GPU 웨이퍼 수요 시장 : 점유율 분석, 업계 동향 및 통계, 성장 예측(2026-2031년)

According to Mordor Intelligence, the GPU wafer demand market size is expected to increase from USD 84.00 million in 2025 to USD 112.00 million in 2026 and reach USD 285.00 million by 2031, growing at a CAGR of 20.54% over 2026-2031.

This report is Segmented by Wafer Diameter (300 Mm Wafers and 200 Mm and Below), Starting Wafer Type (Prime Polished Bulk Silicon Wafers, Epitaxial Silicon Wafers, and SOI and More), Process Node (2 Nm and Below, 3 Nm, 4 Nm To 5 Nm, and More), GPU Application (Data Center and AI/HPC GPUs, Gaming and Consumer Discrete GPUs, and More), and Geography. The Market Forecasts are Provided in Terms of Value (USD).

Global GPU Wafer Demand Market Trends and Insights

AI Training Density Raises Ultra-Low Defect Wafer Requirements

The GPU wafer demand market is being pushed higher by the physical intensity of AI training, because very large compute die are less tolerant of even small variations in surface quality and defect control. That makes wafer quality a direct cost issue for foundries and GPU vendors, since small yield losses at advanced nodes can erase large amounts of output value. Shin-Etsu said AI chips for GPUs and high-bandwidth memory accounted for just under 10% of total 300 mm wafer demand, while broader AI-related end markets, including data centers and servers, exceeded 20% of total 300 mm demand in the fiscal year ended March 2026. As that mix rises, suppliers that can consistently deliver ultra-flat and low-defect substrates gain stronger pricing power and a more protected position inside advanced qualification programs. The GPU wafer demand market therefore rewards wafer makers that can work closely with foundries on defect budgets and process control, because those relationships are likely to carry forward across multiple node transitions.

3 nm and 2 nm GPU Ramps Increase Prime Wafer Pull

The GPU wafer demand market is also rising as leading GPU programs move into smaller process nodes that require more exacting substrate performance and tighter production planning. This shift matters not only because node migration improves chip capability, but also because it raises the commercial value of each qualified wafer start inside advanced logic lines. SUMCO reported that 300 mm wafer shipments grew 9% in 2025, led by leading-edge logic and high-bandwidth memory demand tied to AI, which marked a clear recovery from the weaker conditions seen earlier in the cycle. SUMCO also said AI-use DRAM wafer demand is expected to rise from 500,000-600,000 wafers per month currently to 1,500,000 wafers per month over the next 3-4 years, which shows how tightly AI compute growth is now linked to upstream silicon requirements. In the GPU wafer demand market, that node migration strengthens demand for prime 300 mm material and narrows the room for lower-specification suppliers that cannot serve advanced production ramps at scale.

High-Purity Polysilicon Supply Limits 300 mm Output

The GPU wafer demand market faces a real supply restraint from electronic-grade polysilicon, because advanced wafer production depends on very high purity feedstock that is not easily replaced by lower-grade material. The Semiconductor Industry Association told the US Department of Commerce in August 2025 that import dependence across key silicon inputs and wafer products remains a strategic weakness for domestic semiconductor expansion. USGS also confirmed that 3 companies produced polysilicon in the United States in 2025, while a 4th ceased production after failing to meet customer quality and volume standards, which reduced domestic flexibility at the same time that advanced-node demand kept rising. That tightness matters for the GPU wafer demand market because wafer capacity cannot expand smoothly when feedstock quality, rather than only fab equipment, becomes the limiting step. Until new qualified supply reaches commercial scale, premium 300 mm substrates are likely to remain supported by a firm pricing floor and limited availability.

Other drivers and restraints analyzed in the detailed report include:

1. Backside Power Delivery Increases Epitaxial Specification Intensity
2. Localization Incentives Re-Shape Strategic Wafer Procurement
3. Long GPU Customer Qualification Cycles Delay Supplier Switching

For complete list of drivers and restraints, kindly check the Table Of Contents.

Segment Analysis

300 mm wafers held 97.11% of GPU wafer demand market share in 2025, and the segment is projected to grow at a 21.21% CAGR from 2026 to 2031. That dominance reflects economics as much as technology, because advanced GPU production simply cannot be scaled efficiently on smaller formats once die complexity, process precision, and output value all move higher. The GPU wafer demand market therefore remains centered on the 300 mm platform, while 200 mm and below mostly serve legacy gaming, embedded, and edge products built on older nodes. This split is structural rather than temporary, since the smaller-diameter category has limited relevance for the leading AI accelerators that now shape most forward purchasing decisions. In practical terms, the GPU wafer demand industry has already settled around a format hierarchy where 300 mm captures nearly all advanced value creation.

The 300 mm segment also has an outsized influence on pricing, because nearly every major supply bottleneck in advanced logic now runs through qualified 300 mm lines and their associated materials ecosystem. Demand concentration in that format supports long contract periods, disciplined capacity additions, and stronger bargaining power for suppliers that already hold advanced customer approvals. The GPU wafer demand market is therefore more exposed to 300 mm utilization, qualification status, and regional capacity location than to total wafer unit counts alone. Smaller diameters still matter for some niche and cost-sensitive programs, but they do not shape the revenue base of the GPU wafer demand market in the same way. This is why new investment announcements from leading suppliers continue to target advanced 300 mm output rather than broad-based expansion across all diameter classes.

Prime polished bulk silicon wafers held 82.33% share of 2025 demand, while epitaxial silicon wafers are projected to expand at a 21.62% CAGR from 2026 to 2031. Prime polished substrates remain the working base for large volumes of current GPU production because they fit the needs of established 4 nm to 7 nm programs without requiring a full shift toward more engineered starting material. Even so, the GPU wafer demand market is gradually moving toward a richer mix of epitaxial and other engineered wafers as tighter electrical performance and process control requirements spread across advanced designs. This shift matters because it raises the value of materials expertise, not only the value of raw wafer volume. It also raises the competitive threshold for suppliers, since they need stronger control over contamination, resistivity, and uniformity to participate in next-wave qualifications.

The smallest starting wafer categories remain limited in share, but their strategic role is rising as AI systems place more value on specialty material stacks and optical interconnect support. Soitec said Edge and Cloud AI revenue reached EUR 214 million, or USD 225 million, in fiscal year 2026, and Photonics-SOI revenue exceeded USD 100 million earlier than expected, which shows that engineered silicon has become more important inside AI infrastructure spending. In the GPU wafer demand market, this means the largest segment still rests with prime polished bulk silicon, but growth leadership is shifting toward substrates that help support next-generation architecture and packaging needs. The GPU wafer demand industry is therefore becoming more specification-led, with starting wafer choice increasingly linked to system-level design requirements rather than to legacy volume habits. That progression gives epitaxial wafers a clearer path to premium growth through the forecast period.

Complete Report Scope:

• By Wafer Diameter
  • 300 mm Wafers
  • 200 mm and Below
• By Starting Wafer Type
  • Prime Polished Bulk Silicon Wafers
  • Epitaxial Silicon Wafers
  • SOI and Other Engineered Silicon Wafers
• By Process Node
  • 2 nm and Below
  • 3 nm
  • 4 nm to 5 nm
  • 6 nm to 7 nm
  • 8 nm to 16 nm
  • Above 16 nm
• By GPU Application
  • Data Center and AI/HPC GPUs
  • Gaming and Consumer Discrete GPUs
  • Professional Visualization and Workstation GPUs
  • Automotive, Embedded, and Edge GPUs
• By Geography
  • North America
    • United States
    • Canada
    • Mexico
  • Europe
    • Germany
    • United Kingdom
    • France
    • Italy
    • Rest of Europe
  • Asia-Pacific
    • China
    • Japan
    • South Korea
    • India
    • Southeast Asia
    • Rest of Asia-Pacific
  • South America
  • Middle East and Africa

Geography Analysis

Asia-Pacific retained 86.44% of GPU wafer demand market share in 2025, which keeps the regional base of the GPU wafer demand market heavily concentrated around Taiwan, South Korea, and Japan. This position reflects the fact that advanced GPU fabrication remains centered in Taiwan, while South Korea supports key memory and foundry capacity and Japan anchors a large share of upstream wafer supply. Japan's Shin-Etsu Handotai and SUMCO together hold over 60% of global 300 mm silicon wafer supply, which gives the region a strong materials advantage close to leading fabrication clusters. SUMCO's first-quarter 2026 guidance also confirmed continued strength in advanced logic and DRAM wafers for AI data centers, even as non-advanced products and 200 mm formats remained softer. Shin-Etsu further said broader AI-related wafer demand exceeded 20% of total 300 mm demand and that growth from April to June 2026 was expected to outpace earlier projections, which supports the region's lead in the current cycle.

North America is projected to grow at a 21.42% CAGR from 2026 to 2031, making it the fastest-rising geography in the GPU wafer demand market. The main driver is policy-backed localization, because federal incentives are now aligned with domestic semiconductor and AI infrastructure expansion. The US Department of Commerce award to GlobalWafers supports the first advanced high-volume 300 mm silicon wafer manufacturing platform in the United States in more than 20 years, which gives the region a clearer path toward local substrate availability. NVIDIA's 2026 commitment to build up to USD 500 billion of AI infrastructure in the United States with partners including TSMC, Foxconn, and Corning adds a strong demand-side signal for domestic supply chain development. Even so, the GPU wafer demand market in North America will still need time to align customer qualification, foundry schedules, and local materials output before the full benefit appears.

Europe holds a smaller direct position in volume, but it remains relevant through specialized supplier capabilities and balance-sheet support for 300 mm expansion. Siltronic raised EUR 273 million, or USD 298 million, in June 2026 to support its long-term 300 mm growth strategy, which points to continued confidence in advanced silicon demand. Soitec also strengthened Europe's position in high-value niches by reporting Photonics-SOI revenue above USD 100 million in fiscal year 2026, which ties the region more closely to optical and engineered silicon roles in AI systems. South America and the Middle East and Africa remain peripheral to the GPU wafer demand market in 2026, with activity focused more on downstream electronics and future sovereign AI spending than on upstream wafer manufacturing. The overall regional picture therefore remains clear, because Asia-Pacific still leads in scale, North America is building the fastest new growth path, and Europe is defending a focused position in specialty and advanced materials.

1. Shin-Etsu Handotai Co., Ltd.
2. SUMCO Corporation
3. Siltronic AG
4. GlobalWafers Co., Ltd.
5. SK Siltron Co., Ltd.
6. Soitec S.A.
7. Wafer Works Corporation
8. Shanghai Simgui Technology Co., Ltd.
9. Okmetic Oyj
10. Ferrotec Holdings Corporation
11. Hangzhou Silicon Tech Co., Ltd.
12. Zhonghuan Semiconductor Co., Ltd.
13. POSCO Future M Co., Ltd.
14. Episil-Precision Inc.
15. MEMC Korea Company
16. Korea Silicon Wafer Co., Ltd.
17. Linton Crystal Technologies
18. Salem Advanced Materials Inc.
19. Noel Technologies
20. Topsil GlobalWafers

Additional Benefits:

• The market estimate (ME) sheet in Excel format
• 3 months of analyst support

TABLE OF CONTENTS

1 INTRODUCTION

• 1.1 Study Assumptions and Market Definition
• 1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET LANDSCAPE

• 4.1 Market Overview
• 4.2 Market Drivers
  • 4.2.1 AI Training Density is Raising Ultra-Low Defect Wafer Requirements
  • 4.2.2 3 Nanometer and 2 Nanometer GPU Ramps are Increasing Prime Wafer Pull
  • 4.2.3 Backside Power Delivery is Increasing Epitaxial Specification Intensity
  • 4.2.4 Localization Incentives are Re-Shaping Strategic Wafer Procurement
  • 4.2.5 Chiplet-Based GPU Architectures are Expanding SOI and Specialty Wafer Demand
  • 4.2.6 Sustainability Programs are Accelerating Reclaimed Wafer Adoption in R&D
• 4.3 Market Restraints
  • 4.3.1 High-Purity Polysilicon Supply is Limiting 300 Millimeter Output
  • 4.3.2 Long GPU Customer Qualification Cycles Are Delaying Supplier Switching
  • 4.3.3 Float-Zone and Prime Wafer Capex is Raising Entry Barriers
  • 4.3.4 Export Controls on Advanced Node Equipment are Slowing China Expansion
• 4.4 Industry Value Chain Analysis
• 4.5 Impact of Macroeconomic Factors on the Market
• 4.6 Regulatory Landscape
• 4.7 Technological Outlook
• 4.8 Porter's Five Forces Analysis
  • 4.8.1 Bargaining Power of Suppliers
  • 4.8.2 Bargaining Power of Buyers
  • 4.8.3 Threat of New Entrants
  • 4.8.4 Threat of Substitutes
  • 4.8.5 Intensity of Competitive Rivalry
• 4.9 Pricing Analysis

5 MARKET SIZE AND GROWTH FORECASTS (VALUE)

• 5.1 By Wafer Diameter
  • 5.1.1 300 mm Wafers
  • 5.1.2 200 mm and Below
• 5.2 By Starting Wafer Type
  • 5.2.1 Prime Polished Bulk Silicon Wafers
  • 5.2.2 Epitaxial Silicon Wafers
  • 5.2.3 SOI and Other Engineered Silicon Wafers
• 5.3 By Process Node
  • 5.3.1 2 nm and Below
  • 5.3.2 3 nm
  • 5.3.3 4 nm to 5 nm
  • 5.3.4 6 nm to 7 nm
  • 5.3.5 8 nm to 16 nm
  • 5.3.6 Above 16 nm
• 5.4 By GPU Application
  • 5.4.1 Data Center and AI/HPC GPUs
  • 5.4.2 Gaming and Consumer Discrete GPUs
  • 5.4.3 Professional Visualization and Workstation GPUs
  • 5.4.4 Automotive, Embedded, and Edge GPUs
• 5.5 By Geography
  • 5.5.1 North America
    • 5.5.1.1 United States
    • 5.5.1.2 Canada
    • 5.5.1.3 Mexico
  • 5.5.2 Europe
    • 5.5.2.1 Germany
    • 5.5.2.2 United Kingdom
    • 5.5.2.3 France
    • 5.5.2.4 Italy
    • 5.5.2.5 Rest of Europe
  • 5.5.3 Asia-Pacific
    • 5.5.3.1 China
    • 5.5.3.2 Japan
    • 5.5.3.3 South Korea
    • 5.5.3.4 India
    • 5.5.3.5 Southeast Asia
    • 5.5.3.6 Rest of Asia-Pacific
  • 5.5.4 South America
  • 5.5.5 Middle East and Africa

6 COMPETITIVE LANDSCAPE

• 6.1 Market Concentration
• 6.2 Strategic Moves
• 6.3 Market Share Analysis
• 6.4 Company Profiles (includes Global Level Overview, Market Level Overview, Core Segments, Financials as available, Strategic Information, Market Rank/Share, Products and Services, Recent Developments)
  • 6.4.1 Shin-Etsu Handotai Co., Ltd.
  • 6.4.2 SUMCO Corporation
  • 6.4.3 Siltronic AG
  • 6.4.4 GlobalWafers Co., Ltd.
  • 6.4.5 SK Siltron Co., Ltd.
  • 6.4.6 Soitec S.A.
  • 6.4.7 Wafer Works Corporation
  • 6.4.8 Shanghai Simgui Technology Co., Ltd.
  • 6.4.9 Okmetic Oyj
  • 6.4.10 Ferrotec Holdings Corporation
  • 6.4.11 Hangzhou Silicon Tech Co., Ltd.
  • 6.4.12 Zhonghuan Semiconductor Co., Ltd.
  • 6.4.13 POSCO Future M Co., Ltd.
  • 6.4.14 Episil-Precision Inc.
  • 6.4.15 MEMC Korea Company
  • 6.4.16 Korea Silicon Wafer Co., Ltd.
  • 6.4.17 Linton Crystal Technologies
  • 6.4.18 Salem Advanced Materials Inc.
  • 6.4.19 Noel Technologies
  • 6.4.20 Topsil GlobalWafers

7 MARKET OPPORTUNITIES AND FUTURE OUTLOOK

• 7.1 White-Space and Unmet-Need Assessment