반도체 CVD 장비 시장 : 시장 점유율 분석, 업계 동향 및 통계, 성장 예측(2026-2031년)

According to Mordor Intelligence, the semiconductor CVD equipment market size is estimated at USD 16.71 billion in 2026, and is expected to reach USD 21.96 billion by 2031, at a CAGR of 5.62% during the forecast period (2026-2031).

This report is Segmented by Application (Foundry, IDM, Power and Analog Device Fabs, and More), CVD Technology Type (Plasma-Enhanced CVD, Low-Pressure CVD, and More), Equipment Configuration (Single-Wafer Cluster, and More), Wafer Size (Less Than or Equal To 150 Mm, and More), End-User Type (Pure-Play Foundries, and More), and Geography. The Market Forecasts are Provided in Terms of Value (USD).

Global Semiconductor CVD Equipment Market Trends and Insights

Intensifying 2 nm And Below Logic-Node Race Drives Higher ALD And CVD Tool Counts

Gate-all-around architectures below the 2-nanometer threshold add 40-50% more deposition steps than FinFET predecessors, lifting tool intensity per wafer starts by roughly 1.8x. TSMC's N2 process, in high-volume manufacturing since late 2025, relies on cyclic plasma-enhanced ALD for high-k dielectrics and selective tungsten CVD for contacts, whereas Samsung integrates backside power delivery that inserts repeat planarization-and-re-deposit loops. Intel's 18A node, slated for the second half of 2026, combines RibbonFET and PowerVia features that demand hybrid ALD-CVD chambers able to toggle thermal and plasma modes under a single vacuum. A single leading-edge fab therefore purchases 80-100 process chambers, resulting in USD 2-3 billion in incremental deposition spend per site.

Explosive SiC/GaN Power-Device Capex For EV And Renewables

Wolfspeed, Infineon, and onsemi each broke ground on 200-millimeter silicon carbide fabs that, together, exceeded USD 10 billion in 2025 capital plans. Metal-organic CVD reactors constitute roughly one-quarter of those budgets because SiC drift-layer growth rates remain throughput-limited. Gallium-nitride adoption in data-center power supplies has pushed compound-semiconductor foundries to 85% utilization, triggering long-term equipment orders for AIXTRON planetary reactors. With wide-bandgap wafer starts set to rise 18% annually through 2030, the semiconductor CVD equipment market will see demand tilt toward specialized metal-organic platforms.

EUR 50 Million-Plus Tool Price And Long ROIC Deter Smaller Foundries

Atomic-layer-deposition clusters configured for gate-all-around logic list above EUR 50 million (USD 56.5 million) and carry annual service contracts worth an additional 8-12% of the initial spend. Mature-node specialists, therefore, extend the effective life of refurbished PECVD chambers to 12 years, slowing replacement velocity. Capital-intensity disparity concentrates 78% of global deposition purchases among the top-10 manufacturers, creating a two-tier customer landscape that tempers expansion at second-tier fabs.

Other drivers and restraints analyzed in the detailed report include:

1. 3D-NAND Less than 400-Layer Roadmaps Need Ultra-High-AR Gap-Fill Systems
2. CHIPS-Style Incentives Spawning Less than 30 New Green-Field Fabs Worldwide
3. U.S.-China Export Controls Limit Addressable Sales In Greater than or Equal to 15% Of Market

For complete list of drivers and restraints, kindly check the Table Of Contents.

Segment Analysis

Foundry operations generated 41.64% of 2025 revenue as TSMC and Samsung ramped 3 nanometer and 2 nanometer nodes, anchoring the semiconductor CVD equipment market. Power and analog fabs are projected to advance at a 6.04% CAGR, the highest among applications, as electric vehicles and renewable-energy converters require thick epitaxial layers formed by low-pressure CVD. Memory accounted for 19% but sees the steepest tool-intensity gains from 3D-NAND scaling. Integrated device manufacturers contributed 23%, balancing single-wafer clusters for logic with batch furnaces for cost-sensitive analog lines. LED and optoelectronics remain niche at 6% yet gain momentum from micro-LED and LiDAR adoption.

Foundries are expected to maintain roughly 40% share through 2031, but growth moderates because mature-node lines increasingly retrofit existing chambers rather than purchase new platforms. In contrast, power-device capacity is expanding aggressively in Germany, the United States, and Malaysia, lifting specialty MOCVD demand. Memory spending remains cyclical, hinging on HBM and NAND pricing. The semiconductor chemical vapor deposition equipment market size tied to LED production will fluctuate with augmented-reality display roadmaps.

Single-wafer clusters accounted for 45.09% of 2025 installations, underpinning every leading-edge logic and memory roadmap. Batch vertical furnaces, however, are expected to grow at a 6.18% CAGR as 28-nanometer and 40-nanometer analog fabs trade process precision for 40-50% lower cost per wafer. Dual-chamber clusters accounted for 18% by blending throughput with flexibility, while planetary reactors accounted for 12%, largely in compound-semiconductor MOCVD. Legacy single-chamber and pilot tools filled the remainder.

Gate-all-around devices achieve within-wafer uniformity of less than or equal to 1%, cementing single-wafer relevance at the frontier. Still, the global wafer-start mix remains 72% mature nodes, allowing vertical furnaces to reclaim share where +-5% tolerance suffices. Dual-chamber designs are gaining popularity for hybrid ALD-CVD stacks, shaving 30% off cycle time. Planetary reactors stay competitive in LED epitaxy but face single-wafer encroachment for GaN power devices.

Complete Report Scope:

• By Application
  • Foundry
  • IDM
  • Memory Manufacturers
  • Power and Analog Device Fabs
  • LEDs and Optoelectronics
• By Equipment Configuration
  • Single-Wafer Cluster
  • Batch Vertical Furnace
  • Dual-Chamber Cluster
  • Planetary Multi-Wafer Reactor
• By Wafer Size
  • Less Than or Equal to 150 mm
  • 200 mm
  • 300 mm
  • 450 mm
• By End-User Type
  • Pure-Play Foundries
  • Integrated Device Manufacturers
  • Memory Companies
  • Fabless and R&D Institutes
• By Geography
  • North America
    • United States
    • Canada
    • Mexico
  • South America
    • Brazil
    • Argentina
    • Rest of South America
  • Europe
    • Germany
    • United Kingdom
    • France
    • Italy
    • Spain
    • Rest of Europe
  • Asia-Pacific
    • China
    • Japan
    • India
    • South Korea
    • ASEAN
    • Rest of Asia-Pacific
  • Middle East
    • Saudi Arabia
    • United Arab Emirates
    • Rest of Middle East
  • Africa
    • South Africa
    • Nigeria
    • Rest of Africa

Geography Analysis

Asia-Pacific retained 47.57% of 2025 revenue and is projected to deliver a 7.83% CAGR through 2031 as TSMC, Samsung, and SK Hynix add 1 million wafer starts per month of leading-edge and power capacity. Chinese mature-node demand persists despite export controls, with NAURA Technology and AMEC lifting their local share to 22%. Japan's JPY 2 trillion subsidy pool secures both TSMC's Kumamoto and Micron's Hiroshima expansions. Southeast Asia continues to absorb back-end and power-device investments, including Infineon's 200 millimeter SiC line in Malaysia.

North America generated 28% of 2025 revenue, buoyed by USD 52.7 billion in CHIPS subsidies that anchor Intel, Micron, and Texas Instruments expansions. However, a 5.2% forecast CAGR trails Asia-Pacific because permitting delays push several U.S. fabs into 2027-2028 completion windows and because many projects target mature-node analog production with lower tool intensity. Canada's silicon-photonics ecosystem and Mexico's emerging wafer-level packaging lines add niche but growing demand.

Europe captured 18% of 2025 revenue and will expand at 4.8% through 2031. Intel's EUR 30 billion (USD 35.07 billion) Magdeburg fab, TSMC's EUR 10 billion (USD 11.69 billion) Dresden joint venture, and Infineon's EUR 5 billion (USD 5.84 billion) PowerFab drive near-term orders. Strict environmental mandates raise PECVD system costs by 15-20% as in-situ abatement becomes compulsory. The Middle East and Africa and South America collectively hold less than 7% but may unlock incremental demand should proposed fabs in Abu Dhabi or government-funded Brazilian lines proceed.

1. Applied Materials, Inc.
2. Lam Research Corporation
3. Tokyo Electron Limited
4. ASM International N.V.
5. AIXTRON SE
6. Veeco Instruments Inc.
7. ULVAC, Inc.
8. Kokusai Electric Corporation
9. Advanced Micro-Fabrication Equipment Inc. China
10. NAURA Technology Group Co., Ltd.
11. Wonik IPS Co., Ltd.
12. Eugene Technology Co., Ltd.
13. Jusung Engineering Co., Ltd.
14. TES Co., Ltd.
15. SPTS Technologies Ltd.
16. CVD Equipment Corporation
17. Piotech Co., Ltd.
18. Plasma-Therm LLC
19. Oxford Instruments plc
20. Taiyo Nippon Sanso Corporation
21. Topecsh Co., Ltd.
22. TDK Corporation
23. Lumichem Korea Co., Ltd.

Additional Benefits:

• The market estimate (ME) sheet in Excel format
• 3 months of analyst support

TABLE OF CONTENTS

1 INTRODUCTION

• 1.1 Study Assumptions and Market Definition
• 1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET LANDSCAPE

• 4.1 Market Overview
• 4.2 Market Drivers
  • 4.2.1 Intensifying 2 Nm-And-Below Logic Node Race Drives Higher ALD + CVD Tool Counts
  • 4.2.2 Explosive SIC/GaN Power-Device Capex For EV and Renewables
  • 4.2.3 3D-NAND Less Than 400-Layer Roadmaps Need Ultra-High-AR Gap-Fill Systems
  • 4.2.4 CHIPS-Style Incentives Spawning Less Than 30 New Green-Field Fabs Worldwide
  • 4.2.5 AI-Enabled Process-Control Lowers Coo, Boosting Retrofit Demand
  • 4.2.6 Sub-Fab Energy-Recovery Mandates Favour Low-Emission PECVD Lines*
• 4.3 Market Restraints
  • 4.3.1 EUR 50 Million Tool Price And Long ROIC Deter Smaller Foundries
  • 4.3.2 U.S.-China Export Controls Limit Addressable Sales In Greater than 15% Of Market
  • 4.3.3 Scarcity Of High-Purity Metal-Organic Precursors For III-V Epi
  • 4.3.4 F-Gas Phase-Out Rules Trigger Costly Process Redesigns*
• 4.4 Industry Value Chain Analysis
• 4.5 Regulatory Landscape
• 4.6 Technological Outlook
• 4.7 Porter's Five Forces Analysis
  • 4.7.1 Bargaining Power of Suppliers
  • 4.7.2 Bargaining Power of Buyers
  • 4.7.3 Threat of New Entrants
  • 4.7.4 Threat of Substitute Products
  • 4.7.5 Degree of Competition
• 4.8 Investment Analysis

5 MARKET SIZE AND GROWTH FORECASTS (VALUE)

• 5.1 By Application
  • 5.1.1 Foundry
  • 5.1.2 IDM
  • 5.1.3 Memory Manufacturers
  • 5.1.4 Power and Analog Device Fabs
  • 5.1.5 LEDs and Optoelectronics
• 5.2 By Equipment Configuration
  • 5.2.1 Single-Wafer Cluster
  • 5.2.2 Batch Vertical Furnace
  • 5.2.3 Dual-Chamber Cluster
  • 5.2.4 Planetary Multi-Wafer Reactor
• 5.3 By Wafer Size
  • 5.3.1 Less Than or Equal to 150 mm
  • 5.3.2 200 mm
  • 5.3.3 300 mm
  • 5.3.4 450 mm
• 5.4 By End-User Type
  • 5.4.1 Pure-Play Foundries
  • 5.4.2 Integrated Device Manufacturers
  • 5.4.3 Memory Companies
  • 5.4.4 Fabless and R&D Institutes
• 5.5 By Geography
  • 5.5.1 North America
    • 5.5.1.1 United States
    • 5.5.1.2 Canada
    • 5.5.1.3 Mexico
  • 5.5.2 South America
    • 5.5.2.1 Brazil
    • 5.5.2.2 Argentina
    • 5.5.2.3 Rest of South America
  • 5.5.3 Europe
    • 5.5.3.1 Germany
    • 5.5.3.2 United Kingdom
    • 5.5.3.3 France
    • 5.5.3.4 Italy
    • 5.5.3.5 Spain
    • 5.5.3.6 Rest of Europe
  • 5.5.4 Asia-Pacific
    • 5.5.4.1 China
    • 5.5.4.2 Japan
    • 5.5.4.3 India
    • 5.5.4.4 South Korea
    • 5.5.4.5 ASEAN
    • 5.5.4.6 Rest of Asia-Pacific
  • 5.5.5 Middle East
    • 5.5.5.1 Saudi Arabia
    • 5.5.5.2 United Arab Emirates
    • 5.5.5.3 Rest of Middle East
  • 5.5.6 Africa
    • 5.5.6.1 South Africa
    • 5.5.6.2 Nigeria
    • 5.5.6.3 Rest of Africa

6 COMPETITIVE LANDSCAPE

• 6.1 Market Concentration
• 6.2 Strategic Moves
• 6.3 Market Share Analysis
• 6.4 Company Profiles (includes Global-level Overview, Market-level Overview, Core Segments, Financials as available, Strategic Information, Market Rank/Share, Products and Services, Recent Developments)
  • 6.4.1 Applied Materials, Inc.
  • 6.4.2 Lam Research Corporation
  • 6.4.3 Tokyo Electron Limited
  • 6.4.4 ASM International N.V.
  • 6.4.5 AIXTRON SE
  • 6.4.6 Veeco Instruments Inc.
  • 6.4.7 ULVAC, Inc.
  • 6.4.8 Kokusai Electric Corporation
  • 6.4.9 Advanced Micro-Fabrication Equipment Inc. China
  • 6.4.10 NAURA Technology Group Co., Ltd.
  • 6.4.11 Wonik IPS Co., Ltd.
  • 6.4.12 Eugene Technology Co., Ltd.
  • 6.4.13 Jusung Engineering Co., Ltd.
  • 6.4.14 TES Co., Ltd.
  • 6.4.15 SPTS Technologies Ltd.
  • 6.4.16 CVD Equipment Corporation
  • 6.4.17 Piotech Co., Ltd.
  • 6.4.18 Plasma-Therm LLC
  • 6.4.19 Oxford Instruments plc
  • 6.4.20 Taiyo Nippon Sanso Corporation
  • 6.4.21 Topecsh Co., Ltd.
  • 6.4.22 TDK Corporation
  • 6.4.23 Lumichem Korea Co., Ltd.

7 MARKET OPPORTUNITIES AND FUTURE OUTLOOK

• 7.1 White-space and Unmet-need Assessment