a clearer understanding of consumer behavior and its impact on manufacturing costs and purchasing trends.

• Market Drivers
  • Rising demand for miniaturized electronic devices in consumer electronics applications driving market growth
  • Advancements in materials and manufacturing processes enhancing the efficiency and reliability of embedded die packaging
  • Increasing integration of embedded die packaging in automotive electronics for compact and robust solutions
  • Growing adoption of IoT devices in various industries spurring the need for advanced packaging technologies
• Market Restraints
  • Limited availability of skilled professionals hinders the growth of embedded die packaging technology
  • Slow adoption rate due to apprehensions about the long-term reliability and performance of embedded die packaging solutions
• Market Opportunities
  • Emerging applications in the industrial automation sector fueling requirements for embedded die packaging technology
  • Enhanced performance and reliability demands in aerospace and defense sectors boost embedded die packaging adoption
  • Advancements in Internet of Things (IoT) devices driving the growth of embedded die packaging solutions
• Market Challenges
  • Navigating supply chain disruptions and material shortages affecting the embedded die packaging technology industry
  • Meeting regulatory compliance and environmental sustainability standards in the embedded die packaging technology sector

Porter's Five Forces: A Strategic Tool for Navigating the Embedded Die Packaging Technology Market

Porter's five forces framework is a critical tool for understanding the competitive landscape of the Embedded Die Packaging Technology Market. It offers business organizations with a clear methodology for evaluating their competitive positioning and exploring strategic opportunities. This framework helps businesses assess the power dynamics within the market and determine the profitability of new ventures. With these insights, business organizations can leverage their strengths, address weaknesses, and avoid potential challenges, ensuring a more resilient market positioning.

PESTLE Analysis: Navigating External Influences in the Embedded Die Packaging Technology Market

External macro-environmental factors play a pivotal role in shaping the performance dynamics of the Embedded Die Packaging Technology Market. Political, Economic, Social, Technological, Legal, and Environmental factors analysis provides the necessary information to navigate these influences. By examining PESTLE factors, businesses can better understand potential risks and opportunities. This analysis enables business organizations to anticipate changes in regulations, consumer preferences, and economic trends, ensuring they are prepared to make proactive, forward-thinking decisions.

Market Share Analysis: Understanding the Competitive Landscape in the Embedded Die Packaging Technology Market

A detailed market share analysis in the Embedded Die Packaging Technology Market provides a comprehensive assessment of vendors' performance. Companies can identify their competitive positioning by comparing key metrics, including revenue, customer base, and growth rates. This analysis highlights market concentration, fragmentation, and trends in consolidation, offering vendors the insights required to make strategic decisions that enhance their position in an increasingly competitive landscape.

FPNV Positioning Matrix: Evaluating Vendors' Performance in the Embedded Die Packaging Technology Market

The Forefront, Pathfinder, Niche, Vital (FPNV) Positioning Matrix is a critical tool for evaluating vendors within the Embedded Die Packaging Technology Market. This matrix enables business organizations to make well-informed decisions that align with their goals by assessing vendors based on their business strategy and product satisfaction. The four quadrants provide a clear and precise segmentation of vendors, helping users identify the right partners and solutions that best fit their strategic objectives.

Strategy Analysis & Recommendation: Charting a Path to Success in the Embedded Die Packaging Technology Market

A strategic analysis of the Embedded Die Packaging Technology Market is essential for businesses looking to strengthen their global market presence. By reviewing key resources, capabilities, and performance indicators, business organizations can identify growth opportunities and work toward improvement. This approach helps businesses navigate challenges in the competitive landscape and ensures they are well-positioned to capitalize on newer opportunities and drive long-term success.

Key Company Profiles

The report delves into recent significant developments in the Embedded Die Packaging Technology Market, highlighting leading vendors and their innovative profiles. These include Amkor Technology Inc., Analog Devices Inc., ASE Technology Holding Co. Ltd., Broadcom Inc., Infineon Technologies AG, Integrated Device Technology Inc., Intel Corporation, LSI Corporation, MediaTek Inc., Micron Technology Inc., NVIDIA Corporation, NXP Semiconductors N.V., ON Semiconductor Corporation, Qualcomm Incorporated, Rambus Inc., Renesas Electronics Corporation, Samsung Electronics Co. Ltd., STMicroelectronics N.V., Taiwan Semiconductor Manufacturing Company Limited (TSMC), and Texas Instruments Incorporated.

Market Segmentation & Coverage

This research report categorizes the Embedded Die Packaging Technology Market to forecast the revenues and analyze trends in each of the following sub-markets:

• Based on Technology, market is studied across Embedded Die In Flexible Board and Embedded Die In Rigid Board. The Embedded Die In Flexible Board is further studied across Flexible Hybrid Electronics and Integrated Passive Devices. The Embedded Die In Rigid Board is further studied across Conductor Embedded and Non-Conductor Embedded.
• Based on Application, market is studied across Automotive, Consumer Electronics, and Healthcare. The Automotive is further studied across ADAS, ECUs, and Infotainment Systems. The Consumer Electronics is further studied across Smartphones, Tablets, and Wearables. The Healthcare is further studied across Diagnostics, Medical Devices, and Monitoring.
• Based on End-User Industry, market is studied across Aerospace & Defense, Industrial, and Telecommunications.
• Based on Material, market is studied across Interconnection Materials and Substrate Materials. The Interconnection Materials is further studied across Conductive Adhesives and Solder Alloys. The Substrate Materials is further studied across Ceramic Substrates and Organic Substrates.
• Based on Component Type, market is studied across Active Components and Passive Components. The Active Components is further studied across Memory Chips and Microprocessors. The Passive Components is further studied across Capacitors, Inductors, and Resistors.
• Based on Region, market is studied across Americas, Asia-Pacific, and Europe, Middle East & Africa. The Americas is further studied across Argentina, Brazil, Canada, Mexico, and United States. The United States is further studied across California, Florida, Illinois, New York, Ohio, Pennsylvania, and Texas. The Asia-Pacific is further studied across Australia, China, India, Indonesia, Japan, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, and Vietnam. The Europe, Middle East & Africa is further studied across Denmark, Egypt, Finland, France, Germany, Israel, Italy, Netherlands, Nigeria, Norway, Poland, Qatar, Russia, Saudi Arabia, South Africa, Spain, Sweden, Switzerland, Turkey, United Arab Emirates, and United Kingdom.

The report offers a comprehensive analysis of the market, covering key focus areas:

1. Market Penetration: A detailed review of the current market environment, including extensive data from top industry players, evaluating their market reach and overall influence.

2. Market Development: Identifies growth opportunities in emerging markets and assesses expansion potential in established sectors, providing a strategic roadmap for future growth.

3. Market Diversification: Analyzes recent product launches, untapped geographic regions, major industry advancements, and strategic investments reshaping the market.

4. Competitive Assessment & Intelligence: Provides a thorough analysis of the competitive landscape, examining market share, business strategies, product portfolios, certifications, regulatory approvals, patent trends, and technological advancements of key players.

5. Product Development & Innovation: Highlights cutting-edge technologies, R&D activities, and product innovations expected to drive future market growth.

The report also answers critical questions to aid stakeholders in making informed decisions:

1. What is the current market size, and what is the forecasted growth?

2. Which products, segments, and regions offer the best investment opportunities?

3. What are the key technology trends and regulatory influences shaping the market?

4. How do leading vendors rank in terms of market share and competitive positioning?

5. What revenue sources and strategic opportunities drive vendors' market entry or exit strategies?

Table of Contents

1. Preface

• 1.1. Objectives of the Study
• 1.2. Market Segmentation & Coverage
• 1.3. Years Considered for the Study
• 1.4. Currency & Pricing
• 1.5. Language
• 1.6. Stakeholders

2. Research Methodology

• 2.1. Define: Research Objective
• 2.2. Determine: Research Design
• 2.3. Prepare: Research Instrument
• 2.4. Collect: Data Source
• 2.5. Analyze: Data Interpretation
• 2.6. Formulate: Data Verification
• 2.7. Publish: Research Report
• 2.8. Repeat: Report Update

3. Executive Summary

4. Market Overview

5. Market Insights

• 5.1. Market Dynamics
  • 5.1.1. Drivers
    • 5.1.1.1. Rising demand for miniaturized electronic devices in consumer electronics applications driving market growth
    • 5.1.1.2. Advancements in materials and manufacturing processes enhancing the efficiency and reliability of embedded die packaging
    • 5.1.1.3. Increasing integration of embedded die packaging in automotive electronics for compact and robust solutions
    • 5.1.1.4. Growing adoption of IoT devices in various industries spurring the need for advanced packaging technologies
  • 5.1.2. Restraints
    • 5.1.2.1. Limited availability of skilled professionals hinders the growth of embedded die packaging technology
    • 5.1.2.2. Slow adoption rate due to apprehensions about the long-term reliability and performance of embedded die packaging solutions
  • 5.1.3. Opportunities
    • 5.1.3.1. Emerging applications in the industrial automation sector fueling requirements for embedded die packaging technology
    • 5.1.3.2. Enhanced performance and reliability demands in aerospace and defense sectors boost embedded die packaging adoption
    • 5.1.3.3. Advancements in Internet of Things (IoT) devices driving the growth of embedded die packaging solutions
  • 5.1.4. Challenges
    • 5.1.4.1. Navigating supply chain disruptions and material shortages affecting the embedded die packaging technology industry
    • 5.1.4.2. Meeting regulatory compliance and environmental sustainability standards in the embedded die packaging technology sector
• 5.2. Market Segmentation Analysis
• 5.3. Porter's Five Forces Analysis
  • 5.3.1. Threat of New Entrants
  • 5.3.2. Threat of Substitutes
  • 5.3.3. Bargaining Power of Customers
  • 5.3.4. Bargaining Power of Suppliers
  • 5.3.5. Industry Rivalry
• 5.4. PESTLE Analysis
  • 5.4.1. Political
  • 5.4.2. Economic
  • 5.4.3. Social
  • 5.4.4. Technological
  • 5.4.5. Legal
  • 5.4.6. Environmental

6. Embedded Die Packaging Technology Market, by Technology

• 6.1. Introduction
• 6.2. Embedded Die In Flexible Board
  • 6.2.1. Flexible Hybrid Electronics
  • 6.2.2. Integrated Passive Devices
• 6.3. Embedded Die In Rigid Board
  • 6.3.1. Conductor Embedded
  • 6.3.2. Non-Conductor Embedded

7. Embedded Die Packaging Technology Market, by Application

• 7.1. Introduction
• 7.2. Automotive
  • 7.2.1. ADAS
  • 7.2.2. ECUs
  • 7.2.3. Infotainment Systems
• 7.3. Consumer Electronics
  • 7.3.1. Smartphones
  • 7.3.2. Tablets
  • 7.3.3. Wearables
• 7.4. Healthcare
  • 7.4.1. Diagnostics
  • 7.4.2. Medical Devices
  • 7.4.3. Monitoring

8. Embedded Die Packaging Technology Market, by End-User Industry

• 8.1. Introduction
• 8.2. Aerospace & Defense
• 8.3. Industrial
• 8.4. Telecommunications

9. Embedded Die Packaging Technology Market, by Material

• 9.1. Introduction
• 9.2. Interconnection Materials
  • 9.2.1. Conductive Adhesives
  • 9.2.2. Solder Alloys
• 9.3. Substrate Materials
  • 9.3.1. Ceramic Substrates
  • 9.3.2. Organic Substrates

10. Embedded Die Packaging Technology Market, by Component Type

• 10.1. Introduction
• 10.2. Active Components
  • 10.2.1. Memory Chips
  • 10.2.2. Microprocessors
• 10.3. Passive Components
  • 10.3.1. Capacitors
  • 10.3.2. Inductors
  • 10.3.3. Resistors

11. Americas Embedded Die Packaging Technology Market

• 11.1. Introduction
• 11.2. Argentina
• 11.3. Brazil
• 11.4. Canada
• 11.5. Mexico
• 11.6. United States

12. Asia-Pacific Embedded Die Packaging Technology Market

• 12.1. Introduction
• 12.2. Australia
• 12.3. China
• 12.4. India
• 12.5. Indonesia
• 12.6. Japan
• 12.7. Malaysia
• 12.8. Philippines
• 12.9. Singapore
• 12.10. South Korea
• 12.11. Taiwan
• 12.12. Thailand
• 12.13. Vietnam

13. Europe, Middle East & Africa Embedded Die Packaging Technology Market

• 13.1. Introduction
• 13.2. Denmark
• 13.3. Egypt
• 13.4. Finland
• 13.5. France
• 13.6. Germany
• 13.7. Israel
• 13.8. Italy
• 13.9. Netherlands
• 13.10. Nigeria
• 13.11. Norway
• 13.12. Poland
• 13.13. Qatar
• 13.14. Russia
• 13.15. Saudi Arabia
• 13.16. South Africa
• 13.17. Spain
• 13.18. Sweden
• 13.19. Switzerland
• 13.20. Turkey
• 13.21. United Arab Emirates
• 13.22. United Kingdom

14. Competitive Landscape

• 14.1. Market Share Analysis, 2023
• 14.2. FPNV Positioning Matrix, 2023
• 14.3. Competitive Scenario Analysis
• 14.4. Strategy Analysis & Recommendation

Companies Mentioned

• 1. Amkor Technology Inc.
• 2. Analog Devices Inc.
• 3. ASE Technology Holding Co. Ltd.
• 4. Broadcom Inc.
• 5. Infineon Technologies AG
• 6. Integrated Device Technology Inc.
• 7. Intel Corporation
• 8. LSI Corporation
• 9. MediaTek Inc.
• 10. Micron Technology Inc.
• 11. NVIDIA Corporation
• 12. NXP Semiconductors N.V.
• 13. ON Semiconductor Corporation
• 14. Qualcomm Incorporated
• 15. Rambus Inc.
• 16. Renesas Electronics Corporation
• 17. Samsung Electronics Co. Ltd.
• 18. STMicroelectronics N.V.
• 19. Taiwan Semiconductor Manufacturing Company Limited (TSMC)
• 20. Texas Instruments Incorporated